CN2665919Y - expandable heat sink - Google Patents

Abstract

The utility model relates to an expandable heat dissipation device, which utilizes a pump, a distributor, a main heat dissipation structure and the like to be connected with a heat dissipation pipe in series to form a cooling loop, refrigerant liquid is filled in the loop, and the heat dissipation pipe is tightly attached to a microprocessor or other heat source components in a computer for heat dissipation; the heat generated by the operation of the microprocessor or other heat sources of the computer can be quickly conducted and radiated through the flowing of the refrigerant (water) in the radiating pipe, so that the radiating problem of the heat source in the mainboard or the computer is solved, and the aim of improving the processing speed and the function of the computer is fulfilled.

Description

expandable heat sink

technical field

The utility model relates to an expandable heat dissipation device, in particular to a distributor with multi-directional joints, so as to adapt to the increase of heat source components in the computer or on the mainboard, and to connect the heat dissipation pipes with the pipe joints reserved by the distributor. An expandable heat sink that is in contact with a new heat source component to efficiently dissipate heat from the heat source component.

Background technique

The overclocking limit of computer microprocessors is a hot topic in today's scientific and technological discussions, especially the heat generated when the microprocessor is running affects its overclocking limit. At present, the heat dissipation method of the microprocessor has been encountering a technical bottleneck, which not only affects the stability of the computer itself, but also causes many unexplained downtimes because the heat dissipation problem cannot be solved. The heat dissipation methods used in microprocessors in the early days are nothing more than heat sinks and fans, because of their low cost and have been widely used. However, the materials of conventional heat sinks are almost all made of aluminum alloy, and the contact between the surface area of the heat sink and the air is used to dissipate heat. The more the area in contact with the air, the better the heat dissipation effect achieved. Very few other materials are used, but the thermal conductivity is not much different. Nowadays, computer products are developing in the direction of thinner, thinner and smaller, and more and more heat source components (such as: microprocessor, hard disk, CR-ROM, power supply unit, display module, etc.) are installed inside, and chips can be added according to demand Groups or other heat-generating accessories, so the requirements for high-quality heat dissipation are getting higher and higher, and the existing technologies can no longer meet the requirements.

Contents of the invention

The purpose of the present utility model is to provide an expandable heat dissipation device which can effectively improve the heat dissipation problem of the motherboard or the internal heat source of the computer, and can be expanded when necessary.

The purpose of this utility model is achieved through the following technical means: an expandable heat dissipation device, including a pump, a main heat dissipation structure and a heat dissipation pipe 3, and the device also includes a distributor with a plurality of pipe joints, The heat dissipation pipe is a pipe body that can be configured on the heat source assembly.

In the expandable heat dissipation device, the distributor has four pipe joints. In the expandable heat dissipation device, the heat dissipation pipe can be directly coiled and attached to the heat source assembly. In the expandable heat dissipation device, the heat dissipation pipe attached to the heat source assembly can be made into a heat dissipation unit, and the disc-shaped heat dissipation pipe is embedded in the heat dissipation unit.

The utility model has the advantages of: 1. It can effectively improve the heat dissipation problem of the main board or the internal heat source of the computer; 2. It can be expanded when necessary to meet the heat dissipation problem of new components.

Description of drawings

FIG. 1 is a perspective view of the expandable heat sink of the present invention.

Fig. 2 is the embodiment figure that the utility model is used in the portable computer.

Detailed ways

As shown in Figure 1, the expandable heat dissipation device of the present utility model includes a pump 1, a distributor 2 with a plurality of pipe joints 21, a main heat dissipation structure 5 and heat dissipation pipes that can be arranged on the heat source assembly 4 3. The output end 11 of the pump 1 is connected to a pipe joint 21 of the distributor 2 with a heat dissipation pipe 3, and then other pipes in the distributor 2 (in this embodiment, there are four pipe joints 21 in different directions) The joints 21 are respectively connected to the heat dissipation pipes 3 and make the heat dissipation pipes 3 close to the heat source assembly 4, and then connected to a main heat dissipation structure 5, and then connected back to the input end 12 of the pump 1 to form a cooling circuit, and in the circuit Fill with refrigerant liquid (or water). The part of the above-mentioned radiating pipe 3 closely attached to the heat source assembly 4 can be fixed on a metal body to form a radiating unit 6 , so that the disc-shaped radiating pipe 3 is embedded in the radiating unit 6 .

When the above-mentioned device is assembled in the computer or used on the motherboard, the heat generated by the heat source assembly 4 will be generated by the heat dissipation pipe 3 close to it, and through the operation of the pump 1, the refrigerant liquid inside the heat dissipation pipe 3 will be forced to circulate in the entire circuit. In order to quickly take the heat away from the heat source assembly 4 and transmit it to the main heat dissipation structure 5 (such as the casing or a radiator with a fan or other external heat sinks, etc.), to achieve the expected rapid heat dissipation effect.

Figure 2 is a schematic diagram of an embodiment of a heat sink of the present invention applied to a portable computer. As shown in the figure, the heat source assembly 4 in the computer at least includes: a microprocessor 4a, a hard disk 4b, a CR-ROM4c, a power supply unit 4d, display module 4e, etc., when the utility model is implemented, a pipe joint 21 of the distributor 2 is connected to the heat dissipation pipe 3, bypassing each heat source assembly and then connected back to the pump 1 to form a heat dissipation circuit to achieve the purpose of heat dissipation . When adding other heat source components that can generate heat inside a computer, the unused pipe joint 21 in the distributor 2 of the present utility model can be connected to another heat pipe 3 to the newly added heat source component, or a distributor can be added. 2 is connected back to the pump 1 to form another circuit, which can quickly absorb heat and transmit it to the heat sink 5 for more effective heat dissipation, so that the utility model can achieve the effect of expandable heat dissipation.

Claims (4)

1, a kind of extendible type heat abstractor comprises a gang of Pu, a main heat-dissipating structure and radiating tube 3, it is characterized in that: comprise also in this device that one has the distributor of a plurality of pipe joints, radiating tube is configurable body to the thermal source assembly.

2, extendible type heat abstractor according to claim 1, it is characterized in that: distributor has four pipe joints.

3, extendible type heat abstractor according to claim 1, it is characterized in that: radiating tube can directly coil and be attached on the thermal source assembly.

4, extendible type heat abstractor according to claim 1, it is characterized in that: the radiating tube that is attached on the thermal source assembly can be made into a heat-sink unit, and the plate-like radiating tube is embedded in heat-sink unit.

Images