DE60108659D1 - Durch wärme abziehbare druckempfindliche klebefolie - Google Patents
Durch wärme abziehbare druckempfindliche klebefolieInfo
- Publication number
- DE60108659D1 DE60108659D1 DE60108659T DE60108659T DE60108659D1 DE 60108659 D1 DE60108659 D1 DE 60108659D1 DE 60108659 T DE60108659 T DE 60108659T DE 60108659 T DE60108659 T DE 60108659T DE 60108659 D1 DE60108659 D1 DE 60108659D1
- Authority
- DE
- Germany
- Prior art keywords
- sensitive adhesive
- thermo
- pressure
- expandable
- adhesive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title abstract 5
- 239000011888 foil Substances 0.000 title 1
- 239000010410 layer Substances 0.000 abstract 3
- 229920000103 Expandable microsphere Polymers 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1471—Protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1476—Release layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249982—With component specified as adhesive or bonding agent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000340922 | 2000-11-08 | ||
JP2000340922A JP4651805B2 (ja) | 2000-11-08 | 2000-11-08 | 加熱剥離型粘着シート |
PCT/JP2001/009743 WO2002038691A2 (en) | 2000-11-08 | 2001-11-07 | Heat-peelable pressure-sensitive adhesive sheet |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60108659D1 true DE60108659D1 (de) | 2005-03-03 |
DE60108659T2 DE60108659T2 (de) | 2005-06-30 |
Family
ID=18815753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60108659T Expired - Lifetime DE60108659T2 (de) | 2000-11-08 | 2001-11-07 | Durch wärme abziehbare druckempfindliche klebefolie |
Country Status (10)
Country | Link |
---|---|
US (1) | US7718257B2 (de) |
EP (1) | EP1332191B1 (de) |
JP (1) | JP4651805B2 (de) |
KR (1) | KR100738742B1 (de) |
CN (1) | CN1213119C (de) |
AT (1) | ATE287936T1 (de) |
DE (1) | DE60108659T2 (de) |
MY (1) | MY129795A (de) |
TW (1) | TW562847B (de) |
WO (1) | WO2002038691A2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4651805B2 (ja) * | 2000-11-08 | 2011-03-16 | 日東電工株式会社 | 加熱剥離型粘着シート |
KR100865412B1 (ko) * | 2004-05-18 | 2008-10-24 | 히다치 가세고교 가부시끼가이샤 | 점접착 시트 및 그것을 이용한 반도체장치 및 그 제조 방법 |
JP2007039526A (ja) * | 2005-08-02 | 2007-02-15 | Sekisui Chem Co Ltd | 粘着テープの剥離方法 |
US8932706B2 (en) * | 2005-10-27 | 2015-01-13 | Multi-Color Corporation | Laminate with a heat-activatable expandable layer |
JP5063016B2 (ja) * | 2006-03-23 | 2012-10-31 | リンテック株式会社 | 粘着シート及び剥離シート |
JP2008037943A (ja) | 2006-08-03 | 2008-02-21 | Nitto Denko Corp | 衝撃吸収粘着剤シートおよびその製造方法 |
JP4849993B2 (ja) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | 粘着シート、その製造方法および積層セラミックシートの切断方法 |
JP5283838B2 (ja) * | 2006-11-04 | 2013-09-04 | 日東電工株式会社 | 熱剥離性粘着シート及び被着体回収方法 |
JP2008115272A (ja) * | 2006-11-04 | 2008-05-22 | Nitto Denko Corp | 熱剥離性両面粘着シート及び被加工体の加工方法 |
KR100831081B1 (ko) * | 2007-02-22 | 2008-05-20 | (주)해은켐텍 | 상호반응성 공중합체를 이용한 발포시트용 점착수지 및 이를 이용한 발포시트 |
US20090214837A1 (en) * | 2008-02-21 | 2009-08-27 | Multi-Color Corporation | Insulating Label |
JP2009215489A (ja) * | 2008-03-12 | 2009-09-24 | Nitto Denko Corp | 縁止めテープおよびその利用 |
JP2010039472A (ja) * | 2008-07-08 | 2010-02-18 | Nitto Denko Corp | 電子ペーパーの製造方法、及び電子ペーパー形成工程用両面粘着テープ |
WO2012151734A1 (en) * | 2011-05-06 | 2012-11-15 | Tpk Touch Solutions (Xiamen) Inc. | Optical bonding apparatus, touch-sensitive display using the same and method of making the same |
KR101950051B1 (ko) * | 2011-09-20 | 2019-02-19 | 닛토덴코 가부시키가이샤 | 전자 부품 절단용 가열 박리형 점착 시트 및 전자 부품 절단 방법 |
JP6095386B2 (ja) * | 2013-01-31 | 2017-03-15 | 株式会社太陽マーク | 機能性シート切断用台シート、キット及び積層体並びに機能性シートの切断方法 |
US9472517B2 (en) * | 2014-03-18 | 2016-10-18 | Intel Corporation | Dry-removable protective coatings |
JP6884141B2 (ja) * | 2016-05-12 | 2021-06-09 | ソマール株式会社 | 被着体積層物の製造方法 |
WO2018072137A1 (zh) * | 2016-10-19 | 2018-04-26 | 宁德新能源科技有限公司 | 结构胶纸及其制备方法 |
WO2018072161A1 (zh) * | 2016-10-20 | 2018-04-26 | 东莞市澳中电子材料有限公司 | 加热膨胀失粘型压敏胶粘带及其制作方法 |
CN106479386A (zh) * | 2016-10-25 | 2017-03-08 | 深圳市美信电子有限公司 | 一种导电热敏压敏胶带 |
CN107011820A (zh) * | 2017-04-28 | 2017-08-04 | 新纶科技(常州)有限公司 | 一种热剥离压敏粘合片及其制备方法 |
CN207537384U (zh) * | 2017-11-23 | 2018-06-26 | 宁德新能源科技有限公司 | 胶纸 |
CN108285755A (zh) * | 2017-12-14 | 2018-07-17 | 昆明和裕胶粘制品有限公司 | 一种溶液型压敏胶临时保护膜及其制备和使用方法 |
CN108774475A (zh) * | 2018-07-10 | 2018-11-09 | 浙江纳鑫胶带制品有限公司 | 一种热剥离手撕胶带 |
CN110828707A (zh) * | 2019-11-19 | 2020-02-21 | 京东方科技集团股份有限公司 | 显示基板的制备方法和离型层材料 |
DE102023104755A1 (de) | 2023-02-27 | 2024-08-29 | Tesa Se | Reaktivklebeband zum einfachen Lösen |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5661467A (en) | 1979-10-23 | 1981-05-26 | Matsumoto Yushi Seiyaku Kk | Thermally expansible adhesive |
JP2613389B2 (ja) | 1987-04-17 | 1997-05-28 | 日東電工株式会社 | 発泡型粘着シート |
JPH01299884A (ja) * | 1988-05-28 | 1989-12-04 | Tomoegawa Paper Co Ltd | ダイボンディング接着テープ |
JP2698881B2 (ja) | 1989-05-19 | 1998-01-19 | 日東電工株式会社 | 膨脹型粘着部材 |
JP2970963B2 (ja) | 1991-08-14 | 1999-11-02 | 日東電工株式会社 | 剥離性感圧接着剤及びその粘着部材 |
JP3308672B2 (ja) * | 1993-02-26 | 2002-07-29 | 日東電工株式会社 | 接着シート |
JPH0726220A (ja) * | 1993-07-07 | 1995-01-27 | Nippon Carbide Ind Co Inc | 感圧接着性シート |
JP2877678B2 (ja) * | 1993-11-24 | 1999-03-31 | 積水化学工業株式会社 | 両面粘着テープ |
JP3810911B2 (ja) * | 1997-12-01 | 2006-08-16 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP4010643B2 (ja) * | 1998-04-23 | 2007-11-21 | 日東電工株式会社 | 加熱剥離型粘着シート |
US7214424B2 (en) * | 1999-03-01 | 2007-05-08 | Nitto Denko Corporation | Heat-peelable pressure-sensitive adhesive sheet |
JP3594853B2 (ja) * | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP2001226650A (ja) * | 2000-02-16 | 2001-08-21 | Nitto Denko Corp | 放射線硬化型熱剥離性粘着シート、及びこれを用いた切断片の製造方法 |
JP2001240820A (ja) * | 2000-02-29 | 2001-09-04 | Nitto Denko Corp | 塗膜保護シート、その製造方法及び施工方法 |
JP2001323228A (ja) * | 2000-05-15 | 2001-11-22 | Nitto Denko Corp | 加熱剥離型粘着シート |
JP4651805B2 (ja) * | 2000-11-08 | 2011-03-16 | 日東電工株式会社 | 加熱剥離型粘着シート |
-
2000
- 2000-11-08 JP JP2000340922A patent/JP4651805B2/ja not_active Expired - Lifetime
-
2001
- 2001-11-07 MY MYPI20015121A patent/MY129795A/en unknown
- 2001-11-07 DE DE60108659T patent/DE60108659T2/de not_active Expired - Lifetime
