CN2867803Y - Liquid-cooled heat sink - Google Patents

Abstract

A liquid-cooled heat sink for heat exchange of a circuit board of an electronic device, the liquid-cooled heat sink comprising: a first interlayer contacting one side of the circuit board, having a first circulation path for circulating cooling liquid therein, and absorbing heat energy from the circuit board; and a second interlayer provided on an outer surface of the electronic device, having a first circulation path in which a coolant flows and which is in contact with the first circulation path, and diffusing thermal energy of the coolant to the outside of the electronic device. The utility model discloses a liquid cooling type heat abstractor absorbs the heat that comes from this circuit board through the first intermediate layer that contacts this circuit board to by the outside that the second intermediate layer that sets up at the electronic equipment lateral surface spreads the heat of this coolant liquid to electronic equipment, borrow this and can carry out active heat exchange heat dissipation efficiency to electronic equipment's circuit board, do not use radiator fan, can prevent to produce too big noise, vibrations and too much power consumption, promote its industry value.

Description

Liquid-cooled heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device used in circuit boards of electronic equipment.

Background technique

Today's electronic technology is changing with each passing day, and various electronic components with specific functions are developing towards integrated circuits. In line with the maturity of nanotechnology and people's demand for computer miniaturization and powerful functions, familiar computer motherboards and their processors and various chips The specifications have been reduced again and again, and the computing and storage functions have become more powerful, and blade servers (Blade Servers) should be produced.

The blade server greatly reduces the size of the motherboard of each server unit, and configures a central processing unit (Central Processor Unit, CPU), chipset, memory and hard disk, so that each server unit is like an independently operating, replaceable computer system , and then assemble these server units on the chassis in a manner of being next to each other side by side, and integrate the motherboard, power supply, fan group, etc. to form a blade server. Although the architecture design of the blade server can save space, when these server units in the machine work together, its heat dissipation problem in a small space is particularly prominent.

In order to solve the problem of heat dissipation in a small space, Hitachi Manufacturing Co., Ltd. proposes a liquid cooling system for a computer, as shown in the No. 550449 invention patent of Taiwan Patent Announcement, which can be applied to a central processing unit (CPU). ) and the control circuit substrate of the chipset, or the computer body part with the above-mentioned control circuit substrate and hard disk drive, and the display part rotatably supported on the above-mentioned computer body part. A pipeline filled with cooling liquid is connected to the above-mentioned heat receiving head, and the above-mentioned pipeline is provided between the liquid crystal display panel of the above-mentioned display part and the frame of the display part, and the above-mentioned pipeline is arranged in a serpentine shape or a zigzag shape, and the cooling liquid in the above-mentioned pipe is circulated as The heat transfer medium absorbs the heat generated by the above-mentioned heat-generating part by a part of the above-mentioned heat-receiving pipe or pipeline, and radiates heat in the other part.

In addition, China Taiwan Patent Publication No. 509349 utility model patent also proposes a liquid-cooled computer element cooling device, which includes a base and a conductor, the base has a top plate and a wall plate extending downward from the periphery of the top plate , the two cooperate to define a concave hole, and the bottom surface of the top plate is provided with at least one partition plate protruding toward the concave hole, by which an inlet passage and an outlet passage that can communicate with each other can be separated in the concave hole by the partition board Symmetrical to the top plate of the lead-in and lead-out channels, there is an inlet for cooling liquid to flow in and an outlet for cooling liquid to flow out; Be located on the top surface of the opening of the concave hole and a bottom surface that can be closely attached to the computer element. The top surface is upwardly provided with a plurality of heat sinks that can be stretched in the concave hole. On the opposite sides of the adjacent two heat dissipation There is a channel in between, and each heat sink is provided with a plurality of penetrating parts that can penetrate the two sides; thereby, when a pump is used to force the cooling liquid into the concave hole through the inlet for heat exchange, it can reach the temperature of the computer. Component cooling purpose.

Although the above-mentioned Taiwan Patents No. 550449 and No. 509349 both mentioned the liquid-cooled heat dissipation design, they can only dissipate heat from power crystals such as central processing units. This design can be applied to server units such as blade servers However, since the heat derived from each of the server units is easy to accumulate in the motherboard of the blade server, the above-mentioned patents do not have any improvement solutions. If the design of the above-mentioned patent case is applied to the motherboard, conductors (or heating heads) must be individually arranged for various heating elements of the motherboard (such as the central processing unit, south bridge chip, north bridge chip, hard disk, etc.), which will occupy the server There is a lot of space inside the chassis, which even leads to the dilemma that the chassis of the server must be enlarged, which has no industrial application value.

For example, in order to solve the heat dissipation problem of the internal motherboard of a server or a personal computer, the industry installs an aluminum backplane on the back of the motherboard. Referring to FIG. on the aluminum backboard 12 , and then diffuse through the air flow between the aluminum backplane 12 and the chassis 13 . For blade servers, the mainboard 10 inside the chassis 13 absorbs too much heat from the surface electronic components, and the space between the back of the mainboard 10 and the chassis 13 is limited, resulting in slow air circulation. Utilizing this passive heat dissipation cannot meet the needs of the mainboard at all. 10 cooling requirements.

For this reason, the industry can only provide active cooling effects such as the motherboard of the server by adding a system fan. However, this approach will greatly increase the volume, vibration and noise of the system on the one hand, and will also increase the performance of the system on the other hand. Power consumption is not conducive to energy saving.

Therefore, in the face of the current situation of resource scarcity in the world and people's strict requirements on electronic products, it has become an urgent problem to be solved in the industry to find a cooling method for server motherboards that meets the needs of saving resources and reducing noise.

Utility model content

In order to overcome the above-mentioned shortcomings of the prior art, the main purpose of the present utility model is to provide a liquid-cooled heat dissipation device for actively exchanging and dissipating heat from the circuit board of the electronic equipment.

Another object of the present invention is to provide a liquid-cooled heat dissipation device, which avoids the disadvantage of excessive noise generated by traditional heat dissipation fans.

Another object of the present utility model is to provide a liquid-cooled heat dissipation device to save electric energy.

In order to achieve the above and other purposes, the utility model provides a liquid-cooled heat dissipation device, which is applied to the heat exchange of electronic equipment circuit boards. The liquid-cooled heat dissipation device includes: a first interlayer, which contacts one side of the circuit board, There is a first circulating path for circulating cooling liquid inside, absorbing heat energy from the circuit board; and a second interlayer, arranged on the outer surface of the electronic device, has a second interlayer connected with the first circulating path for circulating cooling liquid inside. A circulation path to dissipate the heat of the coolant to the outside of the electronic device.

In the above-mentioned liquid-cooled heat dissipation device, the surface of the circuit board has a plurality of heating elements, the first circulation path of the first interlayer can coil through each of the heating elements, and the first circulation path passes through the coiling density of each heating element area, It can be higher than the coil density of the area where no heating element is arranged on the surface of the circuit board. The first circulation path can be formed by a heat pipe (Heat Pipe) arranged inside the first interlayer. In addition, the circuit board can be a main board, the heat of which can be conducted to a metal plate through a plurality of screws, and then conducted to the first interlayer through the metal plate.

The liquid-cooled heat dissipation device provided by the present invention may also include a pump connected between the first circulation path and the second circulation path to drive the cooling liquid. The second circulation path of the second interlayer can be arranged in a circular structure, and the second circulation path can be formed by a heat pipe arranged inside the second interlayer. In addition, a channel can also be provided to connect the first circulation path and the second circulation path; the electronic device has a side plate of the case, and the first interlayer and the first interlayer are respectively arranged on the sides of the side plate of the case. Inner and outer sides.

The liquid-cooled heat sink of the utility model absorbs the heat from the circuit board through the first interlayer contacting the circuit board, and diffuses the heat of the cooling liquid to the electronic device through the second interlayer arranged on the outer surface of the electronic device. Externally, active heat exchange and heat dissipation can be performed on the circuit board of electronic equipment without using a cooling fan, which can prevent excessive noise, vibration and excessive power consumption, and enhance its industrial utilization value.

Description of drawings

FIG. 1 is a schematic diagram of a heat dissipation structure of a motherboard in the prior art;

Fig. 2 is a schematic diagram of the application of the liquid-cooled heat dissipation device of the present invention in electronic equipment;

Fig. 3 is a schematic diagram of the distribution of the liquid-cooled heat dissipation device of the present invention applied to the heating element of the circuit board;

Fig. 4 is a schematic diagram of the contact relationship between the first interlayer and the circuit board of the liquid-cooled heat dissipation device of the present invention; and

Fig. 5 is a schematic diagram of heat flow of the liquid-cooled heat dissipation device of the present invention.

Detailed ways

Example

Fig. 2 is a schematic diagram of the application of the liquid-cooled heat dissipation device of the present invention in electronic equipment. As shown in the figure, the liquid-cooled heat sink 3 provided by the utility model is applied in the circuit board 23 of an electronic device 2, and the liquid-cooled heat sink 3 includes a first interlayer 31 that contacts the circuit board 21, A second interlayer 33 disposed on the outer surface of the electronic device 3 and a pump 35 driving cooling fluid to circulate to the first interlayer 31 and the second interlayer 33 . In this embodiment, the electronic device 2 is a server, which has a case 21 and a side plate 211 of the case, and the circuit board 23 is a main board, which is arranged inside the case 21 adjacent to the side plate 211 of the case. It should be noted that although the application in the server 2 is taken as an example in this embodiment, it is not intended to limit the scope of application of the utility model. Any electronic device with a circuit board or equivalent equipment belongs to the scope of application of the utility model. In addition, the case side panel 211 may be a side panel of the case 21 or a cover plate of the case 21 .

Please refer to Fig. 2, the liquid-cooled heat sink 3 provided by the present invention includes a first interlayer 31, a second interlayer 33 and a pump 35, the first interlayer 31 is in contact with one side of the circuit board 23, and is formed by a high The material with thermal conductivity, such as aluminum or copper, is used to absorb heat from the circuit board 23 . The second interlayer 33 is disposed on the outer surface of the electronic device 2 . In this embodiment, the first interlayer 31 is arranged on the inner surface of the side plate 211 of the case, and directly or indirectly contacts the back side of the circuit board 23. If the circuit board 23 is taken as an example of a main board, its heat can pass through A plurality of screws are conducted to a metal plate (not shown), and then conducted to the first interlayer 31 through the metal plate; the second interlayer 33 is arranged on the outer side of the case side plate 211, and the second interlayer 33 has a second circulation path 331 inside, the second circulation path 331 can be formed by a heat pipe (Heat Pipe) arranged inside the second interlayer 33, and can be arranged in a ring structure, but not limited thereto.

Please refer to Fig. 3 and Fig. 4, the surface of the circuit board 23 of the electronic device 2 has a plurality of heating elements 231, such as central processing units, various power crystals, hard disks or various expansion cards, etc., the inside of the first interlayer 31 There is a first circulation path 311 through which cooling fluid flows to absorb heat from the circuit board 23 . In this embodiment, the first circulation path 311 of the first interlayer 31 can be coiled through each of the heating elements 231 , and the coiling density of the first circulation path 311 passing through each of the heating elements 231 can be higher than that of the circuit board 23 The coil density of the region where no heating element 231 is provided on the surface. The first circulation path 311 may be formed by a heat pipe (Heat Pipe) disposed inside the first interlayer 31, but it is not limited thereto. In addition, a channel can be provided to connect the first circulation path 311 and the second circulation path 331 .

The pump 35 is arranged and connected between the first circulation path 311 and the second circulation path 331 to drive the coolant to circulate in the first circulation path 311 of the first interlayer 31 and the second circulation of the second interlayer 33 Specifically, the path 311 may be set in, for example, the channel connecting the first circulation path 311 and the second circulation path 331 described above. The pump 35 can be, for example, a mini-pump, and the circulation speed of the cooling liquid can be changed by adjusting the rotating speed of the pump 35, so that the electronic equipment no matter what kind of placement it is in, such as a horizontal server or a vertical type server, can achieve the ideal heat dissipation effect.

As shown in Figure 3, when the heat generated by the electronic equipment 2 in the working state is accumulated on the circuit board 23, the heat can be directly or indirectly conducted to the liquid-cooled heat sink 3 of the present invention through heat conduction or heat convection. The first interlayer 31, and the cooling liquid absorbs the heat by its internal first circulation path 311 (not shown) and continues to circulate to make it uniform. At the same time, the pump 35 will be located in the first circulation path 311 The heat-absorbed cooling liquid is driven to circulate in the second circulation path 331 , and the heat of the cooling liquid can be diffused to the outside of the electronic device 2 through the second interlayer 33 .

Since the second interlayer 33 is arranged outside the electronic equipment 2 at room temperature, its temperature can be lowered by natural heat exchange with the outside room temperature air, even if a pump 35 is not provided in the liquid-cooled heat sink 3 of the present invention, The cooling liquid circulating in the first circulation path 311 can still be driven to flow to the second circulation path 331 by natural heat convection, forming a natural heat convection circulation effect. Therefore, the liquid-cooled heat sink 3 of the present utility model can also work normally without using electric energy, which reduces the consumption of electric energy, or even if the liquid-cooled heat sink 3 of the present utility model is provided with a pump 35 in order to drive the cooling liquid, drive the The electric energy required by the pump 35 is also far lower than the electric energy required to drive multiple cooling fan groups in the prior art, so it still has the effect of saving electric energy.

Compared with the prior art, the liquid-cooled heat sink of the present invention absorbs the heat from the circuit board through the first interlayer contacting the circuit board, and the cooling liquid is absorbed by the second interlayer arranged on the outer surface of the electronic equipment. The heat is diffused to the outside of the electronic equipment, providing active heat exchange and heat dissipation effect for the circuit board of the electronic equipment, and avoiding excessive noise, vibration and excessive power consumption without using a cooling fan, which relatively solves the problems existing in the prior art question.

Claims (10)

1. A liquid-cooled heat dissipation device, which is applied to the heat exchange of the circuit board of an electronic device, is characterized in that, the liquid-cooled heat dissipation device comprises: The first interlayer, which is in contact with one side of the circuit board, has a first circulation path for circulating cooling fluid inside, absorbing heat from the circuit board; and The second interlayer is arranged on the outer surface of the electronic device, and has a first circulation path connected with the first circulation path to circulate the cooling liquid inside, and diffuses the heat of the cooling liquid to the outside of the electronic device. 2 . The liquid-cooled heat dissipation device according to claim 1 , wherein the surface of the circuit board has a plurality of heating elements, and the first circulation path of the first interlayer coils through each of the heating elements. 3 . 3 . The liquid-cooled heat sink as claimed in claim 2 , wherein the winding density of the first circulation path passing through each area of the heating element is higher than the winding density of the area without the heating element on the surface of the circuit board. 4 . 4. The liquid-cooled heat sink as claimed in claim 1, wherein the first circulation path is formed by a heat pipe disposed inside the first interlayer. 5. The liquid-cooled heat dissipation device according to claim 1, wherein the circuit board is a main board, and its heat is conducted to a metal plate through a plurality of screws, and then conducted to the first interlayer through the metal plate . 6. The liquid-cooled heat sink according to claim 1, further comprising a pump connected between the first circulation path and the second circulation path to drive the cooling liquid . 7 . The liquid-cooled heat dissipation device according to claim 1 , wherein the second circulation path of the second interlayer is arranged in a circular structure. 8 . 8. The liquid-cooled heat sink as claimed in claim 1, wherein the second circulation path is formed by a heat pipe disposed inside the second interlayer. 9 . The liquid-cooled heat sink as claimed in claim 1 , wherein the liquid-cooled heat sink is further provided with a channel connecting the first circulation path and the second circulation path. 10. The liquid-cooled heat dissipation device according to claim 1, wherein the electronic device has a case side plate, and the first interlayer and the first interlayer are respectively arranged on the inner side and the outer side of the case side plate .

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