CN219936149U

CN219936149U - Optical module

Info

Publication number: CN219936149U
Application number: CN202321707545.7U
Authority: CN
Inventors: 郑龙; 孙万菊; 曹亮; 杨思更
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2023-06-30
Filing date: 2023-06-30
Publication date: 2023-10-31
Anticipated expiration: 2033-06-30

Abstract

The disclosure provides an optical module, which comprises a circuit board, an optical emission part, an optical receiving part, an optical fiber fixing frame and an optical fiber adapter group arranged on the optical fiber fixing frame, wherein the optical emission part is embedded in a mounting hole on the circuit board; the light emitting component comprises an emitting base embedded in the mounting hole, a light emitting assembly arranged on the emitting base and an emitting cover plate covered on the emitting base, wherein the top surface of the emitting base is bonded with the back surface of the circuit board, and the emitting cover plate is bonded with the front surface of the circuit board; the light receiving part comprises a light collimator and a light demultiplexer connected with the light collimator, the light demultiplexer is arranged on the back surface of the circuit board, the output end of the light demultiplexer is an inclined reflecting surface, the reflecting surface is positioned above the detector group on the back surface of the circuit board, the light demultiplexer demultiplexes the light output by the light collimator into multiple branches, and the multiple branches are reflected to the detector group through the reflecting surface. The present disclosure employs special structural designs to achieve high transmission rate optical module performance in small spaces.

Description

Optical module

Technical Field

The disclosure relates to the technical field of optical communication, and in particular relates to an optical module.

Background

In the new business and application modes of cloud computing, mobile internet, video, etc., optical communication technology is used. In the optical communication technology, an optical module is a device for realizing photoelectric signal conversion, and is one of key devices in optical communication equipment.

With the development of optical communication technology, the transmission rate of optical modules is continuously improved, and in particular, in recent years, 800G optical modules are gradually introduced into the market. To achieve the transmission rate of 800G optical modules, it is necessary to integrate 8 optical transmitters and 8 optical receivers in the package of QSFP-DD or OSFP, and achieving the required functions in such a small space is a great challenge in terms of high frequency performance, optical performance, heat dissipation characteristics, structural complexity, manufacturability, etc.

Disclosure of Invention

The embodiment of the disclosure provides an optical module, so as to realize the function of the optical module with high transmission rate in a narrow space by adopting special structural design and reasonable assembly flow.

The present disclosure provides an optical module, comprising:

a clamping seat is formed at one end of the lower shell;

the upper shell is covered on the lower shell, and a sealing cavity is formed by the upper shell and the lower shell;

the circuit board is positioned in the sealing cavity, and a mounting hole is formed in the circuit board;

a light emitting member embedded in the mounting hole, the light emitting member comprising:

the emission base is embedded in the mounting hole, and the top surface of the emission base is bonded with the back surface of the circuit board;

The light emitting assembly is arranged on the emitting base and is used for generating multiple paths of composite light signals; the emission cover plate is covered on the emission base and is bonded with the front surface of the circuit board;

a light receiving part mounted on a back surface of the circuit board, the light receiving part comprising:

the detector group is arranged on the back surface of the circuit board;

one end of the light collimator is connected with the internal optical fiber, and the light collimator is used for converting one path of received light transmitted by the internal optical fiber into one path of collimated light;

the optical demultiplexer is arranged on the back surface of the circuit board, the input end of the optical demultiplexer is connected with the optical collimator, the output end of the optical demultiplexer is an inclined reflecting surface, the reflecting surface is positioned above the detector group, the optical demultiplexer is used for demultiplexing one path of collimated light into multiple paths of light, and the multiple paths of light is reflected to the detector group through the reflecting surface;

the optical fiber adapter group is connected with the light emitting component through an internal optical fiber, the light collimator is connected with the optical fiber adapter group through the internal optical fiber, and one end of the optical fiber adapter group is inserted into the clamping seat;

The optical fiber fixing frame is arranged on the lower shell, one side of the optical fiber fixing frame is in contact connection with the clamping seat, and the other end of the optical fiber adapter group is inserted into the optical fiber fixing frame.

As can be seen from the above embodiments, the optical module provided in the embodiments of the present disclosure includes a lower housing, an upper housing, a circuit board, a light emitting component, a light receiving component, an optical fiber adapter group, and an optical fiber fixing frame, where the upper housing is covered on the lower housing, the upper housing and the lower housing form a sealed cavity, the circuit board is located in the sealed cavity, a mounting hole is formed on the circuit board, the light emitting component is embedded in the mounting hole, the light emitting component includes an emitting base, a light emitting assembly, and an emitting cover plate, the emitting base is embedded in the mounting hole, and a top surface of the emitting base is bonded to a back surface of the circuit board; the optical emission assembly is arranged on the emission base and is used for generating multiple paths of composite optical signals, and the multiple paths of composite optical signals are transmitted to the optical fiber adapter group through the internal optical fibers so as to realize the emission of light; the emission cover plate is covered on the emission base and is adhered to the front surface of the circuit board so as to protect the light emission component through the emission cover plate; the light receiving component is arranged on the back surface of the circuit board and comprises a light collimator and a light demultiplexer, one end of the light collimator is connected with the optical fiber adapter group through an internal optical fiber, and the light collimator is used for converting one path of received light transmitted by the internal optical fiber into one path of collimated light; the optical splitter is arranged on the back surface of the circuit board, the input end of the optical splitter is connected with the optical collimator, the output end of the optical splitter is an inclined reflecting surface, the reflecting surface is positioned above the detector group on the back surface of the circuit board, the optical splitter is used for demultiplexing one path of collimated light into multiple paths of light, and the multiple paths of light are reflected to the detector group through the reflecting surface so as to convert an optical signal into an electric signal through the detector, so that light receiving is realized; one end of the lower shell is provided with a clamping seat, the optical fiber fixing frame is arranged on the lower shell, one side of the optical fiber fixing frame is in contact connection with the clamping seat, one end of the optical fiber adapter is inserted into the clamping seat, and the other end of the optical fiber adapter is inserted into the optical fiber fixing frame, so that the optical fiber adapter group is connected with the lower shell through the optical fiber fixing frame.

According to the optical module, the light emitting component is embedded into the mounting hole on the circuit board, so that the size of the optical module in the up-down direction can be effectively reduced, and the miniaturization development of the optical module is facilitated; the light receiving part is arranged on the back surface of the circuit board so as to reasonably arrange the light emitting part and the light receiving part on the circuit board, and the layout space of the circuit board can be effectively utilized.

The high-frequency performance, the optical performance and the like of the high-transmission-rate optical module can be realized in a narrow space by adopting a special structural design and a reasonable assembly flow.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a partial block diagram of an optical communication system provided in accordance with some embodiments of the present disclosure;

Fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure;

FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments of the present disclosure;

fig. 5 is a first partial block diagram of an optical module according to some embodiments of the present disclosure;

fig. 6 is a second partial block diagram of an optical module according to some embodiments of the present disclosure;

fig. 7 is a first block diagram of a circuit board in an optical module according to some embodiments of the present disclosure;

fig. 8 is a second block diagram of a circuit board in an optical module according to some embodiments of the present disclosure;

fig. 9 is a partially exploded view of a light emitting component in an optical module provided in accordance with some embodiments of the present disclosure;

fig. 10 is a partial block diagram of a light emitting component in an optical module according to some embodiments of the present disclosure;

FIG. 11 is a block diagram of an emission housing in an optical module provided in accordance with some embodiments of the present disclosure;

fig. 12 is a partial assembly view of a circuit board and a light emitting component in an optical module according to some embodiments of the present disclosure;

fig. 13 is a partial view of an emission optical path of an optical module provided in accordance with some embodiments of the present disclosure;

Fig. 14 is a partial assembled cross-sectional view of a circuit board and a light emitting component in an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 15 is a block diagram of an emissive cover plate in an optical module provided in accordance with some embodiments of the present disclosure;

fig. 16 is a block diagram of a light emitting component in an optical module provided according to some embodiments of the present disclosure;

fig. 17 is a second partial assembly view of a circuit board and a light emitting component in an optical module according to some embodiments of the present disclosure;

fig. 18 is a partially exploded view of a first light receiving element in an optical module provided in accordance with some embodiments of the present disclosure;

fig. 19 is a partial block diagram of a first light receiving unit in an optical module according to some embodiments of the present disclosure;

fig. 20 is a block diagram of a first receiving housing in an optical module according to some embodiments of the present disclosure;

fig. 21 is an assembled cross-sectional view of a circuit board and a first light receiving element in an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 22 is a block diagram of a fiber holder in an optical module according to some embodiments of the present disclosure;

FIG. 23 is a second block diagram of an optical fiber holder in an optical module according to some embodiments of the present disclosure;

Fig. 24 is a partial block diagram of a lower housing in an optical module provided according to some embodiments of the present disclosure;

FIG. 25 is an assembly view of a lower housing, a fiber optic adapter, and a fiber optic mount in an optical module according to some embodiments of the present disclosure;

fig. 26 is a block diagram of a shielding plate in an optical module according to some embodiments of the present disclosure;

FIG. 27 is an assembly view of a fiber optic adapter, a fiber optic mount, and a shielding plate in an optical module according to some embodiments of the present disclosure;

