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DE3481675D1 - Vorrichtung zum aendern des abstandes in einer anordnung von halbleiterscheiben. - Google Patents

Vorrichtung zum aendern des abstandes in einer anordnung von halbleiterscheiben.

Info

Publication number
DE3481675D1
DE3481675D1 DE8484115901T DE3481675T DE3481675D1 DE 3481675 D1 DE3481675 D1 DE 3481675D1 DE 8484115901 T DE8484115901 T DE 8484115901T DE 3481675 T DE3481675 T DE 3481675T DE 3481675 D1 DE3481675 D1 DE 3481675D1
Authority
DE
Germany
Prior art keywords
changing
distance
disc arrangement
semiconductor disc
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484115901T
Other languages
English (en)
Inventor
Ltd Kusuhara
Ltd Otsubo
Ltd Yatabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomco Manufacturing Ltd
Original Assignee
Tomco Manufacturing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomco Manufacturing Ltd filed Critical Tomco Manufacturing Ltd
Application granted granted Critical
Publication of DE3481675D1 publication Critical patent/DE3481675D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/18—Mechanical movements
    • Y10T74/18056—Rotary to or from reciprocating or oscillating
    • Y10T74/18296—Cam and slide
    • Y10T74/18304—Axial cam
    • Y10T74/18312—Grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00—Machine element or mechanism
    • Y10T74/18—Mechanical movements
    • Y10T74/18056—Rotary to or from reciprocating or oscillating
    • Y10T74/18296—Cam and slide
    • Y10T74/18304—Axial cam
    • Y10T74/18312—Grooved
    • Y10T74/18328—Alternately rotated screw

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8484115901T 1984-02-29 1984-12-20 Vorrichtung zum aendern des abstandes in einer anordnung von halbleiterscheiben. Expired - Fee Related DE3481675D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59038438A JPS60182735A (ja) 1984-02-29 1984-02-29 ウエ−ハの配列ピツチ変更装置

Publications (1)

Publication Number Publication Date
DE3481675D1 true DE3481675D1 (de) 1990-04-19

Family

ID=12525304

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484115901T Expired - Fee Related DE3481675D1 (de) 1984-02-29 1984-12-20 Vorrichtung zum aendern des abstandes in einer anordnung von halbleiterscheiben.

Country Status (4)

Country Link
US (1) US4597819A (de)
EP (1) EP0153482B1 (de)
JP (1) JPS60182735A (de)
DE (1) DE3481675D1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760907A (en) * 1986-09-29 1988-08-02 Sundstrand Corporation Variable lead differential travel limiting mechanism
JP2657185B2 (ja) * 1988-07-19 1997-09-24 東京エレクトロン株式会社 ピッチ変換機及びそれを用いたピッチ変換方法
US5054988A (en) * 1988-07-13 1991-10-08 Tel Sagami Limited Apparatus for transferring semiconductor wafers
US4902186A (en) * 1988-12-09 1990-02-20 Intelmatec Corporation Disk guide for a disk handling system
JPH07105357B2 (ja) * 1989-01-28 1995-11-13 国際電気株式会社 縦型ｃｖｄ拡散装置に於けるウェーハ移載方法及び装置
US5217340A (en) * 1989-01-28 1993-06-08 Kokusai Electric Co., Ltd. Wafer transfer mechanism in vertical CVD diffusion apparatus
US4957406A (en) * 1989-05-08 1990-09-18 Intelmatec Corporation Apparatus for transferring disks from one cassette to another with different pitch
JPH0360336A (ja) * 1989-07-26 1991-03-15 Komatsu Forklift Co Ltd バッテリの負荷接続装置
JP2812642B2 (ja) * 1993-07-01 1998-10-22 三菱電機株式会社 ウエハ整列機
US5735662A (en) * 1996-05-14 1998-04-07 Micron Technology, Inc. Adjustable wafer transfer machine
US5839769A (en) * 1996-10-03 1998-11-24 Kinetrix, Inc. Expanding gripper with elastically variable pitch screw
KR100248704B1 (ko) * 1997-11-08 2000-03-15 정문술 반도체 소자검사기의 소자 간격조절장치
US6637582B1 (en) * 2000-11-07 2003-10-28 Matthew Kuo Board transmitting device for an upright PC board etching machine
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
US20050006205A1 (en) * 2003-07-07 2005-01-13 Kuo Ming Hong Transporting device for a vertical-type thin circuit board etching machine
TWI293282B (en) * 2003-12-31 2008-02-11 Innolux Display Corp Substrate transfer
KR100622415B1 (ko) * 2004-12-06 2006-09-19 미래산업 주식회사 반도체 소자 테스트 핸들러의 소자 반송장치
KR100648919B1 (ko) * 2005-11-15 2006-11-24 (주)테크윙 픽앤플레이스 장치
JP4999374B2 (ja) * 2006-07-03 2012-08-15 アピックヤマダ株式会社 ワークピッチ変換装置およびワーク搬送システム
SG172499A1 (en) * 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP5592710B2 (ja) * 2010-06-17 2014-09-17 セイコーインスツル株式会社 ピッチ変換装置
CN103688348B (zh) * 2011-08-10 2016-08-17 川崎重工业株式会社 末端作用器装置及具备该末端作用器装置的基板搬运用机械手
KR101431179B1 (ko) * 2012-06-28 2014-08-21 권현철 피치 가변에 따른 피커의 흔들림 방지 구조
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
CN114999980B (zh) * 2022-08-01 2022-11-01 智程半导体设备科技(昆山)有限公司 一种半导体晶圆单片清洗用机械手拿取自动松合机构
CN115132644B (zh) * 2022-08-30 2022-12-02 智程半导体设备科技(昆山)有限公司 一种槽式晶圆清洗装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2723749A (en) * 1954-05-25 1955-11-15 I A Osmundson Lifting and timing wheel and a varied pitch auger for a roller gauge sorting machine
US2849710A (en) * 1955-08-16 1958-08-26 Omer R Wade Mechanical scanner and cam transmission therefor
US3062529A (en) * 1960-01-08 1962-11-06 Dravo Corp Apparatus for constructing stairs
US3302967A (en) * 1965-03-08 1967-02-07 Hyster Co Overhead load-handling apparatus
GB1132145A (en) * 1966-09-16 1968-10-30 Oddy Engineering Ltd Improvements in or relating to receiving and transfer means
US3661019A (en) * 1970-05-07 1972-05-09 Elitex Zavody Textilniho Device for transforming a rotary motion into a linear reversing motion, particularly for textile machines
SE362231B (de) * 1972-01-18 1973-12-03 Asea Ab
US3767027A (en) * 1972-07-25 1973-10-23 Jergen Co A Adjustable guide assembly for feeding bottles and the like to a horizontal moving platform
JPS5243373A (en) * 1975-10-02 1977-04-05 Mitsubishi Electric Corp Jigs for apparatus of producing a semiconductor
US3977566A (en) * 1975-10-31 1976-08-31 Bell Telephone Laboratories, Incorporated Semiconductor wafer handling apparatus
JPS5434774A (en) * 1977-08-24 1979-03-14 Hitachi Ltd Article transfer device
JPS56161653A (en) * 1980-05-16 1981-12-12 Fujitsu Ltd Replacing device of wafer
JPS57201043A (en) * 1981-06-04 1982-12-09 Toshiba Corp Wafer conveying device

Also Published As

Publication number Publication date
EP0153482A3 (en) 1987-05-13
EP0153482B1 (de) 1990-03-14
US4597819A (en) 1986-07-01
EP0153482A2 (de) 1985-09-04
JPS60182735A (ja) 1985-09-18
JPS6336137B2 (de) 1988-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee