CN222070893U - An optical module - Google Patents

Abstract

The application discloses an optical module, which comprises a circuit board and a tube shell, wherein the circuit board is provided with a storage through hole, and the tube shell is arranged at the storage through hole. The tube shell comprises a tube shell body, wherein an emission light component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a wave combiner, a second lens set and an optical fiber adapter which are sequentially arranged along the length direction of the tube shell body. The long side of the tube shell body corresponds to the long side of the circuit board. A lip is provided at the edge of the long side of the envelope body to increase the cross-sectional moment of inertia of the envelope. The side of the lip is connected with the circuit board, and the edge of the short side, which is close to the laser chip, of the tube shell body supports the circuit board so as to connect the tube shell with the circuit board. In the application, the light emitting component is arranged along the length direction of the tube shell body, the long side of the tube shell body is correspondingly arranged with the long side of the circuit board, and the edge of the long side of the tube shell body is provided with the lip edge, so that the section moment of inertia of the tube shell is increased, the rigidity of the tube shell is further improved, and the deformation of the tube shell is reduced.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

The optical module comprises a circuit board and a tube shell, wherein the circuit board is provided with a storage through hole, the tube shell is arranged at the storage through hole, and an emission optical component is arranged on the tube shell and used for emitting optical signals. When the circuit board is bent and deformed under the three-temperature condition (0 ℃,25 ℃ and 70 ℃), the tube shells synchronously deform, and the relative positions of the light emitting components are shifted, so that the light power loss of the light emitting components is caused.

Disclosure of utility model

The application provides an optical module, which reduces deformation of a tube shell.

An optical module, comprising:

the circuit board is provided with a storage through hole;

A tube shell arranged at the object placing through hole so as to connect the tube shell with the circuit board; the tube shell comprises a tube shell body, an emission optical component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a combiner, a second lens set and an optical fiber adapter, wherein the laser chip set, the first lens set, the combiner, the second lens set and the optical fiber adapter are sequentially arranged along the length direction of the tube shell body, multiple paths of optical signals emitted by the laser chip set are collimated by the first lens set, the collimated multiple paths of optical signals are combined into one path of optical signals by the combiner, and one path of optical signals are coupled to the optical fiber adapter by the second lens set;

The long side of the tube shell body is arranged corresponding to the long side of the circuit board, and the edge of the long side of the tube shell body is provided with a lip edge so as to increase the section moment of inertia of the tube shell; the side of the lip is connected with the circuit board, and the edge of the short side, which is close to the laser chip group, of the tube shell body supports the circuit board.

An optical module, comprising:

the circuit board is provided with a storage through hole;

A tube shell arranged at the object placing through hole so as to connect the tube shell with the circuit board; the tube shell comprises a tube shell body, an emission optical component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a combiner, a second lens set and an optical fiber adapter, wherein the laser chip set, the first lens set, the combiner, the second lens set and the optical fiber adapter are sequentially arranged along the length direction of the tube shell body, multiple paths of optical signals emitted by the laser chip set are collimated by the first lens set, the collimated multiple paths of optical signals are combined into one path of optical signals by the combiner, and one path of optical signals are coupled to the optical fiber adapter by the second lens set;

The long side of the tube shell body is arranged corresponding to the long side of the circuit board, and the edge of the long side of the tube shell body is provided with a lip edge so as to increase the section moment of inertia of the tube shell; the side surface of the lip edge is connected with the circuit board, and the edge of the short side of the tube shell body supports the circuit board; the thickness of the lip is greater than or equal to the thickness of the circuit board.

The beneficial effects are that: the application provides an optical module, which comprises a circuit board and a tube shell, wherein the circuit board is provided with a storage through hole, and the tube shell is arranged at the storage through hole so as to connect the circuit board with the tube shell. The tube shell comprises a tube shell body, wherein an emission optical component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a combiner, a second lens set and an optical fiber adapter, and the laser chip set, the first lens set, the combiner, the second lens set and the optical fiber adapter are sequentially arranged along the length direction of the tube shell body. The multi-path optical signals emitted by the laser chip set are collimated by the first lens set, the collimated multi-path optical signals are combined into one path of optical signals by the combiner, and one path of optical signals are coupled to the optical fiber adapter by the second lens set. The shell body corresponds to the circuit board, namely, the long side of the shell body corresponds to the long side of the circuit board, and the short side of the shell body corresponds to the short side of the circuit board. Under the condition of three temperatures, the length direction of circuit board is easy to bend and deform, and when the circuit board bends and deforms, the length direction of the tube shell body bends and deforms, and the relative position of the light emitting component arranged along the length direction of the tube shell body is easy to deviate, so that the light power loss of the light emitting component is caused. Therefore, the lip edge is arranged on the edge of the long side of the tube shell body so as to increase the section moment of inertia of the tube shell, further improve the rigidity of the tube shell and reduce the deformation of the tube shell. The side of the lip is connected with the circuit board, and the edge of the short side, which is close to the laser chip, of the tube shell body supports the circuit board so as to connect the tube shell with the circuit board. In the application, the light emitting component is arranged along the length direction of the tube shell body, the long side of the tube shell body is correspondingly arranged with the long side of the circuit board, and the edge of the long side of the tube shell body is provided with the lip edge, so that the section moment of inertia of the tube shell is increased, the rigidity of the tube shell is further improved, and the deformation of the tube shell is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a partial block diagram of an optical communication system provided in accordance with some embodiments;

