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DE60133016D1 - Polyamidsäure, polyimid,verfahren zu deren herstellung und polyimidfilm - Google Patents

Polyamidsäure, polyimid,verfahren zu deren herstellung und polyimidfilm

Info

Publication number
DE60133016D1
DE60133016D1 DE60133016T DE60133016T DE60133016D1 DE 60133016 D1 DE60133016 D1 DE 60133016D1 DE 60133016 T DE60133016 T DE 60133016T DE 60133016 T DE60133016 T DE 60133016T DE 60133016 D1 DE60133016 D1 DE 60133016D1
Authority
DE
Germany
Prior art keywords
polyimide
production
polyaminic acid
polyimide film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60133016T
Other languages
English (en)
Other versions
DE60133016T2 (de
Inventor
Wataru Yamashita
Katsuji Watanabe
Hideaki Oikawa
Hisato Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Application granted granted Critical
Publication of DE60133016D1 publication Critical patent/DE60133016D1/de
Publication of DE60133016T2 publication Critical patent/DE60133016T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/48—Biological material, e.g. blood, urine; Haemocytometers
    • G01N33/50—Chemical analysis of biological material, e.g. blood, urine; Testing involving biospecific ligand binding methods; Immunological testing
    • G01N33/53—Immunoassay; Biospecific binding assay; Materials therefor
    • G01N33/543—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals
    • G01N33/54313—Immunoassay; Biospecific binding assay; Materials therefor with an insoluble carrier for immobilising immunochemicals the carrier being characterised by its particulate form
    • G01N33/54346—Nanoparticles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety

Landscapes

  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Urology & Nephrology (AREA)
  • Hematology (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Cell Biology (AREA)
  • Microbiology (AREA)
  • Biotechnology (AREA)
  • Nanotechnology (AREA)
  • Food Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60133016T 2000-07-27 2001-07-26 Polyamidsäure, polyimid,verfahren zu deren herstellung und polyimidfilm Expired - Lifetime DE60133016T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000226324 2000-07-27
JP2000226324 2000-07-27
PCT/JP2001/006434 WO2002010253A1 (fr) 2000-07-27 2001-07-26 Acide polyamique, polyimide, leur procede de production, et film de polyimide

Publications (2)

Publication Number Publication Date
DE60133016D1 true DE60133016D1 (de) 2008-04-10
DE60133016T2 DE60133016T2 (de) 2009-03-26

Family

ID=18719961

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60133016T Expired - Lifetime DE60133016T2 (de) 2000-07-27 2001-07-26 Polyamidsäure, polyimid,verfahren zu deren herstellung und polyimidfilm

Country Status (8)

