DE68907300D1 - Vorrichtung zur temperaturdetektion in einer anordnung von integrierten schaltkreisen. - Google Patents
Vorrichtung zur temperaturdetektion in einer anordnung von integrierten schaltkreisen.Info
- Publication number
- DE68907300D1 DE68907300D1 DE8989115708T DE68907300T DE68907300D1 DE 68907300 D1 DE68907300 D1 DE 68907300D1 DE 8989115708 T DE8989115708 T DE 8989115708T DE 68907300 T DE68907300 T DE 68907300T DE 68907300 D1 DE68907300 D1 DE 68907300D1
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- integrated circuits
- temperature detection
- detection
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001514 detection method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21166088A JPH0732217B2 (ja) | 1988-08-26 | 1988-08-26 | 集積回路パッケージの温度検出構造 |
| JP512889A JPH0770674B2 (ja) | 1989-01-11 | 1989-01-11 | 集積回路パッケージの温度検出構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE68907300D1 true DE68907300D1 (de) | 1993-07-29 |
| DE68907300T2 DE68907300T2 (de) | 1993-09-30 |
Family
ID=26339031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE89115708T Expired - Fee Related DE68907300T2 (de) | 1988-08-26 | 1989-08-25 | Vorrichtung zur Temperaturdetektion in einer Anordnung von integrierten Schaltkreisen. |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4975766A (de) |
| EP (1) | EP0359007B1 (de) |
| CA (1) | CA1303239C (de) |
| DE (1) | DE68907300T2 (de) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68918156T2 (de) * | 1988-05-09 | 1995-01-12 | Nippon Electric Co | Flache Kühlungsstruktur für integrierte Schaltung. |
| JP2826387B2 (ja) * | 1991-02-26 | 1998-11-18 | 甲府日本電気株式会社 | 温度異常検出方式 |
| US5372427A (en) * | 1991-12-19 | 1994-12-13 | Texas Instruments Incorporated | Temperature sensor |
| JP3058047B2 (ja) * | 1995-04-04 | 2000-07-04 | 株式会社日立製作所 | マルチチップモジュールの封止冷却構造 |
| US5802707A (en) * | 1996-03-28 | 1998-09-08 | Intel Corporation | Controlled bondline thickness attachment mechanism |
| US5831333A (en) * | 1996-05-14 | 1998-11-03 | Sun Microsystems, Inc. | Integrated junction temperature sensor/package design and method of implementing same |
| DE19708653C2 (de) * | 1997-03-04 | 1999-07-08 | Telefunken Microelectron | Vorrichtung zur Bestimmung der Temperatur mindestens eines auf einem Trägerkörper mit geringer Wärmeleitfähigkeit angeordneten Halbleiterbauelements |
| WO1998046059A1 (en) * | 1997-04-04 | 1998-10-15 | Unisys Corporation | Temperature control system for an electronic device |
| US6009264A (en) * | 1997-08-28 | 1999-12-28 | Ncr Corporation | Node coordination using a channel object and point-to-point protocol |
| US7017433B2 (en) * | 2001-10-04 | 2006-03-28 | Ssi Technologies, Inc. | Non-contacting sensor multichip module with integral heat-sinks |
| US6854993B1 (en) * | 2004-01-05 | 2005-02-15 | Hon Hai Precision Ind. Co., Ltd | IC socket assembly with improved heat sink |
| DE102005013762C5 (de) * | 2005-03-22 | 2012-12-20 | Sew-Eurodrive Gmbh & Co. Kg | Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters |
| DE102005039764B4 (de) * | 2005-08-23 | 2018-10-25 | Robert Bosch Gmbh | Verfahren zur Herstellung einer thermischen Kopplung |
| KR100656431B1 (ko) * | 2005-11-09 | 2006-12-11 | 주식회사 하이닉스반도체 | 트랜지스터를 이용한 온도 감지 장치 |
| US8025097B2 (en) * | 2006-05-18 | 2011-09-27 | Centipede Systems, Inc. | Method and apparatus for setting and controlling temperature |
| US8151872B2 (en) | 2007-03-16 | 2012-04-10 | Centipede Systems, Inc. | Method and apparatus for controlling temperature |
| US9806003B2 (en) * | 2016-01-30 | 2017-10-31 | Intel Corporation | Single base multi-floating surface cooling solution |
| US10168222B2 (en) * | 2017-03-30 | 2019-01-01 | Qualcomm Incorporated | Thermal detector array configured to detect thermal radiation from the integrated circuit |
| DE102017205857B3 (de) | 2017-04-06 | 2018-06-07 | Audi Ag | Kühleinrichtung, insbesondere für Elektronikbauteile, und Elektronikanordnung damit |
| US11516949B2 (en) * | 2018-03-13 | 2022-11-29 | Nissan Motor Co., Ltd. | Power convertor |
| JP7077717B2 (ja) * | 2018-03-29 | 2022-05-31 | 株式会社デンソー | 電力変換装置 |
| JP7024870B2 (ja) * | 2018-06-27 | 2022-02-24 | 富士電機株式会社 | 冷却装置、半導体モジュールおよび車両 |
| JP7103109B2 (ja) | 2018-09-21 | 2022-07-20 | 富士電機株式会社 | 半導体モジュールおよび車両 |
| EP3893274A1 (de) * | 2020-04-07 | 2021-10-13 | ABB Schweiz AG | Kühlelement und verfahren zur herstellung eines kühlelements |
Family Cites Families (74)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2357706A (en) * | 1942-06-29 | 1944-09-05 | Rca Corp | Heating and cooling system |
| NL198115A (de) * | 1954-06-22 | |||
| US2999034A (en) * | 1960-10-21 | 1961-09-05 | Wenczler & Heidenhain | Method of manufacture of line plates, scales, and the like |
| US3205469A (en) * | 1961-07-12 | 1965-09-07 | Gen Precision Inc | Pin board |
| US3211969A (en) * | 1961-11-15 | 1965-10-12 | Westinghouse Electric Corp | High voltage rectifier |
| US3651865A (en) * | 1970-08-21 | 1972-03-28 | Us Air Force | Cooled electronic equipment mounting plate |
| US3777220A (en) * | 1972-06-30 | 1973-12-04 | Ibm | Circuit panel and method of construction |
| US3881181A (en) * | 1973-02-22 | 1975-04-29 | Rca Corp | Semiconductor temperature sensor |
| US3827457A (en) * | 1973-06-22 | 1974-08-06 | Westinghouse Air Brake Co | Fluid pressure system for converting digital signals to analog signals |
| US3912001A (en) * | 1974-03-11 | 1975-10-14 | Gen Electric | Water cooled heat sink assembly |
| US3908188A (en) * | 1974-08-14 | 1975-09-23 | Us Air Force | Heat sink for microstrip circuit |
| SU572951A1 (ru) * | 1974-10-24 | 1977-09-15 | Предприятие П/Я А-3162 | Устройство дл охлаждени элементов радиоаппаратуры |
| US4110549A (en) * | 1974-11-30 | 1978-08-29 | Robert Bosch Gmbh | Environmentally protected electronic housing and heat sink structure, particularly for automotive use |
| US4072188A (en) * | 1975-07-02 | 1978-02-07 | Honeywell Information Systems Inc. | Fluid cooling systems for electronic systems |
| US3993123A (en) * | 1975-10-28 | 1976-11-23 | International Business Machines Corporation | Gas encapsulated cooling module |
| US4204246A (en) * | 1976-02-14 | 1980-05-20 | Sony Corporation | Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat conductive block |
| US4037270A (en) * | 1976-05-24 | 1977-07-19 | Control Data Corporation | Circuit packaging and cooling |
| US4093971A (en) * | 1976-12-10 | 1978-06-06 | Burroughs Corporation | D-I-P On island |
| US4115836A (en) * | 1977-04-25 | 1978-09-19 | Burroughs Corporation | Cooling system for dual-in-line packages |
| JPS6011830B2 (ja) * | 1977-05-24 | 1985-03-28 | 日本電気株式会社 | 電子部品の冷却装置 |
| US4196775A (en) * | 1977-09-19 | 1980-04-08 | The Unites States Of America As Represented By The Secretary Of The Navy | Shock-mounted, liquid cooled cold plate assembly |
| US4233645A (en) * | 1978-10-02 | 1980-11-11 | International Business Machines Corporation | Semiconductor package with improved conduction cooling structure |
| JPS5586130A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Connection of semiconductor element |
| US4439918A (en) * | 1979-03-12 | 1984-04-03 | Western Electric Co., Inc. | Methods of packaging an electronic device |
| US4282924A (en) * | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
| US4245273A (en) * | 1979-06-29 | 1981-01-13 | International Business Machines Corporation | Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices |
| JPS5612760A (en) * | 1979-07-10 | 1981-02-07 | Nec Corp | Multi chip lsi package |
| JPS5670655A (en) * | 1979-11-15 | 1981-06-12 | Matsushita Electric Ind Co Ltd | Manufacture of electronic circuit mounting device |
| US4588023A (en) * | 1980-06-16 | 1986-05-13 | Showa Aluminum Corporation | Device for releasing heat |
| JPS57106062A (en) * | 1980-12-24 | 1982-07-01 | Hitachi Ltd | Package for integrated circuit |
| FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
| IT1218271B (it) * | 1981-04-13 | 1990-04-12 | Ates Componenti Elettron | Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento |
| US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
| US4468717A (en) * | 1982-06-09 | 1984-08-28 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US4504156A (en) * | 1982-07-06 | 1985-03-12 | Sperry Corporation | Cooling system monitor assembly and method |
| US4493010A (en) * | 1982-11-05 | 1985-01-08 | Lockheed Corporation | Electronic packaging module utilizing phase-change conductive cooling |
| US4498122A (en) * | 1982-12-29 | 1985-02-05 | At&T Bell Laboratories | High-speed, high pin-out LSI chip package |
| JPS59130450A (ja) * | 1983-01-17 | 1984-07-27 | Nec Corp | Ｉｃパツケ−ジの冷却構造 |
| GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
| US4536824A (en) * | 1983-03-28 | 1985-08-20 | Goodyear Aerospace Corporation | Indirect cooling of electronic circuits |
| DE3479463D1 (en) * | 1983-03-29 | 1989-09-21 | Nec Corp | High density lsi package for logic circuits |
| US4535385A (en) * | 1983-04-22 | 1985-08-13 | Cray Research, Inc. | Circuit module with enhanced heat transfer and distribution |
| JPS59213153A (ja) * | 1983-05-18 | 1984-12-03 | Nec Corp | 集積回路冷却装置 |
| US4602678A (en) * | 1983-09-02 | 1986-07-29 | The Bergquist Company | Interfacing of heat sinks with electrical devices, and the like |
| JPH0673364B2 (ja) * | 1983-10-28 | 1994-09-14 | 株式会社日立製作所 | 集積回路チップ冷却装置 |
| US4546410A (en) * | 1983-10-31 | 1985-10-08 | Kaufman Lance R | Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink |
| JPS60160150A (ja) * | 1984-01-26 | 1985-08-21 | Fujitsu Ltd | 集積回路の冷却装置 |
| US4574879A (en) * | 1984-02-29 | 1986-03-11 | The Bergquist Company | Mounting pad for solid-state devices |
| JPS60257156A (ja) * | 1984-06-01 | 1985-12-18 | Hitachi Ltd | 熱伝導冷却モジユ−ル装置 |
| US4666545A (en) * | 1984-06-27 | 1987-05-19 | The Bergquist Company | Method of making a mounting base pad for semiconductor devices |
| US4628990A (en) * | 1984-08-17 | 1986-12-16 | Nec Corporation | Cooling equipment for an integrated circuit chip |
| JPS61171157A (ja) * | 1985-01-25 | 1986-08-01 | Nec Corp | 集積回路パツケ−ジ |
| JPS61189657A (ja) * | 1985-02-18 | 1986-08-23 | Fuji Photo Film Co Ltd | 半導体素子温度制御装置 |
| JPS61189658A (ja) * | 1985-02-18 | 1986-08-23 | Fuji Photo Film Co Ltd | 半導体素子温度制御装置 |
| JPH06101523B2 (ja) * | 1985-03-04 | 1994-12-12 | 株式会社日立製作所 | 集積回路チツプ冷却装置 |
| JPS61222242A (ja) * | 1985-03-28 | 1986-10-02 | Fujitsu Ltd | 冷却装置 |
| JPS61226946A (ja) * | 1985-04-01 | 1986-10-08 | Hitachi Ltd | 集積回路チツプ冷却装置 |
| FR2580060B1 (de) * | 1985-04-05 | 1989-06-09 | Nec Corp | |
| US4602125A (en) * | 1985-05-10 | 1986-07-22 | The Bergquist Company | Mounting pad with tubular projections for solid-state devices |
| JPS61276242A (ja) * | 1985-05-30 | 1986-12-06 | Hitachi Ltd | 半導体モジユ−ル |
| US4748495A (en) * | 1985-08-08 | 1988-05-31 | Dypax Systems Corporation | High density multi-chip interconnection and cooling package |
| US4724611A (en) * | 1985-08-23 | 1988-02-16 | Nec Corporation | Method for producing semiconductor module |
| EP0217676B1 (de) * | 1985-10-04 | 1993-09-01 | Fujitsu Limited | Kühlsystem für eine elektronische Schaltungsanordnung |
| US4750086A (en) * | 1985-12-11 | 1988-06-07 | Unisys Corporation | Apparatus for cooling integrated circuit chips with forced coolant jet |
| EP0236065B1 (de) * | 1986-02-25 | 1990-11-28 | Nec Corporation | Flüssigkeitskühlungssystem für integrierte Schaltungschips |
| JPS62238653A (ja) * | 1986-04-09 | 1987-10-19 | Nec Corp | 冷却構造 |
| JPS6316648A (ja) * | 1986-07-08 | 1988-01-23 | Nec Corp | 集積回路パツケ−ジ温度検出構造 |
| JPS6381959A (ja) * | 1986-09-26 | 1988-04-12 | Hitachi Ltd | 半導体装置 |
| US4721996A (en) * | 1986-10-14 | 1988-01-26 | Unisys Corporation | Spring loaded module for cooling integrated circuit packages directly with a liquid |
| JPS63157449A (ja) * | 1986-12-22 | 1988-06-30 | Nec Corp | 集積回路の冷却構造 |
| JPH07112033B2 (ja) * | 1987-03-16 | 1995-11-29 | 富士通株式会社 | 冷却モジユ−ル構造 |
| JPS63308943A (ja) * | 1987-06-10 | 1988-12-16 | Mitsubishi Electric Corp | 半導体装置 |
| US4791983A (en) * | 1987-10-13 | 1988-12-20 | Unisys Corporation | Self-aligning liquid-cooling assembly |
| CA1283225C (en) * | 1987-11-09 | 1991-04-16 | Shinji Mine | Cooling system for three-dimensional ic package |
-
1989
- 1989-08-23 US US07/397,233 patent/US4975766A/en not_active Expired - Fee Related
- 1989-08-25 CA CA000609414A patent/CA1303239C/en not_active Expired - Lifetime
- 1989-08-25 EP EP89115708A patent/EP0359007B1/de not_active Expired - Lifetime
- 1989-08-25 DE DE89115708T patent/DE68907300T2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0359007A2 (de) | 1990-03-21 |
| CA1303239C (en) | 1992-06-09 |
| EP0359007A3 (en) | 1990-10-31 |
| US4975766A (en) | 1990-12-04 |
| DE68907300T2 (de) | 1993-09-30 |
| EP0359007B1 (de) | 1993-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |