CN222262857U - Novel COB technology vehicle-mounted camera module - Google Patents
Novel COB technology vehicle-mounted camera module Download PDFInfo
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- CN222262857U CN222262857U CN202420819225.9U CN202420819225U CN222262857U CN 222262857 U CN222262857 U CN 222262857U CN 202420819225 U CN202420819225 U CN 202420819225U CN 222262857 U CN222262857 U CN 222262857U
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- mounted camera
- camera module
- dam
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Abstract
Compared with the prior art, the invention can greatly reduce the difficulty of the COB process, improve the whole production efficiency, and simple structure and low cost, meanwhile, the gold thread, the chip, the box dam, the glue lens and the PCB are connected into a whole, the reliability of the module is improved, and the glue lens can seal the chip at the moment, so that the whole can be highly integrated together, and the chip is further protected.
Description
Technical Field
The invention relates to the technical field of vehicle-mounted camera modules, in particular to a novel COB process vehicle-mounted camera module.
Background
With the trend of automobile innovation and intelligent driving concept, the market of the vehicle-mounted sensing sensor is rapidly developing, and the vehicle-mounted camera which is compared with an automatic driving eye becomes a new blue marine industry. The vehicle-mounted camera is used as core sensing equipment in the field of automatic driving of automobiles, and the imaging quality of the vehicle-mounted camera relates to the direct experience of intelligent driving. Therefore, the higher requirements of customers can be met only by continuously optimizing and exploring the technology.
The traditional COB process vehicle-mounted camera module is complex in structure, so that the COB process is complex, the overall production efficiency is low, and the novel COB process vehicle-mounted camera module is provided.
Disclosure of Invention
In order to solve at least one technical disadvantage, the invention provides a novel COB process vehicle-mounted camera module which comprises a PCB substrate, a chip attached to the PCB substrate, and a circular dam formed on the periphery of the chip, wherein a glue lens which is made of high-permeability glue and completely covers the chip and gold threads is arranged in the dam.
Further, the glue lens is made of UV glue with light transmittance of more than 90%.
Further, the height of the dam is greater than the height of the gold wire.
Further, the dam is made of a back-shaped bracket.
Further, the imaging area of the chip is parallel to the upper surface of the glue lens.
Advantageous effects
The glue lens made of high-permeability glue replaces the traditional lens, so that the COB process difficulty can be greatly reduced, the overall production efficiency is improved, the structure is simple, the manufacturing cost is low, meanwhile, gold threads, chips, the surrounding dams, the glue lens and the PCB are connected into a whole, the reliability of the module is improved, the chips can be glued by the glue lens at the moment, the whole can be highly integrated, and the chips are further protected.
The glue lens made of the UV glue can have the same light transmittance as the traditional transparent glue, the UV glue can be directly replaced according to different light transmittance requirements, and the novel COB process vehicle-mounted camera module with different light transmittance can be directly produced, so that different imaging requirements are met, the light quantity of the chip is improved through improving the light transmittance, and the imaging quality is improved.
The realization, functional characteristics and advantages of the present invention are further described with reference to the accompanying drawings in combination with the embodiments.
Drawings
Fig. 1 is a cross-sectional view of the entire present invention.
Fig. 2 is an isometric view of the entire present invention.
In fig. 1 to 2, the corresponding relation between the part names or lines and the figure numbers is that a PCB substrate 1, a chip 2, gold wires 3, a dam 4 and a glue lens 5.
Detailed Description
Please refer to fig. 1-2;
The embodiment provides a novel COB process vehicle-mounted camera module, referring to fig. 1 and 2, comprising a PCB substrate 1, a chip 2 attached to the PCB substrate 1, a circular surrounding dam 4 formed on the periphery of the chip 2, and a glue lens 5 made of high-permeability glue and completely covering the chip 2 and gold wires 3 arranged in the surrounding dam 4;
When the chip 2 is in a high-integration state, the COB process difficulty can be greatly reduced, the whole production efficiency is improved, the structure is simple, the manufacturing cost is low, meanwhile, the gold thread 3, the chip 2, the surrounding dam 4 and the glue lens are connected with the PCB into a whole, the reliability of the module is improved, the chip 2 can be glued by the glue lens at the moment, the whole chip 2 can be highly integrated, and the chip 2 is further protected.
Further, the glue lens 5 is made of UV glue with a light transmittance of more than 90%;
In the specific implementation, the glue lens 5 made of the UV glue can have the same light transmittance as the traditional transparent one, and the UV glue can be directly replaced according to different light transmittance requirements, so that the novel COB process vehicle-mounted camera module with different light transmittance can be directly produced, and different imaging requirements are met;
the amount of acquired light of the chip 2 is increased by increasing the light transmittance, and the imaging quality is improved.
Further, the height of the dam 4 is larger than the height of the gold wire 3;
In a specific implementation, when the UV glue is injected into the interior of the dam 4 to form the glue lens 5, the UV glue can completely cover the gold wires 3 and the chips 2.
Further, the retaining dam 4 is made of a square bracket;
In the concrete implementation, the rectangular bracket paste adopts the prior art, can be directly adhered on the PCB substrate 1, has simple manufacturing process and can improve the production efficiency.
Further, the imaging area of the chip 2 is parallel to the upper surface of the glue lens 5;
In practice, the upper surface of the glue lens 5 is pressed to an upper surface parallel to the imaging area of the chip 2 by a smooth flat surface made of polytetrafluoroethylene material pressed against the dam 4.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420819225.9U CN222262857U (en) | 2024-04-19 | 2024-04-19 | Novel COB technology vehicle-mounted camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420819225.9U CN222262857U (en) | 2024-04-19 | 2024-04-19 | Novel COB technology vehicle-mounted camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222262857U true CN222262857U (en) | 2024-12-27 |
Family
ID=93983068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420819225.9U Active CN222262857U (en) | 2024-04-19 | 2024-04-19 | Novel COB technology vehicle-mounted camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222262857U (en) |
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2024
- 2024-04-19 CN CN202420819225.9U patent/CN222262857U/en active Active
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