CN2518146Y - Heat sink for improved cooling efficiency - Google Patents

Abstract

A heat sink capable of improving heat dissipation efficiency comprises a first heat dissipation body, a second heat dissipation body, a plurality of hollow grid-shaped heat dissipation sheets stamped from a metal sheet and inserted into the first heat dissipation body in a staggered manner, wherein the first and second heat dissipation bodies are respectively made of different heat conduction materials, and the heat dissipation sheets have a certain length as the heat conduction surface, so that the heat dissipation efficiency is improved by the heat dissipation bodies of the two different heat conduction materials, the material cost is effectively reduced, and meanwhile, the first and second heat dissipation bodies have a certain length as the heat dissipation surfaces, the whole surface can conduct heat, and the heat dissipation area which cannot be achieved by the prior art is increased, the heat conducting effect of the whole heat radiating device is better.

Description

Heat sink for improved cooling efficiency

technical field

The utility model relates to a heat dissipation device capable of improving heat dissipation efficiency, in particular to a heat dissipation device composed of two heat dissipation bodies of different heat conduction materials, which can improve the overall heat conduction efficiency and effectively reduce material costs. At the same time, The heat-dissipating fins of the heat-dissipating body have a certain length as the heat-conducting side, and the entire surface can be used for heat-conducting, increasing the heat-dissipating area that cannot be achieved by the known technology, and making the heat-conducting effect of the entire heat-dissipating device better.

Background technique

General heat dissipation device 20, please refer to shown in Fig. 1, has a heat dissipation body 6, and this heat dissipation body 6 is provided with a plurality of upright and equidistantly arranged heat dissipation fins 61, and described heat dissipation fins 61 are all the same heat conduction Material, such as aluminum material, etc., the heat sink 6 and the CPU chip can be clipped together, and a heat dissipation fan is installed above the heat sink 61 of the heat dissipation body 6, and the thermal conductivity of the heat sink 61 and the The role of the cooling fan is to dissipate the high temperature generated by the CPU chip during operation, so as to improve its service life.

But above-mentioned known radiating body 6, if in order to reduce the material cost of whole radiating device 20, and use the heat-conducting material with low cost but poor heat-conducting effect, then the heat-conducting efficiency of this radiating body 6 just can't be improved, loses its heat dissipation instead. The real effect of device 20, but if in order to improve the heat conduction efficiency, if more expensive heat conduction material is used, the material cost of the whole heat dissipation device 20 will remain high, which will affect its market competitiveness; in addition, the known technology The heat dissipation fins 61 are all made relatively small regardless of their length or width, so each heat dissipation fin 61 is formed to conduct heat only at points, so that the heat conduction effect is not good. Therefore, how to design a heat dissipation device that can increase the heat conduction efficiency and reduce the manufacturing cost is a problem that those who are familiar with this technology must solve at present.

Contents of the invention

The purpose of this utility model is to provide a heat dissipation device that can improve heat dissipation efficiency. The heat dissipation device is mainly composed of two heat dissipation bodies of different heat conduction materials, so as to improve the overall heat conduction efficiency and effectively reduce material costs.

Another purpose of the present utility model is to provide a heat dissipation device that can improve heat dissipation efficiency, so that the heat dissipation fin of the heat dissipation body has a certain length as the heat conduction side, and can use the entire surface for heat conduction. A large heat dissipation area, in order to make the heat conduction effect of the whole heat dissipation device better.

The above purpose of the utility model is achieved in the following way: a heat dissipation device that can improve heat dissipation efficiency, wherein the heat dissipation device includes:

A first heat dissipation body, the first heat dissipation body is integrally extended with a plurality of vertical heat dissipation fins, and there is an interval between every two adjacent heat dissipation fins; and,

A second heat dissipation body, the second heat dissipation body is stamped from a metal sheet and has a plurality of hollow grid-shaped heat dissipation fins, and there is also a gap between every two adjacent heat dissipation fins, so that the second heat dissipation body The body is inserted and fixed in the first heat dissipation body in a staggered manner;

The first heat dissipation body and the second heat dissipation body are respectively made of different heat conducting materials.

In the heat dissipation device capable of improving heat dissipation efficiency described in the utility model, the first heat dissipation body has a plate-shaped base plate, and a plurality of vertical heat dissipation fins extend integrally on the base plate.

According to the heat dissipation device of the utility model that can improve heat dissipation efficiency, two rows of horizontal heat dissipation fins are arranged on the base plate, and there is an interval between two adjacent heat dissipation fins in each row.

In the heat dissipation device capable of improving heat dissipation efficiency described in the present invention, the bottom surface of each interval of the first heat dissipation body is provided with solder or thermally conductive adhesive material.

In the heat dissipation device capable of improving heat dissipation efficiency described in the utility model, the heat dissipation fins have a certain length as the heat conduction side.

According to the heat dissipation device of the utility model which can improve heat dissipation efficiency, the heat conduction material is made of aluminum, copper or graphite.

In the heat dissipation device capable of improving heat dissipation efficiency described in the utility model, the overall height of the second heat dissipation body is slightly higher than that of the first heat dissipation body.

The heat dissipation device that can improve heat dissipation efficiency according to the utility model, wherein a heat dissipation fan is installed on the heat dissipation fin of the second heat dissipation body, or a supply system is arranged above the heat dissipation fin of the second heat dissipation body Wind electronic equipment system.

According to the heat dissipation device described in the utility model that can improve heat dissipation efficiency, the main feature is that the heat dissipation device includes a first heat dissipation body, and a plurality of vertical heat dissipation fins are integrally extended on the first heat dissipation body. In addition, a second The heat dissipation body, the second heat dissipation body is stamped with a plurality of hollow grid-shaped heat dissipation fins from a metal plate, so that the second heat dissipation body is inserted in the first heat dissipation body in a staggered manner, and the above-mentioned first heat dissipation body The body and the second heat dissipation body are respectively made of different heat-conducting materials (such as aluminum, copper or graphite), and the heat-conducting side of the heat-dissipating fin has a certain length.

The detailed description and technical content of the present utility model will be described below in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is the schematic diagram of known technology;

Fig. 2 is a three-dimensional schematic diagram of a heat dissipation device capable of improving heat dissipation efficiency described in the present invention;

Fig. 3 is a schematic diagram of the disassembled state of the heat dissipation device that can improve the heat dissipation efficiency described in the utility model;

Fig. 4 is a side sectional view of the heat dissipation device described in the present invention that can improve heat dissipation efficiency;

FIG. 5 is a schematic diagram of an embodiment of the heat dissipation device that can improve heat dissipation efficiency according to the present invention.

Detailed ways

The utility model is a heat dissipation device that can improve heat dissipation efficiency. Please refer to Fig. 2, Fig. 3, and Fig. 4. The heat dissipation device 10 can be applied to a CPU chip for heat dissipation of the CPU chip, wherein the heat dissipation The device 10 includes a first heat dissipation body 1, the first heat dissipation body 1 has a plate-shaped substrate 11, and a plurality of vertical heat dissipation fins 12 are integrally extended on the substrate 11, and the heat dissipation fins 12 can be arranged at equal intervals , or arranged at unequal intervals. In the present embodiment, two rows of horizontal heat sinks 12 are arranged on the substrate 11. The heat sinks 12 are arranged at equal intervals, and two adjacent heat sinks in each row There are gaps 13 between the sheets 12 , and soldering or thermally conductive adhesive material 14 is provided on the bottom surface of each gap 13 .

Please refer to Fig. 2 and Fig. 4, in addition, there is a second heat dissipation body 2, which is embedded in the first heat dissipation body 1 in a staggered manner, and the second heat dissipation body 2 is stamped by a metal plate. A plurality of cooling fins 21 in the shape of a hollow grid plate make an interval 22 between every two adjacent cooling fins, and the width of the interval 22 is just enough to allow the cooling fins 12 of the first heat dissipation body 1 to be accommodated here, or The gap 22 is accommodated in the gap 13 formed by two adjacent cooling fins 12 of the first heat dissipation body 1 .

In the present utility model, please refer to FIG. 3, the above-mentioned first heat dissipation body 1 and the second heat dissipation body 2 are respectively made of different heat conducting materials (such as aluminum, copper or graphite), and the heat dissipation fins 12, 21 are used as The heat conduction side has certain lengths A and B. In a preferred embodiment of the present invention, the first heat dissipation body 1 can be made of aluminum material, while the second heat dissipation body 2 can be made of copper material, or It is made of "copper+aluminum" material to reduce the weight of the second heat dissipation body 2 which is made of copper as a whole.

When assembling the utility model, please refer to Fig. 2 and Fig. 4, so that the plurality of fins 21 of the second heat dissipation body 2 can be embedded in the plurality of fins 12 of the first heat dissipation body 1 in a staggered manner. After the insertion, the second heat dissipation body 2 is fixed on the first heat dissipation body 1 by soldering or thermally conductive adhesive material 14 on the bottom surface of each interval 13. The second heat dissipation body 2 The overall height is slightly higher than that of the first cooling body 1: afterward, cooling fans 3 can be installed on the cooling fins 21 of the second cooling body 2, or the system wind provided by the electronic equipment system can be blown to the cooling device 10 heat dissipation. In this way, the heat dissipation device 10 can be fastened on the CPU chip with a fastener, so that the high temperature generated by the CPU chip can be dissipated by the heat dissipation device 10, so as to improve its service life.

In the utility model, since the heat dissipation device 10 can be composed of heat dissipation bodies 1 and 2 of two different heat-conducting materials, one of the heat dissipation bodies 1 (or 2) can be made of low-cost heat-conducting materials, while the other heat dissipation body 2 (or 1) use a heat-conducting material with high heat-conducting efficiency, so that the overall heat-conducting efficiency can be improved, and the material cost can be effectively reduced: at the same time, the heat-dissipating fins 12, 21 of the heat-dissipating body 1, 2 have a certain The length of the entire heat dissipation device 10 is used for heat conduction, increasing the heat dissipation area that cannot be achieved by the known technology, so that the heat conduction effect of the entire heat dissipation device 10 is better.

To sum up, the heat dissipation device of the present invention that can improve the heat dissipation efficiency can indeed achieve the above-mentioned effects through the above-mentioned structure.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the implementation scope of the present utility model. That is, all equivalent changes and modifications made according to the claims of the utility model are covered by the patent scope of the utility model.

Claims (8)

1. the heat abstractor that can improve radiating efficiency is characterized in that, this heat abstractor includes:

One first heat radiator body, described first heat radiator body is the heat radiator that one is extended with a plurality of settings, and has between per two adjacent heat radiator at interval; And,

One second heat radiator body, described second heat radiator body is by what a metal sheet was stamped to form a plurality of heat radiator that are the hollow grating form to be arranged, have equally at interval between per two adjacent heat radiator, second heat radiator body is fixed in described first heat radiator body with the interlace mode intercalation;

Described first heat radiator body is made of different Heat Conduction Material respectively with second heat radiator body.

2. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that, described first heat radiator body has one and is flat substrate, and one is extended with the heat radiator of a plurality of settings on substrate.

3. the heat abstractor that improves radiating efficiency as claimed in claim 2 is characterized in that, described substrate be provided with two horizontal rows to a plurality of heat radiator, and have at interval between each row's two adjacent heat radiator.

4. the heat abstractor that improves radiating efficiency as claimed in claim 3 is characterized in that, each bottom surface spaced of described first heat radiator body is provided with soldering or heat conduction jointing material.

5. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that, described heat radiator has certain length as the one side of heat conduction.

6. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that described Heat Conduction Material is made of institutes such as aluminium or copper or graphite.

7. the heat abstractor that improves radiating efficiency as claimed in claim 1 is characterized in that the whole height of described second heat radiator body is a little more than first heat radiator body.

8. the heat abstractor that improves radiating efficiency as claimed in claim 1, it is characterized in that, on the described heat radiator of described second heat radiator body, radiator fan is installed, or the electronics of the system's wind system that provides is provided above the described heat radiator of described second heat radiator body.

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