CN105682434A - Composite heat dissipation device combined with thermoelectric cooling and micro channel liquid cooling - Google Patents

Abstract

The invention discloses a composite cooling device combining thermoelectric cooling and microchannel liquid cooling. The composite cooling device mainly consists of a first-stage microchannel heat sink (4), a second-stage microchannel heat sink (6), and a thermoelectric cooling sheet. (3) and a heat sink liquid supply system, the thermoelectric cooling chip (3) is located on the upper end of the first-stage microchannel heat sink (4), the first-stage microchannel heat sink (4) and the second-stage microchannel The heat sink (6) communicates with the heat sink liquid supply system. The invention utilizes liquid cooling and thermoelectric refrigeration to carry out combined heat dissipation, has large heat dissipation, good effect, stable heat dissipation, and reduces damage to heat dissipation equipment.

Description

A Composite Heat Dissipator Combining Thermoelectric Refrigeration and Microchannel Liquid Cooling

technical field

The invention relates to a heat dissipation device, which belongs to the field of heat dissipation of electronic equipment, and more specifically relates to a composite heat dissipation device combined with thermoelectric refrigeration and microchannel liquid cooling.

Background technique

The miniaturization of electronic components and their combination with mechanical devices has rapidly increased the power density and heat generation of equipment. The heat problem of the highly integrated central processing unit in the computer field and the laser scalpel in the medical field is very prominent. At present, the common method is air-cooling for heat dissipation, but the maximum heat flux density of air-cooling convection heat transfer will not exceed 50W/cm ² , which cannot meet the heat dissipation requirements. Therefore, research on efficient and real-time cooling methods is imperative.

Thermoelectric refrigeration is the use of PN junctions made of semiconductor materials to pass rated DC current, and thermoelectric effects will occur on the contact surface of the two junctions, mainly including Peltier effect, Joule effect, Fourier effect, Seebeck effect and Thomson effect. There are five kinds of thermoelectric effects, and thermoelectric refrigeration mainly uses the Peltier effect to cool. Generally speaking, there will be a large temperature difference between the two ends of the thermoelectric cooling chip, and the heat accumulation at the hot end of the cooling chip is very obvious, so the heat at the hot end can be taken away in time to ensure the normal operation of the cooling chip. Microchannel heat sinks (microchannel heat sinks) are fluid channels processed on the surface of very thin silicon wafers, metals or other materials. When the flow space is small to a certain extent, different fluids appear during the flow of different channels. The scale of the scale effect is different; generally speaking, the equivalent diameter of the microchannel is 1 mm or less. The study found that the wall structure of the microchannel has a great influence on the flow state of the fluid, which largely determines the convective conversion of the structure. Thermal capacity, a reasonable microchannel wall structure plays a very important role in maintaining high heat dissipation characteristics.

At present, people are more simply using thermoelectric cooling or micro-channel liquid cooling, which has many shortcomings: the possible condensation problem of thermoelectric cooling will cause damage to the equipment; micro-channel liquid cooling cannot meet the heat dissipation requirements when the equipment generates a large amount of heat. , and the traditional microchannel wall temperature difference is large, the temperature distribution is uneven, and the flow resistance is large; some people try to combine the two methods to provide cooling and heating equipment, but the above problems have not been well resolved.

Contents of the invention

The invention overcomes the deficiencies of the prior art, provides a composite heat dissipation device combined with thermoelectric refrigeration and microchannel liquid cooling, and solves the technical problems of small heat dissipation and easy damage to heating equipment in the past.

In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions:

A composite heat dissipation device combining thermoelectric refrigeration and microchannel liquid cooling, the composite heat dissipation device is mainly composed of a first-stage microchannel heat sink, a second-stage microchannel heat sink, a thermoelectric cooling sheet, and a heat sink liquid supply system. The thermoelectric cooling sheet is located on the upper end of the first-level microchannel heat sink, and the first-level microchannel heat sink communicates with the second-level microchannel heat sink through a heat sink liquid supply system.

Specifically, heat dissipation fins are connected to the upper ends of the thermoelectric cooling fins and the second-stage microchannel heat sink, and heat dissipation fans are connected to the upper ends of the heat dissipation fins.

Specifically, there are two thermoelectric cooling sheets, and the two thermoelectric cooling sheets are connected in parallel with each other. There are also two first-stage microchannel heat sinks at the lower end of the thermoelectric cooling sheet. The level microchannel heat sink communicates with the heat sink liquid supply system.

Specifically, the first-level microchannel heat sink is composed of a first-level heat sink body and a first-level cover plate located at the upper end of the first-level heat sink body, and the first-level heat sink body includes a first-level heat sink body Micro-channel carrier, the first-level micro-channel carrier is provided with a plurality of first-level micro-channels arranged in parallel evenly, and the first-level micro-channel carrier is located at both ends of the first-level micro-channel. First stage heat sink sump.

Specifically, the second-level microchannel heat sink is composed of a second-level heat sink body and a second-level cover plate located at the upper end of the second-level heat sink body, and the second-level heat sink body includes a second-level heat sink body Micro-channel carrier, the second-level micro-channel carrier is provided with a plurality of evenly arranged second-level micro-channels, and the second-level micro-channel carrier is located at both ends of the second-level micro-channels. The first-level heat sink liquid collection tank, the side wall of the second-level micro-channel has a wavy structure with alternating concave and convex, and the concave and convex surfaces of the wavy structure are arc surfaces.

Specifically, the heat sink liquid supply system includes a liquid supply tank, the outlet pipe of the liquid supply tank communicates with the first-stage microchannel heat sink, and the water inlet pipe of the liquid supply tank communicates with the second-stage microchannel heat sink, so The first-level microchannel heat sink and the second-level microchannel heat sink are connected through connecting pipes, and the liquid supply tank, water outlet pipe, water inlet pipe and connecting pipes form a liquid flow circuit.

Specifically, a water pump is provided on the outlet pipe of the liquid supply tank.

Specifically, the first-level microchannel heat sink and/or the second-level microchannel heat sink are made of aluminum or copper.

Specifically, the composite cooling device also includes a fixing device arranged at the lower end of the first-stage microchannel heat sink, the second-stage microchannel heat sink, the thermoelectric cooling sheet and the heat sink liquid supply system.

Compared with prior art, the beneficial effect of the present invention is:

1. When the calorific value of the present invention is not large, the liquid cooling method is used to dissipate heat, but at the same time, part of the heat is directly taken away by the fins and cooling fans through the heat sink; when the liquid cooling method cannot meet the demand, the thermoelectric cooling sheet and heat dissipation The fan starts to work, the thermoelectric cooling sheet cools the liquid flowing through the first-stage heat sink, and the low-temperature liquid enters the second-stage heat sink, which can keep the cooling device at a very low temperature when the heat generation is large. In this way, the conditional start and stop of the refrigerating sheet and the corresponding fan can not only keep the cooling device at a very low temperature under necessary conditions, but also selectively save power.

2. The first-stage micro-channel of the present invention is a parallel channel, which can increase the distribution area of the liquid, which is conducive to the cooling of the liquid by the cooling plate, and will not cause greater resistance to the flow of the liquid; the second The side wall of the micro-channel has a concave-convex staggered wavy structure, which periodically changes the internal structure of the micro-channel. This wall structure can break the fluid boundary layer, cause the fluid to periodically disturb, and increase the fluid seepage. Significantly enhance the convective heat transfer capacity of the fluid, and at the same time the flow resistance of the fluid is not too large.

3. The thermoelectric cooling chip of the present invention consists of two single thermoelectric cooling chips connected in parallel, which can prevent the failure of the entire refrigeration system due to the failure of a single thermoelectric cooling chip, and improve the stability of the refrigeration system.

4. The second-level microchannel heat sink in the present invention directly dissipates heat for the heat dissipation equipment, and the second-level micro-channel heat sink is not directly connected to the cold end of the thermoelectric cooling sheet, which greatly reduces the heat loss due to condensation of the second-level microchannel heat sink. Possibility of frost damage to cooling equipment.

Description of drawings

The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

Fig. 1 is a structural representation of the present invention;

Fig. 2 is a partial structure schematic diagram of the present invention;

Fig. 3 is the structural representation of first stage microchannel heat sink and second stage microchannel heat sink;

Fig. 4 is a top view of Fig. 3, in which the first-level cover plate and the second-level cover plate are omitted;

Fig. 5 is a side view of the first stage cover plate;

Fig. 6 is a schematic structural view of a second-stage cover plate;

Fig. 7 is the sectional view of A-A plane among Fig. 6;

The marks in the figure are respectively represented as: 1. water pump; 2. water outlet pipe; 3. thermoelectric cooling sheet; 4. first-stage microchannel heat sink; 4-1. first-stage heat sink body; 4-11. first-stage Level microchannel carrier; 4-12, first level microchannel; 4-13, first level microchannel wall; 4-14, first level heat sink sump; 4-2, first level cover plate ; 5, connecting pipes; 6, second-level microchannel heat sink; 6-1, second-level heat sink body; 6-11, second-level microchannel carrier; 6-12, second-level microchannel flow channel; 6-13. Second-level micro-pass wall; 6-14. Second-level heat sink liquid collection tank; 6-2. Second-level cover plate; 7. Chip; 8. Fixing device; 9. Radiating fins; 10 1. Cooling fan; 11. Water pump; 12. Liquid supply tank.

detailed description

The present invention will be further described below in conjunction with the accompanying drawings. Embodiments of the present invention include, but are not limited to, the following examples.

As shown in Figures 1 to 7, a composite cooling device combining thermoelectric cooling and microchannel liquid cooling, the composite cooling device is mainly composed of a first-stage microchannel heat sink 4, a second-stage microchannel heat sink 6, a thermoelectric cooling sheet 3 and a heat sink liquid supply system, the thermoelectric cooling sheet 3 is located at the upper end of the first-stage microchannel heat sink 4, and the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 are supplied through the heat sink The liquid system is connected.

The upper ends of the thermoelectric cooling fins 3 and the second-stage microchannel heat sink 6 are connected with cooling fins 9 , and the upper ends of the cooling fins 9 are connected with cooling fans 10 .

There are two thermoelectric cooling sheets 3, and the two thermoelectric cooling sheets 3 are connected in parallel with each other. There are also two first-stage microchannel heat sinks 4 at the lower end of the thermoelectric cooling sheet 3. Two of the first-stage microchannel heat sinks 4 are also provided. The primary microchannel heat sink 4 communicates with the heat sink liquid supply system.

The first-level microchannel heat sink 4 is composed of two parts: a first-level heat sink body 4-1 and a first-level cover plate 4-2 located at the upper end of the first-level heat sink body 4-1. The heat sink body 4-1 includes a first-level microchannel carrier 4-11, and a plurality of first-level microchannels 4-12 uniformly arranged in parallel are arranged in the first-level microchannel carrier 4-11. The two ends of the first-stage microchannel carrier 4-11 located at the first-stage microchannel 4-12 are provided with first-stage heat sink liquid collection tanks 4-14.

The second-level microchannel heat sink 6 is composed of a second-level heat sink body 6-1 and a second-level cover plate 6-2 located at the upper end of the second-level heat sink body 6-1. The heat sink body 6-1 includes a second-level microchannel carrier 6-11, and a plurality of evenly arranged second-level microchannels 6-12 are arranged in the second-level microchannel carrier 6-11. The microchannel carrier 6-11 is positioned at the two ends of the second-stage micro-channel 6-12 and is provided with a second-stage heat sink sump 6-14, and the sidewall of the second-stage micro-channel 6-12 It is a wavy structure with interlaced concave and convex, and the concave and convex surfaces of the wavy structure are all arc surfaces.

The heat sink liquid supply system includes a liquid supply tank 12, the outlet pipe 2 of the liquid supply tank 12 communicates with the first-level microchannel heat sink 4, and the water inlet pipe 11 of the liquid supply tank 12 communicates with the second-level microchannel heat sink. 6, the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 are connected through a connecting pipe 5, and the liquid supply tank 12, the water outlet pipe 2, the water inlet pipe 11 and the connecting pipe 5 constitute a liquid flow loop.

A water pump 1 is provided on the outlet pipe 2 of the liquid supply tank 12 .

The first-level microchannel heat sink 4 and/or the second-level microchannel heat sink 6 are made of aluminum or copper.

The composite cooling device also includes a fixing device 8 arranged at the lower end of the first-stage microchannel heat sink 4 , the second-stage microchannel heat sink 6 , the thermoelectric cooling sheet 3 and the heat sink liquid supply system.