FIG. 2 is a partial block diagram of a host computer according to some embodiments;

FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments;

FIG. 5 is an exploded view of the interior of a light module provided in accordance with some embodiments;

FIG. 6 is another exploded view of the interior of a light module provided in accordance with some embodiments;

FIG. 7 is a cross-sectional view of an optical module provided in accordance with some embodiments;

FIG. 8 is a block diagram of a cartridge provided in accordance with some embodiments;

fig. 9 is a block diagram of another cartridge provided in accordance with some embodiments;

FIG. 10 is a cross-sectional view of an optical module provided according to some embodiments at another perspective;

Fig. 11 is a first assembly schematic of a circuit board and a package provided in accordance with some embodiments;

Fig. 12 is a second assembly schematic of a circuit board and a package provided in accordance with some embodiments;

fig. 13 is a schematic structural view of a cartridge provided in accordance with some embodiments;

fig. 14 is a third assembly schematic of a circuit board and a package provided in accordance with some embodiments.

Detailed Description

Some embodiments of the present disclosure will be described in detail and clarity with reference to the following drawings. However, the described embodiments are merely some, but not all, embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, the term "comprising" is to be interpreted as an open, inclusive meaning, i.e. "comprising, but not limited to,", unless the context requires otherwise; the terms "first," "second," and "first" are not to be construed as indicating or implying a relative importance or upper limit of the indicated number; the term "plurality" means two or more; the term "coupled" is to be interpreted broadly, as referring to, for example, a fixed connection, a removable connection, or a combination thereof, as well as directly or indirectly via an intermediary; the use of the term "adapted to" or "configured to" is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps; the terms "parallel", "perpendicular", "identical", "flush", etc. describe, without being limited to absolute mathematical theoretical relationships, also include acceptable ranges of error arising in practice, and also include differences based on the same design concept but due to manufacturing reasons.

In the optical communication technology, in order to establish information transfer between information processing apparatuses, it is necessary to load information onto light, and transfer of information is realized by propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so that high-speed, long-distance and low-cost information transmission can be realized. The signal that the information processing apparatus can recognize and process is an electrical signal. Information processing devices typically include optical network terminals (Optical Network Unit, ONUs), gateways, routers, switches, handsets, computers, servers, tablets, televisions, etc., and information transmission devices typically include optical fibers, optical waveguides, etc.

The optical module can realize the mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to an optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information transmission can be performed between the plurality of information processing apparatuses by an electric signal, it is necessary that at least one of the plurality of information processing apparatuses is directly connected to the optical module, and it is unnecessary that all of the information processing apparatuses are directly connected to the optical module. Here, the information processing apparatus directly connected to the optical module is referred to as an upper computer of the optical module. In addition, the optical signal input or the optical signal output of the optical module may be referred to as an optical port, and the electrical signal input or the electrical signal output of the optical module may be referred to as an electrical port.

Fig. 1 is a partial block diagram of an optical communication system provided in accordance with some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends in the direction of the remote information processing apparatus 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. The optical signal may be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection may almost maintain the original optical power, and the optical signal may be totally reflected in the optical fiber 101 a plurality of times to transmit the optical signal from the remote information processing apparatus 1000 into the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing apparatus 1000, thereby realizing remote, low power loss information transfer.

The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected, or fixedly connected, with the optical module 200. The upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the operating state of the optical module 200.

The host computer 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

The upper computer 100 further includes an external electrical interface, which may access an electrical signal network. For example, the pair of external electrical interfaces includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing apparatus 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing apparatus 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the upper computer 100 through the network cable 103, the upper computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the upper computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and the second optical signal is transmitted to the optical fiber 101, where the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal from the first electrical signal, and the fourth electrical signal is transmitted to the local information processing apparatus 2000. The optical module is a tool for realizing the mutual conversion between the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the coding and decoding modes of the information can be changed.

