DE3788546D1 - Halbleiterlasermodul. - Google Patents

Halbleiterlasermodul.

Info

Publication number: DE3788546D1
Authority: DE; Germany
Prior art keywords: semiconductor laser; laser module; module; semiconductor; laser
Prior art date: 1986-09-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Revoked

Application number

DE87113344T

Other languages

English (en)

Other versions

DE3788546T2 (de

Inventor

Naoki C O Nec Corpor Shibanuma

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Corp

Original Assignee

NEC Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1986-09-12

Filing date

1987-09-11

Publication date

1994-02-03

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16689121&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3788546(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1987-09-11 Application filed by NEC Corp filed Critical NEC Corp

1994-02-03 Application granted granted Critical

1994-02-03 Publication of DE3788546D1 publication Critical patent/DE3788546D1/de

1994-04-21 Publication of DE3788546T2 publication Critical patent/DE3788546T2/de

2007-09-12 Anticipated expiration legal-status Critical

Status Revoked legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4233—Active alignment along the optical axis and passive alignment perpendicular to the optical axis
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/0222—Gas-filled housings
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Electromagnetism (AREA)
Optical Couplings Of Light Guides (AREA)
Semiconductor Lasers (AREA)

DE87113344T 1986-09-12 1987-09-11 Halbleiterlasermodul. Revoked DE3788546T2 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP61216482A JPS6370589A (ja)	1986-09-12	1986-09-12	半導体レ−ザモジユ−ル

Publications (2)

Publication Number	Publication Date
DE3788546D1 true DE3788546D1 (de)	1994-02-03
DE3788546T2 DE3788546T2 (de)	1994-04-21

Family

ID=16689121

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE87113344T Revoked DE3788546T2 (de)	1986-09-12	1987-09-11	Halbleiterlasermodul.

Country Status (4)

Country	Link
US (1)	US4803689A (de)
EP (1)	EP0259888B1 (de)
JP (1)	JPS6370589A (de)
DE (1)	DE3788546T2 (de)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
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DE3244882A1 (de) *	1982-12-03	1984-06-07	Siemens AG, 1000 Berlin und 8000 München	Sende- oder empfangsvorrichtung mit einer mittels eines traegers gehalterten diode
GB2208962B (en) *	1987-08-19	1991-05-08	Plessey Co Plc	Power supply
NL8800140A (nl) *	1988-01-22	1989-08-16	Philips Nv	Laserdiode module.
EP0331436B1 (de) *	1988-03-01	2004-12-29	Kabushiki Kaisha Toshiba	Optische Übertragungsvorrichtung
DE68919327T2 (de) *	1988-03-02	1995-04-27	Fujitsu Ltd	Halbleiterlasermodul und methode zu seiner justierung.
JPH01302214A (ja) *	1988-05-30	1989-12-06	Sumitomo Electric Ind Ltd	チップキャリア
US5049762A (en) *	1988-09-14	1991-09-17	Fuji Photo Film Co., Ltd.	Optical wavelength converter system
GB2227102B (en) *	1989-01-13	1993-03-24	Ferranti Int Signal	Optical coupler with a fibre link between transceivers
KR920010947B1 (ko) *	1989-05-24	1992-12-24	가부시끼가이샤 히다찌세이사꾸쇼	광결합장치와 그 제조방법, 발광장치와 그 조립방법 및 렌즈홀더
NL8901523A (nl) *	1989-06-16	1991-01-16	Philips Nv	Laserdiode module.
JP2684219B2 (ja) *	1989-07-05	1997-12-03	三菱電機株式会社	光半導体モジュール
JPH0392805A (ja) *	1989-09-06	1991-04-18	Matsushita Electric Ind Co Ltd	光半導体装置および光半導体素子の検査装置
NL9000027A (nl) *	1990-01-05	1991-08-01	Philips Nv	Opto-elektronische inrichting met een, een lens omvattende koppeling tussen een optische transmissievezel en een halfgeleiderlaserdiode.
JP2570879B2 (ja) *	1990-02-08	1997-01-16	三菱電機株式会社	光半導体モジュールの組立方法
GB2242307B (en) *	1990-02-09	1994-09-07	Omega Universal Tech Ltd	Laser probe for biomodulation of tissue nerve and immune systems
US5029968A (en) *	1990-03-05	1991-07-09	Hughes Aircraft Company	Optoelectronic hybrid package assembly including integral, self-aligned fiber optic connector
US5156999A (en) *	1990-06-08	1992-10-20	Wai-Hon Lee	Packaging method for semiconductor laser/detector devices
JP3035852B2 (ja) *	1990-07-18	2000-04-24	富士通株式会社	半導体レーザモジュール
US5124281A (en) *	1990-08-27	1992-06-23	At&T Bell Laboratories	Method of fabricating a photonics module comprising a spherical lens
JP2695995B2 (ja) *	1991-01-14	1998-01-14	株式会社東芝	光半導体装置
US5100507A (en) *	1991-01-31	1992-03-31	At&T Bell Laboratories	Finishing techniques for lensed optical fibers
JPH04105572U (ja) *	1991-02-26	1992-09-10	ソニー株式会社	レーザ装置
NL9100367A (nl) *	1991-02-28	1992-09-16	Philips Nv	Opto-electronische inrichting bevattende een halfgeleiderlaser en een optische isolator.
US5195102A (en) *	1991-09-13	1993-03-16	Litton Systems Inc.	Temperature controlled laser diode package
US5197076A (en) *	1991-11-15	1993-03-23	Davis James G	Temperature stabilizable laser apparatus
JP2763980B2 (ja) *	1992-01-14	1998-06-11	富士通株式会社	光半導体モジュール
JPH05323165A (ja) *	1992-05-18	1993-12-07	Sumitomo Electric Ind Ltd	レンズ保持ブロック
DE4232327A1 (de) *	1992-09-26	1994-03-31	Sel Alcatel Ag	Halbleiter-Lasermodul
JP2661521B2 (ja) *	1993-09-25	1997-10-08	日本電気株式会社	半導体受光装置
US5469456A (en) *	1994-03-31	1995-11-21	Opto Power Corporation	Laser device and method of manufacture using non-metalized fiber
US5646674A (en) *	1994-04-29	1997-07-08	Eastman Kodak Company	Optical print head with flexure mounted optical device
JP3596029B2 (ja)	1994-06-06	2004-12-02	住友電気工業株式会社	半導体レーザモジュール
DE4422322C1 (de) *	1994-06-27	1995-09-14	Ant Nachrichtentech	Lasermodul
US5500911A (en) *	1994-08-05	1996-03-19	The Whitaker Corporation	Lensed optical fiber assembly and process for alignment with an active device
DE4431285C1 (de)	1994-09-02	1995-12-07	Ant Nachrichtentech	Lasermodul
JPH08195528A (ja) *	1995-01-13	1996-07-30	Fujitsu Ltd	レーザダイオードモジュール
JPH09511848A (ja) *	1995-02-10	1997-11-25	フィリップスエレクトロニクスネムローゼフェンノートシャップ	半導体レーザ変調器又は増幅器と２つの光ガラスファイバとの間の結合を具えたオプトエレクトロニクスデバイス
WO1996024873A2 (en) *	1995-02-10	1996-08-15	Philips Electronics N.V.	Optoelectronic device with a coupling between a semiconductor diode laser modulator or amplifier and two optical glass fibres
JP2851810B2 (ja) *	1995-03-22	1999-01-27	三菱電機株式会社	光半導体素子モジュールの組立方法
US5640407A (en) *	1995-04-28	1997-06-17	Accu-Sort Systems, Inc.	Temperature regulating laser diode assembly
JP3461632B2 (ja) *	1995-08-28	2003-10-27	三菱電機株式会社	半導体レーザ装置
KR0171374B1 (ko) *	1995-11-17	1999-05-01	양승택	광집속렌즈를 포함하는 레이저 모듈 및 그 렌즈 고정방법
JP3076246B2 (ja) *	1996-08-13	2000-08-14	日本電気株式会社	ペルチェクーラ内蔵半導体レーザモジュール
AT405776B (de) *	1997-11-24	1999-11-25	Femtolasers Produktions Gmbh	Kühlvorrichtung für einen laserkristall
EP0961371B1 (de) *	1998-05-25	2001-09-12	Alcatel	Optoelektronisches Modul mit wenigstens einem optoelektronischen Bauelement und Verfahren zur Temperaturstabilisierung
DE69905760T2 (de) *	1998-12-21	2004-03-18	Alliedsignal Inc.	Hochleistungslampe mit infrarot-diode
US6901221B1 (en)	1999-05-27	2005-05-31	Jds Uniphase Corporation	Method and apparatus for improved optical elements for vertical PCB fiber optic modules
US6213651B1 (en)	1999-05-26	2001-04-10	E20 Communications, Inc.	Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
DE19944042A1 (de) *	1999-09-14	2001-04-12	Siemens Ag	Beleuchtungseinheit für eine Vorrichtung für Anwendungen im Bereich der Medizin
JP3518491B2 (ja) *	2000-06-26	2004-04-12	株式会社日立製作所	光結合装置
US6863444B2 (en)	2000-12-26	2005-03-08	Emcore Corporation	Housing and mounting structure
US6905260B2 (en)	2000-12-26	2005-06-14	Emcore Corporation	Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules
US6799902B2 (en)	2000-12-26	2004-10-05	Emcore Corporation	Optoelectronic mounting structure
US6867377B2 (en)	2000-12-26	2005-03-15	Emcore Corporation	Apparatus and method of using flexible printed circuit board in optical transceiver device
US7021836B2 (en)	2000-12-26	2006-04-04	Emcore Corporation	Attenuator and conditioner
JP3929705B2 (ja)	2001-02-05	2007-06-13	ユーディナデバイス株式会社	半導体装置及びチップキャリア
GB0105651D0 (en) *	2001-03-08	2001-04-25	Siemens Plc	Temperature stabilised laser diode and gas reference package
AU2002234766A1 (en) *	2001-03-08	2002-09-24	Siemens Plc	A wavelength stablilised laser source
US6860651B2 (en) *	2001-06-26	2005-03-01	Derosa Michael E.	Method and device for removing heat from a fiber-optic package
JP2003110180A (ja) *	2001-07-25	2003-04-11	Furukawa Electric Co Ltd:The	半導体レーザモジュール並びに光測定方法及び光測定装置
US6868104B2 (en) *	2001-09-06	2005-03-15	Finisar Corporation	Compact laser package with integrated temperature control
US6861641B1 (en) *	2002-03-26	2005-03-01	Optical Communication Products, Inc.	Hermetically sealed optical subassembly
US6869231B2 (en) *	2002-05-01	2005-03-22	Jds Uniphase Corporation	Transmitters, receivers, and transceivers including an optical bench
US6973106B1 (en)	2002-10-11	2005-12-06	Corvis Corporation	Optical package and optical systems apparatuses, and methods of use therein
US6863453B2 (en)	2003-01-28	2005-03-08	Emcore Corporation	Method and apparatus for parallel optical transceiver module assembly
US8811439B2 (en)	2009-11-23	2014-08-19	Seminex Corporation	Semiconductor laser assembly and packaging system
US8821042B2 (en) *	2011-07-04	2014-09-02	Sumitomo Electic Industries, Ltd.	Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount
CN114910188A (zh) *	2022-03-29	2022-08-16	熊云	一种光纤激光器加工头温度检测控制装置

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GB1454188A (de) *	1973-12-03	1976-10-27
JPS5642389A (en) *	1979-09-13	1981-04-20	Fujitsu Ltd	Light semiconductor light emitting device
JPS58134489A (ja) *	1982-02-04	1983-08-10	Mitsubishi Electric Corp	レ−ザダイオ−ドモジユ−ル
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US4767171A (en) *	1986-03-27	1988-08-30	Siemens Aktiengesellschaft	Transmission and reception module for a bidirectional communication network
JP2935179B2 (ja) *	1997-06-11	1999-08-16	青山機工株式会社	削孔装置におけるロッド部材間通信構造

1986
- 1986-09-12 JP JP61216482A patent/JPS6370589A/ja active Pending
1987
- 1987-09-11 DE DE87113344T patent/DE3788546T2/de not_active Revoked
- 1987-09-11 EP EP87113344A patent/EP0259888B1/de not_active Revoked
- 1987-09-14 US US07/095,711 patent/US4803689A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
DE3788546T2 (de)	1994-04-21
EP0259888A3 (en)	1989-05-17
EP0259888B1 (de)	1993-12-22
EP0259888A2 (de)	1988-03-16
JPS6370589A (ja)	1988-03-30
US4803689A (en)	1989-02-07

Publication	Publication Date	Title
DE3788546D1 (de)	1994-02-03	Halbleiterlasermodul.
DE3751535D1 (de)	1995-10-26	Halbleiterlaser.
DE59008471D1 (de)	1995-03-23	Leistungshalbleitermodul.
DE3584702D1 (de)	1992-01-02	Halbleiterlaservorrichtung.
DE3676867D1 (de)	1991-02-21	Halbleiterlaser.
DE3584330D1 (de)	1991-11-14	Halbleiterlaservorrichtung.
DE3750995D1 (de)	1995-03-02	Halbleiterlaservorrichtung.
DE3786339D1 (de)	1993-07-29	Halbleiterlaservorrichtung.
DE3873689D1 (de)	1992-09-17	Halbleiterlaser.
DE3587748D1 (de)	1994-03-24	Halbleiterlaseranordnung.
DE68908646D1 (de)	1993-09-30	Halbleiterlaser.
DE69017279D1 (de)	1995-04-06	Optischer Halbleitermodul.
DE3674959D1 (de)	1990-11-22	Halbleiterlaser.
DE3884503D1 (de)	1993-11-04	Halbleiterlaser.
DE3688002D1 (de)	1993-04-22	Halbleiter-laser.
DE3687102D1 (de)	1992-12-17	Halbleiterlaser.
DE3850890D1 (de)	1994-09-08	Optisches Halbleitermodul.
DE68912852D1 (de)	1994-03-17	Halbleiterlaser.
DE3778510D1 (de)	1992-05-27	Halbleiterlaser.
DE3789832D1 (de)	1994-06-23	Halbleiterlaser-Vorrichtung.
NO872195D0 (no)	1987-05-26	Laseranordning.
DE3776186D1 (de)	1992-03-05	Halbleiterlaser-vorrichtung.
DE3668099D1 (de)	1990-02-08	Laserhalbleiteranordnung.
DE68923778D1 (de)	1995-09-14	Halbleitermodul.
DE3575243D1 (de)	1990-02-08	Halbleiterlaser.

Legal Events

Date	Code	Title	Description
1995-01-05	8363	Opposition against the patent
1999-11-04	8331	Complete revocation