CN101031197A - Electronic device with electromagnetic interference suppression function and heat dissipation component thereof - Google Patents

Abstract

The invention relates to an electronic device with an electromagnetic interference suppression function and a heat dissipation component thereof. The chip is arranged on the circuit board. The heat sink is arranged on the wafer, the grounding piece is adjacently arranged on the heat sink, and the conductive piece is electrically connected with the heat sink and the grounding piece. In the electronic device with electromagnetic interference suppression function and the heat dissipation assembly thereof, the heat dissipation member can solve the problem of electromagnetic interference by the arrangement of the conductive member, so as to improve the reliability of the electronic device. In addition, the conductive piece has simple structural design, low manufacturing cost and good industrial utilization.

Description

Electronic device with electromagnetic interference suppression function and heat dissipation component thereof

technical field

The invention relates to an electronic device and its heat dissipation component, in particular to an electronic device with electromagnetic interference suppression function and its heat dissipation component.

Background technique

In addition to the current development of electronic products in the direction of high speed, high function, light weight, small size and low price, another concern is the problem of electromagnetic interference (EMI) in electronic products. Electromagnetic interference refers to the fact that electronic products cannot operate normally due to the influence of electromagnetic waves during use.

Please refer to FIG. 1 , an electronic device 1 has a circuit board 11 , a chip 12 and a heat sink 13 , wherein the chip 12 is disposed on the circuit board 11 , and the heat sink 13 is disposed on the chip 12 . Since the chip 12 generates a large amount of heat energy when performing calculations, the electronic device 1 is prone to overheating. Therefore, the heat sink 13 can move the heat generated by the chip 12 to the outside to ensure the normal operation of the electronic device 1. . However, since the disposition of the heat sink 13 will produce an "antenna effect", the electronic device 1 will have electromagnetic interference problems.

In view of this, how to solve the electromagnetic interference problem of the heat sink with a relatively simple structural design is one of the current important issues.

Based on years of rich practical experience and professional knowledge engaged in the design and manufacture of such products, the inventor actively researches and innovates in conjunction with the application of academic theories, in order to create a new type of electronic device with electromagnetic interference suppression function and its cooling assembly. The general existing electronic device can be improved to make it more practical. Through continuous research, design, and after repeated trial samples and improvements, the present invention with practical value is finally created.

Contents of the invention

The purpose of the present invention is to overcome the defects of existing electronic devices, and provide a novel electronic device with electromagnetic interference suppression function and its cooling assembly. The technical problem to be solved is to make it possible to solve electromagnetic interference and The problem of heat dissipation is more suitable for practical use.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. According to the present invention, an electronic device with electromagnetic interference suppression function includes: a circuit board; a chip, which is arranged on the circuit board; a heat sink, which is arranged on the chip; a grounding member, which is adjacent to the heat dissipation element; and a conductive element electrically connecting the heat dissipation element and the ground element.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

The aforementioned electronic device with electromagnetic interference suppression function also includes: a casing, the circuit board, the chip, and the heat sink are arranged in the casing, and the grounding element is a metal plate in the casing or the enclosure.

In the aforementioned electronic device with electromagnetic interference suppression function, the heat sink has a base and a plurality of heat dissipation fins disposed on the base.

In the aforementioned electronic device with electromagnetic interference suppression function, the conductive element is a shrapnel or a conductive wire.

In the aforementioned electronic device with the function of suppressing electromagnetic interference, the conductive element is welded, abutted, riveted, locked or clamped to the ground element.

In the aforementioned electronic device with electromagnetic interference suppression function, the heat dissipation element and the conductive element are integrally formed.

The purpose of the present invention and the solution to its technical problems are also achieved by the following technical solutions. According to the present invention, a heat dissipation assembly with electromagnetic interference suppression function is provided with a grounding element, and is characterized in that it includes: a heat dissipation element; and a conductive element electrically connecting the heat dissipation element and the grounding element.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

In the heat dissipation assembly of the aforementioned electronic device with electromagnetic interference suppression function, the heat dissipation element has a base and a plurality of heat dissipation fins arranged on the base.

In the heat dissipation assembly of the aforementioned electronic device with electromagnetic interference suppression function, the conductive element is a shrapnel or a conductive wire.

In the aforementioned heat dissipation assembly of an electronic device with an electromagnetic interference suppression function, the conductive element is welded, abutted, riveted, locked or clamped to the ground element.

From the above, it can be seen that the electronic device with electromagnetic interference suppression function of the present invention includes a circuit board, a chip, a grounding element, a conductive element and a heat dissipation element. The chip is set on the circuit board. The heat sink is disposed on the chip. The grounding element is adjacent to the cooling element, and the conductive element is electrically connected to the cooling element and the grounding element.

Another aspect of the present invention is a heat dissipation assembly with electromagnetic interference suppression function, which is arranged with a grounding element. The heat dissipation assembly includes a heat dissipation element and a conductive element. The heat dissipation element is adjacent to the grounding element, and the conductive element is electrically connected. Heat sink and ground.

By means of the above-mentioned technical solution, the present invention has at least the following advantages: In the electronic device with electromagnetic interference suppression function and its heat dissipation assembly of the present invention, the heat dissipation element can solve the problem of electromagnetic interference by setting the conductive element, so as to improve the efficiency of the electronic device. reliability. In addition, the structure design of the conductive part is simple, the manufacturing cost is low, and it does have good industrial applicability.

To sum up, the electronic device with electromagnetic interference suppression function and its heat dissipation component with special structure of the present invention can solve the problems of electromagnetic interference and heat dissipation at the same time. It has the above-mentioned many advantages and practical value, and there is no similar structural design publicly published or used in similar products, so it is indeed innovative. It has great improvements in both product structure and function, and is technologically advanced. It has made great progress, and has produced easy-to-use and practical effects, and has improved multiple functions compared with existing electronic devices, so it is more suitable for practical use, and has wide industrial application value. It is a novel, progressive, and practical device. new design.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a conventional electronic device;

Fig. 2 is a schematic diagram of the electronic device with electromagnetic interference suppression function of the present invention, showing the state where the conductive member and the grounding member are in contact with each other;

Fig. 3 is a schematic diagram of the electronic device with electromagnetic interference suppression function of the present invention, showing the state that the conductive member and the grounding member are riveted to each other;

Fig. 4 is a schematic diagram of the electronic device with electromagnetic interference suppression function of the present invention, showing the state where the conductive member and the grounding member are welded to each other; and

FIG. 5 is a schematic diagram of the electronic device with electromagnetic interference suppression function of the present invention, showing the state that the conductive part and the grounding part are clamped to each other.

1: Electronic device 11: Circuit board

12: chip 13: heat dissipation fins

2: Electronic device 20: Circuit board

21: Chip 22: Heat sink

231: base 232: cooling fins

24: Conductive parts 241: Holes

242: Chuck 25: Grounding piece

251: convex part 26: heat dissipation glue

27: fan

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the electronic device with electromagnetic interference suppression function and its heat dissipation assembly according to the present invention are specifically implemented below in conjunction with the accompanying drawings and preferred embodiments. Mode, structure, feature and effect thereof are as follows in detail.

First, please refer to FIG. 2 , an electronic device 2 according to a preferred embodiment of the present invention includes a circuit board 21 , a chip 22 , a heat sink 23 , a grounding member, and a conductive member 24 . In this embodiment, the electronic device 2 can be a host computer, but the electronic device 2 is not limited to a host computer, but can be a notebook computer or other electronic devices. In addition, the circuit board 21 can be a motherboard, and the chip 22 can be a central processing chip, a memory chip, or a display chip, and so on.

Referring to FIG. 2 again, the chip 22 is disposed on the circuit board 21 , and the heat sink 23 is disposed on the chip 22 . Wherein, the heat sink 23 has a base 231 and a plurality of heat dissipation fins 232 disposed on the base 231 . The base 231 is bonded to the chip 22 for reducing the temperature of the chip 22 . In this embodiment, the cooling fins 232 and the base 231 can be integrally formed, for example, formed by aluminum extrusion.

At present, the heat sink 23 on the market also has a structural design in which the base 231 and the heat dissipation fins 232 are separately arranged, and the structures, shapes, and materials of the base 231 and the heat dissipation fins 232 are also quite different, but various heat dissipation The component 23 also has the function of transferring the heat generated by the wafer 22 to the outside, which should be included in the scope of the present invention.

In addition, the grounding element in this embodiment is adjacent to the heat sink, and the conductive element 24 is disposed on the heat sink 23 and electrically connected to the heat sink 23 and the ground element 25 . In this embodiment, the conductive member 24 can be an elastic piece, one side of which can be connected to the heat dissipation fin 232 , and the other side can be electrically connected to the grounding member 25 in abutting manner.

In this embodiment, the grounding element 25 can be a metal plate or a casing of the electronic device 2 .

Furthermore, in addition to electrically connecting the conductive element 24 and the grounding element 25 in an abutting manner, as shown in FIG. The casing, the sleeve hole 241 is sleeved on the protrusion 251, and then through a riveting process, the conductive member 24 is electrically connected to the grounding member 25 by riveting.

Alternatively, as shown in FIG. 4 , the conductive element 24 is directly welded on the ground element 25 , so that the conductive element 24 and the ground element 25 are electrically connected to each other by welding. In addition, screws (not shown in the figure) can also be used to electrically connect the conducting element and the grounding element in a locking manner.

Again, as shown in Figure 5, in addition to the above-mentioned structure, the conductive member 24 can also be a conductive wire, and the two ends of the conductive member 24 are respectively provided with a clip 242, which can be clamped on the grounding member 25 and has the same function of avoiding Efficacy of electromagnetic interference.

It should be added that, in the above-mentioned embodiment, the cooling element 23 and the conductive element 24 are designed in two pieces. Of course, the cooling element and the conductive element can also be integrally formed, so that the conductive element can still connect the heat dissipation element to the ground. The components are electrically connected to reduce the effect of electromagnetic wave interference.

Please refer to FIG. 2 again, the electronic device 2 with electromagnetic interference suppression function of the present invention further includes a heat dissipation glue 32, the heat dissipation glue 32 is arranged between the chip 22 and the heat dissipation element 23, except that the heat dissipation element 23 can be fixed on the chip 22 In addition to the above, in addition, the heat dissipation glue 32 can also make the heat conduction between the chip 22 and the heat dissipation element 23 better.

Please refer to FIG. 2 again, the electronic device 2 with electromagnetic interference suppression function of the present invention further includes a fan 27, the fan 27 can be arranged on the heat sink 23, and its wind force can transfer the heat of the heat sink 23 to the outside.

Another embodiment of the present invention also discloses a heat dissipation component with electromagnetic interference suppression function, including a heat dissipation element and a conductive element. Since the structure and function of the heat dissipation element and the conduction element are the same as those of the heat dissipation element 23 and the conduction element 24 in the aforementioned embodiment, the details will not be repeated here.

Based on the above, in the electronic device with electromagnetic interference suppression function and its heat dissipation component of the present invention, the heat dissipation element can solve the problem of electromagnetic interference through the arrangement of the conductive element, so as to improve the reliability of the electronic device. In addition, the structure design of the conductive part is simple, the manufacturing cost is low, and it does have good industrial applicability.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the structure and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solutions of the present invention.

Claims (10)

1. An electronic device with electromagnetic interference suppression function, characterized in that it comprises: a circuit board; a chip is disposed on the circuit board; a heat sink is arranged on the chip; a grounding element is located adjacent to the cooling element; and A conductive element electrically connects the cooling element and the grounding element. 2. The electronic device with electromagnetic interference suppression function according to claim 1, further comprising: A casing, the circuit board, the chip, and the cooling element are arranged in the casing, and the grounding element is a metal plate in the casing or the casing. 3. The electronic device with electromagnetic interference suppression function according to claim 1, wherein said heat sink has a base, and a plurality of heat dissipation fins disposed on the base. 4. The electronic device with electromagnetic interference suppression function according to claim 1, wherein said conductive element is a shrapnel or a conductive wire. 5 . The electronic device with electromagnetic interference suppression function according to claim 1 , wherein the conductive element is welded, abutted, riveted, locked or clamped to the grounding element. 6. The electronic device with electromagnetic interference suppression function according to claim 1, wherein the heat dissipation element and the conductive element are integrally formed. 7. A heat dissipation component with electromagnetic interference suppression function is provided with a grounding piece, and it is characterized in that it includes: a heat sink; and A conductive element electrically connects the cooling element and the grounding element. 8. The heat dissipation assembly with electromagnetic interference suppression function according to claim 7, wherein said heat dissipation element has a base and a plurality of heat dissipation fins disposed on the base. 9. The heat dissipation assembly with electromagnetic interference suppression function according to claim 7, wherein said conductive member is a shrapnel or a conductive wire. 10. The heat dissipation assembly with electromagnetic interference suppression function according to claim 7, wherein the conductive member is welded, abutted, riveted, locked or clamped to the grounding member.

Images