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DE19625622A1 - Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement - Google Patents

Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement

Info

Publication number
DE19625622A1
DE19625622A1 DE19625622A DE19625622A DE19625622A1 DE 19625622 A1 DE19625622 A1 DE 19625622A1 DE 19625622 A DE19625622 A DE 19625622A DE 19625622 A DE19625622 A DE 19625622A DE 19625622 A1 DE19625622 A1 DE 19625622A1
Authority
DE
Germany
Prior art keywords
semiconductor
luminescence conversion
radiation
conversion element
semiconductor body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19625622A
Other languages
German (de)
English (en)
Inventor
Ulrike Reeh
Klaus Dr Hoehn
Norbert Dr Stath
Guenter Ing Grad Waitl
Juergen Dr Schneider
Rolf Schmidt
Peter Schlotter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7798103&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE19625622(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19625622A priority Critical patent/DE19625622A1/de
Priority to BRPI9715293A priority patent/BRPI9715293B1/pt
Priority to EP10184975.0A priority patent/EP2270877B1/de
Priority to DE29724848U priority patent/DE29724848U1/de
Priority to CNB2006101016572A priority patent/CN100502066C/zh
Priority to EP04009018.5A priority patent/EP1441397B1/de
Priority to KR1020047019070A priority patent/KR100702740B1/ko
Priority to CN2003101181788A priority patent/CN1534802B/zh
Priority to EP04009017A priority patent/EP1441396B1/de
Priority to JP50211798A priority patent/JP3773541B2/ja
Priority to KR20047019071A priority patent/KR20040111701A/ko
Priority to KR1020047019069A priority patent/KR100734122B1/ko
Priority to CNB2006100999800A priority patent/CN100514684C/zh
Priority to KR1020047019068A priority patent/KR100662955B1/ko
Priority to CNB2006101016500A priority patent/CN100435369C/zh
Priority to DE29724847U priority patent/DE29724847U1/de
Priority to EP10184358.9A priority patent/EP2267801B1/de
Priority to CN200610101629.0A priority patent/CN1893136B/zh
Priority to CNB2005100917295A priority patent/CN100442555C/zh
Priority to CNB2005100917308A priority patent/CN100433382C/zh
Priority to KR1020047019066A priority patent/KR100662956B1/ko
Priority to CNB2006100999783A priority patent/CN100557833C/zh
Priority to KR1020047019067A priority patent/KR100643442B1/ko
Priority to CN200610101860XA priority patent/CN1917240B/zh
Priority to EP04008349A priority patent/EP1434279B1/de
Priority to DE59711671T priority patent/DE59711671D1/de
Priority to KR1020067012235A priority patent/KR100751692B1/ko
Priority to EP10184425.6A priority patent/EP2284912B1/de
Priority to HK00101386.0A priority patent/HK1022564B/zh
Priority to KR1020057009021A priority patent/KR20050053798A/ko
Priority to KR1019980710985A priority patent/KR100537349B1/ko
Priority to DE29724543U priority patent/DE29724543U1/de
Priority to KR1020057009020A priority patent/KR100629544B1/ko
Priority to CN2003101181792A priority patent/CN1534803B/zh
Priority to PCT/DE1997/001337 priority patent/WO1997050132A1/de
Priority to CNB2005100917280A priority patent/CN100565945C/zh
Priority to EP10184980.0A priority patent/EP2282354B1/de
Priority to EP08163321.6A priority patent/EP1993152B1/de
Priority to DE29724582U priority patent/DE29724582U1/de
Priority to KR1020067012234A priority patent/KR100808749B1/ko
Priority to EP10184973.5A priority patent/EP2270876B1/de
Priority to EP04009016A priority patent/EP1441395B9/de
Priority to EP04008348.7A priority patent/EP1439586B1/de
Priority to EP97931666A priority patent/EP0907969B1/de
Priority to DE59713024T priority patent/DE59713024D1/de
Priority to BRPI9709998-8A priority patent/BR9709998B1/pt
Priority to CNB971974020A priority patent/CN1264228C/zh
Publication of DE19625622A1 publication Critical patent/DE19625622A1/de
Priority to US09/221,789 priority patent/US7078732B1/en
Priority to US09/731,220 priority patent/US6812500B2/en
Priority to US09/731,452 priority patent/US6576930B2/en
Priority to US09/828,727 priority patent/US20010030326A1/en
Priority to JP2003355315A priority patent/JP4286104B2/ja
Priority to JP2003355317A priority patent/JP4308620B2/ja
Priority to JP2003355314A priority patent/JP4278479B2/ja
Priority to JP2003355316A priority patent/JP4280598B2/ja
Priority to US10/979,778 priority patent/US7151283B2/en
Priority to US11/080,786 priority patent/US7126162B2/en
Priority to JP2005112811A priority patent/JP4001893B2/ja
Priority to JP2005112809A priority patent/JP4334497B2/ja
Priority to JP2005112810A priority patent/JP4001892B2/ja
Priority to US11/150,916 priority patent/US7345317B2/en
Priority to JP2006268658A priority patent/JP4388940B2/ja
Priority to US11/828,450 priority patent/US7629621B2/en
Priority to JP2007264556A priority patent/JP5260018B2/ja
Priority to JP2008289894A priority patent/JP5630952B6/ja
Priority to US12/610,560 priority patent/US9196800B2/en
Priority to US13/462,952 priority patent/US20120241779A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Led Device Packages (AREA)
DE19625622A 1996-06-26 1996-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement Ceased DE19625622A1 (de)

Priority Applications (67)

Application Number Priority Date Filing Date Title
DE19625622A DE19625622A1 (de) 1996-06-26 1996-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
BRPI9715293A BRPI9715293B1 (pt) 1996-06-26 1997-06-26 elemento de cobertura para um elemento de construção optoeletrônico
EP10184975.0A EP2270877B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE29724848U DE29724848U1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
CNB2006101016572A CN100502066C (zh) 1996-06-26 1997-06-26 具有发光变换元件的发光半导体器件
EP04009018.5A EP1441397B1 (de) 1996-06-26 1997-06-26 Strahlungskonvertierendes Abdeckelement für ein Licht abstrahlendes Halbleiterbauelement, Verfahren zu dessen Herstellung und Licht abstrahlendes halbleiterbauelement
KR1020047019070A KR100702740B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
CN2003101181788A CN1534802B (zh) 1996-06-26 1997-06-26 具有发光变换元件的发光半导体器件
EP04009017A EP1441396B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP50211798A JP3773541B2 (ja) 1996-06-26 1997-06-26 ルミネセンス変換エレメントを有する半導体発光素子
KR20047019071A KR20040111701A (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
KR1020047019069A KR100734122B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
CNB2006100999800A CN100514684C (zh) 1996-06-26 1997-06-26 发光半导体器件和含有该发光半导体器件的装置
KR1020047019068A KR100662955B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
CNB2006101016500A CN100435369C (zh) 1996-06-26 1997-06-26 具有发光变换元件的发光半导体器件
DE29724847U DE29724847U1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP10184358.9A EP2267801B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
CN200610101629.0A CN1893136B (zh) 1996-06-26 1997-06-26 发光半导体器件和含有该发光半导体器件的装置
CNB2005100917295A CN100442555C (zh) 1996-06-26 1997-06-26 发射射线的半导体器件及包含该半导体器件的装置
CNB2005100917308A CN100433382C (zh) 1996-06-26 1997-06-26 半导体器件外壳用的单独覆盖元件和含有覆盖元件的装置
KR1020047019066A KR100662956B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
CNB2006100999783A CN100557833C (zh) 1996-06-26 1997-06-26 发光半导体器件和含有该发光半导体器件的装置
KR1020047019067A KR100643442B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
CN200610101860XA CN1917240B (zh) 1996-06-26 1997-06-26 具有发光变换元件的发光半导体器件
EP04008349A EP1434279B1 (de) 1996-06-26 1997-06-26 Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung
DE59711671T DE59711671D1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement
KR1020067012235A KR100751692B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
EP10184425.6A EP2284912B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
HK00101386.0A HK1022564B (zh) 1996-06-26 1997-06-26 發光半導體器件、全色發光二極管顯示裝置及其應用
KR1020057009021A KR20050053798A (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
KR1019980710985A KR100537349B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
DE29724543U DE29724543U1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
KR1020057009020A KR100629544B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
CN2003101181792A CN1534803B (zh) 1996-06-26 1997-06-26 具有发光变换元件的发光半导体器件
PCT/DE1997/001337 WO1997050132A1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement
CNB2005100917280A CN100565945C (zh) 1996-06-26 1997-06-26 发射射线的半导体芯片及包含该半导体芯片的装置
EP10184980.0A EP2282354B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP08163321.6A EP1993152B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE29724582U DE29724582U1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
KR1020067012234A KR100808749B1 (ko) 1996-06-26 1997-06-26 발광 변환 소자를 포함하는 발광 반도체 소자
EP10184973.5A EP2270876B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP04009016A EP1441395B9 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP04008348.7A EP1439586B1 (de) 1996-06-26 1997-06-26 Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP97931666A EP0907969B1 (de) 1996-06-26 1997-06-26 Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement
DE59713024T DE59713024D1 (de) 1996-06-26 1997-06-26 Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung
BRPI9709998-8A BR9709998B1 (pt) 1996-06-26 1997-06-26 elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência
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JP2003355315A JP4286104B2 (ja) 1996-06-26 2003-10-15 半導体発光素子及び半導体発光素子の使用
JP2003355317A JP4308620B2 (ja) 1996-06-26 2003-10-15 半導体発光素子のケーシング上に載着される別個に製造された被膜板
JP2003355314A JP4278479B2 (ja) 1996-06-26 2003-10-15 半導体発光素子
JP2003355316A JP4280598B2 (ja) 1996-06-26 2003-10-15 発光半導体チップ
US10/979,778 US7151283B2 (en) 1996-06-26 2004-11-02 Light-radiating semiconductor component with a luminescence conversion element
US11/080,786 US7126162B2 (en) 1996-06-26 2005-03-15 Light-radiating semiconductor component with a luminescence conversion element
JP2005112811A JP4001893B2 (ja) 1996-06-26 2005-04-08 半導体発光素子
JP2005112809A JP4334497B2 (ja) 1996-06-26 2005-04-08 半導体発光素子
JP2005112810A JP4001892B2 (ja) 1996-06-26 2005-04-08 半導体発光素子、ｌｅｄ表示装置、照明装置および液晶表示部の照明装置
US11/150,916 US7345317B2 (en) 1996-06-26 2005-06-13 Light-radiating semiconductor component with a luminescene conversion element
JP2006268658A JP4388940B2 (ja) 1996-06-26 2006-09-29 発光半導体チップ
US11/828,450 US7629621B2 (en) 1996-06-26 2007-07-26 Light-radiating semiconductor component with a luminescence conversion element
JP2007264556A JP5260018B2 (ja) 1996-06-26 2007-10-10 半導体素子
JP2008289894A JP5630952B6 (ja) 1996-09-20 2008-11-12 半導体発光素子
US12/610,560 US9196800B2 (en) 1996-06-26 2009-11-02 Light-radiating semiconductor component with a luminescence conversion element
US13/462,952 US20120241779A1 (en) 1996-06-26 2012-05-03 Light-Radiating Semiconductor Component with a Luminescence Conversion Element

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CN1893136A (zh) 2007-01-10
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CN1738067A (zh) 2006-02-22
CN100514684C (zh) 2009-07-15
CN100433382C (zh) 2008-11-12
CN1913183A (zh) 2007-02-14
CN100442555C (zh) 2008-12-10
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CN100502066C (zh) 2009-06-17
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