DE60133303D1 - Halbleitergrundmaterial und verfahren zu seiner herstellung - Google Patents
Halbleitergrundmaterial und verfahren zu seiner herstellungInfo
- Publication number
- DE60133303D1 DE60133303D1 DE60133303T DE60133303T DE60133303D1 DE 60133303 D1 DE60133303 D1 DE 60133303D1 DE 60133303 T DE60133303 T DE 60133303T DE 60133303 T DE60133303 T DE 60133303T DE 60133303 D1 DE60133303 D1 DE 60133303D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- base material
- semiconductor base
- semiconductor
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
- H01L21/02642—Mask materials other than SiO2 or SiN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
- H01L21/0265—Pendeoepitaxy
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000282047 | 2000-09-18 | ||
JP2000282047 | 2000-09-18 | ||
JP2001068067 | 2001-03-12 | ||
JP2001068067A JP3556916B2 (ja) | 2000-09-18 | 2001-03-12 | 半導体基材の製造方法 |
PCT/JP2001/008035 WO2002023604A1 (fr) | 2000-09-18 | 2001-09-17 | Materiau de base semi-conducteur et procede de fabrication dudit materiau |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60133303D1 true DE60133303D1 (de) | 2008-04-30 |
DE60133303T2 DE60133303T2 (de) | 2009-04-16 |
Family
ID=26600126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60133303T Expired - Lifetime DE60133303T2 (de) | 2000-09-18 | 2001-09-17 | Halbleitergrundmaterial und verfahren zu seiner herstellung |
Country Status (7)
Country | Link |
---|---|
US (1) | US7179667B2 (de) |
EP (2) | EP1328014B1 (de) |
JP (1) | JP3556916B2 (de) |
KR (1) | KR100567614B1 (de) |
CA (1) | CA2422624A1 (de) |
DE (1) | DE60133303T2 (de) |
WO (1) | WO2002023604A1 (de) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1501118B1 (de) * | 1999-03-17 | 2009-10-07 | Mitsubishi Chemical Corporation | Halbleiterbasis ihre Herstellung und Halbleiterkristallhersetllungsmethode |
US7053420B2 (en) * | 2001-03-21 | 2006-05-30 | Mitsubishi Cable Industries, Ltd. | GaN group semiconductor light-emitting element with concave and convex structures on the substrate and a production method thereof |
JP4055503B2 (ja) | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
JP5800452B2 (ja) * | 2001-07-24 | 2015-10-28 | 日亜化学工業株式会社 | 半導体発光素子 |
JP4356723B2 (ja) * | 2001-07-24 | 2009-11-04 | 日亜化学工業株式会社 | 窒化物半導体発光素子の製造方法 |
JP2003068654A (ja) | 2001-08-27 | 2003-03-07 | Hoya Corp | 化合物単結晶の製造方法 |
KR100499129B1 (ko) | 2002-09-02 | 2005-07-04 | 삼성전기주식회사 | 발광 다이오드 및 그 제조방법 |
JP4201079B2 (ja) | 2002-12-20 | 2008-12-24 | 昭和電工株式会社 | 発光素子、その製造方法およびledランプ |
US7042150B2 (en) | 2002-12-20 | 2006-05-09 | Showa Denko K.K. | Light-emitting device, method of fabricating the device, and LED lamp using the device |
JP3966207B2 (ja) | 2003-03-28 | 2007-08-29 | 豊田合成株式会社 | 半導体結晶の製造方法及び半導体発光素子 |
EP3166152B1 (de) | 2003-08-19 | 2020-04-15 | Nichia Corporation | Halbleiter-leuchtdiode und verfahren zur herstellung ihres substrates |
KR100714639B1 (ko) * | 2003-10-21 | 2007-05-07 | 삼성전기주식회사 | 발광 소자 |
JP4622447B2 (ja) * | 2004-01-23 | 2011-02-02 | 住友電気工業株式会社 | Iii族窒化物結晶基板の製造方法 |
KR100568300B1 (ko) * | 2004-03-31 | 2006-04-05 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
JP3920315B2 (ja) * | 2004-06-14 | 2007-05-30 | 三菱電線工業株式会社 | 窒化物系半導体発光素子 |
US20070241352A1 (en) * | 2004-06-18 | 2007-10-18 | Showa Denko K. K. | Group III Nitride Semiconductor Light Emitting Device |
KR100649494B1 (ko) * | 2004-08-17 | 2006-11-24 | 삼성전기주식회사 | 레이저를 이용하여 발광 다이오드 기판을 표면 처리하는발광 다이오드 제조 방법 및 이 방법에 의해 제조된 발광다이오드 |
JP2006165070A (ja) * | 2004-12-02 | 2006-06-22 | Mitsubishi Cable Ind Ltd | 窒化物半導体結晶の製造方法 |
JP4140606B2 (ja) * | 2005-01-11 | 2008-08-27 | ソニー株式会社 | GaN系半導体発光素子の製造方法 |
JP5082278B2 (ja) * | 2005-05-16 | 2012-11-28 | ソニー株式会社 | 発光ダイオードの製造方法、集積型発光ダイオードの製造方法および窒化物系iii−v族化合物半導体の成長方法 |
JP2007012809A (ja) * | 2005-06-29 | 2007-01-18 | Univ Of Tokushima | 窒化ガリウム系化合物半導体装置およびその製造方法 |
KR100780233B1 (ko) * | 2006-05-15 | 2007-11-27 | 삼성전기주식회사 | 다중 패턴 구조를 지닌 반도체 발광 소자 |
TWI304278B (en) * | 2006-06-16 | 2008-12-11 | Ind Tech Res Inst | Semiconductor emitting device substrate and method of fabricating the same |
JP4984119B2 (ja) * | 2006-08-28 | 2012-07-25 | スタンレー電気株式会社 | 窒化物半導体結晶ないしそれを用いた発光素子及びその製造方法 |
JP2008053602A (ja) * | 2006-08-28 | 2008-03-06 | Matsushita Electric Ind Co Ltd | 半導体素子及びその製造方法 |
US9318327B2 (en) | 2006-11-28 | 2016-04-19 | Cree, Inc. | Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same |
JP5082752B2 (ja) | 2006-12-21 | 2012-11-28 | 日亜化学工業株式会社 | 半導体発光素子用基板の製造方法及びそれを用いた半導体発光素子 |
JP5050574B2 (ja) * | 2007-03-05 | 2012-10-17 | 住友電気工業株式会社 | Iii族窒化物系半導体発光素子 |
JP5032171B2 (ja) * | 2007-03-26 | 2012-09-26 | 株式会社東芝 | 半導体発光素子およびその製造方法ならびに発光装置 |
KR100863804B1 (ko) * | 2007-04-19 | 2008-10-16 | 고려대학교 산학협력단 | 질화물 발광소자 및 그 제조 방법 |
US8269251B2 (en) * | 2007-05-17 | 2012-09-18 | Mitsubishi Chemical Corporation | Method for producing group III nitride semiconductor crystal, group III nitride semiconductor substrate, and semiconductor light-emitting device |
KR20100020936A (ko) * | 2007-07-12 | 2010-02-23 | 라티스 파워(지앙시) 코포레이션 | 파티션화된 기판 상에 제작되는 반도체 소자용 고품질 경계부 형성 방법 |
JP4877144B2 (ja) * | 2007-08-10 | 2012-02-15 | 三菱化学株式会社 | エピタキシャルウェハの製造方法 |
US8946772B2 (en) | 2008-02-15 | 2015-02-03 | Mitsubishi Chemical Corporation | Substrate for epitaxial growth, process for manufacturing GaN-based semiconductor film, GaN-based semiconductor film, process for manufacturing GaN-based semiconductor light emitting element and GaN-based semiconductor light emitting element |
US8134169B2 (en) * | 2008-07-01 | 2012-03-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Patterned substrate for hetero-epitaxial growth of group-III nitride film |
JP2008277871A (ja) * | 2008-08-22 | 2008-11-13 | Showa Denko Kk | Ledランプ |
US9224595B2 (en) * | 2008-09-01 | 2015-12-29 | Sophia School Corporation | Semiconductor optical element array and method of manufacturing the same |
KR101009651B1 (ko) * | 2008-10-15 | 2011-01-19 | 박은현 | 3족 질화물 반도체 발광소자 |
JP5099524B2 (ja) * | 2009-03-13 | 2012-12-19 | シャープ株式会社 | 窒化物半導体発光素子とその製造方法 |
WO2010143778A1 (ko) * | 2009-06-10 | 2010-12-16 | 서울옵토디바이스주식회사 | 반도체 기판, 그 제조 방법, 반도체 소자 및 그 제조 방법 |
US8860183B2 (en) | 2009-06-10 | 2014-10-14 | Seoul Viosys Co., Ltd. | Semiconductor substrate, semiconductor device, and manufacturing methods thereof |
US8481411B2 (en) | 2009-06-10 | 2013-07-09 | Seoul Opto Device Co., Ltd. | Method of manufacturing a semiconductor substrate having a cavity |
CN102640307B (zh) | 2009-08-26 | 2015-04-01 | 首尔伟傲世有限公司 | 制造半导体基底的方法和制造发光装置的方法 |
JP5444969B2 (ja) * | 2009-09-08 | 2014-03-19 | 株式会社リコー | テンプレート |
TW201118946A (en) * | 2009-11-24 | 2011-06-01 | Chun-Yen Chang | Method for manufacturing free-standing substrate and free-standing light-emitting device |
JP5570838B2 (ja) | 2010-02-10 | 2014-08-13 | ソウル バイオシス カンパニー リミテッド | 半導体基板、その製造方法、半導体デバイス及びその製造方法 |
US8716049B2 (en) * | 2010-02-23 | 2014-05-06 | Applied Materials, Inc. | Growth of group III-V material layers by spatially confined epitaxy |
JP2010135855A (ja) * | 2010-03-16 | 2010-06-17 | Showa Denko Kk | 発光素子の製造方法及び発光素子 |
JP2010147505A (ja) * | 2010-03-16 | 2010-07-01 | Showa Denko Kk | 発光素子の製造方法及び発光素子 |
JP2010157773A (ja) * | 2010-04-13 | 2010-07-15 | ▲さん▼圓光電股▲ふん▼有限公司 | 発光ダイオード装置の製造方法 |
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JP2012056797A (ja) * | 2010-09-09 | 2012-03-22 | Furukawa Co Ltd | Iii族窒化物半導体基板の製造方法 |
JP5649514B2 (ja) | 2011-05-24 | 2015-01-07 | 株式会社東芝 | 半導体発光素子、窒化物半導体層、及び、窒化物半導体層の形成方法 |
JP5095842B2 (ja) * | 2011-05-24 | 2012-12-12 | 株式会社東芝 | 半導体発光素子、窒化物半導体層成長用基板及び窒化物半導体ウェーハ |
KR101262953B1 (ko) | 2011-12-13 | 2013-05-09 | 고려대학교 산학협력단 | 질화물계 반도체 발광소자 및 그 제조방법 |
CN103305908A (zh) * | 2012-03-14 | 2013-09-18 | 东莞市中镓半导体科技有限公司 | 一种用于GaN生长的复合衬底 |
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JP6028690B2 (ja) * | 2013-08-06 | 2016-11-16 | 豊田合成株式会社 | Iii 族窒化物半導体発光素子 |
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JP6638152B2 (ja) * | 2015-02-25 | 2020-01-29 | 株式会社Flosfia | 蛍光体組成物の製造方法および発光装置 |
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-
2001
- 2001-03-12 JP JP2001068067A patent/JP3556916B2/ja not_active Expired - Lifetime
- 2001-09-17 DE DE60133303T patent/DE60133303T2/de not_active Expired - Lifetime
- 2001-09-17 CA CA002422624A patent/CA2422624A1/en not_active Abandoned
- 2001-09-17 KR KR1020037003910A patent/KR100567614B1/ko not_active Expired - Lifetime
- 2001-09-17 EP EP01965671A patent/EP1328014B1/de not_active Expired - Lifetime
- 2001-09-17 US US10/380,933 patent/US7179667B2/en not_active Expired - Lifetime
- 2001-09-17 WO PCT/JP2001/008035 patent/WO2002023604A1/ja active IP Right Grant
- 2001-09-17 EP EP08004987.7A patent/EP1947684B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1328014A4 (de) | 2005-10-19 |
JP3556916B2 (ja) | 2004-08-25 |
EP1328014B1 (de) | 2008-03-19 |
KR20030030019A (ko) | 2003-04-16 |
US7179667B2 (en) | 2007-02-20 |
WO2002023604A1 (fr) | 2002-03-21 |
EP1947684B1 (de) | 2014-12-24 |
EP1947684A1 (de) | 2008-07-23 |
CA2422624A1 (en) | 2003-03-17 |
KR100567614B1 (ko) | 2006-04-04 |
JP2002164296A (ja) | 2002-06-07 |
US20040048471A1 (en) | 2004-03-11 |
EP1328014A1 (de) | 2003-07-16 |
DE60133303T2 (de) | 2009-04-16 |
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