CN2659096Y

CN2659096Y - Electronic component cooling module

Info

Publication number: CN2659096Y
Application number: CN 200320103481
Authority: CN
Inventors: 陈万添
Original assignee: Jihong Electronic Co ltd
Current assignee: Jihong Electronic Co ltd
Priority date: 2003-11-17
Filing date: 2003-11-17
Publication date: 2004-11-24
Anticipated expiration: 2013-11-17

Abstract

The utility model relates to an electronic component heat radiation module; the heat dissipation module is mainly used for guiding high temperature generated during operation of electronic components such as Metal Oxide Semiconductor (MOS) or Complementary Metal Oxide Semiconductor (CMOS) arranged on a circuit board to a connector combination position at the edge of the circuit board, and even guiding heat energy of the electronic components to a cover plate position and far away from a capacitor component adjacent to the cover plate position, so that influence on the adjacent components is greatly reduced.

Description

The electronic building brick radiating module

Technical field

The utility model relates to a kind of electronic building brick radiating module, particularly a kind of electronic assembly radiator that can produce high temperature and influence adjacent assemblies when operation that is applicable to.

Background technology

General near metal-oxide semiconductor (MOS) on the circuit board (MOS) or complementary metal oxide semiconductors (CMOS) electronic building bricks such as (CMOS), standing other for example electronic building brick of electric capacity that is equipped with, and the mode that is provided with is quite intensive, therefore, the high temperature that metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) (CMOS) are produced when operation, influence in useful life for assemblies such as contiguous electric capacity is very huge, especially, in case radiating effect is not good when the casing inside of ccontaining circuit board, or the ambient temperature of casing outside is when higher, and the assemblies such as electric capacity of adjacent metal oxide semiconductor (MOS) or complementary metal oxide semiconductors (CMOS) (CMOS) then are subject to its high temperature and damage.

Summary of the invention

Main utility model purpose of the present utility model provides a kind of electronic building brick radiating module; Mainly be to utilize a radiating module, with metal-oxide semiconductor (MOS) (MOS) or the complementary metal oxide semiconductors (CMOS) electronic building bricks such as (CMOS) that is arranged on the circuit board, the high temperature that is produced when operation is directed to connector combination place of board edge, even the heat energy of electronic building brick can be directed to a cover plate place, and away from its adjacent assemblies (for example: electric capacity), significantly reducing influence, and obviously possess following advantage for adjacent assemblies:

1), the utility model redundant space of effectively utilizing the connector combination of board edge to be had, radiating module is set, need not change circuit board, connector combination, and original design of casing inside, and install easily;

2), radiating module of the present utility model has two radiators, can two radiators and a cover plate be fixed by heat conduction adhesive plaster or coating heat conduction viscose, increasing stationarity, and heat energy is directed on the cover plate and the increase heat radiation function;

3), the utility model can be provided with second radiating module on original radiating module, and the height and position that radiator increased of second radiating module, only a little more than the connector combination that is combined by the DSUB connector, and unlikely above the connector combination that combines by the Audio connector, and effectively utilize whole space;

4), the utility model for nearby electronic components (for example: the influence in useful life electric capacity) can reduce MOS or CMOS, especially, in case radiating effect is not good when the casing inside of ccontaining circuit board, or the ambient temperature of casing outside is when higher, and the utility model can avoid the assemblies such as electric capacity of contiguous MOS or CMOS to damage.

Above-mentioned purpose of the present utility model is achieved in that a kind of electronic building brick radiating module, comprises a conducting strip, first radiator, reaches second radiator etc.; Wherein:

This conducting strip is arranged on the circuit board, and contacts with the electronic building brick surface of at least one desire heat radiation;

This first radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;

This second radiator is one to have the radiator of plurality of radiating fins, and runs through a heat pipe on the plurality of radiating fins, and an end of heat pipe is connected on this conducting strip;

And two plurality of radiating fins are fixedly arranged on respectively in two grooves of a connector combination, and the connector combination is arranged at the edge of circuit board;

By this, the high temperature that the electronic building brick of desire heat radiation can be produced when moving, connector combination place that is directed to board edge is dispelled the heat, and away from contiguous capacitance component.

The utility model can also be realized like this, and a kind of electronic building brick radiating module comprises a radiator, a conducting strip, reaches a heat pipe etc.; Wherein:

This radiator is fixedly arranged in the two connectors combination of a board edge, and has plurality of radiating fins, and the side of radiator also is provided with a side-blowing fan, and the air-flow that fan produced also can be by the gap of each radiating fin;

One end of this heat pipe is on radiator, and the other end of heat pipe is connected on this conducting strip;

By this, the high temperature that the electronic building brick of desire heat radiation can be produced when moving is directed to the connector combination place heat radiation of board edge, and away from contiguous capacitance component.

The utility model is elaborated with instantiation below in conjunction with accompanying drawing.

Description of drawings

Fig. 1 is a three-dimensional exploded view of the present utility model;

Fig. 2 is the three-dimensional exploded view of another enforcement state of the utility model;

Fig. 3 is the schematic perspective view of another enforcement state of the utility model;

Fig. 4 is the three-dimensional exploded view of the utility model second embodiment;

Fig. 5 is the schematic perspective view of the utility model second embodiment.

Description of reference numerals:

First radiator 10; DSUB-VGA connector 423;

Heat pipe 11; Capacitance component 43;

Stator 13; Connector combination 44;

Radiating fin 15; Connector combination 45;

Second radiator 20; Housing end face 451;

Heat pipe 22; Connector combination 46;

Stator 24; Housing end face 461;

Radiating fin 26; Connector combination 47;

Conducting strip 30; Second radiating module 50;

Circuit board 40; Conducting strip 51;

Electronic building brick 41; Heat pipe 52;

Connector combination 42; Radiator 53;

Groove 420; Radiating fin 531;

DSUB-25PH connector 421; Side-blowing fan 54;

DSUB-COM connector 422; Cover plate 60.

Embodiment

See also Fig. 1 to Fig. 3, in preferred embodiment, radiating module of the present utility model comprises: a conducting strip 30, first radiator 10, and second radiator 20 etc.; Wherein:

This conducting strip 30 is arranged on the circuit board 40, and contacts with the surface of metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) plural electronic building bricks 41 such as (CMOS);

This first radiator 10 is one to have the radiator (heat sink) of plurality of radiating fins 15, and runs through a heat pipe (heat pipe) 11 on the plurality of radiating fins 15, and an end of heat pipe (heat pipe) 11 is connected on this conducting strip 30;

This second radiator 20 is one to have the radiator (heat sink) of plurality of radiating fins 26, and runs through a heat pipe (heat pipe) 22 on the plurality of radiating fins 26, and an end of heat pipe (heat pipe) 24 is connected on this conducting strip 30;

And two plurality of radiating fins 15,26 are fixedly arranged on respectively in two grooves 420 of a connector combination 42, and connector combination 42 is arranged at the edge of circuit board 40;

By this, can be via conducting strip 30 and first and second radiator 10,20, the high temperature that plural electronic building brick 41 time is produced in operation, the connector that is directed to circuit board 40 edges makes up the heat radiation of 42 places, and away from contiguous complex capacitance assembly 43, significantly to reduce the influence of plural electronic building brick 41 for adjacent assemblies, and when the ambient temperature of the casing of ccontaining circuit board 40 (figure does not show) internal heat dissipating poor effect or casing outside is higher, and can avoid complex capacitance assembly 43 to damage.

In addition, this conducting strip 30 further can in the surperficial contact position of metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) plural electronic building bricks 41 such as (CMOS), be provided with a heat conduction adhesive plaster (figure does not show), or coating heat conduction viscose, so that conducting strip 30 can be attached on the surface of plural electronic building brick 41 fully, and increase set and thermal contact conductance effect.

Should be noted that usually that on this circuit board 40 regular meeting is the intensive connector combination 44 that is provided with other dissimilar functions near

connector combination

42,45,46,47, and when circuit board 40 is placed in casing (figure does not show) inside, can cover each

connectors combination

42,44 by a

cover plate

60,45,46,47, cover plate 60 has most and each

connector combination

42,44,45, the slotted eye of 46,47 correspondences; Wherein:

This connector combination 42 is the group of DSUB connector, for example: by DSUB-25PH connector 421, DSUB-COM connector 422, DSUB-VGA connector 423 compositions such as grade, and 422 of DSUB-25PH connector 421 and DSUB-COM connectors are formed with a groove 420,423 of DSUB-25PH connector 421 and DSUB-VGA connectors also are formed with a groove 420, two plurality of radiating fins 15 that then radiating module of the present utility model had, 26 can be fixedly arranged on respectively in this two groove 420, need not change circuit board 40 fully, connector combination 42, and it is original design of casing inside, and easy by dressing;

This connector combination 44 can be the combination of PS2 connector;

This connector combination 45 can be the combination of IEEE 1394 connectors and USB connector;

This connector combination 46 can be the combination of LAN connector and USB connector;

This connector combination 47 can be the combination of Audio connector; And above-mentioned each

connector combination

42,44,45,46,47 order is set and type of functionality is slightly different according to actual demand, and this cover plate 60 and have majority and corresponding slotted eye.

