CN201119246Y - Water-cooled auxiliary heat dissipation device - Google Patents

Abstract

A water-cooled auxiliary heat radiator is set on a heat radiator with a first and a second guide tubes and containing cooling liquid to provide auxiliary heat radiation function, which comprises a heat radiation plate unit with a frame and a heat radiation fin component, a first cooling wafer set on the frame and connected with the heat radiation fin component, and a cooling unit set on the frame and connected with the first and the second guide tubes, wherein the cooling unit includes a first cooling liquid groove. Therefore, by virtue of the advantage that the first low-temperature surface of the first chilled wafer can generate low temperature in a short time, the cooling liquid which absorbs heat and is heated up during heat dissipation in the first cooling liquid tank of the cooling unit is rapidly cooled, so as to achieve the effect of auxiliary heat dissipation.

Description

Water-cooled auxiliary cooling device

【Technical field】

The utility model relates to an auxiliary cooling device, in particular to a water-cooled auxiliary cooling device which can effectively achieve the auxiliary cooling effect.

【Background technique】

With the rapid advancement of electronic technology, the operating efficiency of electronic components has been greatly improved. Correspondingly, the heat energy generated during its operation has also increased significantly. In order to avoid damage or failure of electronic components due to high heat, in addition to the general In addition to cooling fans on electronic components, there are also cooling devices designed using water-cooling principles on the market, such as water-cooling head devices that are generally installed directly on electronic components for heat dissipation.

As shown in Figure 1, the existing heat sink for electronic components is used to be installed on an electronic component 31 of an electrical device 3 that generates high temperature during operation, so as to assist the electronic component 31 to dissipate heat. The heat sink 1 includes a hollow Heat absorbing element 11, a refrigerant 2 that can circulate in the heat absorbing element 11, a first conduit 12 communicated with the heat absorbing element 11, a second conduit 13 communicated with the heat absorbing element 11, a A condensing element 14 communicated with the first and second conduits 12, 13, a fan 15 arranged on the electrical equipment 3 and connected to the condensing element 14, and a pumping element 16 arranged on the first conduit 12 . Wherein, the condensing element 14 has a continuously bent condensing tube 141 communicating with the first and second conduits 12 , 13 respectively, and several cooling fins 142 arranged between the condensing tubes 141 at intervals.

Compared with the existing water-cooled head device directly installed on the electronic components, the heat dissipation device of the electronic components can effectively improve the circulation of the refrigerant 2 in the heat dissipation device 1 by installing the pumping member 16 on the first conduit 12 efficiency, and can overcome the influence of the condensation and evaporation of the refrigerant 2 in the pipeline on the circulation flow direction, and avoid the installation restriction that the existing condensing element 14 must be higher than the heat absorbing element 11 .

However, although the above-mentioned design can indeed improve the circulation efficiency of the refrigerant 2 and accelerate the flow of the refrigerant 2, relatively, the time for the refrigerant 2 to pass through the condensation pipe 141 is also shortened. Therefore, the condensation The cooling effect of the pipe 141 on the passing refrigerant 2 is also reduced. Not only cannot the refrigerant 2 pass through the condensing pipe 141, it can be effectively lowered to a lower temperature, but it may cause the refrigerant 2 injected into the heat absorbing element 11 to The temperature is too high, resulting in poor overall heat dissipation efficiency.

Therefore, how to achieve the auxiliary heat dissipation effect effectively and in a short time has become a research direction that the related industry wants to study hard.

【Content of utility model】

The purpose of the utility model is to provide a water-cooled auxiliary heat dissipation device which can effectively achieve the effect of auxiliary heat dissipation.

The water-cooled auxiliary heat dissipation device of the utility model is arranged on a heat dissipation device having a first conduit and a second conduit and containing cooling liquid, so as to assist the heat dissipation device to dissipate heat. The water-cooled auxiliary heat dissipation device includes : a cooling plate unit, a fan, a cooling unit, and a first cooling chip.

The heat dissipation plate unit includes a frame and a heat dissipation fin assembly. The fan is arranged on the frame and adjacent to the cooling fin assembly. The cooling unit is arranged on the frame and communicates with the first and second conduits of the cooling device respectively. The first cooling chip is arranged on the frame and has a first low-temperature surface adjacent to the cooling unit and a first high-temperature surface adjacent to the cooling fin assembly.

