CN222506853U - Heat dissipation refrigerating device - Google Patents
Heat dissipation refrigerating device Download PDFInfo
- Publication number
- CN222506853U CN222506853U CN202420541901.0U CN202420541901U CN222506853U CN 222506853 U CN222506853 U CN 222506853U CN 202420541901 U CN202420541901 U CN 202420541901U CN 222506853 U CN222506853 U CN 222506853U
- Authority
- CN
- China
- Prior art keywords
- heat
- tec
- refrigeration
- fin radiator
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 41
- 238000005057 refrigeration Methods 0.000 claims abstract description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000001816 cooling Methods 0.000 claims abstract description 43
- 239000007788 liquid Substances 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229920000742 Cotton Polymers 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 238000004321 preservation Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 239000000306 component Substances 0.000 description 31
- 101150023508 TEC1 gene Proteins 0.000 description 20
- 239000000047 product Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000001502 supplementing effect Effects 0.000 description 5
- 241000251468 Actinopterygii Species 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
一种散热制冷装置，它涉及电子设备散热降温技术领域。它包含鳍片散热器、TEC和散热风扇，所述鳍片散热器设置于所述TEC上，所述散热风扇设置于鳍片散热器的一侧，所述鳍片散热器包括与所述TEC的热端连接、用于为所述TEC的热端散热的热管鳍片散热器；及，设置于所述TEC的冷端上的制冷鳍片散热器；所述散热制冷装置还包括：一部分设置于所述制冷鳍片散热器内的、另一部分设置于所述制冷鳍片散热器外的水冷循环系统，所述水冷循环系统用于为发热部件换热。采用上述技术方案具有能够有效的对发热部件如CPU等进行散热降温，从而提高发热部件工作的稳定性。
A heat dissipation and refrigeration device, which relates to the technical field of heat dissipation and cooling of electronic equipment. It comprises a fin heat sink, a TEC and a heat dissipation fan, wherein the fin heat sink is arranged on the TEC, the heat dissipation fan is arranged on one side of the fin heat sink, the fin heat sink comprises a heat pipe fin heat sink connected to the hot end of the TEC and used to dissipate heat for the hot end of the TEC; and a cooling fin heat sink arranged on the cold end of the TEC; the heat dissipation and refrigeration device also comprises: a water cooling circulation system, a part of which is arranged inside the cooling fin heat sink and the other part is arranged outside the cooling fin heat sink, and the water cooling circulation system is used to exchange heat for heat-generating components. The above technical solution can effectively dissipate heat and cool down heat-generating components such as CPUs, thereby improving the working stability of heat-generating components.
Description
Technical Field
The utility model relates to the technical field of heat dissipation and cooling of electronic equipment, in particular to a heat dissipation and cooling device.
Background
In electronic devices, chip components are widely used, and electronic components such as a central processing unit (cpu) as a core component generate a large amount of heat during operation. In order to prevent the heat-generating electronic component from being unstable due to the temperature rise caused by heat accumulation, a heat dissipation device is usually added to the electronic component to assist the heat dissipation.
Generally, as known from the disclosure of a temperature control device and an assembly process thereof, the patent publication No. CN115792570a, the temperature control device (heat dissipating device) mainly comprises a TEC, a fin radiator, a heat dissipating fan, a heat insulating plate and an aluminum pressure head, wherein the heat dissipating fan is arranged on one side of the fin radiator, the heat insulating plate is arranged at the upper end of the fin radiator in a floating manner, a mounting groove is formed in the heat insulating plate, the TEC is arranged in the mounting groove and is in contact with the fin radiator, the aluminum pressure head is arranged on the heat insulating plate, the lower end of the aluminum pressure head is connected with the TEC, and at least two contact stages are arranged at the upper end of the aluminum pressure head. The fin radiator is matched with the radiating fan, so that strong convection air is provided for the fin radiator to accelerate heat radiation. However, the development of the computer industry has increased the integration level and functionality of electronic components, resulting in more heat generated on the cpu, and more electronic components need to dissipate heat, and the heat dissipation device needs to be further optimized because the heat dissipation device cannot meet the needs of the user only by means of air heat dissipation.
