[go: up one dir, main page]

DE60336539D1 - Methode zum Elektroplattieren mit Umkehrpulsstrom - Google Patents

Methode zum Elektroplattieren mit Umkehrpulsstrom

Info

Publication number
DE60336539D1
DE60336539D1 DE60336539T DE60336539T DE60336539D1 DE 60336539 D1 DE60336539 D1 DE 60336539D1 DE 60336539 T DE60336539 T DE 60336539T DE 60336539 T DE60336539 T DE 60336539T DE 60336539 D1 DE60336539 D1 DE 60336539D1
Authority
DE
Germany
Prior art keywords
electroplating
pulse current
reversed pulse
reversed
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60336539T
Other languages
English (en)
Inventor
Leon R Barstad
Thomas Buckley
Raymond Cruz
Trevor Goodrick
Gary Hamm
Mark J Kapeckas
Katie Price
Erik Reddington
Wade Sonnenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials LLC
Original Assignee
Shipley Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32990583&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60336539(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shipley Co LLC filed Critical Shipley Co LLC
Application granted granted Critical
Publication of DE60336539D1 publication Critical patent/DE60336539D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
DE60336539T 2002-12-20 2003-12-18 Methode zum Elektroplattieren mit Umkehrpulsstrom Expired - Lifetime DE60336539D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43597602P 2002-12-20 2002-12-20

Publications (1)

Publication Number Publication Date
DE60336539D1 true DE60336539D1 (de) 2011-05-12

Family

ID=32990583

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60336539T Expired - Lifetime DE60336539D1 (de) 2002-12-20 2003-12-18 Methode zum Elektroplattieren mit Umkehrpulsstrom

Country Status (7)

Country Link
US (2) US20050016858A1 (de)
EP (1) EP1475463B2 (de)
JP (1) JP4342294B2 (de)
KR (1) KR101085005B1 (de)
CN (1) CN1540040B (de)
DE (1) DE60336539D1 (de)
TW (1) TWI296014B (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7371311B2 (en) * 2003-10-08 2008-05-13 Intel Corporation Modified electroplating solution components in a low-acid electrolyte solution
EP1598449B1 (de) * 2004-04-26 2010-08-04 Rohm and Haas Electronic Materials, L.L.C. Verbessertes Plattierungsverfahren
JP4973829B2 (ja) * 2004-07-23 2012-07-11 上村工業株式会社 電気銅めっき浴及び電気銅めっき方法
US7329334B2 (en) * 2004-09-16 2008-02-12 Herdman Roderick D Controlling the hardness of electrodeposited copper coatings by variation of current profile
DE102004045451B4 (de) 2004-09-20 2007-05-03 Atotech Deutschland Gmbh Galvanisches Verfahren zum Füllen von Durchgangslöchern mit Metallen, insbesondere von Leiterplatten mit Kupfer
JP4589695B2 (ja) * 2004-10-29 2010-12-01 ディップソール株式会社 錫又は錫合金めっき浴及びそれを用いためっき方法
JP2006131926A (ja) * 2004-11-02 2006-05-25 Sharp Corp 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置
TW200632147A (de) 2004-11-12 2006-09-16
JP4894990B2 (ja) * 2005-03-09 2012-03-14 奥野製薬工業株式会社 酸性電気銅めっき液
JP4716760B2 (ja) * 2005-03-09 2011-07-06 国立大学法人信州大学 金めっき液および金めっき方法
US20060226014A1 (en) * 2005-04-11 2006-10-12 Taiwan Semiconductor Manufacturing Co., Ltd. Method and process for improved uniformity of electrochemical plating films produced in semiconductor device processing
JP5497261B2 (ja) 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
US20080271995A1 (en) * 2007-05-03 2008-11-06 Sergey Savastiouk Agitation of electrolytic solution in electrodeposition
US7905994B2 (en) * 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US20090188553A1 (en) * 2008-01-25 2009-07-30 Emat Technology, Llc Methods of fabricating solar-cell structures and resulting solar-cell structures
US9034165B2 (en) * 2008-06-23 2015-05-19 Brookhaven Science Associates, Llc Underpotential deposition-mediated layer-by-layer growth of thin films
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP5568250B2 (ja) * 2009-05-18 2014-08-06 公立大学法人大阪府立大学 銅を充填する方法
MX2012001809A (es) 2009-08-14 2012-06-08 Saint Gobain Abrasives Inc Articulos abrasivos que incluyen particulas abrasivas unidas a un cuerpo alargado, y metodos para formar los mismos.
JP5542938B2 (ja) 2009-08-14 2014-07-09 サンーゴバン アブレイシブズ，インコーポレイティド 細長い物体に結合させた研磨粒子を含む研磨物品
JP5574912B2 (ja) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 スズめっき液
TWI466990B (zh) 2010-12-30 2015-01-01 Saint Gobain Abrasives Inc 磨料物品及形成方法
EP2755803A4 (de) 2011-09-16 2015-12-30 Saint Gobain Abrasives Inc Schleifartikel und verfahren zu seiner herstellung
KR20140075717A (ko) 2011-09-29 2014-06-19 생-고뱅 어브레이시브즈, 인코포레이티드 배리어층이 있는 신장 기재 몸체 결합 연마 입자를 포함하는 연마 물품, 및 이를 형성하는 방법
TW201404527A (zh) 2012-06-29 2014-02-01 Saint Gobain Abrasives Inc 研磨物品及形成方法
TWI477343B (zh) 2012-06-29 2015-03-21 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201402274A (zh) 2012-06-29 2014-01-16 Saint Gobain Abrasives Inc 研磨物品及形成方法
TW201441355A (zh) 2013-04-19 2014-11-01 Saint Gobain Abrasives Inc 研磨製品及其形成方法
CN103668370A (zh) * 2013-12-19 2014-03-26 潮州市连思科技发展有限公司 一种光盘脉冲电镀方法
US9681828B2 (en) * 2014-05-01 2017-06-20 Medtronic Minimed, Inc. Physiological characteristic sensors and methods for forming such sensors
US9725816B2 (en) * 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
TWI664057B (zh) 2015-06-29 2019-07-01 美商聖高拜磨料有限公司 研磨物品及形成方法
JP6813574B2 (ja) * 2015-10-06 2021-01-13 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ インジウムまたはインジウム合金の堆積方法および物品
KR101646160B1 (ko) * 2015-11-13 2016-08-08 (주)에스에이치팩 내식성이 우수한 크롬도금액
US20180030608A1 (en) * 2016-07-27 2018-02-01 Apple Inc. Plating having increased thickness and reduced grain size
CN106637308B (zh) * 2016-11-16 2019-07-09 山东金宝电子股份有限公司 电解无轮廓铜箔用混合添加剂及用其制备电解铜箔的方法
CN106782980B (zh) * 2017-02-08 2018-11-13 包头天和磁材技术有限责任公司 永磁材料的制造方法
JP7087760B2 (ja) * 2018-07-18 2022-06-21 住友金属鉱山株式会社 銅張積層板
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4132605A (en) * 1976-12-27 1979-01-02 Rockwell International Corporation Method for evaluating the quality of electroplating baths
US4666567A (en) † 1981-07-31 1987-05-19 The Boeing Company Automated alternating polarity pulse electrolytic processing of electrically conductive substances
US4917774A (en) * 1986-04-24 1990-04-17 Shipley Company Inc. Method for analyzing additive concentration
US4932518A (en) * 1988-08-23 1990-06-12 Shipley Company Inc. Method and apparatus for determining throwing power of an electroplating solution
US4897165A (en) * 1988-08-23 1990-01-30 Shipley Company Inc. Electroplating composition and process for plating through holes in printed circuit boards
US5068013A (en) * 1988-08-23 1991-11-26 Shipley Company Inc. Electroplating composition and process
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
DE3836521C2 (de) * 1988-10-24 1995-04-13 Atotech Deutschland Gmbh Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung des Bades
DE59700942D1 (de) † 1990-03-19 2000-02-10 Atotech Deutschland Gmbh Wässriges, saures Bad zur galvanischen Abscheidung von glänzenden und rissfreien Kupferüberzügen und Verwendung dieses Bades
US5223118A (en) * 1991-03-08 1993-06-29 Shipley Company Inc. Method for analyzing organic additives in an electroplating bath
US5192403A (en) * 1991-05-16 1993-03-09 International Business Machines Corporation Cyclic voltammetric method for the measurement of concentrations of subcomponents of plating solution additive mixtures
DE4126502C1 (de) † 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
US5328589A (en) * 1992-12-23 1994-07-12 Enthone-Omi, Inc. Functional fluid additives for acid copper electroplating baths
US5486280A (en) † 1994-10-20 1996-01-23 Martin Marietta Energy Systems, Inc. Process for applying control variables having fractal structures
CA2143606C (en) * 1995-02-24 1999-07-20 Peter Arrowsmith Method of making electronic housings more reliable by preventing formation of metallic whiskers on the sheets used to fabricate them
DE19545231A1 (de) † 1995-11-21 1997-05-22 Atotech Deutschland Gmbh Verfahren zur elektrolytischen Abscheidung von Metallschichten
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US6071398A (en) † 1997-10-06 2000-06-06 Learonal, Inc. Programmed pulse electroplating process
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
JP4132273B2 (ja) 1998-08-25 2008-08-13 日本リーロナール有限会社 充填されたブラインドビアホールを有するビルドアッププリント配線板の製造方法
JP2000080494A (ja) * 1998-09-03 2000-03-21 Ebara Corp 銅ダマシン配線用めっき液
US6878259B2 (en) * 1998-10-14 2005-04-12 Faraday Technology Marketing Group, Llc Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
US6210555B1 (en) † 1999-01-29 2001-04-03 Faraday Technology Marketing Group, Llc Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
US6793796B2 (en) † 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
AU3143500A (en) * 1999-01-21 2000-08-07 Atotech Deutschland Gmbh Method for galvanically forming conductor structures of high-purity copper in the production of integrated circuits
US6444110B2 (en) † 1999-05-17 2002-09-03 Shipley Company, L.L.C. Electrolytic copper plating method
JP2001152386A (ja) † 1999-07-12 2001-06-05 Applied Materials Inc 高アスペクト比構造のために電気パルス変調を使用する電気化学堆積方法及びシステム
EP1225972A4 (de) * 1999-09-24 2006-08-30 Semitool Inc Musterabhaengige entwicklung des oberflaechenprofils von elektrochemisch abgeschiedenem metal
US6309528B1 (en) † 1999-10-15 2001-10-30 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
US6652727B2 (en) * 1999-10-15 2003-11-25 Faraday Technology Marketing Group, Llc Sequential electrodeposition of metals using modulated electric fields for manufacture of circuit boards having features of different sizes
EP1132500A3 (de) † 2000-03-08 2002-01-23 Applied Materials, Inc. Verfahrem zum elektrochemischen Absetzen von Metall unter Verwendung von modulierten Wellenformen
US6491806B1 (en) * 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
EP1203950B1 (de) * 2000-11-02 2005-09-07 Shipley Company LLC Plattierungsbadanalyse
US6740221B2 (en) * 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
TWI268966B (en) * 2001-06-07 2006-12-21 Shipley Co Llc Electrolytic copper plating method
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Also Published As

Publication number Publication date
EP1475463B2 (de) 2017-03-01
EP1475463A3 (de) 2006-04-12
JP4342294B2 (ja) 2009-10-14
US20050016858A1 (en) 2005-01-27
KR20040055684A (ko) 2004-06-26
TW200424330A (en) 2004-11-16
JP2004204351A (ja) 2004-07-22
CN1540040B (zh) 2012-04-04
EP1475463A2 (de) 2004-11-10
CN1540040A (zh) 2004-10-27
TWI296014B (en) 2008-04-21
EP1475463B1 (de) 2011-03-30
KR101085005B1 (ko) 2011-11-21
US20060081475A1 (en) 2006-04-20

Similar Documents

Publication Publication Date Title
DE60336539D1 (de) Methode zum Elektroplattieren mit Umkehrpulsstrom
ATE477722T1 (de) Zahnbürste mit konturanpassbarem kopfteil
ATE479518T1 (de) Widerstandsschweissverfahren
DE60315041D1 (de) Bohrverfahren
DE50311697D1 (de) Zwischenwirbelimplantat mit kalottenartigen gelenkflächen
ATE404085T1 (de) Zahnbürste mit verbesserter reinigungswirkung
DE50311057D1 (de) Nockenwellenversteller mit elektrischem antrieb
DE602004016704D1 (de) Gleichstrommaschine mit Stromwender
DE60331626D1 (de) Fälschungssicheres Merkmal mit Linienmustern
DE60336693D1 (de) Qualitätspegeleinstellungsverfahren
DE602004025823D1 (de) Mundwasser mit einem n-acyl-argininalkylestersalz
DE10393993D2 (de) Elektrolysezelle mit Innenrinne
DE50308708D1 (de) Tieflochbohrer mit austauschsätzen für verschiedene durchmesser
DE60306911D1 (de) Spaltoven mit gleichmässiger heizung
DE60326559D1 (de) Implantierbare leitung mit verbesserter distaler spitze
FR2842536B1 (fr) Reacteur electrolytique
DK1463552T3 (da) Injektionssprøjtehoved med garantiforsegling
DE502004001596D1 (de) Greifereinheit zum bestücken von substraten mit elektrischen bauelementen
GB0315842D0 (en) Water-softening method
DE50208368D1 (de) Rinnenschuss für strebförderer mit laderampe
DE60333210D1 (de) Desinfektionsmethode
NO20023358D0 (no) Metode
ATE378445T1 (de) Titanium gegenstand mit verbessertem korrosionswiderstand
DE50308020D1 (de) Piezoelektrischer transformator mit cu-innenelektroden
DE60334174D1 (de) Zeilendrucker mit gestaffelten Magneten