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DE69032970D1 - Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen - Google Patents

Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen

Info

Publication number
DE69032970D1
DE69032970D1 DE69032970T DE69032970T DE69032970D1 DE 69032970 D1 DE69032970 D1 DE 69032970D1 DE 69032970 T DE69032970 T DE 69032970T DE 69032970 T DE69032970 T DE 69032970T DE 69032970 D1 DE69032970 D1 DE 69032970D1
Authority
DE
Germany
Prior art keywords
packages
stacks
semiconductor chip
modules consisting
chip packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032970T
Other languages
English (en)
Other versions
DE69032970T2 (de
Inventor
Elwyn Paul Michael Wakefield
Christopher Paul Hulme Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics Inc
Application granted granted Critical
Publication of DE69032970D1 publication Critical patent/DE69032970D1/de
Publication of DE69032970T2 publication Critical patent/DE69032970T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/10—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10
    • H01L2225/1011—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1029—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices having separate containers the devices being integrated devices of class H10 the containers being in a stacked arrangement the lowermost container comprising a device support the support being a lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
DE69032970T 1989-12-01 1990-11-06 Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen Expired - Fee Related DE69032970T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898927164A GB8927164D0 (en) 1989-12-01 1989-12-01 Semiconductor chip packages

Publications (2)

Publication Number Publication Date
DE69032970D1 true DE69032970D1 (de) 1999-04-08
DE69032970T2 DE69032970T2 (de) 2000-03-09

Family

ID=10667248

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032970T Expired - Fee Related DE69032970T2 (de) 1989-12-01 1990-11-06 Halbleiterchippackungen und Module bestehend aus Stapeln derartiger Packungen

Country Status (5)

Country Link
US (2) US5165067A (de)
EP (1) EP0430458B1 (de)
JP (1) JP2859429B2 (de)
DE (1) DE69032970T2 (de)
GB (1) GB8927164D0 (de)

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JP3575001B2 (ja) * 1999-05-07 2004-10-06 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
USRE40112E1 (en) 1999-05-20 2008-02-26 Amkor Technology, Inc. Semiconductor package and method for fabricating the same
JP3398721B2 (ja) 1999-05-20 2003-04-21 アムコー テクノロジー コリア インコーポレーティド 半導体パッケージ及びその製造方法
JP2001077301A (ja) * 1999-08-24 2001-03-23 Amkor Technology Korea Inc 半導体パッケージ及びその製造方法
KR20010064907A (ko) * 1999-12-20 2001-07-11 마이클 디. 오브라이언 와이어본딩 방법 및 이를 이용한 반도체패키지
US6414396B1 (en) 2000-01-24 2002-07-02 Amkor Technology, Inc. Package for stacked integrated circuits
KR100559664B1 (ko) 2000-03-25 2006-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지
US6452278B1 (en) 2000-06-30 2002-09-17 Amkor Technology, Inc. Low profile package for plural semiconductor dies
KR100699810B1 (ko) * 2000-08-05 2007-03-27 삼성전자주식회사 버스 효율을 향상시키는 반도체 메모리장치 및 메모리시스템
US6552416B1 (en) 2000-09-08 2003-04-22 Amkor Technology, Inc. Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lead trace wiring
US7205036B2 (en) 2000-11-13 2007-04-17 Henkel Kommanditgesellschaft Auf Aktien Anti-telescoping adhesive tape product
US20040225766A1 (en) * 2001-01-25 2004-11-11 Ellison Ryan Scott Functional pathway configuration at a system/IC interface
US20030033576A1 (en) * 2001-05-25 2003-02-13 Mark Palmer Functional pathway configuration at a system/IC interface
JP3623762B2 (ja) * 2001-08-20 2005-02-23 エルピーダメモリ株式会社 半導体装置
US20050156322A1 (en) * 2001-08-31 2005-07-21 Smith Lee J. Thin semiconductor package including stacked dies
US20040021483A1 (en) * 2001-09-28 2004-02-05 Brian Boles Functional pathway configuration at a system/IC interface
KR100458869B1 (ko) * 2002-04-17 2004-12-03 삼성전자주식회사 부착 방향이 자유로운 반도체 칩 패키지
JP2004296853A (ja) 2003-03-27 2004-10-21 Seiko Epson Corp 半導体チップ、半導体装置及びその製造方法、回路基板並びに電子機器
US7098541B2 (en) * 2003-05-19 2006-08-29 Hewlett-Packard Development Company, L.P. Interconnect method for directly connected stacked integrated circuits
US8222721B2 (en) * 2003-09-15 2012-07-17 Silicon Laboratories Inc. Integrated circuit suitable for use in radio receivers
US20050285248A1 (en) * 2004-06-29 2005-12-29 Sun-Teck See Method and system for expanding flash storage device capacity
US8324725B2 (en) * 2004-09-27 2012-12-04 Formfactor, Inc. Stacked die module
JP5346578B2 (ja) * 2005-03-31 2013-11-20 スタッツ・チップパック・リミテッド 半導体アセンブリおよびその作製方法
US7364945B2 (en) 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
WO2006105514A2 (en) 2005-03-31 2006-10-05 Stats Chippac Ltd. Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
US7354800B2 (en) 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7429786B2 (en) 2005-04-29 2008-09-30 Stats Chippac Ltd. Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
US7394148B2 (en) 2005-06-20 2008-07-01 Stats Chippac Ltd. Module having stacked chip scale semiconductor packages
US7768125B2 (en) 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7750482B2 (en) 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
KR101340512B1 (ko) * 2006-12-01 2013-12-12 삼성디스플레이 주식회사 반도체 칩 패키지 및 이를 포함하는 인쇄 회로 기판어셈블리
US9466545B1 (en) 2007-02-21 2016-10-11 Amkor Technology, Inc. Semiconductor package in package
KR100795027B1 (ko) * 2007-03-12 2008-01-16 주식회사 하이닉스반도체 반도체 집적 회로 및 이를 포함하는 반도체 패키지 모듈
KR101557273B1 (ko) * 2009-03-17 2015-10-05 삼성전자주식회사 반도체 패키지
KR101660430B1 (ko) * 2009-08-14 2016-09-27 삼성전자 주식회사 반도체 패키지
TWI539565B (zh) * 2014-01-29 2016-06-21 森富科技股份有限公司 記憶體與記憶體球位焊墊之佈局方法
KR101626935B1 (ko) * 2014-02-28 2016-06-02 (주)하이디어 솔루션즈 돌보미 업무 검증 방법 및 보호 관리 시스템

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Also Published As

Publication number Publication date
JP2859429B2 (ja) 1999-02-17
EP0430458A3 (en) 1992-06-03
US5165067A (en) 1992-11-17
US5512783A (en) 1996-04-30
EP0430458B1 (de) 1999-03-03
JPH03181163A (ja) 1991-08-07
GB8927164D0 (en) 1990-01-31
EP0430458A2 (de) 1991-06-05
DE69032970T2 (de) 2000-03-09

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee