CN210984762U - Integrated package display module - Google Patents

Abstract

The utility model discloses an integrated encapsulation display module assembly, including the base plate, drive IC and L ED chip, a plurality of drive IC subsides are adorned in the base plate bottom surface, and a plurality of L ED chip subsides are adorned in the base plate top surface, still including stratum lucidum and translucent layer, and the stratum lucidum sets up in base plate top surface and cladding L ED chip, and the translucent layer sets up in the stratum lucidum top surface, and the material of translucent layer is fluorine-containing organic matter.

Description

Integrated package display module

technical field

The utility model relates to the technical field of LED display, in particular to an integrated package display module.

Background technique

The screen body of the LED display screen is spliced by multiple display modules. Integrated packaging technology is a product that directly encapsulates the LED chip on the LED driver board, eliminating the need for SMD packaging and reflow, and using one-time overall packaging technology to achieve integration. It has the technical characteristics of simple structure, easy realization of high density, high reliability and low packaging cost.

As shown in FIG. 1, a traditional integrated package display module includes a substrate 1, a driver IC 2, an LED chip 3, and a translucent layer 4 doped with melanin. The driver IC 2 is mounted on the bottom surface of the substrate 1, and the LED chip 3 is mounted on the bottom surface. Installed on the top surface of the substrate 1 , the translucent layer 4 is disposed on the top surface of the substrate 1 and covers the LED chips 3 . The materials of the traditional translucent layer are epoxy resin, silicone resin, and silica gel.

Although these materials have certain heat resistance, hydrophobicity and insulation, because the LED chip will generate a lot of heat when it emits light, the temperature of the LED chip is very high, and the translucent layer will be easily aged after the LED display is used for a long time. The hydrophobicity and insulation deteriorate, the LED chip is easily affected by moisture, dust and static electricity damage, and the service life of the integrated package display module is low.

Utility model content

The technical problem to be solved by the present invention is to propose an integrated package display module based on the above-mentioned shortcomings of the prior art, which solves the problems of easy aging of the translucent layer and low service life of the integrated package display module.

The technical scheme of the present utility model is realized in this way:

The integrated package display module includes a substrate, a driver IC and an LED chip, a plurality of the driver ICs are mounted on the bottom surface of the substrate, a plurality of the LED chips are mounted on the top surface of the substrate, and a transparent layer is also included and a translucent layer, the transparent layer is arranged on the top surface of the substrate and covers the LED chip, the translucent layer is arranged on the top surface of the transparent layer, and the material of the translucent layer is a fluorine-containing organic compound.

Further, the translucent layer is obtained by a sputtering process.

Further, the thickness of the translucent layer is 1-50um.

Further, the translucent layer has a matte effect.

Further, the thickness of the transparent layer is higher than the height of the LED chip.

Further, the material of the transparent layer is epoxy resin, silicone resin or silica gel.

By adopting the above technical scheme, the beneficial effects of the present invention are: (1) The material of the translucent layer is a fluorine-containing organic compound and is located in the outermost layer, and the fluorine-containing organic compound has more excellent heat resistance, hydrophobicity and insulation, which can make The integrated package display module realizes the functions of moisture-proof, dust-proof and anti-static, avoids the damage of the integrated package display module, and improves the service life of the integrated package display module; (2) The translucent layer is obtained by the sputtering process, and the translucent layer is formed No stress and deformation, high yield, and the thickness of the translucent layer is easy to control; (3) The translucent layer has a certain light transmittance, which can block the color of the substrate, so that the color of the surface of the packaged display module is consistent , which solves the problem of inconsistent ink color on the surface of the packaged display module, and also reduces the brightness and increases the contrast; the matte effect makes the light output in a diffuse reflection state, which increases the light mixing performance and increases the viewing angle.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative labor.

FIG. 1 is a cross-sectional view of a conventional integrated package display module.

FIG. 2 is a cross-sectional view of the embodiment.

In the figure, 1-substrate, 2-driver IC, 3-LED chip, 4-translucent layer, 5-transparent layer.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

As shown in FIG. 2, in the embodiment provided by the present invention, the integrated package display module includes a substrate 1, a driver IC 2 and an LED chip 3, a plurality of driver ICs 2 are mounted on the bottom surface of the substrate 1, and a plurality of LED chips 3 is mounted on the top surface of the substrate 1 . This embodiment also includes a transparent layer 5 and a translucent layer 4. The transparent layer 5 is arranged on the top surface of the substrate 1 and covers the LED chip 3. The translucent layer 4 is arranged on the top surface of the transparent layer 5. The material of the translucent layer 4 is: Fluorinated organics.

The translucent layer 4 is obtained by a sputtering process. The thickness of the translucent layer 4 is 1-50um, and in this embodiment, the thickness of the translucent layer 4 is preferably 25um. The translucent layer 4 has a matte finish.

The thickness of the transparent layer 5 is higher than the height of the LED chip 3 and shields the entire substrate 1 . The material of the transparent layer 5 is epoxy resin, silicone resin or silica gel. In this embodiment, the material of the transparent layer 5 is preferably epoxy resin.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the within the scope of protection of the present invention.

Claims (6)

1. An integrated package display module, including a substrate, a driver IC and an LED chip, a plurality of the driver ICs are mounted on the bottom surface of the substrate, and a plurality of the LED chips are mounted on the top surface of the substrate, characterized in that : also includes a transparent layer and a translucent layer, the transparent layer is arranged on the top surface of the substrate and covers the LED chip, the translucent layer is arranged on the top surface of the transparent layer, and the translucent layer is The material is a fluorine-containing organic compound. 2 . The integrated package display module according to claim 1 , wherein the translucent layer is obtained by a sputtering process. 3 . 3. The integrated package display module according to claim 1, wherein the thickness of the translucent layer is 1-50um. 4 . The integrated package display module according to claim 1 , wherein the translucent layer has a matte effect. 5 . 5 . The integrated package display module according to claim 1 , wherein the thickness of the transparent layer is higher than the height of the LED chip. 6 . 6 . The integrated package display module according to claim 1 , wherein the material of the transparent layer is epoxy resin, silicone resin or silica gel. 7 .

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