The beneficial effects of the utility model are: by virtue of the advantage that the low-temperature surface of the first refrigerated wafer can generate low temperature in a short time, the cooling liquid that flows through the cooling unit that is heated due to the absorption of heat energy is rapidly cooled to provide Auxiliary heat dissipation effect of the cooling device.

【Description of drawings】

Fig. 1 is an explanatory diagram of an existing water-cooled heat sink;

Fig. 2 is an explanatory diagram of a preferred embodiment of the water-cooled auxiliary cooling device of the present invention, in which the water-cooled auxiliary cooling device performs auxiliary cooling on a cooling device;

Figure 3 is a perspective view of the preferred embodiment;

Fig. 4 is a partial cross-sectional view of the components and locations of the preferred embodiment.

【Detailed ways】

Below in conjunction with accompanying drawing and embodiment the utility model is described in detail:

Referring to Fig. 2 and Fig. 3, a preferred embodiment of the water-cooled auxiliary heat dissipation device of the present invention is arranged on a heat dissipation device 1 having a first conduit 12 and a second conduit 13 and containing cooling liquid 2, To assist the heat dissipation device 1 to dissipate heat, the water-cooled auxiliary heat dissipation device includes a heat dissipation plate unit 4 , a fan 5 , a first cooling chip 6 , a second cooling chip 60 , and a cooling unit 70 . In addition, in this preferred embodiment, the coolant 2 is an example of refrigerant, in addition, water, liquid helium and other substances can also be used, and should not be limited to the specific examples cited in this preferred embodiment .

Referring to FIGS. 3 and 4 , the heat dissipation plate unit 4 includes a frame 41 and a heat dissipation fin assembly 42 . The frame 41 has a first base surface 411 , a second base surface 412 , a first end surface 413 , and a second end surface 414 . The cooling fin assembly 42 has a base wall 421 connected to the first base surface 411 of the frame 41 , and several plates 422 spaced apart from the base wall 421 extending away from the first base surface 411 . It is worth mentioning that, in practice, the frame 41 and the cooling fin assembly 42 are made of heat-conducting metal materials.

The fan 5 is disposed on the second base surface 412 of the frame 41 .

The cooling unit 70 includes a first cooling liquid tank 7 , a second cooling liquid tank 8 , and a connecting pipe 9 . The first coolant tank 7 is disposed on the first end surface 413 of the frame 41 and has a first liquid inlet hole 71 and a first liquid outlet hole 72 . The second cooling liquid tank 8 is disposed on the second end surface 414 of the frame 41 and has a second liquid inlet hole 81 and a second liquid outlet hole 82 . Two ends of the connecting pipe 9 are respectively connected to the first liquid outlet hole 72 and the second liquid inlet hole 81 . Moreover, the first liquid inlet hole 71 and the second liquid outlet hole 82 communicate with the first and second conduits 12 and 13 of the heat dissipation device 1 in sequence, respectively.

The first cooling chip 6 is electrically connected to a power supply (not shown), and is arranged on the first cooling liquid tank 7, and the first cooling chip 6 has a A first low temperature surface 61 in contact with, and a first high temperature surface 62 in contact with the cooling fin assembly 42 .

The second cooling chip 60 is electrically connected to the power supply (not shown), and is arranged on the second cooling liquid tank 8, and has a second low temperature surface 63 in contact with the second cooling liquid tank 8 , and a second high temperature surface 64 in contact with the cooling fin assembly 42 .

It is worth mentioning that in this preferred embodiment, although only the first and second cooling chips 6, 60 are set, in practical applications, more than two cooling chips can be added to strengthen the cooling effect of the cooling chip. The heat dissipation and cooling effects of the first and second cooling liquid tanks 7 and 8 should not be limited to the specific form and quantity in this preferred embodiment.

With reference to Fig. 2, when the utility model water-cooled auxiliary heat dissipation device is connected to the heat dissipation device 1, after the heat dissipation device 1 dissipates heat to an electronic component 31 of an electrical device 3 that generates high temperature during operation, it flows in the The liquid temperature of the cooling liquid 2 in the cooling device 1 will also increase accordingly; 71, and in the process of flowing out of its first liquid outlet hole 72, it can be rapidly cooled by the first low-temperature surface 61 of the first cooling chip 6 that is arranged in contact with the cooling liquid tank 7, and when cooling The liquid 2 flows from the first liquid outlet hole 72 through the connecting pipe 9 into the second liquid inlet hole 81, and in the process of flowing out of the second liquid outlet hole 82, the liquid 2 passes through the second liquid outlet hole 8 in contact with the cooling liquid tank 8. The second low-temperature surface 63 of the cooling chip 60 makes it cool again, so as to reach the purpose of assisting the heat dissipation of the cooling liquid 2 in the cooling device 1; in addition, the first and second cooling chips 6, 60 produce The heat on the first and second high-temperature surfaces 62, 64 can also be transferred to the cooling plate unit 4 by the principle of metal conduction, and then the plate 422 of the cooling fin assembly 42 can be used to cooperate with the operation of the fan 5 to dissipate the heat. The heat escapes.

It is worth mentioning that, in this preferred embodiment, in addition to installing the first cooling liquid tank 7, the main reason for adding the second cooling liquid tank 8 is to prolong the cooling time course of the cooling liquid 2; In addition, the number of water-cooled auxiliary cooling devices installed on the cooling device 1 can be several, so as to strengthen and quickly carry out auxiliary cooling of the cooling liquid 2 in the cooling device 1. Therefore, the cooling liquid tank and the water-cooling type The number of auxiliary heat sinks and their locations are easy to think about and change for those with relevant backgrounds, so they should not be limited by the specific examples of this preferred embodiment, and their numbers can be adjusted according to actual needs, or Change its installation location.

As can be seen from the above description, the water-cooled auxiliary heat dissipation device of the present invention can take advantage of the advantages that the first and second low-temperature surfaces 61, 63 of the first and second cooling chips 6, 60 can generate low temperatures in a short time, convective flow through The cooling liquid 2 in the first and second cooling liquid tanks 7 and 8 of the cooling unit 70 , which is warmed up by absorbing heat energy, quickly achieves the effects of assisting heat dissipation and cooling. In addition, the heat dissipation of the first and second cooling chips 6, 60 can also be accelerated by the heat dissipation fin assembly 42, so the purpose of the present utility model can be achieved indeed.

Claims (5)

1. water-cooled auxiliary radiating device, being arranged at one has on the heat abstractor of one first conduit and one second conduit, so that the effect of auxiliary this heat abstractor heat radiation to be provided, comprise: a cooling plate unit, a fan, a cooling unit, and one first cooling wafer, wherein this cooling plate unit comprises a framework and a heat radiation fin assemblies, and this fan is arranged on this framework and contiguous this heat radiation fin assemblies; It is characterized in that: this cooling unit is to be arranged on this framework, and is connected with first and second conduit of this heat abstractor respectively; And this first cooling wafer is to be arranged on this framework, and has first low temperature face of contiguous this cooling unit and first high temperature face of contiguous this heat radiation fin assemblies.

2. water-cooled auxiliary radiating device as claimed in claim 1, it is characterized in that: this cooling unit comprises that first a cooling liquid bath, with one first liquid-entering hole and one first fluid hole has the second cooling liquid bath of one second liquid-entering hole and one second fluid hole, an and tube connector, the two ends of this tube connector are connected with this first fluid hole and second liquid-entering hole respectively, and this first liquid-entering hole and second fluid hole are connected with first and second conduit of this heat abstractor respectively in regular turn.

3. water-cooled auxiliary radiating device as claimed in claim 2, it is characterized in that: this cooling plate unit and fan be arranged at this first and second the cooling liquid bath between, and the first low temperature face of this first cooling wafer contacts with this first cooling liquid bath, and this first high temperature face contacts with this heat radiation fin assemblies.

4. water-cooled auxiliary radiating device as claimed in claim 3, it is characterized in that: this water-cooled auxiliary radiating device also comprises second cooling wafer with one second low temperature face and one second high temperature face, and the second low temperature face of this second cooling wafer contacts with this second cooling liquid bath, and this second high temperature face contact with this heat radiation fin assemblies with this.

5. water-cooled auxiliary radiating device as claimed in claim 4 is characterized in that: this framework and heat radiation fin assemblies are to be made by the heat-conducting metal material.

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