The host computer 100 includes an Optical line terminal (Optical LINE TERMINAL, OLT), an Optical network device (Optical Network Terminal, ONT), a data center server, or the like, in addition to the Optical network terminal.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex structure such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected by bi-directional electrical signals. Furthermore, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module provided in accordance with some embodiments, and fig. 4 is an exploded view of an optical module provided in accordance with some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, a light emitting part 400, and a light receiving part 500. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of the light emitting part 400 and the light receiving part 500.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Or opening 204 is located at the end of light module 200 and opening 205 is located at the side of light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port and is inserted into the electrical connector of the upper computer 100; the opening 205 is an optical port configured to be accessed to the external optical fiber 101 so that the optical fiber 101 connects the light emitting part 400 and the light receiving part 500 in the optical module 200.

The circuit board 300, the light emitting part 400, the light receiving part 500, etc. are conveniently mounted in the upper case 201 and the lower case 202 by adopting the combined assembly mode, and the upper case 201 and the lower case 202 can perform encapsulation protection on the devices. In addition, when the circuit board 300, the light emitting part 400, the light receiving part 500, and the like are assembled, the disposition of the positioning part, the heat dissipating part, and the electromagnetic shielding part of these devices is facilitated, and the automated production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer, or to release the fixed connection between the optical module 200 and the upper computer.

For example, the unlocking member 600 is located outside the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the fixation between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a transimpedance amplifier (TRANSIMPEDANCE AMPLIFIER, TIA), a limiting amplifier (LIMITING AMPLIFIER, LIA), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the rigid circuit board may also be inserted into an electrical connector in the cage 106 of the host computer 100.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to provide more pins, thereby being suitable for occasions with high pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to realize power supply, grounding, two-wire synchronous serial (Inter-INTEGRATED CIRCUIT, I2C) signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

At least one of the light emitting part 400 or the light receiving part 500 is located at a side of the circuit board 300 remote from the gold finger.

In some embodiments, the light emitting part 400 and the light receiving part 500 are physically separated from the circuit board 300, respectively, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively.

In some embodiments, at least one of the light emitting component or the light receiving component may be disposed directly on the circuit board 300. For example, at least one of the light emitting part or the light receiving part may be provided on the surface of the circuit board 300 or the side of the circuit board 300.

As shown in fig. 4, the optical module 200 may include a first fiber optic connector 800. The first optical fiber connector 800 may be connected with the light emitting part 400 through a first optical fiber.

As shown in fig. 4, the optical module 200 may include a second fiber optic connector 801. The second optical fiber connector 801 may be connected to the light receiving member 500 through a second optical fiber.

As shown in fig. 4, the upper surface of the circuit board 300 may be covered with a cover case 301. The cover 301 and the circuit board 300 may enclose a housing cavity. The housing cavity may be provided therein with a light emitting member 400. The housing cavity may be provided therein with a light receiving member 500.

Fig. 5 is an exploded view of the interior of a light module provided in accordance with some embodiments. Fig. 6 is another exploded view of the interior of a light module provided in accordance with some embodiments. Fig. 7 is a cross-sectional view of an optical module provided in accordance with some embodiments. As shown in fig. 5, 6, and 7, in some embodiments, the light emitting component 400 may include a package 401. The package 401 is placed at the placement through-hole 302 of the circuit board 300 to connect the light emitting part 400 with the circuit board 300.

In some embodiments, the light emitting component 400 may include an emitting light assembly 402. The transmitting optical component 402 is for transmitting an optical signal.

As shown in fig. 5, 6, and 7, in some embodiments, the emitted light assembly 402 may include a laser chip set 421. The laser chip set 421 may include a plurality of laser chips arranged in parallel so that the laser chip set 421 emits multiple optical signals.

For example, the laser chip set 421 includes 4 laser chips arranged in parallel, the laser chips are 100G EML laser chips, so that the laser chip set 421 emits 4 paths of 100G optical signals.

In some embodiments, the emitted light assembly 402 may include a first lens group 422. The first lens group 422 may include a plurality of first lenses arranged in parallel such that the first lens group 422 receives multiple optical signals. The first lens may be a collimating lens to collimate the received optical signal.

The first lens may be located in a light emitting direction of the laser chip, so that an optical signal emitted by the laser chip is collimated by the first lens.

Illustratively, the first lens group 422 includes 4 first lenses arranged side-by-side to collimate the 4-way 100G optical signal through the first lens group 422.

In some embodiments, the emission light component 402 may include a combiner 423. The combiner 423 is configured to combine multiple collimated light beams into one collimated light beam.

The combiner 423 may be located in the light emitting direction of the first lens group 422, so as to combine multiple collimated light into one collimated light.

In some embodiments, the emitted light assembly 402 may include a second lens 424. The second lens 424 is used to focus one path of collimated light.

In some embodiments, the emission light assembly 402 may include a fiber optic adapter 700. The fiber optic adapter 700 may be connected to the first fiber optic connector 800 by first optical fibers.

The optical fiber adapter 700 may be located in the light emitting direction of the second lens 424 to receive the light spot converged by the second lens 424.

The laser chip set 421 emits multiple paths of optical signals, the multiple paths of optical signals are collimated by the first lens set 422, the multiple paths of collimated light are combined into one path of collimated light by the combiner 423, and the one path of collimated light is converged by the second lens 424 and then coupled to the optical fiber adapter 700.

The laser chip set 421, the first lens set 422, the combiner 423, the second lens 424 and the optical fiber adapter 700 are sequentially disposed on the package 401 along the length direction of the circuit board, so that the multiple optical signals emitted by the laser chip set 421 are transmitted to the optical fiber adapter 700 along the length direction of the circuit board.

The package 401 is disposed corresponding to the circuit board 300, that is, the long side of the package 401 is disposed corresponding to the long side of the circuit board 300, and the short side of the package 401 is disposed corresponding to the short side of the circuit board 300.

The circuit board 300 is easy to bend and deform in the length direction under the three-temperature condition (0 ℃,25 ℃ and 70 ℃), and when the circuit board bends and deforms, the tube shell 401 arranged at the object placing through hole 302 is also easy to bend and deform in the length direction, and the relative position of the light emitting component arranged along the length direction of the tube shell body is easy to deviate, so that the light power loss of the light emitting component is caused. To address this problem, in some embodiments, the edges of the cartridge 401 may be provided with lips to increase the thickness and width of the partial region of the cross section, thereby increasing the cross section moment of inertia of the cartridge, increasing the stiffness of the cartridge, and reducing deformation of the cartridge.

The sides of the envelope 401 disposed in the longitudinal direction are long sides of the envelope 401, and the sides of the envelope 401 disposed in the width direction are short sides of the envelope 401.

In some embodiments, the edges of the long sides of the cartridge 401 may be provided with lips to increase the first moment of inertia of the cartridge, thereby increasing the stiffness of the cartridge and reducing deformation of the cartridge.

The long side of the envelope 401 may comprise a first long side. The edges of the first long side may be provided with lips to increase the first moment of inertia of the envelope 401 and thereby increase the rigidity of the envelope and reduce deformation of the envelope.

The long side of the envelope 401 may comprise a second long side. The edges of the second long side may be provided with lips to increase the second moment of inertia of the envelope 401 and thereby increase the rigidity of the envelope and reduce deformation of the envelope.

The width of the lip affects the cross-sectional moment of inertia of the cartridge. The greater the width of the lip, the greater the moment of inertia of the cross section of the cartridge; the smaller the width of the lip, the smaller the moment of inertia of the cartridge. Thus, in some embodiments, the width of the lip may be no less than a width preset value. Illustratively, the first width preset is 1mm, i.e., the width of the lip is not less than 1mm.

However, the width of the lip is 1mm due to the limited space of the envelope 401.

The thickness of the lip affects the cross-sectional moment of inertia of the cartridge. The greater the thickness of the lip, the greater the moment of inertia of the cross section of the cartridge; the smaller the thickness of the lip, the smaller the moment of inertia of the cartridge. Thus, in some embodiments, the thickness of the lip may be no less than a thickness preset value. Illustratively, the first predetermined thickness is 1mm, i.e., the lip has a thickness of no less than 1mm.

The thickness of the lip has a greater effect on the cross-sectional moment of inertia of the cartridge than the width of the lip has on the cross-sectional moment of inertia of the cartridge.

In some embodiments, the edges of the short sides of the cartridge 401 may be provided with lips to increase the second moment of inertia of the cartridge 401, thereby increasing the stiffness of the cartridge and reducing deformation of the cartridge.

The short sides of the envelope 401 may comprise the first short side. The edges of the first short side may be provided with lips to increase the second moment of inertia of the envelope 401 and thereby increase the rigidity of the envelope and reduce deformation of the envelope. The first short side is the short side of the package 401 near the laser chip set 421.

The short sides of the envelope 401 may comprise the second short side. The edges of the second short side may be provided with lips to increase the second moment of inertia of the envelope 401 and thereby increase the rigidity of the envelope and reduce deformation of the envelope. The second short side is the short side far from the laser chip set 421 in the package 401.

In some embodiments, the edges of the package 401 near the short sides of the laser chip set 421 support the circuit board 300, and the edges of the package 401 far from the short sides of the laser chip set 421 are provided with lips.

The length direction of the circuit board 300 is more flexible than the width direction of the circuit board 300, the length direction of the package 401 is more flexible than the width direction of the package 401, and the width direction bending deformation of the circuit board 300 has less influence on the light emitting element provided along the length direction of the package 401. Thus, as shown in fig. 5, 6, and 7, in some embodiments, the edges of the short sides of the package 401 may support the circuit board 300.

The short sides of the envelope 401 may comprise the first short side. The edge of the first short side supports the circuit board 300 to ensure that the wire bonding distance between the laser chip set 421 and the driving chip set on the circuit board 300 is minimized. The first short side is the short side of the package 401 near the laser chip set 421.

The short sides of the envelope 401 may comprise the second short side. The edge of the second short side supports the circuit board 300 to protect the optical fibers connected to the fiber optic adapter 700. The second short side is the short side far from the laser chip set 421 in the package 401.

In some embodiments, the elastic modulus of the shell 401 may be greater than or equal to the first elastic modulus preset value, so that the rigidity of the shell meets the requirement, and the deformation of the shell is reduced. Illustratively, the first elastic modulus preset value is 200GPam, i.e., the elastic modulus of the envelope 401 is 200GPam or greater.

In some embodiments, the elastic modulus of the shell 401 may be greater than or equal to the second elastic modulus preset value, so that the rigidity of the shell meets the requirement, and the deformation of the shell is reduced. For example, the second elastic modulus preset value is 250GPam, that is, the elastic modulus of the envelope 401 is 250GPam or more.

In some embodiments, the coefficient of thermal expansion of the envelope 401 may be less than the first coefficient of thermal expansion preset value, so that the thermal stability of the envelope meets the requirements, reducing deformation of the envelope. Illustratively, the first coefficient of thermal expansion preset is 7e ^-6, i.e., the coefficient of thermal expansion of the envelope 401 is less than 7e ^-6.

In some embodiments, the coefficient of thermal expansion of the envelope 401 may be less than the second coefficient of thermal expansion preset value, so that the thermal stability of the envelope meets the requirements, reducing the deformation of the envelope. Illustratively, the second thermal expansion coefficient preset value is 5e ^-6, i.e., the thermal expansion coefficient of the envelope 401 is less than 5e ^-6.

Fig. 8 is a block diagram of a cartridge provided in accordance with some embodiments. Fig. 9 is a block diagram of another cartridge provided in accordance with some embodiments. As shown in fig. 8 and 9, in some embodiments, the cartridge 401 may include a cartridge body 411. The package body 411 is provided with an emission light component 402.

In some embodiments, the housing 401 may include relief notches 414 to relief other devices on the circuit board 300.

In some embodiments, the cartridge 401 may include a first lip 412. The first lip 412 may be located at an edge of one long side of the cartridge body 411.

The first lip 412 may increase the cross-sectional moment of inertia of the cartridge 401, thereby increasing the stiffness of the cartridge and reducing deformation of the cartridge.

In some embodiments, cartridge 401 may include a second lip 413. The second lip 413 may be located at the edge of the other long side of the cartridge body 411.

The second lip 413 may increase the cross-sectional moment of inertia of the cartridge 401, thereby increasing the stiffness of the cartridge and reducing deformation of the cartridge.

As shown in fig. 8 and 9, in some embodiments, the cartridge body 411 may have a first storage slot 4111. A laser chip set 421 may be disposed in the first storage groove 4111. A first lens group 422 may be disposed within the first storage groove 4111.

The laser chip set 421 and the first lens set 422 are placed on a semiconductor cooler (TEC) placed in the first storage groove 4111.

In some embodiments, the cartridge body 411 may have a fifth support plate 4116. The fifth support plate 4116 may be located at an edge of the cartridge body 411, and the fifth support plate 4116 is adjacent to the first storage groove 4111. The circuit board 300 may be placed on the fifth support plate 4116, so that the thickness of the circuit board 300 is flush with that of the laser chip set 421, and the wire bonding distance between the laser chip set 421 and the circuit board 300 is reduced.

In some embodiments, the cartridge body 411 may have a first support plate 4112. The combiner 423 may be disposed on the first support plate 4112 to support the combiner 423.

In some embodiments, the first support plate 4112 may have a notch, so that the first support plate 4112 and the bottom surface of the housing body 411 enclose a groove with a notch, thereby facilitating the processing of the housing 401.

The first support plate 4112 protrudes further from the first accommodating groove 4111, so that the central axes of the laser chip set 421, the first lens set 422 and the combiner 423 are aligned with each other.

In some embodiments, the cartridge body 411 may have a fourth support plate 4113. The fourth support plate 4113 may be located in a groove with a notch defined by the first support plate 4112 and the bottom surface of the cartridge body 411. The combiner 423 may be disposed on the fourth support plate 4113 to support the combiner 423. The fourth support plate 4113 may enclose a closed dispensing slot with the bottom surface of the cartridge body 411. Glue can be placed in the glue dispensing groove, so that the combiner 423 is fixedly connected with the fourth support plate 4113.

The thickness of the upper surface of the fourth support plate 4113 is flush with the thickness of the upper surface of the first support plate 4112 so that the combiner 423 is placed in parallel on the package 401.

In some embodiments, the cartridge body 411 may have a glue slot 4119. The glue groove 4119 may be defined by the first support plate 4112, the fourth support plate 4113, and the bottom surface of the housing body 411. The glue placement slot 4119 may be located outside the glue dispensing slot to accommodate glue spilled from the glue dispensing slot.

In some embodiments, the cartridge body 411 may have a first bearing member 4117. The first bearing member 4117 may be disconnected from the first support plate 4112. The gap between the first bearing member 4117 and the first support plate 4112 is more recessed relative to the first support plate 4112 to facilitate machining of the cartridge 401. The side surface of the combiner 423 is supported against the first support member 4117 to define the position of the combiner 423 in the width direction of the package 401.

In some embodiments, the cartridge body 411 may have a second support plate 4114. The second support plate 4114 may have a second lens 424 disposed thereon.

The second support plate 4114 is recessed with respect to the first support plate 4112 such that the center axis of the second lens 424 is aligned with the center axis of the combiner 423.

In some embodiments, an end of the second support plate 4114 remote from the first support plate 4112 may be provided with a limit notch 4141. The fiber optic adapter 700 is placed at the limit notch 4141 to define the position of the fiber optic adapter 700 in the length direction of the housing 401.

In some embodiments, the cartridge body 411 may have a third support plate 4115. The third support plate 4115 may have the fiber optic adapter 700 disposed thereon to support the fiber optic adapter 700. One end of the third support plate 4115 may be connected with the second support plate 4114. The circuit board 300 may be placed on the other end of the third support plate 4115 to support the circuit board 300.

The third support plate 4115 is recessed relative to the second support plate 4114 such that the central axis of the fiber optic adapter 700 is flush with the central axis thickness of the combiner 423.

In some embodiments, the cartridge body 411 may have a second bearing member 4118. The side surface of the fiber optic adapter 700 is seated against the second seating member 4118 to define the position of the fiber optic adapter 700 in the width direction of the housing 401.

As shown in fig. 8, the first lip 412 may be disconnected from the first bearing member 4117, i.e., the first lip 412 may have a gap with the first bearing member 4117.

The second lip 413 may be unconnected to the first support plate 4112, i.e., the second lip 413 may have a gap with the first support plate 4112.

As shown in fig. 9, the first lip 412 may be connected to the first bearing member 4117, further increasing the thickness of a partial area of the cross section of the cartridge 401, thereby increasing the cross section moment of inertia of the cartridge 401, increasing the rigidity of the cartridge 401, and reducing the deformation of the cartridge 401.

The second lip 413 may be coupled to the first support plate 4112 to further increase the thickness of a partial region of the cross section of the cartridge 401, thereby increasing the cross section moment of inertia of the cartridge 401, increasing the stiffness of the cartridge 401, and reducing deformation of the cartridge 401.

Fig. 10 is a cross-sectional view of an optical module provided according to some embodiments at another perspective. Fig. 11 is a first assembly schematic of a circuit board and a package provided according to some embodiments. Fig. 12 is a second assembly schematic of a circuit board and a package provided in accordance with some embodiments. As shown in fig. 10, 11 and 12, in some embodiments, a side of the lip is connected to a side of the circuit board 300 to connect the package 401 to the circuit board 300.

As shown in fig. 10, 11 and 12, the thickness of the upper surface of the lip may be equal to or greater than the thickness of the upper surface of the circuit board 300.

In some embodiments, the upper surface of the lip may have a thickness equal to the thickness of the upper surface of the circuit board 300 so that the upper surface of the lip may be flush with the upper surface of the circuit board 300, thereby facilitating assembly of the package 401 with the circuit board 300.

In some embodiments, the thickness of the upper surface of the lip is greater than the thickness of the upper surface of the circuit board 300 such that the upper surface of the lip is higher than the upper surface of the circuit board 300.

As shown in fig. 10 and 11, the upper surface of the first lip 412 may be flush with the upper surface of the circuit board 300.

As shown in fig. 10 and 11, the upper surface of the second lip 413 may be flush with the upper surface of the circuit board 300.

As shown in fig. 11 and 12, the package 401 and the circuit board 300 are glued by the first glue dispensing area 900 and the second glue dispensing area 901, so that the package 401 is adhered to the circuit board 300, and the package 401 is embedded in the placement through hole 302 of the circuit board 300.

Fig. 13 is a schematic structural view of a cartridge provided in accordance with some embodiments. Fig. 14 is a third assembly schematic of a circuit board and a package provided in accordance with some embodiments. As shown in fig. 13 and 14, in some embodiments, the lip may have a notch. One side of the notch may be connected to the upper surface of the circuit board 300. The other side of the notch may be connected to a side of the circuit board 300.

The lip has a notch, which not only increases the cross-sectional moment of inertia of the envelope 401, thereby increasing the rigidity of the envelope 401, but also allows the circuit board 300 to support the lip.

One side of the notch is connected to the upper surface of the circuit board 300 and the other side of the notch is connected to the side of the circuit board 300 so that the circuit board 300 supports the lip.

As shown in fig. 13 and 14, the first lip 412 has a first notch 4121. One side of the first notch 4121 may be connected to the upper surface of the circuit board 300. The other side of the first notch 4121 may be connected with the side of the circuit board 300.

One face of the first notch 4121 is connected to the upper surface of the circuit board 300 and the other face of the first notch 4121 is connected to the side of the circuit board 300 so that the circuit board 300 supports the first lip 412.

As shown in fig. 13 and 14, the second lip 413 has a second notch 4131. One side of the second notch 4131 may be connected with the upper surface of the circuit board 300. The other side of the second notch 4131 may be connected with the side of the circuit board 300.

One face of the second notch 4131 is connected to the upper surface of the circuit board 300 and the other face of the second notch 4131 is connected to the side of the circuit board 300 so that the circuit board 300 supports the second lip 413.

The above is the case where the lip is located at the edge of the envelope 401. On the premise that the width dimension of the tube shell 401 is not changed, the edge of the tube shell 401 is provided with a lip, one side of the lip is connected with one side of the circuit board 300, and the width dimension of the storage through hole 302 in the circuit board 300 is increased, so that the tube shell 401 is embedded into the storage through hole 302.

The following describes the gap between the lip and the edge of the cartridge 401. The gap between the lip and the edge of the housing 401 is the edge region of the housing 401 that supports the circuit board 300. On the premise that the width dimension of the tube shell 401 is not changed, a gap between the lip and the edge of the tube shell 401 supports the circuit board 300, one side of the lip is connected with one side of the circuit board 300, and the length dimension of the storage through hole 302 in the circuit board 300 is increased, so that the tube shell 401 is embedded in the storage through hole 302.

Because of the limited width dimension of the envelope 401, the circuit board 300 is supported between the lips and the edges of the envelope 401, in which case the lips of the envelope 401 are smaller in width, resulting in a smaller moment of inertia of the envelope 401 in cross section, which in turn results in a smaller stiffness of the envelope 401, which is still easily deformed. Thus, in some embodiments, the width dimension of the cartridge 401 is increased, the width dimension of the storage aperture 302 is increased, and the width dimension of the lip is increased to increase the cross-sectional moment of inertia of the cartridge 401, thereby increasing the stiffness of the cartridge 401 such that the cartridge 401 is not easily deformed.

The application provides an optical module, which comprises a circuit board and a tube shell, wherein the circuit board is provided with a storage through hole, and the tube shell is arranged at the storage through hole so as to connect the circuit board with the tube shell. The tube shell comprises a tube shell body, wherein an emission optical component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a combiner, a second lens set and an optical fiber adapter, and the laser chip set, the first lens set, the combiner, the second lens set and the optical fiber adapter are sequentially arranged along the length direction of the tube shell body. The multi-path optical signals emitted by the laser chip set are collimated by the first lens set, the collimated multi-path optical signals are combined into one path of optical signals by the combiner, and one path of optical signals are coupled to the optical fiber adapter by the second lens set. The shell body corresponds to the circuit board, namely, the long side of the shell body corresponds to the long side of the circuit board, and the short side of the shell body corresponds to the short side of the circuit board. Under the condition of three temperatures, the length direction of circuit board is easy to bend and deform, and when the circuit board bends and deforms, the length direction of the tube shell body bends and deforms, and the relative position of the light emitting component arranged along the length direction of the tube shell body is easy to deviate, so that the light power loss of the light emitting component is caused. Therefore, the lip edge is arranged on the edge of the long side of the tube shell body so as to increase the section moment of inertia of the tube shell, further improve the rigidity of the tube shell and reduce the deformation of the tube shell. The side of the lip is connected with the circuit board, and the edge of the short side, which is close to the laser chip, of the tube shell body supports the circuit board so as to connect the tube shell with the circuit board. In the application, the light emitting component is arranged along the length direction of the tube shell body, the long side of the tube shell body is correspondingly arranged with the long side of the circuit board, and the edge of the long side of the tube shell body is provided with the lip edge, so that the section moment of inertia of the tube shell is increased, the rigidity of the tube shell is further improved, and the deformation of the tube shell is reduced.

Finally, it should be noted that: the above embodiments are merely for illustrating the technical solution of the present disclosure, and are not limiting thereof; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims (10)

1. An optical module, comprising:

the circuit board is provided with a storage through hole;

The tube shell is arranged at the object placing through hole so as to be connected with the circuit board; the tube shell comprises a tube shell body, an emission optical component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a combiner, a second lens set and an optical fiber adapter, wherein the laser chip set, the first lens set, the combiner, the second lens set and the optical fiber adapter are sequentially arranged along the length direction of the tube shell body, multiple paths of optical signals emitted by the laser chip set are collimated by the first lens set, the collimated multiple paths of optical signals are combined into one path of optical signals by the combiner, and one path of optical signals are coupled to the optical fiber adapter by the second lens set;

The long side of the tube shell body is arranged corresponding to the long side of the circuit board, and the edge of the long side of the tube shell body is provided with a lip edge so as to increase the section moment of inertia of the tube shell; the side of the lip is connected with the circuit board, and the edge, close to the short side of the laser chip set, in the tube shell body supports the circuit board.

2. The optical module according to claim 1, wherein the package body has a first bearing member and a first support plate, the combiner is placed on the first support plate, and a side surface of the combiner is bearing against the first bearing member;

The lips comprise a first lip and a second lip, the first lip and the second lip are respectively positioned on two sides of the shell body, the first lip is not connected with the first bearing piece, and the second lip is not connected with the first supporting plate.

3. The optical module according to claim 1, wherein the package body has a first bearing member and a first support plate, the combiner is placed on the first support plate, and a side surface of the combiner is bearing against the first bearing member;

The lip includes a first lip connected to the first bearing member and a second lip connected to the first support plate.

4. The optical module of claim 1, wherein the lip has a thickness that is greater than or equal to a thickness of the circuit board.

5. The optical module of claim 1 wherein a lip is provided in the package body at a short side remote from the laser chip set to increase the cross-sectional moment of inertia of the package.

6. The optical module of claim 1, wherein the package body has a first storage slot, a first support plate, a second support plate, and a third support plate, the first storage slot having the laser chip set and the first lens set disposed thereon, the first support plate having the combiner disposed thereon, the second support plate having the second lens set disposed thereon, and the third support plate having the fiber optic adapter disposed thereon;

The first storage groove is sunken relative to the first supporting plate, and the sunken degrees of the first supporting plate, the second supporting plate and the third supporting plate are deepened in sequence.

7. The optical module of claim 1 wherein the envelope has an elastic modulus greater than 200GPam and a coefficient of thermal expansion less than 7e ^-6.

8. A light module as claimed in claim 2 or 3, wherein the first support plate is unconnected to the first bearing member.

9. An optical module, comprising:

the circuit board is provided with a storage through hole;

The tube shell is arranged at the object placing through hole so as to be connected with the circuit board; the tube shell comprises a tube shell body, an emission optical component is arranged on the tube shell body and comprises a laser chip set, a first lens set, a combiner, a second lens set and an optical fiber adapter, wherein the laser chip set, the first lens set, the combiner, the second lens set and the optical fiber adapter are sequentially arranged along the length direction of the tube shell body, multiple paths of optical signals emitted by the laser chip set are collimated by the first lens set, the collimated multiple paths of optical signals are combined into one path of optical signals by the combiner, and one path of optical signals are coupled to the optical fiber adapter by the second lens set;

The long side of the tube shell body is arranged corresponding to the long side of the circuit board, and the edge of the long side of the tube shell body is provided with a lip edge so as to increase the section moment of inertia of the tube shell; the side surface of the lip edge is connected with the circuit board, and the edge of the short side of the shell body supports the circuit board; the thickness of the lip is greater than or equal to the thickness of the circuit board.

10. The optical module of claim 9, wherein the package body has a first bearing member and a first support plate, the combiner being placed on the first support plate, a side of the combiner bearing against the first bearing member;

The lips comprise a first lip and a second lip, the first lip and the second lip are respectively positioned on two sides of the shell body, the first lip is connected with the first bearing piece, and the second lip is connected with the first supporting plate.