CN221200014U

CN221200014U - Optical module

Info

Publication number: CN221200014U
Application number: CN202323173880.6U
Authority: CN
Inventors: 葛建平; 王扩
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2023-11-23
Filing date: 2023-11-23
Publication date: 2024-06-21
Anticipated expiration: 2033-11-23

Abstract

The optical module provided by the disclosure comprises a lower shell, a circuit board and a light emitting component, wherein the lower shell and the upper shell are covered to form a cavity, and the circuit board and the light emitting component are positioned in the cavity. The light emitting member includes: the first light emitting chip, the second light emitting chip and the third light emitting chip are respectively used for emitting signal lights with different wavelengths. The first filter reflects the first wavelength signal light. The second filter is arranged in parallel with the first filter, reflects the first wavelength signal light, and transmits the second wavelength signal light. The first filter and the second filter combine the first wavelength signal light and the second wavelength signal light into a beam and emit light towards the third filter. The third filter is positioned at one side of the second filter, and the first wavelength signal light and the second wavelength signal light are transmitted through the third filter. The fourth filter plate reflects the third wavelength signal light to the third filter plate; the third filter plate reflects the third wavelength signal light and combines the third wavelength signal light, the first wavelength signal light after beam combination and the second wavelength signal light into a beam.

Description

Optical module

Technical Field

The disclosure relates to the technical field of optical fiber communication, and in particular relates to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology. In general, the optical module with high transmission rate has high integration density of the optical module with lower transmission rate, such as adopting a multi-channel optical transceiver technology, so as to concentrate more optical transmitting components and optical accommodating components in the optical module.

Disclosure of utility model

The embodiment of the disclosure provides an optical module for realizing the emission of integrated multi-wavelength optical signals in the optical module.

In one aspect, the present application provides an optical module, comprising:

An upper shell body, a lower shell body and a lower shell body,

The lower shell is covered with the upper shell to form a cavity;

The circuit board is positioned in the cavity,

A light emitting component located in the cavity and electrically connected to the circuit board, the light emitting component comprising:

A first light emitting chip for emitting a first wavelength signal light;

A second light emitting chip for emitting a second wavelength signal light;

a third light emitting chip for emitting a third wavelength signal light;

The first filter is positioned on the light-emitting path of the first light-emitting chip and is used for reflecting the first wavelength signal light;

A second filter arranged in parallel with the first filter, reflecting the first wavelength signal light from the first filter, and transmitting the second wavelength signal light;

The third filter is positioned at one side of the second filter, the first wavelength signal light and the second wavelength signal light are transmitted through the third filter, and the third filter reflects the third wavelength signal light;

And the fourth filter is positioned on the light-emitting light path of the third light-emitting chip and reflects the third wavelength signal light to the third filter.

In another aspect, the present disclosure provides an optical module, comprising:

An upper shell body, a lower shell body and a lower shell body,

The lower shell is covered with the upper shell to form a cavity;

The circuit board is positioned in the cavity,

A fiber optic adapter;

an optical receiving member having a first side provided with a light receiving member connected to the optical fiber adapter and a second side provided with a first light receiving member, a second light receiving member, and a third light receiving member;

A light emitting member connected with the third side of the optical housing member, the light emitting member comprising:

A first light emitting chip for emitting a first wavelength signal light;

A second light emitting chip for emitting a second wavelength signal light;

a third light emitting chip for emitting a third wavelength signal light;

Compared with the prior art, the application has the beneficial effects that:

The optical module provided by the disclosure comprises a cavity formed by covering the lower shell and the upper shell, and a circuit board and a light emitting component which are positioned in the cavity. The light emitting member includes: the first light emitting chip, the second light emitting chip and the third light emitting chip are respectively used for emitting signal lights with different wavelengths. The first filter is positioned on the light-emitting path of the first light-emitting chip and reflects the signal light with the first wavelength. The second filter is disposed parallel to the first filter, reflects the first wavelength signal light from the first filter, and transmits the second wavelength signal light. The first filter and the second filter combine the first wavelength signal light and the second wavelength signal light into a beam and emit light towards the third filter. The third filter is positioned at one side of the second filter, and the first wavelength signal light and the second wavelength signal light are transmitted through the third filter. The fourth filter is positioned on the light-emitting light path of the third light-emitting chip and reflects the third wavelength signal light to the third filter; the third filter plate reflects the third wavelength signal light and combines the third wavelength signal light, the first wavelength signal light after beam combination and the second wavelength signal light into a beam. The application adopts the filter plate to realize the beam combination of light with different wavelengths, has simple structure and low price, and can greatly reduce the material cost.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a partial architectural diagram of an optical communication system provided in accordance with some embodiments of the present disclosure;

fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure;

Fig. 3 is a schematic structural diagram of an optical module according to some embodiments of the present disclosure;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments of the present disclosure;

Fig. 5 is a schematic diagram of an internal structure of an optical module according to some embodiments of the present disclosure;

Fig. 6 is an exploded schematic view of an internal structure of an optical module provided according to some embodiments of the present disclosure;

Fig. 7 is a schematic structural view of a light emitting component provided according to some embodiments of the present disclosure;

FIG. 8 is an exploded schematic illustration of a light emitting component provided in accordance with some embodiments of the present disclosure;

FIG. 9 is a second exploded view of a light emitting component provided in accordance with some embodiments of the disclosure;

Fig. 10 is a schematic view of a partial structure of a light emitting member provided according to some embodiments of the disclosure;

FIG. 11 is a schematic diagram showing a partial structure of a light emitting device according to some embodiments of the disclosure;

FIG. 12 is a schematic view of a portion of another light emitting component provided in accordance with some embodiments of the disclosure;

fig. 13 is a schematic diagram of a multiplexing component provided in accordance with some embodiments of the disclosure;

fig. 14 is an exploded view of a multiplexing assembly provided in accordance with some embodiments of the disclosure;

fig. 15 is a schematic diagram of a multiplexing component according to some embodiments of the disclosure;

fig. 16 is a schematic view of an optical path of a multiplexing component according to an embodiment;

fig. 17 is a schematic diagram three of a multiplexing assembly provided according to some embodiments of the disclosure.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and specifically described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

The optical communication technology establishes information transfer between information processing apparatuses, and the optical communication technology loads information onto light, and uses propagation of light to realize information transfer, and the light loaded with information is an optical signal. The optical signal propagates in the information transmission device, so that the loss of optical power can be reduced, and the high-speed, long-distance and low-cost information transmission can be realized. Information that can be processed by the information processing device exists in the form of an electrical signal, and an optical network terminal/gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer and a television are common information processing devices, and an optical fiber and an optical waveguide are common information transmission devices.

The mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment is realized through an optical module. For example, an optical fiber is connected to an optical signal input end and/or an optical signal output end of the optical module, and an optical network terminal is connected to an electrical signal input end and/or an electrical signal output end of the optical module; the optical module converts the first optical signal into a first electric signal, and the optical module transmits the first electric signal into an optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Because the information processing devices can be connected with each other through an electrical signal network, at least one type of information processing device is required to be directly connected with the optical module, and not all types of information processing devices are required to be directly connected with the optical module, and the information processing device directly connected with the optical module is called an upper computer of the optical module.

Fig. 1 is a partial architectural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in fig. 1, a part of the optical communication system is represented as a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends toward the remote information processing apparatus 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, the propagation of the optical signal in the total reflection direction can almost maintain the original optical power, the optical signal can be totally reflected in the optical fiber 101 for a plurality of times, the optical signal from the direction of the far-end information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated towards the direction of the far-end information processing device 1000, so that the information transmission with long distance and low power consumption is realized.

The number of the optical fibers 101 may be one or plural (two or more); the optical fiber 101 and the optical module 200 are movably connected in a pluggable mode, and can also be fixedly connected.

The upper computer 100 is provided with an optical module interface 102, and the optical module interface 102 is configured to be connected with the optical module 200, so that the upper computer 100 and the optical module 200 are connected by unidirectional/bidirectional electric signals; the upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working state of the optical module 200.

The host computer 100 has an external electrical interface, such as a universal serial bus interface (Universal Serial Bus, USB), a network cable interface 104, and the external electrical interface can access an electrical signal network. Illustratively, the network cable interface 104 is configured to access the network cable 103, thereby enabling the host computer 100 to establish a unidirectional/bidirectional electrical signal connection with the network cable 103.

Optical network terminals (ONU, optical Network Unit), optical line terminals (OLT, optical LINE TERMINAL), optical network units (ONT, optical Network Terminal), and data center servers are common upper computers.

One end of the network cable 103 is connected to the local information processing device 2000, the other end is connected to the host computer 100, and the network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

Illustratively, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal based on the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, the optical module 200 transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101.

Illustratively, the first optical signal from the direction of the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal into the local information processing apparatus 2000.

The optical module is a tool for realizing the mutual conversion of the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the encoding and decoding modes of the information can be changed.

Fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 and the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown in the drawing) disposed inside the cage 106, wherein the heat sink 107 has a convex structure for increasing a heat dissipation area, and the fin-like structure is a common convex structure.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected with an electrical connector inside the cage 106.

Fig. 3 is a block diagram of an optical module according to some embodiments of the present disclosure, and fig. 4 is an exploded schematic diagram of an optical module according to some embodiments of the present disclosure. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, a light emitting part 400, and an optical receiving part 500. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of the light emitting part 400 and the optical housing part 500.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being covered on the lower housing 202 to form the above-mentioned housing having two openings; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed at both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011 and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction in which the connection lines of the two openings 203 and 204 are located may be identical to the longitudinal direction of the optical module 200 or may be inconsistent with the longitudinal direction of the optical module 200. For example, opening 203 is located at the end of light module 200 (right end of fig. 3), and opening 204 is also located at the end of light module 200 (left end of fig. 3). Or opening 203 is located at the end of light module 200 and opening 204 is located at the side of light module 200. The opening 203 is an electrical port, from which the golden finger of the circuit board 300 extends and is inserted into an upper computer (e.g., the optical network terminal 100); the opening 204 is an optical port configured to access the optical fiber 101 such that the optical fiber 101 connects to the light emitting component 400 and/or the optical receiving component 500 in the optical module 200.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the components such as the circuit board 300, the light emitting component 400, the optical accommodating component 500 and the like are conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form packaging protection for the components. In addition, when the assembly of the light emitting part 400 and the optical housing part 500 of the circuit board 300 is assembled, the positioning part, the heat dissipating part and the electromagnetic shielding part of the devices are conveniently disposed, which is beneficial to the automatic implementation of the production.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 600 located outside the housing thereof, and the unlocking member 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking component 600 is located at an end of the lower housing 202, having a snap-fit component that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 600; when the unlocking member 600 is pulled, the unlocking member 600 rotates, so that the locking member of the unlocking member 600 moves along with the unlocking member, and the connection relation between the locking member and the upper computer is changed, so that the locking relation between the optical module 200 and the upper computer is released, and the optical module 200 can be pulled out of the cage of the upper computer. In some embodiments, the unlocking component 600 is located on the outer walls of the two lower side panels 2022 of the lower housing 202, with a snap-fit component that mates with an upper computer cage (e.g., cage 106 of the optical network terminal 100).

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driving chip, a limiting amplifier (LIMITING AMPLIFIER, LA), a clock data recovery (Clock and Data Recovery, CDR) chip, a power management chip, a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like.

Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, a flexible circuit board connection may be employed between the hard circuit board and the light emitting part 400.

In some embodiments of the present disclosure, the light emitting component 400 is configured to enable emission of an optical signal and the optical receiving component 500 is configured to enable reception of the optical signal. Illustratively, the light emitting member 400 and the optical receiving member 500 are combined together to form an integral light transceiving member; of course, in the embodiment of the present application, the light emitting component and the optical accommodating component may be separated, that is, the light emitting component and the optical accommodating component do not share the housing.

Fig. 5 is an internal structure schematic diagram of an optical module provided according to some embodiments of the present disclosure, and fig. 6 is an internal structure exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure. As shown in fig. 5 and 6, one end of the optical housing member 500 is connected to the optical fiber adapter 700, and the other end of the optical housing member 500 is connected to the light emitting member 400. The optical signal generated by the light emitting part 400 is transmitted to the optical accommodating part 500, then transmitted to the optical fiber adapter 700 through the optical accommodating part 500, and finally output through the optical fiber adapter 700; the externally input optical signal is input to the optical housing member 500 through the optical fiber adapter 700, so that the optical housing member 500 and the light emitting member 400 share the optical fiber adapter 700, and further the upstream optical signal and the downstream optical signal of the optical module share the optical fiber 101.

In some embodiments of the present disclosure, the light emitting part 400 may generate light signals of a plurality of wavelengths, and the light signals of the plurality of wavelengths are combined into one light signal, and the optical housing part 500 may receive the light signals including the plurality of wavelengths. Illustratively, the light emitting part 400 generates optical signals of 3 wavelengths, and the optical housing part 500 receives the optical signals of three wavelengths.

As shown in fig. 5 and 6, the optical housing part 500 includes a first housing 510 and a first upper cover 520 that are coupled to each other to form a first cavity, and further includes a first light receiving part 530, a second light receiving part 540, and a third light receiving part 550. The first housing 510 and the first upper cover 520 form a first cavity having an inner accommodating cavity therein for accommodating the device. In some embodiments, the first housing 510 has an inner cavity formed therein, such that the first upper cover 520 covers the first housing 510 to form a receiving cavity.

In some embodiments, the first case 510 connects the light emitting part 400, the first light receiving part 530, the second light receiving part 540, and the third light receiving part 550 to realize encapsulation of the light emitting part 400, the first light receiving part 530, the second light receiving part 540, and the third light receiving part 550 through the first case 510, and to realize optical connection of the light emitting part 400, the first light receiving part 530, the second light receiving part 540, and the third light receiving part 550 with the inside of the first cavity, respectively.

In some embodiments, the optical module 200 is configured to receive a beam of optical signals comprising three wavelength ranges and to emit a beam of optical signals comprising three wavelength ranges. Illustratively, the light emitting part 400 is configured to output a beam of optical signals including a first wavelength, a second wavelength, and a third wavelength, the first light receiving part 530 is configured to receive an optical signal of a fourth wavelength, the second light receiving part 540 is configured to receive an optical signal of a fifth wavelength, and the third light receiving part 550 is configured to receive an optical signal of a sixth wavelength.

In some embodiments, the light emitting part 400 employs a micro-optical package, and the first, second, and third light receiving parts 530, 540, and 550 employ coaxial packages. Illustratively, the receiving optical axes of the first, second, and third light receiving parts 530, 540, and 550 are parallel to each other. In some embodiments, the light emitting part 400, the first light receiving part 530, the second light receiving part 540, and the third light receiving part 550 are electrically connected to the circuit board 300 through flexible circuit boards, respectively.

In some embodiments, a first side of the first housing 510 is connected to the fiber optic adapter 700, a second side of the first housing 510 is provided with the first light receiving member 530, the second light receiving member 540, and the third light receiving member 550, and a third side of the first housing 510 is provided with the light emitting member 400. Illustratively, a first side of the first housing 510 is adjacent to the optical port of the optical module, a second side of the first housing 510 is adjacent to the lower side panel 2022 of the lower housing 202, and a third side of the first housing 510 is adjacent to the electrical port of the optical module.

In some embodiments, a first side of the first housing 510 is provided with a first connection hole, a second side of the first housing 510 is provided with a second connection hole, a third connection hole, and a fourth connection hole, and a third side of the first housing 510 is provided with a fifth connection hole, which are respectively communicated with an inner cavity of the first housing 510. The other end of the optical fiber adapter 700 is connected to the first connection hole; the first light receiving part 530 is connected to the second connection hole, the second light receiving part 540 is connected to the third connection hole, the third light receiving part 550 is connected to the fourth connection hole, and the light emitting part 400 is connected to the fifth connection hole. Illustratively, the second, third and fourth connection holes are disposed in sequence on the second side of the first housing 510.

Fig. 7 is a schematic structural view of a light emitting component provided according to some embodiments of the present disclosure. Fig. 8 is an exploded schematic view of a light emitting component provided in accordance with some embodiments of the present disclosure. As shown in fig. 7 and 8, the light emitting part 400 includes a second cavity 410, and the second cavity 410 includes a second housing 411 and a second upper cover 412. An inner cavity is formed on the second shell 411, and a second upper cover 412 is connected with the second shell 411 in a covering manner, so that a relatively sealed cavity structure is formed with the second shell 411.

The second cavity 410 is provided with a connecting portion 4112 at a side thereof, and the second cavity 410 is connected to the first housing 510 through the connecting portion 4112, so that the second cavity 410 and the first housing 510 can be conveniently connected through the connecting portion 4112.

As shown in fig. 7, a fixing surface 4111 is provided on the top of the second housing 411, and the second upper cover 412 is fixedly connected to the fixing surface 4111; the second housing 411 is provided with a first through hole 4113, the first through hole 4113 communicates with an inner cavity of the second housing 411, the first through hole 4113 communicates with the connecting portion 4112, the first through hole 4113 communicates with the fifth connecting hole through the connecting portion 4112, and the first through hole 4113 is used for outputting an optical signal.

In some embodiments, the light emitting component 400 includes an isolator 420. Illustratively, the spacer 420 is disposed in the first through hole 4113, the spacer 420 seals the first through hole 4113, and the spacer 420 is used to prevent the optical signal output from the first cavity through the fifth connection hole 5151 from being incident into the second cavity 410.

In some embodiments, the other end of the second housing 411 is provided with a switching block 430, and the switching block 430 is used to electrically connect the electrical device in the second cavity 410 with the circuit board 300. Illustratively, the adapter 430 is embedded at the other end of the second housing 411, such that one end of the adapter 430 extends into the second housing 411, and the other end of the adapter 430 is located outside the second housing 411, and the adapter 430 is electrically connected to the circuit board 300 through the flexible circuit board. In some embodiments, the adapter block 430 employs a ceramic substrate, but is not limited to a ceramic substrate.

Fig. 9 is an exploded schematic view of a light emitting component provided in accordance with some embodiments of the disclosure. As shown in fig. 9, the other end of the second housing 411 is provided with an opening 4114 penetrating the other end of the second housing 411. One end of the adapter block 430 is embedded in the opening 4114, that is, one end of the adapter block 430 passes through the opening 4114 and extends into the inner cavity of the second housing 411.

In some embodiments, a laser assembly is disposed in the interior cavity of the second housing 411, the laser assembly being proximate one end of the adapter block 430, to facilitate electrical connection of the laser assembly to the adapter block 430. The laser component is used for emitting multiple paths of optical signals with different wavelengths. Illustratively, the laser assembly wire bonds to the adapter block 430.

In some embodiments, a multiplexing component 460 is further disposed in the inner cavity of the second housing 411, where the multiplexing component 460 is configured to combine multiple optical signals with different wavelengths emitted by the laser component into one emitted optical signal.

In some embodiments, the light emitting component 400 further includes a collimating lens 490, where the collimating lens 490 is disposed on the optical path from the laser assembly to the multiplexing assembly 460, for collimating the optical signals generated by the laser assembly and transmitting to the light inlet of the multiplexing assembly 460.

Fig. 10 is a schematic view of a partial structure of a light emitting device according to some embodiments of the disclosure. In some embodiments, as shown in fig. 10, the laser assembly includes a first laser assembly 451, a second laser assembly 452, and a third laser assembly 453; the second laser assembly 452 is positioned between the first laser assembly 451 and the third laser assembly 453, and the light exiting directions of the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 are toward the multiplexing assembly 460. In some embodiments, the first laser assembly 451 emits a first wavelength optical signal, the second laser assembly 452 emits a second wavelength optical signal, the third laser assembly 453 emits a third wavelength optical signal, and the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal optical axis are parallel to the length extension direction of the second housing. Illustratively, the wavelength of the first wavelength optical signal is in the range 1340-1344nm, e.g., the wavelength of the first wavelength optical signal is 1342nm; the wavelength of the second wavelength optical signal is 1480-1500nm, for example, the wavelength of the second wavelength optical signal is 1490 nm; the wavelength of the third wavelength optical signal is in the range of 1575-1580nm, e.g., the wavelength of the third wavelength optical signal is 1577 nm.

In some embodiments, the transmission rate of the first laser assembly 451 is greater than the transmission rate of the third laser assembly 453, and the transmission rate of the third laser assembly 453 is greater than the transmission rate of the second laser assembly 452. Illustratively, the first laser assembly 451 has a transmission rate of 10G, the second laser assembly 452 has a transmission rate of 2.5G, and the third laser assembly 453 has a transmission rate of 50G.

In some embodiments, the light emitting end surfaces of the first, second, and third laser assemblies 451, 452, 453 are flush, i.e., the light emitting end surfaces of the first, second, and third laser assemblies 451, 452, 453 are located on the same length face of the second housing 411.

In some embodiments, the light emitting end surfaces of the first laser assembly 451 and the second laser assembly 452 are flush, i.e., the light emitting end surfaces of the first laser assembly 451 and the second laser assembly 452 are located on the same length surface of the second housing 411. The light emitting end surfaces of the second laser component 452 and the third laser component 453 are not flush, i.e. the light emitting end surfaces of the third laser component 453 and the second laser component 452 are located on different length surfaces of the second housing 411.

In some embodiments, the light emitting component 400 further includes a semiconductor refrigerator (Thermo Electric Cooler, TEC) 470, the TEC470 being disposed in the interior cavity of the second housing 411 and below the laser assembly, the TEC470 being used to adjust the temperature of the laser assembly.

In some embodiments, the light emitting component 400 further includes a support plate 480, the top of the tec470 is fixedly coupled to the support plate 480, and the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 are disposed on the support plate 480.

In some embodiments, collimating lens 490 includes a first collimating lens 491, a second collimating lens 492, and a third collimating lens 493, first collimating lens 491 disposed on the transmission path of first laser assembly 451 to multiplexing assembly 460, second collimating lens 492 disposed on the transmission path of second laser assembly 452 to multiplexing assembly 460, and third collimating lens 493 disposed on the transmission path of third laser assembly 453 to multiplexing assembly 460. In some embodiments, the first, second and third collimating lenses 491, 492, 493 are disposed on the support plate 480, although embodiments of the present disclosure are not limited to the first, second and third collimating lenses 491, 492, 493 being disposed on the support plate 480.

In some embodiments, the multiplexing assembly 460 is disposed on a support plate 480.

Fig. 11 is a schematic diagram showing a partial structure of a light emitting part according to some embodiments of the disclosure. Fig. 11 is another angular schematic view of fig. 10. In some examples, as shown in fig. 10 and 11, multiplexing component 460 includes: a first filter 461, a second filter 462, a third filter 463 and a fourth filter 464. The arrows in fig. 11 indicate the direction of light. The first laser assembly 451 includes a first light emitting chip 4511, and the first light emitting chip 4511 emits signal light of a first wavelength. The first collimating lens 491 is located in the light emitting direction of the first light emitting chip 4511, and the first collimating lens 491 collimates the first wavelength signal light emitted from the first light emitting chip 4511. The first filter 461 is located on the other side of the first collimating lens 491 and reflects the first-wavelength signal light.

For convenience of description, the angle of the filter represents an included angle between a normal line of the filter and a propagation direction of the collimated first wavelength signal light. The propagation direction of the first wavelength signal light is the length direction of the light emitting component.

For example, the first filter reflects the signal light with the first wavelength, and an angle between a normal line of the first filter and a length direction of the light emitting component is 45 degrees.

The second laser assembly 452 includes a second light emitting chip 4521, and the second light emitting chip 4521 emits signal light of a second wavelength. The second collimating lens 492 is located in the light emitting direction of the second light emitting chip 4521, and the second collimating lens 492 collimates the second wavelength signal light emitted from the second light emitting chip 4521. The second filter 462 is positioned at the other side of the second collimating lens 492, and the second wavelength signal light is transmitted through the second filter. The second filter 462 is also disposed parallel to the first filter 461, and the first wavelength signal light is reflected by the first filter and then directed toward the second filter 462. The second filter reflects the first wavelength signal light.

The second filter reflects the first wavelength signal light, and an angle between a normal line of the second filter and a length direction of the light emitting component is 45 degrees. The second filter transmits the second wavelength signal light.

The third filter 463 is located at the light-emitting side of the second filter 462, and the second wavelength signal light is transmitted through the second filter and then transmitted through the third filter 463. The first wavelength signal light is reflected by the second filter and transmitted through the third filter 463.

The third laser assembly 453 includes a third light emitting chip 4531, and the third light emitting chip 4531 emits signal light of a third wavelength. The third collimating lens 493 is located in the light emitting direction of the third light emitting chip 4531, and the third collimating lens 493 collimates the third wavelength signal light emitted from the third light emitting chip 4531. The fourth filter 464 is located at the other side of the third collimating lens 493, and the third wavelength signal light is reflected by the fourth filter. The fourth filter 464 is further disposed parallel to the third filter 463, and the third wavelength signal light is reflected by the fourth filter and then directed toward the third filter 463.

The third filter 463 reflects the third wavelength signal light, and the third filter 463 transmits the first wavelength signal light and the second wavelength signal light.

In some embodiments, the first wavelength signal light emitted by the first light emitting chip 4511 is collimated by the first collimating lens 491, reflected by the first filter, reflected by the second filter, transmitted through the third filter, and enters the first housing 510 from the second cavity 410.

The second wavelength signal light emitted by the second light emitting chip 4521 is collimated by the second collimating lens 492, transmitted through the second filter and the third filter, and enters the first housing 510 from the second cavity 410.

The third wavelength signal light emitted by the third light emitting chip 4531 is collimated by the third collimating lens 493, reflected by the fourth filter 464, reflected by the third filter, and enters the first housing 510 from the second cavity 410.

In some embodiments, the second filter is at an angle of 90 ° to the third filter.

The application adopts the filter plate to realize the beam combination of light with different wavelengths, has simple structure and low price, and can greatly reduce the material cost.

In some embodiments, the third light emitting chip 4531 is an electroabsorption modulated laser (ELECTRICAL ABSORPTION MODULATED LASER, EML) and is packaged with a semiconductor laser amplifier, one end of the first high-frequency transmission line is wired to the anode of the electroabsorption modulator of the EML.

In some embodiments, the third light emitting chip 4531 is obliquely disposed, but the direction of the third wavelength light signal output by the third light emitting chip 4531 is parallel to the length direction of the second housing 411, so as to effectively reduce the reflected light signal entering the third light emitting chip 4531 to interfere with the light emission of the third light emitting chip 4531.

In some embodiments, the first light emitting chip 4511 is an EML, and one end of the second high-frequency transmission line is wired to the positive electrode of the electro-absorption modulator of the EML.

In some embodiments, TEC470 includes a first electrode and a second electrode located at an edge of TEC470 package. Illustratively, the first and second electrodes are disposed on a side of the third laser assembly 453 remote from the second laser assembly 452.

In some embodiments, the arrangement of the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453, in combination with the structural configuration of the adapter block 430, can make full use of the space of the second housing 411, and facilitate the setting of the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 in the second housing 411 and the electrical connection of the first laser assembly 451, the second laser assembly 452, and the third laser assembly 453 with the circuit board 300.

Fig. 12 is a schematic view of a partial structure of another light emitting member provided according to some embodiments of the disclosure. Fig. 13 is a schematic diagram of a multiplexing component provided according to some embodiments of the disclosure. Fig. 14 is an exploded view of a multiplexing assembly provided in accordance with some embodiments of the disclosure. In some examples, as shown in fig. 12 and 13, multiplexing component 460 includes: a first prism 465, a second prism 466, a third prism 467, and a fourth prism 468. The inclined surface of the second prism 466 is connected to the first prism 465, one right angle surface of the third prism is connected to the first prism 465, and the inclined surface of the third prism is connected to the fourth prism 468.

Wherein the first prism 465 is a diamond prism. The first prism 465 includes: first side 4651, second side 4652, third side 4653, and fourth side 4654. The first side 4651 is disposed opposite the fourth side 4654, and the second side 4652 and the third side 4653 are disposed opposite. The first side 4651 is angled 45 from the second side. The first side 4651 is disposed perpendicular to the length of the light emitting member.

The second prism 466 is a triangular prism, and the second prism 466 includes a first right angle surface 4661, a second right angle surface 4662, and a first oblique side surface 4663.

The first right angle face 4661 is parallel to the first side face 4651. In some embodiments, the first right angle face 4661 is in the same plane as the first side face 4651. The first right-angle surface 4661 and the first side surface 4651 may be positioned at the same position in the longitudinal direction of the light emitting member, and the first right-angle surface 4661 and the first side surface 4651 may be positioned at different positions in the longitudinal direction of the light emitting member.

The first angled side 4663 is connected to the third side 4653, and the first angled side 4663 is angled at 45 ° from the first right angle side 4661.

In some embodiments, the first angled side 4663 is the same shape and area as the third side 4653, facilitating assembly.

The third prism 467 is a triangular prism, and the third prism 467 includes a third right angle face 4671, a fourth right angle face 4672, and a second oblique side face 4673.

The third right angle face 4671 is parallel to the first side face 4651. In some embodiments, third right angle face 4671 is connected to third side face 4653.

Fig. 15 is a schematic diagram of a multiplexing component according to some embodiments of the disclosure. As shown in fig. 15, the third right angle face 4671 and the third side face 4653 may also be separately provided.

The second angled side 4673 is angled 45 from the third angled side 4671. The second angled side 4673 is at an angle of 90 ° to the first angled side 4663.

The fourth prism 468 is a diamond prism. The fourth prism 468 includes: fifth side 4681, sixth side 4682, seventh side 4683, and eighth side 4684. The fifth side 4681 is disposed opposite the eighth side 4684, and the sixth side 4682 and the seventh side 4683 are disposed opposite each other. The included angle between the fifth side 4681 and the sixth side 4682 is 45 °. The fifth side 4681 is disposed perpendicular to the longitudinal direction of the light emitting member.

The sixth side 4682 is connected to the second angled side 4673. In some embodiments, sixth side 4682 is the same shape and area as second angled side 4673, facilitating assembly.

In some embodiments of the application, the first prism 465 and the second prism 466 are connected to form a first set of mirrors and the third prism 467 and the fourth prism 468 are connected to form a second set of mirrors. The first lens group and the second lens group can be connected and also can be arranged in a separated way.

Fig. 16 is a schematic diagram of an optical path of a multiplexing component according to an embodiment. As shown in fig. 16, in some embodiments, a third reflective film 4603 is disposed between the third side 4653 and the first angled side 4663, the third reflective film 4603 being reflective to the first wavelength signal light and transmissive to the second wavelength signal light.

A fourth reflective film 4604 is provided between the sixth side surface 4682 and the second inclined side surface 4673, the fourth reflective film 4604 transmits the first wavelength signal light and the second wavelength signal light, and the fourth reflective film 4604 reflects the third wavelength signal light.

The second side 4652 is provided with a first reflective film 4602, and the first reflective film 4602 reflects the first wavelength signal light. The seventh side 4683 is provided with a second reflective film 4605, and the second reflective film 4605 reflects the third wavelength signal light.

The first laser assembly 451 includes a first light emitting chip 4511, and the first light emitting chip 4511 emits signal light of a first wavelength. The first collimating lens 491 is located in the light emitting direction of the first light emitting chip 4511, and the first collimating lens 491 collimates the first wavelength signal light emitted from the first light emitting chip 4511. The first wavelength signal light enters the multiplexing component through the first side 4651, is reflected by the second side 4652, faces the third side 4653, is reflected by the third reflective film 4603, faces the fourth side 4654, and is transmitted through the fourth reflective film 4604 to be emitted from the eighth side 4684.

The second laser assembly 452 includes a second light emitting chip 4521, and the second light emitting chip 4521 emits signal light of a second wavelength. The second collimating lens 492 is located in the light emitting direction of the second light emitting chip 4521, and the second collimating lens 492 collimates the second wavelength signal light emitted from the second light emitting chip 4521. The second wavelength signal light is sequentially transmitted through the second prism 466, the first prism, the third prism and the fourth prism, and is emitted through the eighth side 4684.

The third laser assembly 453 includes a third light emitting chip 4531, and the third light emitting chip 4531 emits signal light of a third wavelength. The third collimating lens 493 is located in the light emitting direction of the third light emitting chip 4531, and the third collimating lens 493 collimates the third wavelength signal light emitted from the third light emitting chip 4531. The third wavelength signal light enters the fourth prism through the fifth side face 4681, is reflected by the second reflecting film 4605, is reflected by the fourth reflecting film 4604, and is emitted through the eighth side face 4684.

In some embodiments of the present application, the first wavelength signal light, the second wavelength signal light and the third wavelength signal light are combined into one beam by the first reflection film, the third reflection film, the second reflection film and the fourth reflection film in the multiplexing component, so that the structure is simple, the price is low, and the material cost can be greatly reduced. Compared with the example of the filter, the first, third, second and fourth reflection films are disposed on the prism surface, and the angles are determined, so that the first, third, second and fourth reflection films do not need to be coupled at the time of installation. The length and angular position of the multiplexing assembly need only be determined from the first side 4651 during installation.

Fig. 17 is a schematic diagram of a multiplexing assembly provided according to some embodiments of the disclosure. As shown in fig. 17, the second prism 466 may also be a trapezoidal prism.

In some embodiments, multiplexing component 460 comprises: a first prism 465, a second prism 466, a third prism 467 and a fourth prism 468, one right angle surface of the third prism being connected to the first prism 465, and an inclined surface of the third prism being connected to the fourth prism 468. The third side face 4653 is provided with a third reflective film 4603, and the third reflective film 4603 is reflective to the first wavelength signal light and transmissive to the second wavelength signal light.

The first laser assembly 451 includes a first light emitting chip 4511, and the first light emitting chip 4511 emits signal light of a first wavelength. The first collimating lens 491 is located in the light emitting direction of the first light emitting chip 4511, and the first collimating lens 491 collimates the first wavelength signal light emitted from the first light emitting chip 4511. The first wavelength signal light enters the multiplexing component through the first side 4651, is reflected by the second side 4652, faces the third side 4653, faces the fourth side 4654 after being reflected by the third reflective film 4603, is transmitted through the fourth side 4654, the fourth reflective film 4604 and the first inclined side 4663, and is emitted from the eighth side 4684.

The second laser assembly 452 includes a second light emitting chip 4521, and the second light emitting chip 4521 emits signal light of a second wavelength. The second collimating lens 492 is located in the light emitting direction of the second light emitting chip 4521, and the second collimating lens 492 collimates the second wavelength signal light emitted from the second light emitting chip 4521. The second wavelength signal light is sequentially transmitted through the second prism, the first prism, the third prism and the fourth prism, and is emitted through the eighth side 4684.

Finally, it should be noted that: the above embodiments are merely for illustrating the technical solution of the present disclosure, and are not limiting thereof; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, comprising:

An upper shell body, a lower shell body and a lower shell body,

The lower shell is covered with the upper shell to form a cavity;

The circuit board is positioned in the cavity,

A first light emitting chip for emitting a first wavelength signal light;

A second light emitting chip for emitting a second wavelength signal light;

a third light emitting chip for emitting a third wavelength signal light;

2. The light module of claim 1 wherein the light emitting component further comprises:

A first collimating lens located between the first light emitting chip and the first filter;

The second collimating lens is positioned between the second light emitting chip and the second filter;

And the third collimating lens is positioned between the third light emitting chip and the fourth filter.

3. The light module of claim 1 wherein the light emitting component further comprises:

A second upper cover;

the second shell and the second upper cover form an inner cavity;

One end of the second shell is provided with a switching block, one end of the switching block is embedded into the inner cavity, and one end of the switching block is electrically connected with the first light emitting chip, the second light emitting chip and the third light emitting chip; the other end of the switching block is electrically connected with the circuit board.

4. A light module as recited in claim 3, wherein the light emitting component further comprises:

TEC located in the cavity;

The support plate is located above the TEC, and the first light emitting chip, the second light emitting chip and the third light emitting chip are located above the support plate.

5. An optical module, comprising:

An upper shell body, a lower shell body and a lower shell body,

The lower shell is covered with the upper shell to form a cavity;

The circuit board is positioned in the cavity,

A fiber optic adapter;

A first light emitting chip for emitting a first wavelength signal light;

A second light emitting chip for emitting a second wavelength signal light;

a third light emitting chip for emitting a third wavelength signal light;

6. The light module of claim 5 wherein the light emitting component further comprises:

7. The light module of claim 5 wherein the light emitting component further comprises:

A second upper cover;

the second shell and the second upper cover form an inner cavity;

8. The light module of claim 7 wherein the light emitting component further comprises:

TEC located in the cavity;

9. The light module of claim 5 wherein the optical containment component comprises: the first shell and the first upper cover are connected to form a first cavity;

A first side of the first shell is provided with a first optical receiving component, a second optical receiving component and a third optical receiving component which are connected with the optical fiber adapter, and a second side of the first shell is provided with a first optical receiving component, a second optical receiving component and a third optical receiving component;

And a light emitting member connected to the third side of the first housing.