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DE60033866D1 - Vorrichtung und Verfahren zur Planarisierung - Google Patents

Vorrichtung und Verfahren zur Planarisierung

Info

Publication number
DE60033866D1
DE60033866D1 DE60033866T DE60033866T DE60033866D1 DE 60033866 D1 DE60033866 D1 DE 60033866D1 DE 60033866 T DE60033866 T DE 60033866T DE 60033866 T DE60033866 T DE 60033866T DE 60033866 D1 DE60033866 D1 DE 60033866D1
Authority
DE
Germany
Prior art keywords
planarization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60033866T
Other languages
English (en)
Other versions
DE60033866T2 (de
Inventor
Toshihiko Ishikawa
Yasushi Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of DE60033866D1 publication Critical patent/DE60033866D1/de
Application granted granted Critical
Publication of DE60033866T2 publication Critical patent/DE60033866T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE60033866T 1999-01-06 2000-01-03 Planarisierungsverfahren und Planarisierungsvorrichtung Expired - Lifetime DE60033866T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP131799 1999-01-06
JP131799 1999-01-06
JP32143299 1999-11-11
JP32143299A JP2000254857A (ja) 1999-01-06 1999-11-11 平面加工装置及び平面加工方法

Publications (2)

Publication Number Publication Date
DE60033866D1 true DE60033866D1 (de) 2007-04-19
DE60033866T2 DE60033866T2 (de) 2007-07-05

Family

ID=26334526

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60033866T Expired - Lifetime DE60033866T2 (de) 1999-01-06 2000-01-03 Planarisierungsverfahren und Planarisierungsvorrichtung
DE60020614T Expired - Lifetime DE60020614T2 (de) 1999-01-06 2000-01-03 Planarisierungsvorrichtung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE60020614T Expired - Lifetime DE60020614T2 (de) 1999-01-06 2000-01-03 Planarisierungsvorrichtung

Country Status (8)

Country Link
US (2) US6431964B1 (de)
EP (2) EP1018400B1 (de)
JP (1) JP2000254857A (de)
KR (1) KR100650703B1 (de)
DE (2) DE60033866T2 (de)
MY (1) MY123347A (de)
SG (1) SG86364A1 (de)
TW (1) TW426582B (de)

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JP4642183B2 (ja) * 2000-05-09 2011-03-02 不二越機械工業株式会社 ウェーハの研磨装置
JP2002028073A (ja) * 2000-07-13 2002-01-29 Disco Abrasive Syst Ltd 伸縮自在カーテン
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JP4455750B2 (ja) * 2000-12-27 2010-04-21 株式会社ディスコ 研削装置
JP4594545B2 (ja) * 2001-03-28 2010-12-08 株式会社ディスコ 研磨装置及びこれを含んだ研削・研磨機
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JP4580118B2 (ja) * 2001-03-28 2010-11-10 株式会社ディスコ 研磨方法及び研削・研磨方法
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JP4190211B2 (ja) * 2002-06-05 2008-12-03 株式会社東京精密 基板加工方法および基板加工装置
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JP6523872B2 (ja) * 2015-08-27 2019-06-05 株式会社ディスコ 研削装置
JP2017054872A (ja) * 2015-09-08 2017-03-16 株式会社東京精密 ウェーハ研削方法及びウェーハ研削装置
CN106041706B (zh) * 2016-07-20 2018-02-23 华侨大学 蓝宝石晶片腐蚀抛光复合加工机床
JP6283081B1 (ja) * 2016-09-28 2018-02-21 株式会社東京精密 加工装置のセッティング方法
JP6803187B2 (ja) * 2016-10-05 2020-12-23 株式会社ディスコ 研削砥石のドレッシング方法
JP6635003B2 (ja) * 2016-11-02 2020-01-22 株式会社Sumco 半導体ウェーハの両面研磨方法
CN106625158A (zh) * 2017-01-24 2017-05-10 王文胜 一种石材磨光机
JP6379232B2 (ja) * 2017-01-30 2018-08-22 株式会社東京精密 研削装置
JP6909598B2 (ja) * 2017-03-13 2021-07-28 光洋機械工業株式会社 平面研削方法及び平面研削装置
CN107263267A (zh) * 2017-07-05 2017-10-20 北京中电科电子装备有限公司 一种晶圆减薄抛光装置
TWI633281B (zh) 2017-11-17 2018-08-21 財團法人工業技術研究院 量測夾持裝置及量測方法
JP2018142717A (ja) * 2018-04-20 2018-09-13 株式会社東京精密 ウェハ加工方法及びウェハ加工システム
JP2018133593A (ja) * 2018-05-22 2018-08-23 株式会社東京精密 ウェハ加工方法及びウェハ加工システム
TWI860380B (zh) * 2019-07-17 2024-11-01 日商東京威力科創股份有限公司 基板加工裝置、基板處理系統及基板處理方法
JP6911950B2 (ja) * 2020-01-10 2021-07-28 株式会社Sumco 半導体ウェーハの洗浄装置および半導体ウェーハの洗浄方法
WO2021166687A1 (ja) * 2020-02-17 2021-08-26 東京エレクトロン株式会社 加工装置
CN111633520B (zh) * 2020-06-10 2021-06-18 清华大学 一种高度集成化的减薄设备
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Also Published As

Publication number Publication date
TW426582B (en) 2001-03-21
EP1541284B1 (de) 2007-03-07
DE60020614T2 (de) 2005-12-01
KR20000052631A (ko) 2000-08-25
JP2000254857A (ja) 2000-09-19
EP1018400B1 (de) 2005-06-08
SG86364A1 (en) 2002-02-19
EP1541284A1 (de) 2005-06-15
DE60020614D1 (de) 2005-07-14
KR100650703B1 (ko) 2006-11-28
EP1018400A3 (de) 2003-02-05
EP1018400A2 (de) 2000-07-12
US20020160691A1 (en) 2002-10-31
MY123347A (en) 2006-05-31
DE60033866T2 (de) 2007-07-05
US6910943B2 (en) 2005-06-28
US6431964B1 (en) 2002-08-13

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