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DE60315257D1 - Polierverfahren und polierflüssigkeit - Google Patents

Polierverfahren und polierflüssigkeit

Info

Publication number
DE60315257D1
DE60315257D1 DE60315257T DE60315257T DE60315257D1 DE 60315257 D1 DE60315257 D1 DE 60315257D1 DE 60315257 T DE60315257 T DE 60315257T DE 60315257 T DE60315257 T DE 60315257T DE 60315257 D1 DE60315257 D1 DE 60315257D1
Authority
DE
Germany
Prior art keywords
polishing
liquid
polishing liquid
polishing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60315257T
Other languages
English (en)
Other versions
DE60315257T2 (de
Inventor
Yutaka Wada
Tomohiko Akatsuka
Tatsuya Sasaki
Toshiya Hagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Kao Corp
Original Assignee
Ebara Corp
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp, Kao Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE60315257D1 publication Critical patent/DE60315257D1/de
Publication of DE60315257T2 publication Critical patent/DE60315257T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60315257T 2002-02-20 2003-02-20 Polierverfahren und polierflüssigkeit Expired - Fee Related DE60315257T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002043471 2002-02-20
JP2002043471 2002-02-20
PCT/JP2003/001870 WO2003071593A1 (fr) 2002-02-20 2003-02-20 Procede de polissage et fluide de polissage

Publications (2)

Publication Number Publication Date
DE60315257D1 true DE60315257D1 (de) 2007-09-13
DE60315257T2 DE60315257T2 (de) 2008-04-17

Family

ID=27750526

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60315257T Expired - Fee Related DE60315257T2 (de) 2002-02-20 2003-02-20 Polierverfahren und polierflüssigkeit
DE60320227T Expired - Fee Related DE60320227T2 (de) 2002-02-20 2003-02-20 Verfahren und einrichtung zum polieren

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60320227T Expired - Fee Related DE60320227T2 (de) 2002-02-20 2003-02-20 Verfahren und einrichtung zum polieren

Country Status (6)

Country Link
US (2) US20040248415A1 (de)
EP (2) EP1478011B1 (de)
JP (2) JPWO2003071593A1 (de)
CN (2) CN100369210C (de)
DE (2) DE60315257T2 (de)
WO (2) WO2003071592A1 (de)

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KR20040031071A (ko) * 2001-09-28 2004-04-09 신에쯔 한도타이 가부시키가이샤 연마용 워크지지반, 워크의 연마장치 및 연마방법
US20050287932A1 (en) * 2004-06-25 2005-12-29 Basol Bulent M Article for polishin substrate surface
ITMI20041788A1 (it) * 2004-09-20 2004-12-20 St Microelectronics Srl "macchina rotativa a piu' stazioni per la levigatura di wafer di componenti elettronici a semiconduttore"
US20060097219A1 (en) * 2004-11-08 2006-05-11 Applied Materials, Inc. High selectivity slurry compositions for chemical mechanical polishing
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JP2006261261A (ja) * 2005-03-16 2006-09-28 Renesas Technology Corp 化学機械研磨装置および化学機械研磨方法
US20070032176A1 (en) * 2005-08-04 2007-02-08 Chih-Ming Hsu Method for polishing diamond wafers
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US8506661B2 (en) * 2008-10-24 2013-08-13 Air Products & Chemicals, Inc. Polishing slurry for copper films
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JP5533884B2 (ja) * 2009-12-01 2014-06-25 株式会社Ｓｕｍｃｏ ウェーハの研磨方法
JP5761943B2 (ja) * 2010-03-25 2015-08-12 株式会社東京精密 仕上研削装置および仕上研削方法
CA2797096C (en) 2010-04-27 2018-07-10 3M Innovative Properties Company Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same
US8602838B2 (en) * 2010-08-26 2013-12-10 Mcronix International Co., Ltd. Chemical mechanical polishing method and system
CN102528646A (zh) * 2010-12-31 2012-07-04 中芯国际集成电路制造(上海)有限公司 一种半导体研磨方法
US8211775B1 (en) 2011-03-09 2012-07-03 United Microelectronics Corp. Method of making transistor having metal gate
US8519487B2 (en) 2011-03-21 2013-08-27 United Microelectronics Corp. Semiconductor device
KR102202331B1 (ko) * 2014-10-03 2021-01-13 가부시키가이샤 에바라 세이사꾸쇼 기판 처리 장치 및 처리 방법
CN105619965A (zh) * 2014-11-28 2016-06-01 苏州力合光电薄膜科技有限公司 自润滑薄膜结构及其制造方法和应用
CN104493683B (zh) * 2014-11-28 2017-10-03 上海华力微电子有限公司 一种测定薄膜研磨速率的方法
CN104669075B (zh) * 2014-12-08 2017-08-04 沈阳工业大学 金刚石刀具光催化辅助刃磨方法及装置
JP6489973B2 (ja) * 2015-07-30 2019-03-27 株式会社ディスコ 研削装置
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
US9534148B1 (en) 2015-12-21 2017-01-03 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of polishing semiconductor substrate
JP7023455B2 (ja) * 2017-01-23 2022-02-22 不二越機械工業株式会社 ワーク研磨方法およびワーク研磨装置
CN107846656B (zh) * 2017-12-22 2024-01-12 镇江贝斯特新材料股份有限公司 用于受话器自动化柔性生产线的抛光装置
US10967480B2 (en) * 2018-10-29 2021-04-06 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus and methods for chemical mechanical polishing
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
CN110039405B (zh) * 2019-03-20 2024-01-05 广东工业大学 一种增压雾化喷淋装置、抛光装置及抛光方法
JP6698921B1 (ja) * 2019-06-30 2020-05-27 株式会社西村ケミテック 研磨液供給装置
CN110517951B (zh) * 2019-08-29 2022-11-29 上海华力集成电路制造有限公司 一种改善sti研磨前晶圆微刮伤的清洗方法
US12285837B2 (en) 2021-11-18 2025-04-29 SanDisk Technologies, Inc. Wafer surface chemical distribution sensing system and methods for operating the same
CN119159506A (zh) * 2024-10-22 2024-12-20 北京晶亦精微科技股份有限公司 一种晶圆光电化学机械抛光装置、方法及控制器
CN119238229B (zh) * 2024-12-06 2025-02-18 浙江工业大学 一种光流变抛光液回流式射流抛光装置及其抛光方法
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Also Published As

Publication number Publication date
EP1478012B1 (de) 2007-08-01
WO2003071592A1 (fr) 2003-08-28
EP1478011A4 (de) 2005-06-01
CN1533595A (zh) 2004-09-29
CN100347827C (zh) 2007-11-07
JPWO2003071593A1 (ja) 2005-06-16
DE60315257T2 (de) 2008-04-17
JPWO2003071592A1 (ja) 2005-06-16
EP1478012A1 (de) 2004-11-17
US20040248415A1 (en) 2004-12-09
CN100369210C (zh) 2008-02-13
US7108579B2 (en) 2006-09-19
EP1478012A4 (de) 2005-06-01
WO2003071593A1 (fr) 2003-08-28
US20040235301A1 (en) 2004-11-25
EP1478011A1 (de) 2004-11-17
DE60320227T2 (de) 2009-05-20
EP1478011B1 (de) 2008-04-09
CN1537324A (zh) 2004-10-13
DE60320227D1 (de) 2008-05-21

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