CN205384573U - Novel multi -functional computer radiator - Google Patents

Abstract

The utility model discloses a novel multifunctional computer radiator, which comprises an air inlet device, a cooling fin, a heat dissipation pipe and a liquid conveying pipe. connected to form an integrated structure, a pressure sensor is arranged under the buckle, the pressure sensor is arranged on the left side of the air outlet device, and an operation indicator light is arranged under the air outlet device, and the operation indicator light passes through The pressure sensor is connected with the buckle. By making the heat sink directly contact with the surface of the CPU, the heat on the CPU surface is transferred to the CPU heat sink through heat conduction. It has extremely high thermal conductivity, good isothermal property, and is composed of heat pipes The device has high heat transfer efficiency, compact structure, can control the temperature of the tube wall, avoids dew point corrosion, is quiet, stable in cooling, less dependent on the environment, intuitive, economical, convenient, simple in design, low in cost, and can be widely used.

Description

New multifunctional computer radiator

technical field

The utility model relates to the technical field of electronic equipment, in particular to a novel multifunctional computer radiator.

Background technique

The radiator is a device or instrument that transfers the heat generated by machinery or other appliances during the working process in time to avoid affecting its normal operation. Common radiators can be divided into air cooling, heat pipe, liquid cooling, semiconductor refrigeration, compression, etc. according to the heat dissipation method. There are various types of mechanical refrigeration, and integrated circuits are widely used in computer components. As we all know, high temperature is the enemy of integrated circuits. The heat does not come from outside the computer, but inside the computer, or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it to the inside or outside of the chassis to ensure that the temperature of the computer components is normal. Most radiators pass through and generate heat. There are many types of heat sinks, such as CPU, graphics card, motherboard chipset, hard disk, chassis, power supply, even optical drive and memory. These are different. The heat sink of the CPU cannot be mixed, and the heat sink of the CPU is the most frequently contacted one.

However, the popular computer radiators in the domestic market not only have poor heat dissipation effect and low heat dissipation efficiency, but also have high noise, uncompact structure, unstable cooling, and relatively difficult installation.

Utility model content

Aiming at the above problems, the utility model provides a novel multi-functional computer heat sink. By making the heat sink directly contact with the surface of the CPU, the heat on the CPU surface is transferred to the CPU heat sink through heat conduction, which has extremely high thermal conductivity and good Isothermal, heat exchanger composed of heat pipes has high heat transfer efficiency, compact structure, can control the temperature of the tube wall, avoid dew point corrosion, quiet, stable cooling, less dependent on the environment, and intuitive, economical, convenient, simple design, low cost It is cheap, can be widely promoted and used, and can effectively solve the problems in the background technology.

In order to achieve the above object, the technical scheme adopted by the utility model is as follows: a novel multifunctional computer radiator, comprising an air inlet device, a cooling fin, a cooling pipe and a liquid delivery pipe, the right side of the air inlet device is provided with a cooling fin , the heat sink is directly connected with the heat dissipation pipe to form an integrated structure, the heat dissipation pipe is connected with the heat dissipation fan through the liquid delivery pipe, and the right side of the heat dissipation fan is provided with a pressure reducing valve, and the pressure relief valve Located above the liquid delivery pump, the liquid delivery pump is directly connected to the buckle, and a pressure sensor is arranged below the buckle, the pressure sensor is set on the left side of the air outlet device, and the bottom of the air outlet device A running indicator light is provided, and the running indicator light is connected with the buckle through a pressure sensor.

As a preferred technical solution of the utility model, a running indicator light is provided below the pressure sensor.

As a preferred technical solution of the utility model, the operation indicator light is arranged on the right side of the temperature sensor, and the temperature sensor is directly connected to the liquid delivery pump.

As a preferred technical solution of the present utility model, the cooling fan is connected to the cooler through a liquid delivery pipe, and a heat absorbing device is provided on the left side of the cooler.

As a preferred technical solution of the present invention, the heat absorbing device is directly connected with the heat-conducting silicone grease.

The beneficial effects of the utility model:

The utility model transfers the heat on the surface of the CPU to the CPU heat sink through heat conduction by directly contacting the heat sink with the surface of the CPU. In addition, the airflow generated by the heat dissipation fan takes away the heat on the surface of the CPU heat sink through thermal convection, and the air in the chassis The flow is also to take away the heat of the air around the CPU heat sink through heat convection until it reaches the outside of the case. At the same time, all parts with high temperature will radiate heat to the parts with low temperature around them. It has extremely high thermal conductivity, good isothermal property, cold The heat transfer area on both sides of the heat can be changed arbitrarily, long-distance heat transfer, temperature control, etc., and the heat exchanger composed of heat pipes has high heat transfer efficiency and compact structure, which can control the temperature of the tube wall and avoid dew point corrosion. , quiet, stable cooling, less dependent on the environment, intuitive, economical, convenient, simple in design, low in cost, and can be widely used.

Description of drawings

Fig. 1 is a schematic diagram of the overall structure of the utility model.

Fig. 2 is a structural schematic diagram of the utility model heat sink.

The labels in the figure are: 1-air intake device; 2-radiating fin; 3-radiating pipe; 4-liquid delivery pipe; 5-radiating fan; 6-pressure reducing valve; 7-liquid delivery pump; 8-fastener; 9 -pressure sensor; 10-air outlet device; 11-operation indicator light; 12-temperature sensor; 13-cooler; 14-thermal silicone grease; 15-heat absorption device.

detailed description

In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

Specific examples:

As shown in Figures 1 and 2, a novel multifunctional computer radiator includes an air intake device 1, a cooling fin 2, a cooling pipe 3 and a liquid delivery pipe 4, and the right side of the air intake device 1 is provided with a cooling fin 2. The heat sink 2 is directly connected with the heat dissipation pipe 3 to form an integrated structure, the heat dissipation pipe 3 is connected with the heat dissipation fan 5 through the liquid delivery pipe 4, and the right side of the heat dissipation fan 5 is provided with a pressure reducing valve 6 , the pressure reducing valve 6 is set above the liquid delivery pump 7, the liquid delivery pump 7 is directly connected with the buckle 8, and a pressure sensor 9 is arranged under the buckle 8, and the pressure sensor 9 is set at the outlet On the left side of the wind device 10, an operation indicator light 11 is provided below the air outlet device 10, and the operation indicator light 11 is connected with the buckle 8 through the pressure sensor 9; by adopting a cooling fan, the blades push the air to connect with the shaft Flowing in the same direction, the impeller and propeller of the axial flow fan are somewhat similar. When working, most of the airflow flows parallel to the axis. When the inlet airflow is free air with 0 static pressure, its power consumption is the lowest. Due to its compact structure, It can save a lot of space, and it is also very convenient to install. The pressure sensor is mainly a mechanical structural device, and the deformation of the elastic element is used to indicate the pressure. It is characterized by small size, light weight, high accuracy and good temperature characteristics. , and its low power consumption, high reliability.

Preferably, in the above embodiment, a running indicator light 11 is provided below the pressure sensor 9, and the running indicator light 11 is used to indicate the running condition of the equipment.

In the above embodiment, preferably, the operation indicator light 11 is arranged on the right side of the temperature sensor 12, the temperature sensor 12 is directly connected with the liquid delivery pump 7, and the temperature sensor 12 can sense the change of temperature.

In the above embodiment, preferably, the cooling fan 5 is connected to the cooler 13 through the liquid delivery pipe 4, and the left side of the cooler 13 is provided with a heat absorbing device 15, which can be used to absorb heat.

Preferably, in the above embodiment, the heat absorbing device 15 is directly connected to the thermally conductive silicone grease 14, and the thermally conductive silicone grease 14 can transfer heat.

Based on the above, the utility model transfers the heat on the surface of the CPU to the CPU heat sink through heat conduction by directly contacting the heat sink with the surface of the CPU. In addition, the heat dissipation fan generates airflow to take away the heat on the surface of the CPU heat sink through thermal convection, and the chassis The flow of the air inside also takes away the heat of the air around the CPU heat sink through thermal convection until it reaches the outside of the case. At the same time, all parts with high temperature will radiate heat to the parts with low temperature around them, which has extremely high thermal conductivity and good isothermal The heat transfer area on both sides of the cold and hot sides can be changed arbitrarily, the heat can be transferred over a long distance, and the temperature can be controlled, etc., and the heat exchanger composed of heat pipes has high heat transfer efficiency and compact structure, and can control the temperature of the tube wall. Avoid dew point corrosion, quiet, stable cooling, less dependent on the environment, intuitive, economical, convenient, simple in design, low in cost, and can be widely used.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present utility model shall be included in this utility model. within the scope of protection of utility models.

Claims (5)

1. a Multifunction computer radiator, including air-intake device, fin, radiating tube and liquid delivery tube, the right side of described air-intake device is provided with fin, described fin and radiating tube are joined directly together and are connected into integral structure, described radiating tube is connected with radiator fan by described liquid delivery tube, it is characterized in that, the right side of described radiator fan is provided with air relief valve, described air relief valve is located at the top of liquid delivery pump, described liquid delivery pump and fastener are directly connected to, described fastener be connected with pressure transducer, described pressure transducer is located at the left side of exhaust apparatus, described exhaust apparatus be connected with run indicator, described run indicator is connected with fastener by pressure transducer.

2. a kind of Multifunction computer radiator according to claim 1, it is characterised in that: described pressure transducer be connected with run indicator.

3. a kind of Multifunction computer radiator according to claim 1, it is characterised in that: described run indicator is located at the right side of temperature sensor, and described temperature sensor and liquid delivery pump are directly connected to.

4. a kind of Multifunction computer radiator according to claim 1, it is characterised in that: described radiator fan is connected with cooler by liquid delivery tube, and the left side of described cooler is provided with heat sink.

5. a kind of Multifunction computer radiator according to claim 4, it is characterised in that: described heat sink and heat-conducting silicone grease are directly connected to.