Country Link
US (1) US6710160B2 (de)
EP (1) EP1321487B1 (de)
JP (1) JP5174311B2 (de)
KR (1) KR100494631B1 (de)
CN (1) CN1243781C (de)
DE (1) DE60133016T2 (de)
TW (1) TWI245781B (de)
WO (1) WO2002010253A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4908698B2 (ja) * 2001-09-06 2012-04-04 三井化学株式会社 色素を含有したポリアミド酸溶液およびポリイミド系色調フィルム、さらにはポリイミド系色調フィルムの製造方法
EP1661856B1 (de) 2003-09-02 2017-11-01 Kaneka Corporation Verfahren zur herstellung von filmartigem graphit
KR20070059114A (ko) * 2004-08-30 2007-06-11 제이에스알 가부시끼가이샤 광학 필름, 편광판 및 액정 디스플레이
US7666573B2 (en) 2005-07-14 2010-02-23 Mitsui Chemicals, Inc. Positive photosensitive resin composition and method for forming pattern
US7572878B2 (en) * 2005-09-16 2009-08-11 E. I. Du Pont De Nemours And Company Polycyclic polyimides and compositions and methods relating thereto
TWI335455B (en) 2005-09-22 2011-01-01 Ind Tech Res Inst Liquid crystal display device
US7662449B2 (en) * 2005-11-22 2010-02-16 Industrial Technology Research Institute Liquid crystal display
TWI387812B (zh) * 2006-11-13 2013-03-01 Ind Tech Res Inst 具有光學補償功能之透明基板及其液晶顯示器
JP5053650B2 (ja) * 2007-01-29 2012-10-17 三井化学株式会社 ポリイミド共重合体、ポジ型感光性樹脂組成物、およびパターン形成方法
EP2218754B1 (de) * 2007-11-30 2018-06-20 Mitsui Chemicals, Inc. Polyimidverbundwerkstoff und folie daraus
JP5595376B2 (ja) * 2009-03-04 2014-09-24 三井化学株式会社 ポリアミド酸およびポリイミド、それらの製造方法、組成物ならびに用途
US8288484B2 (en) * 2009-03-10 2012-10-16 Samsung Electronics Co., Ltd. Cross-linked product of metal-containing polyamic acid, cross-linked product of metal-containing polyimide including the cross-linked product of metal-containing polyamic acid, method of manufacturing the cross-linked product of metal-containing polyimide, and polyimide film including the cross-linked product of metal-containing polyimide
WO2010113412A1 (ja) * 2009-03-31 2010-10-07 三井化学株式会社 低熱膨張性ブロックポリイミドおよびその前駆体ならびにその用途
JPWO2011033751A1 (ja) * 2009-09-18 2013-02-07 三井化学株式会社 透明熱可塑性ポリイミド、およびそれを含む透明基板
KR101304590B1 (ko) * 2010-03-11 2013-09-05 주식회사 엘지화학 Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물
JP5603627B2 (ja) * 2010-03-24 2014-10-08 三井化学株式会社 ２，５−ジアミノメチル−ビシクロ［２，２，１］ヘプタンの製造方法
JP5603626B2 (ja) * 2010-03-24 2014-10-08 三井化学株式会社 ２−ｅｎｄｏ−６−ｅｘｏ−ジアミノメチル−ビシクロ［２，２，１］ヘプタンの製造方法
JP5268980B2 (ja) * 2010-03-24 2013-08-21 三井化学株式会社 ポリイミド及びその製造方法、並びにポリアミド酸及びその製造方法
TWI472555B (zh) 2010-12-23 2015-02-11 Ind Tech Res Inst 共聚亞醯胺溶液、共聚亞醯胺、透明薄膜、顯示元件與太陽能電池
US20120225959A1 (en) * 2011-03-03 2012-09-06 Excellatron Solid State Llc Proton-conductive membrane
JP5824237B2 (ja) * 2011-04-28 2015-11-25 三井化学株式会社 ポリイミドフィルムの製造方法
WO2013051213A1 (ja) * 2011-10-05 2013-04-11 日立化成デュポンマイクロシステムズ株式会社 高透明ポリイミド
TWI492967B (zh) 2011-12-30 2015-07-21 Ind Tech Res Inst 聚亞醯胺
JP6246572B2 (ja) * 2013-12-02 2017-12-13 山本化成株式会社 ビシクロヘプタン化合物およびエポキシ樹脂硬化剤およびエポキシ樹脂組成物
CN104945980A (zh) * 2015-06-18 2015-09-30 成都纳硕科技有限公司 一种增强导热性光固化涂料
JP6944784B2 (ja) * 2017-02-03 2021-10-06 東京応化工業株式会社 積層体、フレキシブルデバイスおよび積層体の製造方法
CN111187414B (zh) * 2020-02-14 2022-09-06 吉林奥来德光电材料股份有限公司 高性能透明聚酰亚胺薄膜及其制备方法
KR102472537B1 (ko) * 2020-11-19 2022-12-01 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이를 포함하는 폴리이미드
KR102472532B1 (ko) * 2020-11-19 2022-12-01 피아이첨단소재 주식회사 폴리아믹산 조성물 및 이를 포함하는 폴리이미드

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3731229B2 (ja) * 1995-10-20 2006-01-05 チッソ株式会社 ポリアミド酸、ポリイミド膜及びこれを用いた液晶配向膜、液晶表示素子
JPH107906A (ja) 1996-06-21 1998-01-13 Chisso Corp ポリアミド酸系ワニス、このワニスを用いて作られた液晶配向膜、およびこの配向膜を用いた液晶表示素子
CA2247287C (en) * 1996-12-27 2004-07-13 Maruzen Petrochemical Co., Ltd. Soluble polyimide resin, process for production thereof, and polyimide resin solution composition
JP2001181241A (ja) * 1999-12-22 2001-07-03 Mitsui Chemicals Inc ジアミン異性体混合物の製造方法

Also Published As

Publication number Publication date
EP1321487A4 (de) 2004-05-12
CN1392885A (zh) 2003-01-22
TWI245781B (en) 2005-12-21
KR20020040820A (ko) 2002-05-30
EP1321487A1 (de) 2003-06-25
DE60133016T2 (de) 2009-03-26
US20020188090A1 (en) 2002-12-12
EP1321487B1 (de) 2008-02-27
KR100494631B1 (ko) 2005-06-13
US6710160B2 (en) 2004-03-23
CN1243781C (zh) 2006-03-01
WO2002010253A1 (fr) 2002-02-07
JP5174311B2 (ja) 2013-04-03

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Legal Events

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8364 No opposition during term of opposition