CN210835959U - Liquid cooling radiator for server - Google Patents

Abstract

The utility model discloses a liquid cooling radiator for a server, comprising a liquid cooling plate, a heat pipe is arranged on the liquid cooling plate, an aluminum plate and a heat sink are connected to the heat pipe, and a cooling liquid flow channel is arranged inside the liquid cooling plate , the cooling liquid flow channel is connected with the external pipeline to form a water circuit circulation, the liquid cooling plate is installed with a spoiler fan near the pipeline, and adopts a full-coverage cooling method, which solves the problem of easy leakage caused by too many liquid cooling plate interfaces. It will reduce the leakage point to a minimum and greatly improve the safety factor of the product.

Description

A server liquid cooling radiator

technical field

The utility model relates to the technical field of heat exchangers, in particular to a liquid cooling radiator for servers.

Background technique

From the perspective of the development trend of the server, due to the integration of more and more functions, the heating power of the chip is increasing, and the heat dissipation problem is becoming more and more serious. The traditional air cooling can no longer solve the heat problem generated by the high power of the server. , so liquid cooling will be a better way to solve the problem of server heat dissipation in the future, and although liquid cooling can solve more high-power heating problems of servers, its safety is a problem, because the heat transfer medium of liquid cooling is liquid, so Involving a liquid leakage problem, the existing liquid cooling heat dissipation is to dissipate heat for each component separately. Each CPU has a separate liquid cooling board, and the memory also has a separate liquid cooling board. There will be many interfaces, and these interfaces may leak coolant, resulting in a safety hazard in the use of the product.

Utility model content

In order to overcome the above problems, the utility model provides a server liquid cooling radiator, which adopts a full coverage cooling method, solves the problem of easy leakage caused by too many liquid cooling plate interfaces, and reduces the leakage point to a minimum , greatly improving the safety factor of the product.

The technical solution adopted by the utility model to solve the technical problem is as follows: the utility model provides a liquid cooling radiator for a server, comprising a liquid cooling plate, a heat pipe is arranged on the liquid cooling plate, and an aluminum plate and a heat dissipation device are connected to the heat pipe. The liquid cooling plate is provided with a cooling liquid flow channel inside, and the cooling liquid flow channel is connected with an external pipeline to form a water circuit circulation, and a spoiler fan is installed at the position of the liquid cooling plate close to the pipeline.

Preferably, the liquid cooling plate is composed of an upper plate and a lower plate that are sealed and installed, the top surface of the upper plate is connected to the heat pipe, the bottom surface of the upper plate is provided with an annular groove, and forms a closed cooling liquid flow channel with the lower plate. The bottom surface of the lower board is coated with thermal paste.

Preferably, the heat pipe is mounted on the liquid cooling plate by welding or interference fit.

Preferably, the heat pipe includes a first heat pipe and a second heat pipe, the first heat pipe is symmetrically arranged on the top of the liquid cooling plate, one end of the first heat pipe is connected to the liquid cooling plate, and the other end is welded with an aluminum plate, and both sides of the aluminum plate are also attached with heat conduction The second heat pipe is arranged on the top of the liquid cooling plate facing the pipeline, one end of which is connected to the liquid cooling plate, and the other end is welded with a heat sink.

Preferably, a positioning device is symmetrically arranged on the liquid cooling plate, the positioning device includes a screw rod, a spring and a circlip, the screw rod penetrates the liquid cooling plate, and the circlip is sleeved on the part where the screw rod penetrates and protrudes from the liquid cooling plate , the spring is sleeved on the screw rod and abuts against the liquid cooling plate.

Compared with the prior art, the utility model has the beneficial effects as follows: the liquid cooling radiator adopts a full-coverage cooling method, which can transfer the heat of all components to the liquid cooling plate through the heat pipe and the spoiler fan, thus solving the problem of The problem of easy leakage caused by too many liquid cooling plate interfaces will minimize the leakage point and greatly improve the safety factor of the product.

Description of drawings

The present utility model will be further described below in conjunction with the accompanying drawings and embodiments.

1 is a schematic diagram of the axonometric structure of a liquid cooling radiator for a server according to the present invention;

2 is a schematic diagram of the axonometric structure of a liquid cooling radiator for a server according to the present invention;

3 is a schematic structural diagram of a liquid cooling plate of a server liquid cooling radiator according to the present invention;

Fig. 4 is the partial enlarged schematic diagram of Fig. 2;

FIG. 5 is an assembly diagram of a liquid cooling radiator for a server according to the present invention.

Description of drawings: 1. Liquid cooling plate; 101, upper plate; 102, lower plate; 2, heat pipe; 201, first heat pipe; 202, second heat pipe; 3, aluminum plate; 4, heat sink; 5, cooling liquid flow Road; 6, pipe; 7, spoiler fan; 8, thermal paste; 9, positioning device; 901, screw; 902, spring; 903, circlip.

Detailed ways

The present utility model will now be described in further detail in conjunction with the accompanying drawings. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the present invention in a schematic manner, so they only show the structures related to the present invention.

The specific implementation of the utility model is as follows: as shown in Figures 1-5, a liquid cooling radiator for a server includes a liquid cooling plate 1, and a heat pipe 2 is arranged on the liquid cooling plate 1, and the heat pipe 2 adopts the method of welding or interference fit. Installed on the liquid cooling plate 1, the heat pipe 2 is connected with an aluminum plate 3 and a heat sink 4, and a cooling liquid flow channel 5 is arranged inside the liquid cooling plate 1, and the cooling liquid flow channel 5 is communicated with the external pipe 6 to form a water circuit circulation, The liquid-cooling plate 1 is installed with a spoiler fan 7 near the pipe 6. The liquid-cooling radiator adopts a full-coverage cooling method, which can transfer the heat generated by all components to the liquid-cooling plate 1 through the heat pipe 2 and the spoiler fan 7. , and it is taken away by the coolant in the liquid-cooling plate 1, which solves the problem of easy leakage caused by too many interfaces of the liquid-cooling plate 1, reduces the leakage point to a minimum, and greatly improves the safety factor of the product. The liquid-cooling plate 1 It consists of an upper plate 101 and a lower plate 102 that are sealed and installed. The top surface of the upper plate 101 is connected to the heat pipe 2, and its bottom surface is provided with an annular groove, and forms a closed cooling liquid flow channel 5 with the lower plate. The cooling liquid flow channel 5 is covered with The upper plate 101 ensures that the maximum area of the cooling liquid contacts the heat source and achieves the best heat dissipation efficiency. The bottom surface of the lower plate 102 is coated with thermally conductive paste 8. The thermally conductive paste 8 is a jelly-like substance that can transmit heat and has a high thermal conductivity, and can be filled with liquid The gap between the cold plate 1 and the CPU ensures the heat dissipation performance.

The heat pipe 2 includes a first heat pipe 201 and a second heat pipe 202. The first heat pipe 201 is symmetrically arranged on the top of the liquid cooling plate 1, one end of which is connected to the liquid cooling plate 1, and the other end is welded with an aluminum plate 3. The thermal pad, the first heat pipe 201 is arranged to fit the memory module of the product, and the heat generated by the memory module is transferred to the liquid cooling plate 1 through the first heat pipe 201, so as to ensure the heat dissipation efficiency of the memory module. The second heat pipe 202 is located on the top of the liquid-cooling plate 1 facing the pipe 6, one end of which is connected to the liquid-cooling plate 1, and the other end is welded with a heat sink 4. The heat sink 4 is placed close to the array board, and the heat generated by the array board passes through the first The two heat pipes 202 are transmitted to the liquid cooling plate 1, thereby ensuring the heat dissipation efficiency of the array board.

The liquid cooling plate 1 is symmetrically provided with a positioning device 9, the positioning device includes a screw 901, a spring 902 and a retaining spring 903, the screw 901 penetrates the liquid cooling plate 1, and the retaining spring 903 is sleeved on the screw 901 and extends out of the liquid cooling plate 1, the spring 902 is sleeved on the screw 901 and is in contact with the liquid cooling plate 1. The radiator is fixed to the server motherboard as a whole through the screw 901. The deformation generated by the compression of the spring 902 can tightly stick the liquid cooling plate 1. It is attached to the CPU to ensure its contact area and improve the heat dissipation effect. The retaining spring 903 is used to fix the position of the screw 901 on the liquid cooling plate 1, which is convenient for installation.

Taking the above ideal embodiment according to the present invention as inspiration, through the above description, relevant staff can make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present utility model is not limited to the content in the description, and its technical scope must be determined according to the scope of the claims.

Claims (5)

1. A server liquid cooling radiator, characterized in that it comprises a liquid cooling plate, which is provided with a heat pipe, the heat pipe is connected with an aluminum plate and a heat sink, and a cooling liquid flow is arranged inside the liquid cooling plate The cooling liquid flow channel communicates with the external pipeline to form a water circuit circulation, and a spoiler fan is installed on the liquid cooling plate near the pipeline. 2 . The server liquid cooling radiator according to claim 1 , wherein the liquid cooling plate is composed of an upper plate and a lower plate that are sealed and installed, the top surface of the upper plate is connected to the heat pipe, and the bottom surface of the upper plate is provided with a heat pipe. 3 . The annular groove forms a closed cooling liquid flow channel with the lower plate, and the bottom surface of the lower plate is coated with thermal conductive paste. 3 . The server liquid cooling radiator according to claim 1 , wherein the heat pipe is mounted on the liquid cooling plate by welding or interference fit. 4 . 4 . The liquid cooling radiator for a server according to claim 1 , wherein the heat pipe comprises a first heat pipe and a second heat pipe, and the first heat pipe is symmetrically arranged on the top of the liquid cooling plate, and one end of the first heat pipe is connected to the liquid cooling plate. 5 . The other end is welded with an aluminum plate, and the two sides of the aluminum plate are also attached with thermal pads. The second heat pipe is located on the top of the liquid cooling plate facing the pipeline, and one end is connected to the liquid cooling plate, and the other end is welded with heat sinks. 5 . The liquid cooling radiator for a server according to claim 1 , wherein a positioning device is symmetrically arranged on the liquid cooling plate, and the positioning device comprises a screw rod, a spring and a circlip, and the screw rod penetrates through the liquid cooling plate. 6 . The retaining spring is sleeved on the part where the screw rod passes through and extends out of the liquid cooling plate, and the spring is sleeved on the screw rod and abuts against the liquid cooling plate.

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