DE19546990C2 - Anlage zur chemischen Naßbehandlung - Google Patents
Anlage zur chemischen NaßbehandlungInfo
- Publication number
- DE19546990C2 DE19546990C2 DE19546990A DE19546990A DE19546990C2 DE 19546990 C2 DE19546990 C2 DE 19546990C2 DE 19546990 A DE19546990 A DE 19546990A DE 19546990 A DE19546990 A DE 19546990A DE 19546990 C2 DE19546990 C2 DE 19546990C2
- Authority
- DE
- Germany
- Prior art keywords
- plant
- substrates
- transport carriage
- hood
- substrate carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000126 substance Substances 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 147
- 238000001035 drying Methods 0.000 claims description 34
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 18
- 238000009412 basement excavation Methods 0.000 claims description 18
- 239000012530 fluid Substances 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 7
- 210000004197 pelvis Anatomy 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 2
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 34
- 239000007788 liquid Substances 0.000 description 26
- 239000000969 carrier Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000035508 accumulation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 210000003903 pelvic floor Anatomy 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Weting (AREA)
Description
Claims (30)
- - Ausheben der Substrate (5) aus einem Spülfluid (23) und Belassen des Subtratträgers (17) im Behälter (21);
- - Absenken des Spülfluids (23) unter den Substratträger (17); und
- - Absenken der Substrate (25) in den Substrat träger (17) nach dem Trocknungsvorgang.
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19546990A DE19546990C2 (de) | 1995-01-05 | 1995-12-15 | Anlage zur chemischen Naßbehandlung |
DE19549488A DE19549488C2 (de) | 1995-01-05 | 1995-12-15 | Anlage zur chemischen Naßbehandlung |
DE19549490A DE19549490C2 (de) | 1995-01-05 | 1995-12-15 | Anlage zur chemischen Naßbehandlung |
DE19549487A DE19549487C2 (de) | 1995-01-05 | 1995-12-15 | Anlage zur chemischen Naßbehandlung |
EP95943224A EP0801814B1 (de) | 1995-01-05 | 1995-12-29 | Anlage zur chemischen nassbehandlung |
AT95943224T ATE205017T1 (de) | 1995-01-05 | 1995-12-29 | Anlage zur chemischen nassbehandlung |
JP08520722A JP3088463B2 (ja) | 1995-01-05 | 1995-12-29 | 化学的湿式処理装置 |
CN95197255A CN1084048C (zh) | 1995-01-05 | 1995-12-29 | 用于化学湿处理的装置 |
DE59509568T DE59509568D1 (de) | 1995-01-05 | 1995-12-29 | Anlage zur chemischen nassbehandlung |
KR1019970704546A KR100275166B1 (ko) | 1995-01-05 | 1995-12-29 | 화학 습식 처리 장치 |
US08/875,408 US5902402A (en) | 1995-01-05 | 1995-12-29 | Device for chemical wet treatment |
CA002209339A CA2209339A1 (en) | 1995-01-05 | 1995-12-29 | Wet chemical treatment installation |
PCT/EP1995/005153 WO1996021241A1 (de) | 1995-01-05 | 1995-12-29 | Anlage zur chemischen nassbehandlung |
TW085100109A TW399224B (en) | 1995-01-05 | 1996-01-05 | A chemical wet treatment device |
FI972733A FI972733A0 (fi) | 1995-01-05 | 1997-06-25 | Kemiallinen märkäkäsittelylaitteisto |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19500239 | 1995-01-05 | ||
DE19546990A DE19546990C2 (de) | 1995-01-05 | 1995-12-15 | Anlage zur chemischen Naßbehandlung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19546990A1 DE19546990A1 (de) | 1996-07-11 |
DE19546990C2 true DE19546990C2 (de) | 1997-07-03 |
Family
ID=7751056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19546990A Expired - Fee Related DE19546990C2 (de) | 1995-01-05 | 1995-12-15 | Anlage zur chemischen Naßbehandlung |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100275166B1 (de) |
DE (1) | DE19546990C2 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6189552B1 (en) | 1996-11-22 | 2001-02-20 | Steag Microtech Gmbh | Substrate processing device |
US6244282B1 (en) | 1996-11-04 | 2001-06-12 | Steag Microtech Gmbh | Substrate treatment device |
DE10215284A1 (de) * | 2002-04-05 | 2003-10-30 | Astec Halbleitertechnologie Gm | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE10118167B4 (de) * | 2000-04-11 | 2007-06-28 | Samsung Electronics Co., Ltd., Suwon | Vorrichtung und Verfahren zur Reinigung von Halbleiterwafern |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19616402C2 (de) * | 1996-04-24 | 2001-11-29 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19616400C2 (de) * | 1996-04-24 | 2001-08-30 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19654903C2 (de) * | 1996-04-24 | 1998-09-24 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
DE19644779C2 (de) * | 1996-10-28 | 2001-06-28 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten, insbesondere auch von Halbleiterwafern |
DE19640848C2 (de) | 1996-10-03 | 1998-07-16 | Steag Microtech Gmbh Pliezhaus | Verfahren und Vorrichtung zum Behandeln von Substraten |
DE19644255C1 (de) | 1996-10-24 | 1998-04-30 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten und Verwendung der Vorrichtung |
DE19644253A1 (de) | 1996-10-24 | 1998-05-07 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten |
US5954068A (en) * | 1996-12-06 | 1999-09-21 | Steag Microtech Gmbh | Device and method for treating substrates in a fluid container |
DE19706072C1 (de) * | 1997-02-17 | 1998-06-04 | Steag Microtech Gmbh Pliezhaus | Vorrichtung und Verfahren zum Behandeln von Substraten in einem Fluid-Behälter |
JP3043709B2 (ja) * | 1997-11-19 | 2000-05-22 | 株式会社カイジョー | 基板の乾燥装置 |
DE10021329C1 (de) * | 2000-05-02 | 2001-10-11 | Steag Microtech Gmbh Pliezhaus | Verfahren und Vorrichtung zum Behandeln von scheibenförmigen Substraten |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4500407A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Disk or wafer handling and coating system |
DE3637880C2 (de) * | 1986-11-06 | 1994-09-01 | Meissner & Wurst | Transportierbares Behältnis zur Handhabung von Halbleiterelementen während ihrer Herstellung sowie Verfahren zur partikelfreien Übergabe von Produkten |
NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
JPH05270660A (ja) * | 1992-03-24 | 1993-10-19 | Tokyo Electron Ltd | 洗浄処理装置 |
US5299901A (en) * | 1992-04-16 | 1994-04-05 | Texas Instruments Incorporated | Wafer transfer machine |
DE4232183A1 (de) * | 1992-09-25 | 1994-03-31 | Ralf G Helmecke | Verfahren und Vorrichtung zur Oberflächenbehandlung von aus einem Tauchbad geführten Festkörpern |
-
1995
- 1995-12-15 DE DE19546990A patent/DE19546990C2/de not_active Expired - Fee Related
- 1995-12-29 KR KR1019970704546A patent/KR100275166B1/ko not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6244282B1 (en) | 1996-11-04 | 2001-06-12 | Steag Microtech Gmbh | Substrate treatment device |
US6189552B1 (en) | 1996-11-22 | 2001-02-20 | Steag Microtech Gmbh | Substrate processing device |
DE10118167B4 (de) * | 2000-04-11 | 2007-06-28 | Samsung Electronics Co., Ltd., Suwon | Vorrichtung und Verfahren zur Reinigung von Halbleiterwafern |
DE10215284A1 (de) * | 2002-04-05 | 2003-10-30 | Astec Halbleitertechnologie Gm | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE10215284B4 (de) * | 2002-04-05 | 2007-05-31 | Astec Halbleitertechnologie Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
Also Published As
Publication number | Publication date |
---|---|
KR100275166B1 (ko) | 2001-01-15 |
DE19546990A1 (de) | 1996-07-11 |
KR980701133A (ko) | 1998-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: STEAG MICROTECH GMBH, 72124 PLIEZHAUSEN, DE |
|
8181 | Inventor (new situation) |
Free format text: DURST, JOHANN, DIPL.-ING., 78166 DONAUESCHINGEN, DE SCHULZ, WERNER, 73434 AALEN, DE |
|
8181 | Inventor (new situation) |
Free format text: DURST, JOHANN, DIPL.-ING., 78166 DONAUESCHINGEN, DE SCHULZ, WERNER, 78166 DONAUESCHINGEN, DE |
|
D2 | Grant after examination | ||
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8327 | Change in the person/name/address of the patent owner |
Owner name: SCP U.S.,INC., WILMINGTON, DEL., US |
|
8339 | Ceased/non-payment of the annual fee |