The working principle of the present invention is: when the heat dissipation device dissipates little heat, the thermoelectric cooling sheet and the corresponding fan are in a closed state, and the heat of the heat dissipation device is transferred to the second-stage microchannel heat sink and its internal liquid in contact with it, And take it away through the fins and fans; when the heat dissipation equipment has a relatively high calorific value, and the micro-channel liquid cooling method alone cannot meet the heat dissipation requirements, the thermoelectric cooling sheet and the corresponding fan are started under the control of the control circuit, and the cooling sheet and the first The upper surfaces of the first-level microchannels are in contact with each other to cool the flowing liquid, and the low-temperature liquid enters the second-level heat sink through the connecting pipe to cool down the heat dissipation equipment, thereby greatly improving the heat dissipation efficiency.

The cooling fins and fan of the present invention have two functions, one is to directly dissipate the heat transferred to the heat sink into the environment, and the other is to cool the liquid in the microchannel. There are two thermoelectric cooling chips, so as to ensure the stability of the refrigeration system and avoid failure of a single thermoelectric cooling chip resulting in failure of the entire refrigeration system. The first-stage micro-channels are a plurality of parallel straight grooves evenly arranged in parallel, thereby increasing the distribution area of the liquid and increasing the contact area between the liquid and the cold end of the thermoelectric cooling sheet, which is beneficial to the thermoelectric cooling sheet for the liquid. Cooling without causing great resistance to liquid flow; the side walls of the second-stage micro-channels 6-12 have a wavy structure with interlaced concave and convex, and the concave and convex surfaces of the wavy structure are arc surfaces, which can break The fluid boundary layer causes periodic disturbance of the fluid, increases fluid percolation, and significantly enhances the convective heat transfer capacity of the fluid. The heat sink liquid supply system provides the cooling liquid of the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 through the liquid flow circuit, and the liquid after absorbing heat can be recycled, which is convenient to use and has good heat dissipation effect; fixed The device 8 can fix the whole heat dissipation device at the position where heat dissipation is required.

The first-level microchannel heat sink 4 and/or the second-level microchannel heat sink 6 of the present invention are made of aluminum or copper. Considering the easy deformation of aluminum, it is recommended to use copper as a material in some high-temperature operating environments.

The beneficial effects of the present invention are: when the heat dissipation device generates little heat, the liquid cooling method is used, that is, the second-stage microchannel heat sink is used to dissipate heat; when the liquid cooling method cannot meet the demand, the thermoelectric cooling sheet and the cooling fan start to work , The thermoelectric cooling sheet cools the liquid flowing through the first-stage heat sink, and the low-temperature liquid enters the second-stage heat sink, which can keep the heat dissipation device at a very low temperature when the heat generation is large. In this way, the cooling fins and corresponding fans can be started and stopped conditionally, which can not only keep the cooling equipment at a very low temperature under necessary conditions, but also selectively save power; the first-stage micro-channels are parallel grooves In this way, the distribution area of the liquid can be increased, which is conducive to the cooling of the liquid by the cooling plate, and will not cause greater resistance to the flow of the liquid; the side wall of the second-stage micro-channel has a wavy structure with staggered concave and convex , periodically change the convex-convex internal structure of the micro-channel, this wall structure can break the fluid boundary layer, cause periodic disturbance of the fluid, increase fluid percolation, significantly enhance the convective heat transfer capacity of the fluid, and at the same time, the flow resistance of the fluid also increases Not too large; the thermoelectric cooling chip consists of two single thermoelectric cooling chips connected in parallel, which can prevent the failure of the entire cooling system due to the failure of a certain thermoelectric cooling chip, and improve the stability of the cooling system; the second-stage microchannel thermal The sink directly dissipates heat for the heat dissipation equipment, and the second-stage micro-channel heat sink is not directly connected to the cold end of the thermoelectric cooling sheet, which greatly reduces the possibility of the second-stage micro-channel heat sink causing damage to the heat dissipation equipment due to dew and frost.

Below, the present invention will be described in further detail in combination with specific embodiments.

specific embodiment

As shown in Figures 1 to 7, a composite cooling device combining thermoelectric cooling and microchannel liquid cooling, the composite cooling device is mainly composed of a first-stage microchannel heat sink 4, a second-stage microchannel heat sink 6, a thermoelectric cooling sheet 3 and a heat sink liquid supply system, the thermoelectric cooling sheet 3 is located at the upper end of the first-stage microchannel heat sink 4, and the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 are supplied through the heat sink The liquid system is connected; the upper ends of the thermoelectric cooling sheet 3 and the second-stage microchannel heat sink 6 are connected with cooling fins 9, and the upper ends of the cooling fins 9 are connected with cooling fans 10; the thermoelectric cooling sheet 3 is provided with two , the two thermoelectric cooling sheets 3 are connected in parallel with each other, the first-stage microchannel heat sink 4 at the lower end of the thermoelectric cooling sheet 3 is also provided with two, and the two first-stage microchannel heat sinks 4 pass through the heat sink The liquid supply system is connected; the first-level microchannel heat sink 4 is composed of two parts, the first-level heat sink body 4-1 and the first-level cover plate 4-2 located at the upper end of the first-level heat sink body 4-1, The first-level heat sink body 4-1 includes a first-level microchannel carrier 4-11, and a plurality of first-level microchannels 4-12 uniformly arranged in parallel are arranged in the first-level microchannel carrier 4-11 , the first-level microchannel carrier 4-11 is located at both ends of the first-level microchannel flow channel 4-12 and is provided with a first-level heat sink sump 4-14; the second-level microchannel heat sink 6 consists of two parts, the second-level heat sink body 6-1 and the second-level cover plate 6-2 located at the upper end of the second-level heat sink body 6-1, and the second-level heat sink body 6-1 includes the second Level micro-channel carrier 6-11, the second-level micro-channel carrier 6-11 is provided with a plurality of evenly arranged second-level micro-channels 6-12, and the second-level micro-channel carrier 6-11 is located in the second Both ends of the first-level micro-channel 6-12 are provided with a second-level heat sink sump 6-14, and the side walls of the second-level micro-channel 6-12 have a wavy structure with interlaced concave and convex, and the waves The concave surface and the convex surface of the shaped structure are arc surfaces; the heat sink liquid supply system includes a liquid supply tank 12, and the outlet pipe 2 of the liquid supply tank 12 communicates with the first-stage microchannel heat sink 4, and the liquid supply tank 12 The water inlet pipe 11 is in communication with the second-level microchannel heat sink 6, and the first-level micro-channel heat sink 4 and the second-level microchannel heat sink 6 are connected through a connecting pipe 5, and the liquid supply tank 12, outlet The water pipe 2, the water inlet pipe 11 and the connecting pipe 5 form a liquid flow circuit; the outlet pipe 2 of the liquid supply tank 12 is provided with a water pump 1; the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 Made of copper; the composite cooling device also includes a fixing device 8 arranged at the lower end of the first-level microchannel heat sink 4, the second-level microchannel heat sink 6, the thermoelectric cooling sheet 3 and the heat sink liquid supply system.

The second-level microchannel heat sink 6 of this embodiment is directly fixed on the upper end of the chip 7 of the heat dissipation device through a fixing device 8 for dissipating heat from the chip 7 .

As shown in FIG. 1 , the device of this embodiment is evacuated and filled with a certain volume of water or other liquid working medium into the liquid supply tank 12 and then sealed. The water pump 1 drives the liquid to flow into the first-stage microchannel heat sink 4 through the water outlet pipe 2. The first-stage microchannel heat sink 4 is composed of two symmetrically distributed rectangular heat sinks. When the calorific value is not large, the thermoelectric cooling chip 3 and the fan 10 are in a non-working state, and the liquid flows from the first-stage microchannel heat sink 4 to the liquid sump 6 of the second-stage microchannel heat sink 6 through the connecting pipe 5- 14. After the heat generated by the chip 7 is absorbed by the second-stage microchannel heat sink 6, part of it is taken away by the heat dissipation fins 9 and the heat dissipation fan 10, and the other part is taken away by the liquid flowing through the microchannel, and then the liquid flows into the inlet through the outlet. Water pipe 11, and finally flows into liquid supply tank 12, completes a cycle. When the chip generates a lot of heat and the above-mentioned liquid cooling method cannot meet the heat dissipation requirements, the thermoelectric cooling sheet 3 and the cooling fan 10 start to work, and the distribution area of the liquid will increase when the liquid flows through the first-stage microchannel heat sink 4 . Therefore, it can be fully cooled by the cold end of the thermoelectric cooling sheet 3, and the cooled low-temperature liquid flows into the second-stage microchannel heat sink 6 through the connecting pipe 5 to realize the exchange of heat emitted by the chip 7; the heat at the hot end of the cooling sheet passes through the cooling fins 9 And radiating fan 10 emits in the surrounding environment.

Among them, the inner diameter of the water outlet pipe 2 and the water inlet pipe 11 is between 3 and 6mm. In order to improve the sealing and connection effect, before the heat sink is assembled, each component should be ultrasonically cleaned to remove oil and impurities on the surface.

As shown in Figure 2, it can be seen from the figure that there are two first-stage microchannel heat sinks 4 symmetrically arranged. One function is to allow the cooling liquid to contact the cooling sheet with a larger area so that the cooling sheet becomes the cooling liquid. Cooling, another effect is that if one of them fails and the other can continue to cool down; the cold end of the thermoelectric cooling sheet 3 and the upper surface of the first-stage microchannel heat sink 4 can be connected by thermally conductive silicone grease; the thermoelectric cooling sheet 3 is provided with two One, the two thermoelectric cooling plates 3 are connected in parallel with each other, so that in the case of failure of one of them, the other can continue to work, thereby improving the reliability of the device.

In order to further increase the heat transfer effect, the upper surface of the second-stage micro-channel heat sink 6 and the heat dissipation fins 9, and between the hot end of the thermoelectric cooling sheet 3 and the heat dissipation fins 9 can also be connected by thermal conductive silicone grease.

As shown in Figure 3, the first-stage cover plate 4-2 is in contact with the lower surface of the cooling fin 9, and the upper surface of the second-stage cover plate 6-2 is in contact with the cold end of the thermoelectric cooling fin 3, so the first-stage cover plate 4-2. The second-level cover plate 6-2 is bonded to the microfluidic body through epoxy high-temperature heat-resistant heat-conducting adhesive, but it is necessary to ensure good sealing and no liquid leakage.

The thermoelectric cooling sheet 3 of this embodiment can be connected to a control circuit for control, and the control circuit can control the temperature of the cold end of the thermoelectric cooling sheet 3 so as not to be too low, which can reduce the possibility of frosting or dew condensation on the equipment, and further improve system reliability.

The material of the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 is copper, which is suitable for use in a high-temperature environment, so that they are not easily deformed by high temperature while having high-efficiency heat dissipation.

As shown in Figure 4, the overall plane size of the first-stage micro-channel heat sink 4 is 25x25mm, and the interior includes the first-stage micro-channel flow channel 4-12 and the first-stage heat sink sump 4-14, and their heights are the same. About 1.5mm, the width of the first-stage heat sink sump 4-14 is 3mm, the width of the first-stage micro-channel 4-12 is 1mm, any two adjacent first-stage micro-channels 4- The distance between 12 is 1 mm, and this arrangement increases the distribution area of the liquid without significantly increasing the flow resistance of the liquid; the overall planar size of the second-level microchannel heat sink 6 is 55x55 mm, and includes a second-level heat sink inside The height of the liquid collection tank 6-14 and the second-stage micro-flow channel 6-12 is 1.8mm; the width of the second-stage heat sink liquid collection tank 6-14 is 2~3mm, and the second-stage micro-channel The width of each micro-flow channel of -12 is 0.8-1mm, and the distance between any two adjacent second-stage micro-channels 6-12 is designed to be 1.5-2mm, and the second-stage micro-channels 6- The side wall of 12 is the 6-13 shown in Figure 4, which is a wavy structure with interlaced concave and convex. The arc diameter is 1.5mm, and the distance between two adjacent concave and convex surfaces is 1.3-1.8mm. The liquids in the first-stage microchannel heat sink 4 and the second-stage microchannel heat sink 6 first flow into their respective liquid collection tanks, Then enter the respective flow channels, and finally merge into the respective sump, and flow out through the pipes connected with the respective sump.

As shown in Figures 5-7, it can be seen from the figures that both the first-level cover plate 4-2 and the second-level cover plate 6-2 have a boss, and the boss has two functions, one is to realize the cover The close contact between the plate 4-2, 6-2 and the heat sink body 4-1, 6-1, the other is to ensure the accurate positioning of the cover plate 4-2, 6-2 and the heat sink body 4-1, 6-1 . The screw holes provided at the four corners of the second stage cover plate 6-2 are used to fix the heat dissipation fins 9 connected thereto.

The foregoing is an embodiment of the present invention. The foregoing are various preferred embodiments of the present invention. If the preferred implementations in each preferred embodiment are not obviously self-contradictory or based on a certain preferred implementation, each preferred implementation can be used in any superposition and combination. The specific parameters in the embodiments and the embodiments are only for clearly expressing the inventor's invention verification process, and are not used to limit the scope of patent protection of the present invention. The scope of patent protection of the present invention is still subject to its claims. The equivalent structural changes made in the description of the invention and the content of the accompanying drawings should be included in the protection scope of the present invention in the same way.

Claims (9)

1. one kind in conjunction with the cold composite heat dissipation device of thermoelectric cooling and microchannel liquid, it is characterized in that: this composite heat dissipation device is mainly made up of first order micro-channel heat sink (4), second level micro-channel heat sink (6), thermoelectric module (3) and heat sink liquid-supplying system, described thermoelectric module (3) is positioned at first order micro-channel heat sink (4) upper end, and described first order micro-channel heat sink (4) is connected by heat sink liquid-supplying system with second level micro-channel heat sink (6).

2. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described thermoelectric module (3) and second level micro-channel heat sink (6) upper end are respectively connected with radiating fin (9), and radiating fin (9) upper end is respectively connected with radiator fan (10).

3. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described thermoelectric module (3) is provided with two, two described thermoelectric modules (3) are connected in parallel with each other, the first order micro-channel heat sink (4) of described thermoelectric module (3) lower end is again provided with two, and two described first order micro-channel heat sinks (4) are connected by heat sink liquid-supplying system.

4. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described first order micro-channel heat sink (4) is by the heat sink body of the first order (4-1) and is positioned at first order cover plate (4-2) two parts of the first order heat sink body (4-1) upper end and forms, the described first order is heat sink, and body (4-1) includes first order microchannel carrier (4-11), the micro-passage flow duct of the first order (4-12) of multiple uniform parallel arrangement it is provided with in first order microchannel carrier (4-11), the two ends that described first order microchannel carrier (4-11) is positioned at the micro-passage flow duct of the first order (4-12) are provided with the heat sink collecting tank of the first order (4-14).

5. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 1, it is characterized in that: described second level micro-channel heat sink (6) is by the heat sink body in the second level (6-1) and is positioned at second level cover plate (6-2) two parts of the second level heat sink body (6-1) upper end and forms, the described second level is heat sink, and body (6-1) includes microchannel, second level carrier (6-11), the micro-passage flow duct in multiple evenly distributed second level (6-12) it are provided with in microchannel, second level carrier (6-11), microchannel, described second level carrier (6-11) is positioned at the two ends of the micro-passage flow duct in the second level (6-12) and is provided with the heat sink collecting tank in the second level (6-14), the sidewall of the micro-passage flow duct in the described second level (6-12) is concavo-convex staggered wavy shaped configuration, concave surface and the convex surface of wavy shaped configuration are arc surface.

6. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to any one of claim 1-5, it is characterized in that: described heat sink liquid-supplying system includes liquid supply box (12), the outlet pipe (2) of liquid supply box (12) connects with first order micro-channel heat sink (4), the water inlet pipe (11) of described liquid supply box (12) connects with second level micro-channel heat sink (6), by connecting pipeline (5) connection between described first order micro-channel heat sink (4) and second level micro-channel heat sink (6), described liquid supply box (12), outlet pipe (2), water inlet pipe (11) and connection pipeline (5) constitute liquid flow circuits.

7. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to claim 6, it is characterised in that: the outlet pipe (2) of described liquid supply box (12) is provided with water pump (1).

8. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to any one of claim 1-5, it is characterised in that: described first order micro-channel heat sink (4) and/or second level micro-channel heat sink (6) are made of aluminum or copper.

9. a kind of composite heat dissipation device cold in conjunction with thermoelectric cooling and microchannel liquid according to any one of claim 1-5, it is characterised in that: this composite heat dissipation device also includes the fixing device (8) being arranged on first order micro-channel heat sink (4), second level micro-channel heat sink (6), thermoelectric module (3) and heat sink liquid-supplying system lower end.