- 2001-11-07 EP EP01982743A patent/EP1332191B1/de not_active Expired - Lifetime
- 2001-11-07 KR KR1020037006276A patent/KR100738742B1/ko active IP Right Grant
- 2001-11-07 AT AT01982743T patent/ATE287936T1/de not_active IP Right Cessation
- 2001-11-07 CN CNB018185711A patent/CN1213119C/zh not_active Expired - Lifetime
- 2001-11-07 US US10/415,948 patent/US7718257B2/en not_active Expired - Fee Related
- 2001-11-07 WO PCT/JP2001/009743 patent/WO2002038691A2/en active IP Right Grant
- 2001-11-08 TW TW090127740A patent/TW562847B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1332191B1 (de) | 2005-01-26 |
US20040038020A1 (en) | 2004-02-26 |
KR20040030452A (ko) | 2004-04-09 |
JP2002146299A (ja) | 2002-05-22 |
CN1213119C (zh) | 2005-08-03 |
TW562847B (en) | 2003-11-21 |
ATE287936T1 (de) | 2005-02-15 |
DE60108659T2 (de) | 2005-06-30 |
US7718257B2 (en) | 2010-05-18 |
WO2002038691A3 (en) | 2002-09-26 |
EP1332191A2 (de) | 2003-08-06 |
CN1473184A (zh) | 2004-02-04 |
MY129795A (en) | 2007-04-30 |
KR100738742B1 (ko) | 2007-07-12 |
JP4651805B2 (ja) | 2011-03-16 |
WO2002038691A2 (en) | 2002-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60108659D1 (de) | Durch wärme abziehbare druckempfindliche klebefolie | |
MY123708A (en) | Heat-peelable pressure-sensitive adhesive sheet | |
MY144179A (en) | Wafer-processing tape and method of producing the same | |
ATE352832T1 (de) | Etikettenbogen | |
TWI264456B (en) | Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet | |
EP1154002A4 (de) | Mit hitze expandierter druckempfindlicher klebefilm | |
DK0546047T4 (da) | Selvklæbende label og fremgangsmåde til fremstilling deraf | |
WO2004016439A3 (en) | Send-reply label | |
EP1591504A4 (de) | Haftklebstoffband zum ankleben von wafern daran | |
MY119665A (en) | Pressure sensitive adhesive sheet and method of use thereof | |
AR040011A1 (es) | Revestimiento de desprendimiento que incluye un polimero termoplastico con contenido de silicona | |
JP2003512500A5 (de) | ||
TW200736361A (en) | Pressure-sensitive adhesive sheet and process for producing electronic part therewith | |
DK1093501T3 (da) | Klæbende overförselsanordning | |
BR0013473A (pt) | Construção de formulário, e, composição de revestimento para remoção imprimìvel | |
BR0006109A (pt) | Processo para a transferência, com relação a região, de uma camada decorativa de uma folha metálica de transferência para um substrato, e uma folha metálica de transferência adequada para o mesmo | |
MXPA04000460A (es) | Articulo adhesivo disoluble. | |
BR0100025A (pt) | Artigo absorvente decomponìvel em água | |
KR970022897A (ko) | 라벨 부착부 형성용 점착 시이트 | |
EP1310538A4 (de) | Druckempfindliche klebefolie mit wiederholbarem haftklebe- und abzugsverhalten | |
ATE393196T1 (de) | Trennschichtträger | |
EP1293185A3 (de) | Klebender Wundverband | |
TW200518249A (en) | Bonding structure with buffer layer and method of forming the same | |
ATE344516T1 (de) | Verbundmaterial | |
JP2000169804A5 (de) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |