CN100442555C - 发射射线的半导体器件及包含该半导体器件的装置 - Google Patents
发射射线的半导体器件及包含该半导体器件的装置 Download PDFInfo
- Publication number
- CN100442555C CN100442555C CNB2005100917295A CN200510091729A CN100442555C CN 100442555 C CN100442555 C CN 100442555C CN B2005100917295 A CNB2005100917295 A CN B2005100917295A CN 200510091729 A CN200510091729 A CN 200510091729A CN 100442555 C CN100442555 C CN 100442555C
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- semiconductor device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
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Abstract
Description
Claims (36)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19625622A DE19625622A1 (de) | 1996-06-26 | 1996-06-26 | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
DE19625622.4 | 1996-06-26 | ||
DE19638667.5 | 1996-09-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB971974020A Division CN1264228C (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件、全色发光二极管显示装置及其应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1738067A CN1738067A (zh) | 2006-02-22 |
CN100442555C true CN100442555C (zh) | 2008-12-10 |
Family
ID=7798103
Family Applications (9)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101016572A Expired - Lifetime CN100502066C (zh) | 1996-06-26 | 1997-06-26 | 具有发光变换元件的发光半导体器件 |
CNB2005100917308A Expired - Lifetime CN100433382C (zh) | 1996-06-26 | 1997-06-26 | 半导体器件外壳用的单独覆盖元件和含有覆盖元件的装置 |
CNB2006100999800A Expired - Lifetime CN100514684C (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件和含有该发光半导体器件的装置 |
CN200610101860XA Expired - Lifetime CN1917240B (zh) | 1996-06-26 | 1997-06-26 | 具有发光变换元件的发光半导体器件 |
CNB2005100917280A Expired - Lifetime CN100565945C (zh) | 1996-06-26 | 1997-06-26 | 发射射线的半导体芯片及包含该半导体芯片的装置 |
CNB2006101016500A Expired - Lifetime CN100435369C (zh) | 1996-06-26 | 1997-06-26 | 具有发光变换元件的发光半导体器件 |
CNB2005100917295A Expired - Lifetime CN100442555C (zh) | 1996-06-26 | 1997-06-26 | 发射射线的半导体器件及包含该半导体器件的装置 |
CNB2006100999783A Expired - Lifetime CN100557833C (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件和含有该发光半导体器件的装置 |
CN200610101629.0A Expired - Lifetime CN1893136B (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件和含有该发光半导体器件的装置 |
Family Applications Before (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101016572A Expired - Lifetime CN100502066C (zh) | 1996-06-26 | 1997-06-26 | 具有发光变换元件的发光半导体器件 |
CNB2005100917308A Expired - Lifetime CN100433382C (zh) | 1996-06-26 | 1997-06-26 | 半导体器件外壳用的单独覆盖元件和含有覆盖元件的装置 |
CNB2006100999800A Expired - Lifetime CN100514684C (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件和含有该发光半导体器件的装置 |
CN200610101860XA Expired - Lifetime CN1917240B (zh) | 1996-06-26 | 1997-06-26 | 具有发光变换元件的发光半导体器件 |
CNB2005100917280A Expired - Lifetime CN100565945C (zh) | 1996-06-26 | 1997-06-26 | 发射射线的半导体芯片及包含该半导体芯片的装置 |
CNB2006101016500A Expired - Lifetime CN100435369C (zh) | 1996-06-26 | 1997-06-26 | 具有发光变换元件的发光半导体器件 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100999783A Expired - Lifetime CN100557833C (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件和含有该发光半导体器件的装置 |
CN200610101629.0A Expired - Lifetime CN1893136B (zh) | 1996-06-26 | 1997-06-26 | 发光半导体器件和含有该发光半导体器件的装置 |
Country Status (2)
Country | Link |
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CN (9) | CN100502066C (zh) |
DE (1) | DE19625622A1 (zh) |
Cited By (1)
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CN103764788A (zh) * | 2011-08-04 | 2014-04-30 | 皇家飞利浦有限公司 | 光转换器和包括这样的光转换器的照明单元 |
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KR100662955B1 (ko) | 1996-06-26 | 2006-12-28 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | 발광 변환 소자를 포함하는 발광 반도체 소자 |
DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
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DE19829197C2 (de) * | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
DE19836943B9 (de) * | 1998-08-17 | 2008-01-31 | Osram Opto Semiconductors Gmbh | Photolumineszenzschicht im optischen und angrenzenden Spektralbereichen |
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DE19934126A1 (de) * | 1999-07-23 | 2001-01-25 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle |
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JP6323650B2 (ja) * | 2013-12-20 | 2018-05-16 | セイコーエプソン株式会社 | 面発光レーザーおよび原子発振器 |
DE102014117764A1 (de) * | 2014-12-03 | 2016-06-09 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes optoelektronisches Halbleiterbauteil und Verfahren zu dessen Herstellung |
KR102451208B1 (ko) * | 2015-02-04 | 2022-10-06 | 메르크 파텐트 게엠베하 | 전기 광학 스위칭 엘리먼트 및 디스플레이 디바이스 |
DE102018121324A1 (de) * | 2018-08-31 | 2020-03-05 | Osram Opto Semiconductors Gmbh | Sol-Gele als Bindemittel für die Herstellung von Konversionselementen |
CN111312881A (zh) * | 2020-02-27 | 2020-06-19 | 盐城东山精密制造有限公司 | 一种一体成型led器件及其制作方法 |
DE102020206897A1 (de) | 2020-06-03 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements |
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Also Published As
Publication number | Publication date |
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DE19625622A1 (de) | 1998-01-02 |
CN1722485A (zh) | 2006-01-18 |
CN100557833C (zh) | 2009-11-04 |
CN1881637A (zh) | 2006-12-20 |
CN1722486A (zh) | 2006-01-18 |
CN1905226A (zh) | 2007-01-31 |
CN1983651A (zh) | 2007-06-20 |
CN1917240B (zh) | 2012-05-23 |
CN1893136A (zh) | 2007-01-10 |
CN1917240A (zh) | 2007-02-21 |
CN100565945C (zh) | 2009-12-02 |
CN1738067A (zh) | 2006-02-22 |
CN100514684C (zh) | 2009-07-15 |
CN100433382C (zh) | 2008-11-12 |
CN1913183A (zh) | 2007-02-14 |
CN100435369C (zh) | 2008-11-19 |
CN100502066C (zh) | 2009-06-17 |
CN1893136B (zh) | 2014-03-12 |
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