Disclosure of utility model
The utility model provides a heat dissipation refrigeration device and a control method thereof, which can effectively dissipate heat and cool heat-generating components such as a CPU (Central processing Unit) and the like, thereby improving the working stability of the heat-generating components.
The heat dissipation and refrigeration device comprises a fin radiator, a TEC and a heat dissipation fan, wherein the fin radiator is arranged on the TEC, the heat dissipation fan is arranged on one side of the fin radiator, the fin radiator comprises a heat pipe fin radiator which is connected with the hot end of the TEC and used for dissipating heat for the hot end of the TEC, and a refrigeration fin radiator which is arranged on the cold end of the TEC, and the heat dissipation and refrigeration device further comprises a water cooling circulation system, one part of which is arranged in the refrigeration fin radiator, the other part of which is arranged outside the refrigeration fin radiator, and the water cooling circulation system is used for exchanging heat for a heating component.
The water cooling circulation system comprises a water tank, a circulation pump, a metal refrigeration pipeline, a cold and heat exchange head and a heat exchange head, wherein the water tank is used for storing liquid, the circulation pump is communicated with the water tank through a first connecting pipeline, one part of the metal refrigeration pipeline is positioned in the TEC, the other part of the metal refrigeration pipeline penetrates through the refrigeration fin radiator, one end of the metal refrigeration pipeline is communicated with the circulation pump through a second connecting pipeline, the cold and heat exchange head is communicated with the other end of the metal refrigeration pipeline through a third connecting pipeline and used for exchanging heat for a heating component, the liquid can flow in the cold and heat exchange head, and the cold and heat exchange head is communicated with the water tank through a fourth connecting pipeline.
Optionally, a semiconductor refrigeration sheet is arranged in the TEC, and a heat insulation cotton layer is arranged below the TEC and right below the semiconductor refrigeration sheet.
Optionally, the cooling fan is fixedly arranged on one side, far away from the heat pipe fin radiator, of the refrigeration fin radiator.
Optionally, the TEC is fixedly disposed on the upper surface of the cold-heat exchange head, and the heat insulation cotton layer is disposed between the TEC and the cold-heat exchange head and covers the upper surface of the cold-heat exchange head.
Optionally, a fluid infusion port is formed in the water tank, and a sealing plug is detachably arranged on the fluid infusion port.
Optionally, the metal refrigeration pipeline is a copper product or an aluminum product.
Optionally, the air inlet of the cooling fan faces one side of the cooling fin radiator.
After the technical scheme is adopted, the heat dissipation refrigeration device has the beneficial effects that the heat dissipation refrigeration device comprises a fin radiator, a TEC, a heat dissipation fan and a water cooling circulation system, wherein the fin radiator is arranged on the TEC, the heat dissipation fan is arranged on one side of the fin radiator, and the fin radiator comprises a heat pipe fin radiator and a refrigeration fin radiator. Part of the cold water circulation system is attached to a heating component such as a CPU chip, so that heat generated by the heating component is taken away through flowing liquid. And the hot end of the TEC of the heat pipe fin radiator radiates heat. The cooling fin radiator is used for radiating heat of liquid flowing through the cooling fin radiator into air, so that the temperature of the flowing liquid is reduced, the heat of the heating component is taken away in the circulation process of the liquid in the water cooling circulation system, the cold end of the TEC is used for rapidly cooling the liquid flowing through the cold end of the TEC, the heat radiation of the liquid in the water cooling circulation system is further accelerated, the heat efficiency of the heating component is improved, the probability of abnormality of the heating component due to overhigh temperature is reduced, and the working reliability of the heating component is improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
fig. 2 is an exploded view of the present utility model.
The reference numerals are 1, TEC, 11, semiconductor refrigerating sheets, 2, a cooling fan, 3, a heat pipe fin radiator, 31, a heat conducting pipe, 4, a water cooling circulation system, 41, a water tank, 42, a circulation pump, 43, a metal refrigerating pipeline, 44, a cold-heat exchange head, 45, a sealing plug, 5, a heat insulation and heat preservation cotton layer, a liquid supplementing port, 6, a refrigerating fin radiator, 7, a first connecting pipeline, 8, a second connecting pipeline, 9, a third connecting pipeline, 10 and a fourth connecting pipeline.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and those skilled in the art can make modifications to the present embodiment which do not contribute to the utility model as required after reading the present specification, but are protected by the patent laws within the scope of the appended claims.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of some utility models, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The embodiment relates to a heat dissipation and refrigeration device, as shown in fig. 1 and 2, comprising a fin radiator, a TEC1 and a heat dissipation fan 2, wherein the fin radiator is arranged on the TEC1, the heat dissipation fan 2 is arranged on one side of the fin radiator, and the fin radiator comprises a heat pipe fin radiator 3 and a refrigeration fin radiator 6.
The heat pipe fin radiator 3 is connected with the hot end of the TEC1, and the heat pipe fin radiator 3 is used for radiating heat for the hot end of the TEC 1. A refrigeration fin heat sink 6 is disposed on the cold end of TEC 1. The heat dissipation refrigerating device also comprises a water cooling circulation system 4, wherein one part of the water cooling circulation system 4 is arranged in the refrigerating fin radiator 6, the other part of the water cooling circulation system 4 is arranged outside the refrigerating fin radiator 6, the water cooling circulation system 4 is used for exchanging heat for a heating component, and the heating component can be a Central Processing Unit (CPU). The fin radiator and the TEC1 are used for cooling the heating component, the water cooling circulation system 4 is used for further radiating heat of the heating component, heat of the heating component is taken away through the flowing liquid, and radiating efficiency of the heating component is further improved, so that probability of abnormality of the heating component due to overhigh temperature is reduced, and working reliability of the heating component is improved.
The part of the cold water circulation system is attached to the heat generating component such as the CPU chip, so that the heat generated by the heat generating component is taken away by flowing liquid. The heat pipe fin radiator 3 comprises a plurality of heat pipes 31 and radiating fins, wherein the plurality of heat pipes 31 are arranged in parallel, the plurality of radiating fins are stacked from bottom to top, one end of each heat pipe 31 is connected with the hot end of the TEC1, and the other end of each heat pipe 31 penetrates through the plurality of radiating fins from bottom to top. The heat pipe 31 is a copper product or an aluminum product. The cooling fin radiator 6 comprises a plurality of cooling fins which are sequentially stacked on the cold end of the TEC1 from bottom to top, so that heat of liquid flowing through the cooling fin radiator 6 is emitted into air, the temperature of the flowing liquid is reduced, heat of a heating component is taken away in a circulation process of the liquid in the water cooling circulation system 4, the cold end of the TEC1 is used for rapidly cooling the liquid flowing through the cold end of the TEC1, heat dissipation of the liquid in the water cooling circulation system 4 is further accelerated, and therefore heat efficiency of the liquid in the water cooling circulation system 4 for taking away the heat of the heating component in the circulation process is improved.
Preferably, in order to realize the circulation flow of the liquid in the cold water circulation system to remove the heat on the heat generating components, the water cooling circulation system 4 includes a water tank 41, a circulation pump 42, a metal refrigeration pipe 43 and a cold-heat exchange head 44.
The water tank 41 is used for storing liquid. The circulation pump 42 communicates with the water tank 41 through the first connection pipe 7. One part of the metal refrigeration pipeline 43 is positioned in the TEC1, the other part of the metal refrigeration pipeline is penetrated through the refrigeration fin radiator 6, and one end of the metal refrigeration pipeline 43 is communicated with the circulating pump 42 through the second connecting pipeline 8. The cold-heat exchange head 44 is communicated with the other end of the metal refrigerating pipeline 43 through the third connecting pipeline 9, the cold-heat exchange head 44 is used for exchanging heat for the heating component, liquid can flow in the cold-heat exchange head 44, the cold-heat exchange head 44 is communicated with the water tank 41 through the fourth connecting pipeline 10, the cold water circulation system forms a circulation loop, the water tank 41 is used for supplementing liquid for the cold water circulation system, and meanwhile, the liquid flowing through the cold-heat exchange head 44, the metal refrigerating pipeline 43 and the circulation pump 42 is mixed with the liquid in the water tank 41 for uniform temperature. Optionally, the first connecting pipe 7, the second connecting pipe 8, the third connecting pipe 9 and the fourth connecting pipe 10 are all hoses. The hose may be a silicone hose. Optionally, the metal refrigeration conduit 43 is a copper or aluminum product.
Optionally, be provided with semiconductor refrigeration piece 11 in TEC1, TEC1 below just is provided with thermal-insulated heat preservation cotton layer 5 under the semiconductor refrigeration piece 11 to the cold and hot end of isolated TEC1 avoids TEC1 cooling time to appear the condensation phenomenon with the spare part that TEC 1's cold junction is close to. The heat insulation cotton layer 5 is stuck and fixed with the lower surface of the TEC 1.
It should be noted that, when the heat dissipation and refrigeration device of the present application is applied to cooling an electric product such as a computer or a fish tank, and the heat dissipation and refrigeration device is applied to the fish tank, the heat exchange head 44 is disposed in the fish tank, and the fin radiator, the circulation pump 42, the water tank 41, the heat dissipation fan 2 and the TEC1 are all disposed outside the water tank 41. Optionally, the heat pipe fin radiator 3 and the refrigeration fin radiator 6 are arranged in parallel, and the heat dissipation fan 2 is used for taking away heat on the heat pipe fin radiator 3 and the refrigeration fin radiator 6. In the present embodiment, the heat radiation fan 2 is fixedly disposed on the side of the refrigeration fin radiator 6 away from the heat pipe fin radiator 3. The cooling fan 2 fixes one side of the cooling fin radiator 6 by screws. In some embodiments, when the heat dissipation and refrigeration device of the present application is applied to an electrical product such as a computer, the components of the heat dissipation and refrigeration device are more compact, the TEC1 is fixedly disposed on the upper surface of the cold-heat exchange head 44, and the heat insulation cotton layer 5 is disposed between the TEC1 and the cold-heat exchange head 44 and covers the upper surface of the cold-heat exchange head 44. TEC1 is fixed on cold-heat exchange head 44 through the screw, and the screw wears TEC1 and thermal insulation cotton layer 5 in proper order to be fixed on cold-heat exchange head 44. Further, to stabilize TEC1 on the stationary heat exchange head 44, a spring is sleeved on the screw head, the spring being located between TEC1 and the screw head.
Optionally, in order to facilitate the user to supplement the liquid in the water tank 41 according to the requirement, the water tank 41 is provided with a liquid supplementing port a, and the liquid supplementing port a is detachably provided with a sealing plug 45. The sealing plug 45 can be connected with the fluid supplementing port a through threads. The sealing plug 45 may be an elastic silicone article.
The above description is only for the purpose of illustrating the technical solution of the present utility model and not for the purpose of limiting the same, and other modifications and equivalents thereof by those skilled in the art should be included in the scope of the claims of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (8)
1. The heat dissipation refrigeration device comprises a fin radiator, a TEC (1) and a heat dissipation fan (2), wherein the fin radiator is arranged on the TEC (1), and the heat dissipation fan (2) is arranged on one side of the fin radiator; and a refrigeration fin radiator (6) arranged on the cold end of the TEC (1);
The heat dissipation refrigeration device also comprises a water cooling circulation system (4) of which one part is arranged in the refrigeration fin radiator (6) and the other part is arranged outside the refrigeration fin radiator (6), wherein the water cooling circulation system (4) is used for exchanging heat for a heating component.
2. The heat-dissipating and refrigerating apparatus according to claim 1, wherein the water-cooling circulation system (4) comprises a water tank (41), the water tank (41) being for storing a liquid;
a circulation pump (42) communicating with the water tank (41) through a first connection pipe (7);
a part of the metal refrigerating pipeline (43) is positioned in the TEC (1), the other part of the metal refrigerating pipeline (43) penetrates through the refrigerating fin radiator (6), one end of the metal refrigerating pipeline (43) is communicated with the circulating pump (42) through a second connecting pipeline (8), and,
And a cold-heat exchange head (44) communicated with the other end of the metal refrigerating pipeline (43) through a third connecting pipeline (9) and used for exchanging heat for the heating component, wherein the liquid can flow in the cold-heat exchange head (44), and the cold-heat exchange head (44) is communicated with the water tank (41) through a fourth connecting pipeline (10).
3. The heat dissipation and refrigeration device according to claim 2, wherein a semiconductor refrigeration piece (11) is arranged in the TEC (1), and a heat insulation cotton layer (5) is arranged below the TEC (1) and right below the semiconductor refrigeration piece (11).
4. A heat sink and refrigeration device according to claim 1, characterized in that the heat radiation fan (2) is fixedly arranged on the side of the refrigeration fin radiator (6) remote from the heat pipe fin radiator (3).
5. A heat dissipation and refrigeration device as set forth in claim 3, characterized in that the TEC (1) is fixedly disposed on the upper surface of the cold-heat exchange head (44), and the heat insulation and heat preservation cotton layer (5) is disposed between the TEC (1) and the cold-heat exchange head (44) and covers the upper surface of the cold-heat exchange head (44).
6. The heat dissipation and refrigeration device as recited in claim 2, characterized in that a fluid-supplementing port (a) is formed in the water tank (41), and a sealing plug (45) is detachably mounted on the fluid-supplementing port (a).
7. A heat sink refrigeration device according to claim 2, characterized in that the metal refrigeration duct (43) is a copper product or an aluminium product.
8. A heat sink refrigeration device according to claim 1, characterized in that the inlet opening of the heat dissipating fan (2) is directed towards the side of the refrigeration fin radiator (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420541901.0U CN222506853U (en) | 2024-03-20 | 2024-03-20 | Heat dissipation refrigerating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420541901.0U CN222506853U (en) | 2024-03-20 | 2024-03-20 | Heat dissipation refrigerating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222506853U true CN222506853U (en) | 2025-02-18 |
Family
ID=94560576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420541901.0U Active CN222506853U (en) | 2024-03-20 | 2024-03-20 | Heat dissipation refrigerating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222506853U (en) |
-
2024
- 2024-03-20 CN CN202420541901.0U patent/CN222506853U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI663903B (en) | Thermoelectric cooling module and heat dissipation apparatus including the same | |
| CN204721777U (en) | Electronic device and liquid cooling type heat dissipation structure thereof | |
| CN100394352C (en) | cooling jacket | |
| US20070163270A1 (en) | Liquid cooling system with thermoeletric cooling module | |
| TWM512883U (en) | Heat dissipation module, water-cooling heat dissipation module and heat dissipation system | |
| GB2456590A (en) | Water cooled heat dissipation device for a notebook computer | |
| US20060021737A1 (en) | Liquid cooling device | |
| JP3068892U (en) | CPU heat dissipation device | |
| US20110192572A1 (en) | Heat exchanger | |
| CN201119246Y (en) | Water-cooled auxiliary heat dissipation device | |
| TWM355548U (en) | Heat-dissipation module | |
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN2410678Y (en) | A cooling device for a computer mainframe | |
| CN207719189U (en) | A kind of CPU high fevers radiator | |
| CN109152314B (en) | Heat abstractor, control radiating component and washing machine | |
| TWM586876U (en) | Composite water-cooled drain structure | |
| CN222506853U (en) | Heat dissipation refrigerating device | |
| TWM442535U (en) | Heat-dissipating device and heat-dissipating module | |
| CN218994113U (en) | Water-cooling radiator | |
| WO2023232064A1 (en) | Water-cooled heat radiating device | |
| CN206895114U (en) | A positioning radiator for communication equipment | |
| CN113325936B (en) | Quick cold type heat sink of CPU frost | |
| CN211607189U (en) | Liquid cooling device with pumping structure | |
| CN118244861A (en) | Heat dissipation refrigeration device and control method thereof | |
| CN216527067U (en) | Water-cooling row with semiconductor refrigerating sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |