[go: up one dir, main page]

DE3884901D1 - Anlage zur Kühlflüssigkeitsversorgung. - Google Patents

Anlage zur Kühlflüssigkeitsversorgung.

Info

Publication number
DE3884901D1
DE3884901D1 DE88402669T DE3884901T DE3884901D1 DE 3884901 D1 DE3884901 D1 DE 3884901D1 DE 88402669 T DE88402669 T DE 88402669T DE 3884901 T DE3884901 T DE 3884901T DE 3884901 D1 DE3884901 D1 DE 3884901D1
Authority
DE
Germany
Prior art keywords
coolant
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88402669T
Other languages
English (en)
Other versions
DE3884901T2 (de
Inventor
Hisashi Kawashima
Tsuguo Okada
Haruhiko Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3884901D1 publication Critical patent/DE3884901D1/de
Publication of DE3884901T2 publication Critical patent/DE3884901T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
DE88402669T 1987-10-22 1988-10-21 Anlage zur Kühlflüssigkeitsversorgung. Expired - Fee Related DE3884901T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62267124A JPH0682941B2 (ja) 1987-10-22 1987-10-22 冷却液供給装置

Publications (2)

Publication Number Publication Date
DE3884901D1 true DE3884901D1 (de) 1993-11-18
DE3884901T2 DE3884901T2 (de) 1994-02-10

Family

ID=17440403

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88402669T Expired - Fee Related DE3884901T2 (de) 1987-10-22 1988-10-21 Anlage zur Kühlflüssigkeitsversorgung.

Country Status (8)

