CN2691053Y - Liquid cooling heat dissipation module - Google Patents

Abstract

A liquid-cooled heat dissipation module comprises a support member, a housing provided with a fan, a water tank provided on the housing and connected to a cold and hot pipe, the cold and hot pipe extending outward and having one end respectively connected to a water-cooling head, and a heat dissipation hole provided at one end of the housing, so that when in use, the housing can be fixed on an expansion tank (SLOT) in a computer case by the support member, the water-cooling head mounted on a heating electronic component can be transmitted to the housing through the hot pipe, heat is diffused outward from the heat dissipation hole by blowing of the fan, and cooled liquid is transmitted to the water-cooling head through the cold pipe via the water tank, thereby continuously circulating to rapidly take away heat generated by the heating electronic component, and simultaneously, the load of the heating electronic component can be reduced because the water tank, the cold and hot pipe and the fan are fixed on the expansion tank, thereby reducing the possibility of damage to the heat-generating electronic component and further avoiding occupying space on the heat-generating electronic component.

Description

Liquid cooling heat dissipation module

technical field

The utility model relates to a liquid-cooled heat dissipation module. The device mainly separates the heat dissipation module, and fixes the heavy water tank, cold and heat pipes of the heat dissipation module in the expansion slot, so as to reduce the heat dissipation of electronic components. burden without taking up space on heat-generating electronic components.

Background technique

The general conventional cooling structure, please refer to shown in Fig. 1, it is provided with a base 10, has a plurality of cooling fins 11 on the flat surface of this base 10, and the other side is then cut with a waterway (not shown in the figure), and the waterway Both ends are provided with water inlet pipe 12 and water outlet pipe 13 respectively, and a fan 30 is arranged on the base 10. When this kind of device is constructed in use, there will be the following disadvantages:

1. In addition to the heat dissipation fins 11, there are water channels containing water under the heat dissipation fins 11. In this way, not only will the height of the entire heat dissipation structure be increased, but the weight of the water in the water channels will increase the burden on the heating electronic components, and The heating electronic components are damaged and take up a lot of space.

2. Because all the water in the water channel is between the cooling fins 11, the water in the water channel is all performing heat exchange between the cooling fins 11. In this way, not only will the heat stay on the cooling fins 11, And the heat dissipation speed will be relatively slow.

3. Because the fan 30 is located on the cooling fins 11, when the fan 30 rotates, the heat flow will first flow slowly in the computer, and then flow out from the cooling holes around the computer, causing heat to stay in the computer.

Contents of the invention

In order to improve the various shortcomings of the above-mentioned conventional device structure, after long-term research and experiments, the designer finally developed and designed a liquid-cooled type that can separate the water tank from the radiator and increase the heat dissipation effect by means of integral molding technology. Cooling module.

The main purpose of this utility model is to provide a liquid-cooled heat dissipation module, the module is provided with a support, the support can be inserted into the expansion slot in the computer case, and the support is provided with a A casing, the casing is provided with a fan, and the casing is provided with a water tank, the water tank is connected with a cold pipe and a heat pipe, the heat pipe is provided with a plurality of cooling fins, and the cold and heat pipes are outward One end of the extension is respectively connected to a water cooling head, and one end of the shell is provided with a cooling hole.

In this way, when in use, the support piece can be inserted into the expansion slot in the computer case, and the casing can be fixed on the expansion slot, so that the water cooling head on the heat-generating electronic component can be transmitted to the casing through the heat pipe , and then by the rotation of the fan, the heat entering the shell is quickly discharged through the heat dissipation holes, and through the heat exchange effect of the heat dissipation fins, the liquid entering the shell is cooled and flows through the water tank through the cold pipe to the water cooling In the head, in this way, the heat generated by the heating electronic components can be quickly taken away by continuous circulation. At the same time, because the cooling fins and fans are fixed in the expansion slot, the burden on the heating electronic components can be reduced, thereby reducing the heat generation. The electronic components may be damaged, and it will not occupy the space on the heating electronic components.

Another object of the present utility model is to provide a liquid-cooled heat dissipation module, in which a pump is provided in the casing, and the pump is connected to the heat pipe so that the liquid in the heat pipe can be accelerated to flow during use, and can Forces the direction of fluid flow in it.

Another purpose of the present utility model is to provide a liquid-cooled heat dissipation module, the supporting part is provided with a fixing part on the end adjacent to the heat dissipation hole of the casing, and the fixing part is also provided with an opening, so that when in use, In addition to being inserted into the expansion slot by the support piece, it can also be fixed on the computer casing by the fixing piece, so that the casing can be inserted into the expansion slot more stably without shaking.

With the composition of the above components, the water tank can be fixed on the heat-generating electronic components and separated from the water tank, cooling fins and fan standing on the expansion slot through the fixing of the support inserted in the expansion slot, so that the heat-generating electronic components can be separated. The components do not need to bear the weight of the water tank, cooling fins and fans, thereby reducing the possibility of damage to the heating electronic components and reducing the space occupied by the heating electronic components.

Description of drawings

Figure 1 is a schematic diagram of a conventional device.

Fig. 2 is a three-dimensional schematic diagram of an embodiment of the utility model.

Fig. 3 is a schematic diagram of an embodiment of the utility model installed on a computer.

Fig. 4 is a schematic diagram of another embodiment of the utility model installed on a computer.

Fig. 5 is a schematic diagram of the action when the utility model is implemented.

Description of drawing numbers of main components:

Supports 10

Fixing parts 20

Hole 21

Housing 30

pump 31

Water tank 310

Cold pipe 32

Heat pipe 33

Heat sink fins 34

Fan 35

Cooling hole 36

On 37

Water block 40

Detailed ways

In order to enable a further understanding and understanding of the purpose of the utility model, the characteristics of the shape structure device and its effect, the embodiments are given in conjunction with the drawings, and the details are as follows:

The utility model is a liquid-cooled heat dissipation module, as shown in Figure 2, which is an embodiment of the utility model, the device is provided with a support 10, and the support 10 can cooperate with various expansion slot interfaces For example, different interfaces such as AGP, PCI, ISA, etc., and one end of the support member 10 is provided with a fixing member 20, the fixing member 20 and the support member 10 are perpendicular to each other, and the fixing member 20 is provided with an opening 21.

In addition, please refer to FIG. 3, the support member 10 is provided with a housing 30, the housing 30 is provided with a water tank 310, the water tank 310 is connected with a cold pipe 32, and one side of the water tank 310 is connected to A heat pipe 33 is provided, and the part of the heat pipe 33 extending outward from the water tank 310 is continuously bent, and the heat pipe 33 is in a bent area and is embedded with radiating fins 34 arranged neatly, and next to the radiating fins 34 A fan 35 is provided, and an opening 37 is provided on the side of the housing 30 that is not in contact with the support member 10, the opening 37 is opposite to the fan 35, and a pump 31 is provided beside the fan 35, and the pump 31 is connected to the heat pipe 33 connected, and the heat pipe 33 extends outward from the pump 31 to connect with a water cooling head 40, the water cooling head 40 is also connected to the cold pipe 32, and the housing 30 is provided with a cooling hole 36 at the end opposite to the opening 21 .

When in use, please refer to Figures 2, 3, and 5, first install the water cooling head 40 on the electronic component that generates heat, in this embodiment it is a processor, and then insert it into the expansion slot in the computer case through the support member 10 (SLOT), and under the fixing of the fixing part 20 fixed on the back of the computer casing, the support part 10 is fixed in an expansion slot of the computer case, so that the casing 30 on it can be firmly stood on the expansion slot. , the heat conducted by the electronic components to the water-cooled head 40 will increase the temperature of the liquid in the water-cooled head 40, and the liquid with elevated temperature can be pumped by the pump 31, flow back to the pump 31 through the heat pipe 33, and flow through radiating fins 34, and the fan 35 sucks cold air into the housing 30, and the cooling fins 34 cool down, so that the heat contained in the liquid can be quickly discharged by the radiating holes 36 and the openings 21, so that the cooled The liquid can flow back to the water cooling head 40 through the water tank 310 through the cold pipe 32. In this way, the heat generated by the heating electronic components can be quickly taken away by continuous circulation. The fins 34 and the fan 35 are separated, and the water tank 310, the cooling fins 34 and the fan 35 are fixed on the expansion slot, so that the heating electronic components do not need to bear the weight of the water tank 310, the cooling fins 34 and the fan 35, thereby reducing heat generation The possibility of damage to the electronic components can be achieved, and the purpose of reducing the space occupied by the electronic components that generate heat is achieved.

Please refer to FIG. 4, which is another embodiment of the present utility model. Its cooling module is provided with a housing 30, and a supporting piece 10 is pasted on both sides of the housing 30, and these supporting pieces 10 can be respectively inserted. Placed in two expansion slots, and one end of the supports 10 is provided with a fixing part 20 connected with the supports 10, the fixing part 20 is perpendicular to the supports 10, and the fixing part 20 is provided with Open hole 21; In addition, a housing 30 is provided on the support member 10, a water tank 310 is arranged in the housing 30, the water tank 310 is connected with a cold pipe 32, and a heat pipe 33 is arranged on one side of the water tank 310, The part of the heat pipe 33 extending outward from the water tank 310 is continuously bent, and the heat pipe 33 is in a bent area and is embedded with neatly arranged cooling fins 34 , and a fan 35 is arranged beside the cooling fins 34 . An opening 37 is provided on the side of the casing 30 that is not in contact with the support member 10, and the opening 37 is opposite to the fan 35, and a pump 31 is arranged beside the fan 35, and the pump 31 is connected to the heat pipe 33, and the fan 35 is connected to the heat pipe 33. The heat pipe 33 extends outward from the pump 31 and connects with a water cooling head 40 , the water cooling head 40 also connects with the cooling pipe 32 , and the housing 30 is provided with a cooling hole 36 at the end opposite to the opening 21 .

When in use, please refer to Figures 3, 4, and 5. First, install the water tank 40 on the electronic component that generates heat, which is a processor in this embodiment, and then insert it into the expansion slot of the computer host through the support member 10. And under the fixing part 20 that is fixed on the back side of the computer casing, the support part 10 is fixed in an expansion slot of the computer host, and after the casing 30 on it can stand firmly on the expansion slot, the electronic components are conducted to The heat in the water cooling head 40 will increase the temperature of the liquid in the water cooling head 40, and the liquid with elevated temperature can be pumped by the pump 31, flow back to the pump 31 through the heat pipe 33, and flow through the cooling fins 34, And in the fan 35 sucking cold air in the housing 30, and under the cooling of the cooling fins 34, the heat contained in the liquid can be discharged quickly by the cooling holes 36 and the openings 21, so that the cooled liquid can pass through the cooling tube. 32 flows back into the water cooling head 40, so that the heat generated by the heating electronic components can be taken away quickly by continuous circulation. The water tank 310, cooling fins 34 and fan 35 are fixed on the expansion slot, so that the heating electronic components do not need to bear the weight of the water tank 310, cooling fins 34 and fan 35, thereby reducing the possibility of damage to the heating electronic components, and more To achieve the purpose of reducing the space occupied by electronic components that generate heat.

To sum up, the utility model is the first creation on the shape and structure device of the article, and can improve various shortcomings of the conventional technology, can improve the efficacy in use, is practical, fully meets the requirements of the new patent, and is really an ideal creation.

Claims (5)

1. A liquid-cooled heat dissipation module, characterized in that the device comprises: A casing, one side of the casing is provided with an opening, and one side of the casing is provided with cooling holes; A pump, which is arranged in the casing, and a heat pipe is connected to the pump. The part of the heat pipe in the casing is continuously bent and connected, and the bent part of the heat pipe is embedded with neatly arranged cooling fins; A water tank, which is arranged in the casing, and the water tank is connected with the cold and heat pipes; A fan, which is arranged between the pump and the cooling fins, and the fan is opposite to the opening of the casing; A water cooling head, which is connected to one end of the cold and heat pipes extending out of the housing; A support piece, which is attached to the casing, and the support piece is inserted into the expansion slot of the computer; A fixing piece is fixed on one end of the supporting piece, and the fixing piece is provided with an opening opposite to the cooling hole. 2. The liquid-cooled heat dissipation module according to claim 1, wherein the supporting member is attached to one side of the casing. 3 . The liquid-cooled heat dissipation module according to claim 1 , wherein the support members are placed on both sides of the casing. 4 . 4. The liquid-cooled heat dissipation module according to claim 1, wherein the fixing part is connected with a supporting part. 5 . The liquid-cooled heat dissipation module according to claim 1 , wherein the fixing member is connected to more than one supporting member. 6 .

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