Need to prove the side of this two plurality of radiating fins 15,26, further can be respectively arranged with a stator 13,24, and two stators 13, can attach a gum (figure does not show) on 24, make that two plurality of radiating fins 15,26 can be by stator 13 when cover plate 60 covers, gum on 24, be attached at cover plate 60, and increase the stationarity of two plurality of radiating fins 15,26.

Need to prove the front end face of this two plurality of radiating fins 15,26 and two stators 13, also can be provided with heat conduction adhesive plaster (figure does not show) on 24, or coating heat conduction viscose, with the stationarity of increase with cover plate 60, and simultaneously heat energy is directed on the cover plate 60, and increases heat radiation function.

See also Fig. 4 to Fig. 5, in a second embodiment, further can be on the radiating module of the present utility model in conjunction with one second radiating module 50, to increase heat radiation function; Wherein:

This conducting strip 51 combines with the conducting strip 30 of original radiating module, and two conducting

strips

30,51 are asked can increase set by a heat conduction adhesive plaster (figure do not show) or coating heat conduction viscose;

This radiator 53 can be fixedly arranged in the two

connectors combination

45,46, and 451,461 of the housing end faces of radiator 53 and two

connectors combination

45,46 can or be coated with the heat conduction viscose and increase set by a heat conduction adhesive plaster (figure does not show);

This second radiating module 50 runs through a heat pipe (heat pipe) 52 by a radiator 53 and constitutes, has plurality of radiating fins 531 on the radiator 53, and the side of radiator 53 is provided with a side-blowing fan 54, the air-flow that fan 54 is produced can be by the gap of each radiating fin 531, and to radiator 53 forced heat radiations, an end of heat pipe 52 connects a conducting strip 51;

By this, can increase heat radiation function, especially when the ambient temperature of the casing internal heat dissipating poor effect of ccontaining circuit board 40 or casing outside is higher, more helps avoid complex capacitance assembly 43 and damage.

In addition, when the housing end face 451,461 of two

connectors combination

45,46 was not contour, the below of this radiator 53 further can be provided with a stator 531, made radiator 53 firmly to stride and was located on the housing end face 451,461 of two

connectors combination

45,46.

Need to prove, when on original radiating module second radiating module 50 being set, the radiator 53 of second radiating module 50 is fixedly arranged on two

connectors combination

45,46 housing end face 451, on 461, the height and position that this radiator 53 is increased, only a little more than the connector combination 42 that is combined by the DSUB connector, and the unlikely connector that is combined by the Audio connector that surpasses of height and position makes up 47, therefore, among second embodiment of the present utility model, it is effective utilization of overall space, this is to promote according to preferable enforcement example of the present utility model, and follows the suitable person who extends according to spirit of the present utility model, so must be included in the scope of the present utility model.

In addition, in the 3rd embodiment, the conducting strip 51 of this second radiating module 50 can directly be arranged on the circuit board 40, and contact with the surface of metal-oxide semiconductor (MOS) (MOS) or complementary metal oxide semiconductors (CMOS) plural electronic building bricks 41 such as (CMOS), to omit original radiating module, and conducting strip 51 with can increase set and heat conduction by a heat conduction adhesive plaster (figure does not show) or coating heat conduction viscose between the surface of electronic building brick 41 contacts, this is the suitable person for following spirit of the present utility model to extend still, so must be included in the scope of the present utility model.

Claims

1. A cooling module for electronic components, comprising a heat conducting sheet, a first radiator, and a second radiator; it is characterized in that:

The heat conducting sheet is arranged on the circuit board and is in contact with the surface of at least one electronic component to be dissipated;

The first radiator is a radiator with a plurality of heat dissipation fins, and a heat pipe runs through the plurality of heat dissipation fins, and one end of the heat pipe is connected to the heat conduction fin;

The second radiator is a radiator with a plurality of heat dissipation fins, and a heat pipe runs through the plurality of heat dissipation fins, and one end of the heat pipe is connected to the heat conduction fin;

The two plurality of cooling fins are respectively fixed in two grooves of a connector assembly, and the connector assembly is arranged on the edge of the circuit board.

2. The heat dissipation module for electronic components as claimed in claim 1, wherein the electronic component to be dissipated is metal oxide semiconductor (MOS) or complementary metal oxide semiconductor (CMOS).

3. The electronic component cooling module as claimed in claim 1, wherein the connector combination is a combination of DSUB connectors, consisting of DSUB-25PH connectors, DSUB-COM connectors, and DSUB-VGA connectors, and The two grooves of the connector combination are respectively formed between the DSUB-25PH connector and the DSUB-COM connector, and between the DSUB-25PH connector and the DSUB-VGA connector.

4. The heat dissipation module of electronic components as claimed in claim 1, wherein, the two radiators are provided with a fixing piece on the side of the plurality of cooling fins, and a back glue is attached on the fixing piece, when the cover plate covers, the two radiators The plurality of heat dissipation fins are attached to the cover plate by the back glue on the fixing sheet and fixed.

5. The heat dissipation module of electronic components as claimed in claim 1, wherein, the two heat sinks are provided with a fixing piece on the side of the plurality of heat dissipation fins; Or apply thermally conductive adhesive and fix it with the cover.

6 . The heat dissipation module for electronic components as claimed in claim 1 , wherein a heat-conducting tape or coated with heat-conducting adhesive is provided at the contact between the heat-conducting sheet and the surface of the electronic component to be dissipated. 7 .

7. The heat dissipation module of electronic components as claimed in claim 1, wherein, the vicinity of the connector combination is densely provided with PS2 connector combination, IEEE 1394 and USB connector combination, LAN and USB connector combination, and Audio connector combination .

8. The heat dissipation module of electronic components as claimed in claim 1, wherein a second heat dissipation module is combined on the heat dissipation module; the second heat dissipation module is formed by a heat sink passing through a heat pipe, and the heat sink has a plurality of heat dissipation fins, and A side blowing fan is arranged on the side of the radiator, and the airflow generated by the fan passes through the gaps of the cooling fins, and one end of the heat pipe is connected with a heat conducting fin.

9. The heat dissipation module for electronic components as claimed in claim 8, wherein the heat conduction sheet of the second heat dissipation module is directly combined with the heat conduction sheet of the original heat dissipation module, and a heat conduction tape or a heat conduction adhesive is applied between the two heat conduction sheets fixed.

10. The heat dissipation module for electronic components as claimed in claim 8, wherein the heat sink of the second heat dissipation module is fixed on the other two connector combinations that are densely arranged near the connector combination, and the heat sink and the two connectors The top surfaces of the combined housings are fixed by a thermally conductive adhesive cloth or coated with thermally conductive adhesive.

11. The heat dissipation module for electronic components as claimed in claim 10, wherein, the other two connector combinations that are densely arranged near the connector combination are a connector combination composed of an IEEE 1394 connector and a USB connector, and A connector combination consisting of a LAN connector and a USB connector.

12. The heat dissipation module for electronic components as claimed in claim 10, wherein the top surfaces of the housings of the other two connector combinations that are densely arranged near the connector combination are not of the same height; and the heat sink below the second heat dissipation module A fixing piece is provided, which is stably straddled on the top surface of the casing of the combination of the two connectors.

13. A cooling module for electronic components, comprising a radiator, a heat conducting sheet, and a heat pipe; it is characterized in that:

The heat sink is fixed on the combination of two connectors on the edge of a circuit board, and has a plurality of heat dissipation fins. The side of the heat sink is provided with a side blowing fan, and the airflow generated by the fan passes through the gaps between the heat dissipation fins;

The heat conduction sheet is arranged on the circuit board and is in contact with the surface of at least one electronic component to be dissipated;

One end of the heat pipe runs through the radiator, and the other end of the heat pipe is connected to the heat conducting sheet.

14 . The heat dissipation module for electronic components as claimed in claim 13 , wherein the heat sink and the top surface of the combined housing of the two connectors are fixed by a thermally conductive adhesive tape or coated with thermally conductive adhesive. 15 .

15. The heat dissipation module for electronic components as claimed in claim 13, wherein the two connector combinations are a connector combination composed of an IEEE 1394 connector and a USB connector, and a combination of a LAN connector and a USB connector connector combination.

16. The heat dissipation module for electronic components as claimed in claim 13, wherein the top surfaces of the housings of the two connectors are of unequal height; on the top surface of the housing.