Country Link
US (1) US4865123A (de)
EP (1) EP0313473B1 (de)
JP (1) JPH0682941B2 (de)
KR (1) KR920003683B1 (de)
AU (1) AU593176B2 (de)
CA (1) CA1302100C (de)
DE (1) DE3884901T2 (de)
ES (1) ES2043869T3 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0363098B1 (de) * 1988-10-03 1995-04-05 Canon Kabushiki Kaisha Vorrichtung zum Regeln der Temperatur
JP2509322B2 (ja) * 1989-02-03 1996-06-19 富士通株式会社 複合熱負荷集中冷却制御方法
JPH0680914B2 (ja) * 1989-02-06 1994-10-12 富士通株式会社 タンク
JPH0727168B2 (ja) * 1989-06-21 1995-03-29 株式会社オーク製作所 放電灯の冷却液循環システム
US5052472A (en) * 1989-07-19 1991-10-01 Hitachi, Ltd. LSI temperature control system
JP2513040B2 (ja) * 1989-10-03 1996-07-03 日本電気株式会社 液冷電子機器への冷媒供給装置
JP2910127B2 (ja) * 1990-03-01 1999-06-23 富士通株式会社 冷却装置
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JPH04320399A (ja) * 1991-04-19 1992-11-11 Fujitsu Ltd 電子機器の冷却装置
US5192958A (en) * 1991-10-09 1993-03-09 Xerox Corporation Method and apparatus to control overall write length in LED print bars
US5191353A (en) * 1991-12-30 1993-03-02 Xerox Corporation Thermal control mechanism for multiple print bar system
JPH05335454A (ja) * 1992-04-03 1993-12-17 Fuji Electric Co Ltd 電子機器の冷却装置
JP2801998B2 (ja) * 1992-10-12 1998-09-21 富士通株式会社 電子機器の冷却装置
JP3477533B2 (ja) * 1993-04-26 2003-12-10 株式会社日立製作所 冷水供給装置
US5515910A (en) * 1993-05-03 1996-05-14 Micro Control System Apparatus for burn-in of high power semiconductor devices
DE9309428U1 (de) * 1993-06-24 1993-08-12 Siemens AG, 80333 München Stromrichtermodul
US5509468A (en) * 1993-12-23 1996-04-23 Storage Technology Corporation Assembly for dissipating thermal energy contained in an electrical circuit element and associated method therefor
US5523640A (en) * 1994-04-22 1996-06-04 Cincinnati Milacron Inc. Liquid cooling for electrical components of a plastics processing machine
EP0709885A3 (de) * 1994-10-31 1997-08-27 At & T Corp Baugruppe mit integriertem, geschlossenem Kühlkreislaufsystem
US5899265A (en) * 1997-04-08 1999-05-04 Sundstrand Corporation Reflux cooler coupled with heat pipes to enhance load-sharing
US6161612A (en) * 1998-06-02 2000-12-19 Ericsson Inc. Cooling system and method for distributing cooled air
JP4583530B2 (ja) * 1999-03-19 2010-11-17 オルガノ株式会社 熱交換用水及びその供給装置
DE10022138B4 (de) * 2000-05-06 2004-09-30 Hauni Maschinenbau Ag Flüssigkeitskühlsystem für Produktionsmaschinen der Tabak verarbeitenden Industrie
DE20011508U1 (de) 2000-06-30 2000-10-12 TermoTek Laserkühlung GmbH, 76437 Rastatt Kühlvorrichtung für einen Laser
US6700396B1 (en) 2001-05-16 2004-03-02 Ltx Corporation Integrated micromachine relay for automated test equipment applications
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
JP4151328B2 (ja) * 2002-07-15 2008-09-17 株式会社日立製作所 電子機器の冷却装置
JP4226347B2 (ja) * 2003-01-29 2009-02-18 富士通株式会社 冷却システムおよび電子機器
JP2005072216A (ja) * 2003-08-25 2005-03-17 Hitachi Ltd 液冷システムおよびこれを用いた電子機器
US7088585B2 (en) * 2003-12-03 2006-08-08 International Business Machines Corporation Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems
US7106590B2 (en) * 2003-12-03 2006-09-12 International Business Machines Corporation Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
GB0404231D0 (en) * 2004-02-26 2004-03-31 Xaar Technology Ltd Droplet deposition apparatus
US8430156B2 (en) * 2004-04-29 2013-04-30 Hewlett-Packard Development Company, L.P. Liquid loop with multiple pump assembly
FR2876812B1 (fr) * 2004-10-15 2006-12-22 J C C Chereau Aeronautique Dispositif a fluide de refroidissement pour ordinateur
JP2006147265A (ja) * 2004-11-18 2006-06-08 Fuji Electric Holdings Co Ltd 燃料電池発電装置
JP4544527B2 (ja) * 2005-06-24 2010-09-15 富士通株式会社 電子機器用液体冷却装置
US8002025B2 (en) * 2006-04-28 2011-08-23 International Business Machines Corporation Containment of a wafer-chuck thermal interface fluid
US7916267B2 (en) * 2006-08-29 2011-03-29 Asml Netherlands B.V. Lithographic apparatus, and motor cooling device
US7665325B2 (en) * 2006-09-12 2010-02-23 International Business Machines Corporation Multi-fluid cooling system and method with freeze protection for cooling an electronic device
US8607586B2 (en) * 2007-02-20 2013-12-17 B/E Aerospace, Inc. Aircraft galley refrigeration system with multi-circuit heat exchanger
US7602609B2 (en) * 2007-05-31 2009-10-13 Liebert Corporation Cooling system and method of use
US7777130B2 (en) * 2007-06-18 2010-08-17 Vivant Medical, Inc. Microwave cable cooling
DE102007054724B4 (de) * 2007-11-14 2011-02-17 KKT KRAUS Kälte- und Klimatechnik GmbH Installationsschrank zur Aufnahme von elektrischen oder elektronischen Geräten, insbesondere von Recheneinrichtungen, sowie Einrichtung aufweisend mehrere solcher Installationsschränke, und Verfahren zum Betreiben einer solchen Einrichtung
US8387249B2 (en) * 2007-11-19 2013-03-05 International Business Machines Corporation Apparatus and method for facilitating servicing of a liquid-cooled electronics rack
US8369090B2 (en) * 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
FR2972893B1 (fr) * 2011-03-14 2013-04-26 Converteam Technology Ltd Dispositif de conversion d'energie, notamment pour un systeme d'entrainement electrique de station sous-marine de compression et de pompage
JP5760796B2 (ja) * 2011-07-22 2015-08-12 富士通株式会社 冷却ユニット
EP2810812B1 (de) 2012-01-30 2019-08-21 Mitsubishi Electric Corporation Hauptstromkreissystem für elektroschienenfahrzeuge
CN103677173A (zh) * 2012-09-17 2014-03-26 英业达科技有限公司 冷却装置
US9351431B2 (en) 2012-10-11 2016-05-24 International Business Machines Corporation Cooling system with automated seasonal freeze protection
CN103402345B (zh) * 2013-08-14 2016-05-25 南车株洲电力机车研究所有限公司 一种电子器件多级水冷装置
US11049624B2 (en) * 2015-12-07 2021-06-29 Ge-Hitachi Nuclear Energy Americas Llc Nuclear reactor liquid metal coolant backflow control
CN106604617B (zh) * 2016-01-19 2018-07-06 包头轻工职业技术学院 一种电气控制柜
US11025034B2 (en) * 2016-08-31 2021-06-01 Nlight, Inc. Laser cooling system
US10136554B2 (en) * 2017-03-31 2018-11-20 International Business Machines Corporation Passive two-phase cooling with forced cooling assist
US10813253B2 (en) 2017-12-07 2020-10-20 Hewlett Packard Enterprise Development Lp Chassis cooling
US10784645B2 (en) 2018-03-12 2020-09-22 Nlight, Inc. Fiber laser having variably wound optical fiber
US20210276738A1 (en) * 2020-03-03 2021-09-09 The Boeing Company Space vehicle comprising cooling system
US20220142007A1 (en) * 2020-10-29 2022-05-05 Nvidia Corporation Coolant thermal buffer for datacenter cooling systems
US11683910B2 (en) * 2021-04-27 2023-06-20 Quanta Computer Inc. Hot plug redundant pump for cooling system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6508824A (de) * 1964-07-08 1966-01-10
US3334684A (en) * 1964-07-08 1967-08-08 Control Data Corp Cooling system for data processing equipment
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US3512582A (en) * 1968-07-15 1970-05-19 Ibm Immersion cooling system for modularly packaged components
US3774677A (en) * 1971-02-26 1973-11-27 Ibm Cooling system providing spray type condensation
US3757530A (en) * 1972-04-12 1973-09-11 Control Data Corp Cooling system for data processing apparatus
US4513346A (en) * 1981-05-10 1985-04-23 General Electric Company Means to improve the dielectric performance of an insulative conduit with a flow of liquid dielectric coolant therein
CA1227886A (en) * 1984-01-26 1987-10-06 Haruhiko Yamamoto Liquid-cooling module system for electronic circuit components
DK157590C (da) * 1984-02-29 1990-06-18 Jens Peter Kvistgaard Optager, navnlig til optagning af kartofler og andre, navnlig underjordiske, planteprodukter som sellerier, guleroedder, blomster- som spiseloeg, etc.
US4655230A (en) * 1985-03-29 1987-04-07 Celanese Corporation Localized liquid additive applicator system for continuous cylindrical product
US4721996A (en) * 1986-10-14 1988-01-26 Unisys Corporation Spring loaded module for cooling integrated circuit packages directly with a liquid

Also Published As

Publication number Publication date
KR920003683B1 (ko) 1992-05-06
JPH01109798A (ja) 1989-04-26
ES2043869T3 (es) 1994-01-01
AU593176B2 (en) 1990-02-01
EP0313473B1 (de) 1993-10-13
KR890007420A (ko) 1989-06-19
JPH0682941B2 (ja) 1994-10-19
AU2409388A (en) 1989-04-27
CA1302100C (en) 1992-06-02
US4865123A (en) 1989-09-12
DE3884901T2 (de) 1994-02-10
EP0313473A3 (en) 1989-12-27
EP0313473A2 (de) 1989-04-26

Similar Documents

Publication Publication Date Title
DE3884901D1 (de) Anlage zur Kühlflüssigkeitsversorgung.
DE3872647D1 (de) Korrosionshemmung.
DK140591A (da) Lineaert motorfremfoeringsanlaeg
KR890700874A (ko) 텔레링크 시스템
MX9203552A (es) Sistema de suministro de capas multiples.
DE3888787D1 (de) Kühlmittel.
DK682388A (da) Transportkoeleanlaeg
DE3886376D1 (de) Kühlmittel.
DE3884824D1 (de) Objekt-Positionierungssystem.
DE68917037D1 (de) System zur Stromversorgung.
NO161661C (no) Flergjenstands h ndverktoey med chucksystem.
NO880046D0 (no) Holdeanordning for kateter.
FI882069A (fi) Transportanordning foer burkaemnen i en burksvetsmaskin.
DE3873484D1 (de) Kuehlmittel.
FI885728L (fi) Antikorrosionsmedel.
ES2016864B3 (es) Unidad de ensamble al recibo de canalizaciones de alimentacion de auto-vehiculo.
DK150290A (da) Gavlstykke til kasser
DE3778003D1 (de) Anlage zur steuerung der raumluftkuehlung.
NO880601D0 (no) Stabiliseringssystem.
FI883676L (fi) System foer graevning pao havsbottnen.
DE3750261D1 (de) Numerisch gesteuerte Anlage.
NO891839D0 (no) Trykkfoeler-system.
NO872282L (no) Framgangsmaate for traaling.
NO154711C (no) Linehaandteringssystem for line med loesbare forsyn.
FI882247A0 (fi) Anordning foer infaestning av en kropp.

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee