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DE60237001D1 - Formen für die formung von schutzkappen auf wafer-massstab - Google Patents

Formen für die formung von schutzkappen auf wafer-massstab

Info

Publication number
DE60237001D1
DE60237001D1 DE60237001T DE60237001T DE60237001D1 DE 60237001 D1 DE60237001 D1 DE 60237001D1 DE 60237001 T DE60237001 T DE 60237001T DE 60237001 T DE60237001 T DE 60237001T DE 60237001 D1 DE60237001 D1 DE 60237001D1
Authority
DE
Germany
Prior art keywords
molds
forms
wafer scale
working faces
forming caps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60237001T
Other languages
English (en)
Inventor
Kia Silverbrook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
Original Assignee
Silverbrook Research Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Application granted granted Critical
Publication of DE60237001D1 publication Critical patent/DE60237001D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/503—Removing moulded articles using ejector pins, rods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/256—Sheets, plates, blanks or films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/30—Vehicles, e.g. ships or aircraft, or body parts thereof
    • B29L2031/3055—Cars
    • B29L2031/3061—Number plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/56—Stoppers or lids for bottles, jars, or the like, e.g. closures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Power Steering Mechanism (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Closures For Containers (AREA)
DE60237001T 2001-01-10 2002-01-08 Formen für die formung von schutzkappen auf wafer-massstab Expired - Lifetime DE60237001D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AUPR2455A AUPR245501A0 (en) 2001-01-10 2001-01-10 An apparatus (WSM08)
PCT/AU2002/000015 WO2002056374A1 (en) 2001-01-10 2002-01-08 Molds for wafer scale molding of protective caps

Publications (1)

Publication Number Publication Date
DE60237001D1 true DE60237001D1 (de) 2010-08-26

Family

ID=3826490

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60237001T Expired - Lifetime DE60237001D1 (de) 2001-01-10 2002-01-08 Formen für die formung von schutzkappen auf wafer-massstab

Country Status (7)

Country Link
US (3) US6991207B2 (de)
EP (1) EP1360719B1 (de)
JP (1) JP4259866B2 (de)
AT (1) ATE473849T1 (de)
AU (1) AUPR245501A0 (de)
DE (1) DE60237001D1 (de)
WO (1) WO2002056374A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPR245501A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM08)
AUPR245201A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus and method (WSM05)
KR100537892B1 (ko) * 2003-08-26 2005-12-21 삼성전자주식회사 칩 스택 패키지와 그 제조 방법
KR100843213B1 (ko) * 2006-12-05 2008-07-02 삼성전자주식회사 메모리 칩과 프로세서 칩이 스크라이브 영역에 배열된관통전극을 통해 연결된 다중 입출력 반도체 칩 패키지 및그 제조방법
US20130193172A1 (en) * 2012-01-27 2013-08-01 Michael J. Damkot Mold and method of using the same in the manufacture of holsters
US9677950B2 (en) 2013-03-14 2017-06-13 Robert Bosch Gmbh Portable device with temperature sensing

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3636147A (en) * 1969-01-14 1972-01-18 Rowland Products Inc Method for making sheet material for visual pattern effects
IT1128752B (it) 1980-01-18 1986-06-04 Olivetti & Co Spa Calcolatrice elettronica tascabile
US4436439A (en) 1980-08-27 1984-03-13 Epson Corporation Small printer
GB8413330D0 (en) * 1984-05-24 1984-06-27 Mbm Technology Ltd Mounting semi-conductor chips
US5118271A (en) * 1991-02-22 1992-06-02 Motorola, Inc. Apparatus for encapsulating a semiconductor device
US5815396A (en) * 1991-08-12 1998-09-29 Hitachi, Ltd. Vacuum processing device and film forming device and method using same
JP2531472B2 (ja) 1992-08-07 1996-09-04 株式会社ニコン プラスチック成形用鋳型の製造方法
JPH06263164A (ja) 1993-03-12 1994-09-20 Urawa Polymer Kk キャリアテープおよびその製造方法
DE4307869C2 (de) * 1993-03-12 1996-04-04 Microparts Gmbh Mikrostrukturkörper und Verfahren zu deren Herstellung
JPH06347475A (ja) * 1993-06-08 1994-12-22 Murata Mfg Co Ltd 加速度センサおよびその製造方法
JPH07219689A (ja) 1994-01-31 1995-08-18 Hitachi Ltd プリンタおよびこれを用いるシステム
JPH07323428A (ja) 1994-06-01 1995-12-12 Nippon Zeon Co Ltd 光学シート製造用スタンパーおよびそれを用いた光学シートの製造方法
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
JP3496347B2 (ja) * 1995-07-13 2004-02-09 株式会社デンソー 半導体装置及びその製造方法
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
JPH11138911A (ja) 1997-11-07 1999-05-25 F & F:Kk 印刷装置
US6376344B1 (en) * 1999-10-20 2002-04-23 Texas Instruments Incorporated Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device
JP3499755B2 (ja) 1998-09-11 2004-02-23 日本電信電話株式会社 記録媒体およびその作製方法
AUPP701998A0 (en) 1998-11-09 1998-12-03 Silverbrook Research Pty Ltd Image creation method and apparatus (ART74)
AU3508600A (en) * 1999-02-26 2000-09-14 Orchid Biosciences, Inc. Microstructures for use in biological assays and reactions
JP4151164B2 (ja) 1999-03-19 2008-09-17 株式会社デンソー 半導体装置の製造方法
US6406545B2 (en) * 1999-07-27 2002-06-18 Kabushiki Kaisha Toshiba Semiconductor workpiece processing apparatus and method
AUPR245001A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd A method (WSM03)
AUPR245501A0 (en) * 2001-01-10 2001-02-01 Silverbrook Research Pty Ltd An apparatus (WSM08)
JP2002368028A (ja) * 2001-06-13 2002-12-20 Nec Corp 半導体パッケージ及びその製造方法

Also Published As

Publication number Publication date
US7618575B2 (en) 2009-11-17
AUPR245501A0 (en) 2001-02-01
US20020090413A1 (en) 2002-07-11
EP1360719B1 (de) 2010-07-14
ATE473849T1 (de) 2010-07-15
US20040052886A1 (en) 2004-03-18
JP2004523382A (ja) 2004-08-05
US6991207B2 (en) 2006-01-31
US6766998B2 (en) 2004-07-27
EP1360719A4 (de) 2006-05-17
EP1360719A1 (de) 2003-11-12
JP4259866B2 (ja) 2009-04-30
US20040262812A1 (en) 2004-12-30
WO2002056374A1 (en) 2002-07-18

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