FIG. 28 is a partially exploded view of a lower housing, fiber optic adapter, fiber optic mount and shield plate in an optical module provided in accordance with some embodiments of the present disclosure;

fig. 29 is a block diagram of an upper housing in an optical module provided in accordance with some embodiments of the present disclosure;

fig. 30 is a block diagram of a lower housing in an optical module provided according to some embodiments of the present disclosure;

fig. 31 is a partial cross-sectional view of an optical module provided in accordance with some embodiments of the present disclosure;

fig. 32 is a cross-sectional view of an optical module provided in accordance with some embodiments of the present disclosure.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and specifically described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In the optical communication technology, in order to establish information transfer between information processing apparatuses, it is necessary to load information onto light, and transfer of information is realized by propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so that high-speed, long-distance and low-cost information transmission can be realized. The signal that the information processing apparatus can recognize and process is an electrical signal. Information processing devices typically include optical network terminals (Optical Network Unit, ONUs), gateways, routers, switches, handsets, computers, servers, tablets, televisions, etc., and information transmission devices typically include optical fibers, optical waveguides, etc.

The optical module can realize the mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to an optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information transmission can be performed between the plurality of information processing apparatuses by an electric signal, it is necessary that at least one of the plurality of information processing apparatuses is directly connected to the optical module, and it is unnecessary that all of the information processing apparatuses are directly connected to the optical module. Here, the information processing apparatus directly connected to the optical module is referred to as an upper computer of the optical module. In addition, the optical signal input or the optical signal output of the optical module may be referred to as an optical port, and the electrical signal input or the electrical signal output of the optical module may be referred to as an electrical port.

Fig. 1 is a partial block diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an external optical fiber 101, and a network cable 103.

One end of the external optical fiber 101 extends in the direction of the remote information processing apparatus 1000, and the other end of the external optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. The optical signal may be totally reflected in the external optical fiber 101, and propagation of the optical signal in the direction of total reflection may almost maintain the original optical power, and the optical signal may be totally reflected in the external optical fiber 101 a plurality of times to transmit the optical signal from the remote information processing apparatus 1000 into the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing apparatus 1000, thereby realizing remote, low power loss information transfer.

The optical communication system may include one or more external optical fibers 101, and the external optical fibers 101 are detachably connected to the optical module 200, or fixedly connected. The upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the operating state of the optical module 200.

The host computer 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

The upper computer 100 further includes an external electrical interface, which may access an electrical signal network. For example, the pair of external electrical interfaces includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing apparatus 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing apparatus 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal sent by the local information processing apparatus 2000 is transmitted to the host computer 100 through the network cable 103, the host computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and the second optical signal is transmitted to the external optical fiber 101, and the second optical signal is transmitted to the remote information processing apparatus 1000 in the external optical fiber 101. For example, a first optical signal from the remote information processing apparatus 1000 propagates through the external optical fiber 101, the first optical signal from the external optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal from the first electrical signal, and the fourth electrical signal is transmitted to the local information processing apparatus 2000. The optical module is a tool for realizing the mutual conversion between the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the coding and decoding modes of the information can be changed.

The host computer 100 includes an optical line terminal (Optical Line Terminal, OLT), an optical network device (Optical Network Terminal, ONT), a data center server, or the like in addition to the optical network terminal.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex structure such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected by bi-directional electrical signals. In addition, the optical port of the optical module 200 is connected to the external optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the external optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, a light emitting part 400, and a light receiving part. The present disclosure is not limited thereto and in some embodiments, the optical module 200 includes one of a light emitting part 400 and a light receiving part.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper case 201 includes an upper cover 2011, and the upper cover 2011 is covered on two lower side plates 2022 of the lower case 202 to form the case.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes an upper cover 2011, and two upper side plates disposed on two sides of the upper cover 2011 and perpendicular to the upper cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger 301 of the circuit board 300 extends out of the electrical port and is inserted into the electrical connector of the upper computer 100; the opening 205 is an optical port configured to access the external optical fiber 101 so that the optical fiber 101 connects the light emitting part 400 and the light receiving part in the optical module 200.

The circuit board 300, the light emitting part 400, the light receiving part and the like are conveniently mounted in the upper and lower housings 201 and 202 in a combined assembly mode, and the upper and lower housings 201 and 202 can encapsulate and protect the devices. In addition, the above-described assembly manner of the upper case 201 and the lower case 202 in combination facilitates the deployment of the positioning member, the heat dissipation member, and the electromagnetic shielding member of these devices in assembling the circuit board 300, the light emitting member 400, the light receiving member, and the like, which is advantageous for the automated implementation of production.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the light module 200 further includes an unlocking member 600 located outside its housing. The unlocking part 600 is configured to achieve a fixed connection between the optical module 200 and the upper computer 100 or to release the fixed connection between the optical module 200 and the upper computer 100.

For example, the unlocking member 600 is located outside the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the fixation between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (limiting amplifier, LA), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip, a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the rigid circuit board may also be inserted into an electrical connector in the cage 106 of the host computer 100.

The circuit board 300 further includes a gold finger 301 formed on an end surface thereof, the gold finger 301 being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connector within the cage 106 by the gold finger 301. The golden finger 301 may be disposed on a surface of only one side of the circuit board 300 (for example, an upper surface shown in fig. 4), or may be disposed on surfaces of both sides of the circuit board 300, so as to provide a greater number of pins, thereby adapting to occasions with a large number of pins. The golden finger 301 is configured to establish electrical connection with an upper computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

At least one of the light emitting part 400 or the light receiving part is located at a side of the circuit board 300 remote from the gold finger 301.

In some embodiments, the light emitting and receiving components 400 and 300, respectively, are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 by corresponding flexible circuit boards or electrical connections, respectively.

In some embodiments, at least one of the light emitting component or the light receiving component may be disposed directly on the circuit board 300. For example, at least one of the light emitting part or the light receiving part may be provided on the surface of the circuit board 300 or the side of the circuit board 300.

Fig. 5 is a first partial structure diagram of an optical module according to some embodiments of the present disclosure, and fig. 6 is a second partial structure diagram of an optical module according to some embodiments of the present disclosure. As shown in fig. 5 and 6, the optical module provided by the embodiment of the present disclosure includes a light emitting part 400, a first light receiving part 510, a second light receiving part 520, a first optical fiber adapter group 700 and a second optical fiber adapter group 800, the light emitting part 400 is mounted on the front surface of the circuit board 300, and the housing of the light emitting part 400 is in contact with the upper housing 201, thereby greatly improving the heat dissipation characteristics of the light emitting part 400.

The light emitting part 400 receives the electrical signal transmitted from the circuit board 300, so that the light emitting part 400 generates an optical signal, and the optical signal is transmitted into the first optical fiber adapter group 700 through the internal optical fiber, so as to realize light emission.

The first light receiving part 510 and the second light receiving part 520 may be mounted on the rear surface of the circuit board 300, and the first light receiving part 510 and the second light receiving part 520 are located at both sides of the light emitting part 400. The first light receiving part 510 and the second light receiving part 520 are respectively connected through an internal optical fiber and the second optical fiber adapter set 800, external optical signals are respectively transmitted to the first light receiving part 510 and the second light receiving part 520 through the second optical fiber adapter set 800, the first light receiving part 510 and the second light receiving part 520 convert the optical signals into electric signals, the electric signals are transmitted to the golden finger 301 through the circuit board 300, and the golden finger 301 transmits the electric signals to the upper computer 100, so that light receiving is realized.

In some embodiments, the light emitting component 400 is mounted on the front surface of the circuit board 300, and the first light receiving component 510 and the second light receiving component 520 are mounted on the back surface of the circuit board 300, so that crosstalk between light emitting signals and light receiving signals can be avoided, and layout space between the front surface and the back surface of the circuit board 300 can be fully utilized.

In some embodiments, the light emitting part 400, the first light receiving part 510, and the second light receiving part 520 may be disposed on the front surface of the circuit board 300, and the first light receiving part 510 and the second light receiving part 520 may be mounted on both sides of the light emitting part 400.

Fig. 7 is a first structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure, and fig. 8 is a second structural diagram of a circuit board in an optical module according to some embodiments of the present disclosure. As shown in fig. 7 and 8, the circuit board 300 is formed with a mounting hole 302, and the light emitting part 400 is embedded in the mounting hole 302 to bring the laser assembly of the light emitting part 400 close to the front surface of the circuit board 300 so that the wire bonding surface height of the laser assembly is the same as the front surface of the circuit board 300 at the time of assembly, thereby minimizing the connection wire bonding of the front surface of the circuit board 300 and the laser assembly to ensure excellent high frequency transmission performance.

In some embodiments, since the first light receiving part 510 and the second light receiving part 520 are mounted on the rear surface of the circuit board 300, a plurality of positioning grooves are formed on the rear surface of the circuit board 300, and the housings of the first light receiving part 510 and the second light receiving part 520 are respectively inserted into the plurality of positioning grooves to achieve positioning connection of the first light receiving part 510, the second light receiving part 520 and the circuit board 300 through the positioning grooves.

Fig. 9 is a partially exploded view of a light emitting component in an optical module provided according to some embodiments of the present disclosure, and fig. 10 is a partially block diagram of a light emitting component in an optical module provided according to some embodiments of the present disclosure. As shown in fig. 9 and 10, the light emitting component 400 includes a light emitting assembly, a light emitting base 401 and a light emitting cover plate 402, the light emitting base 401 is embedded in the mounting hole 302, the bottom surface of the light emitting base 401 faces the lower housing 202, the light emitting assembly is mounted on the light emitting base 401, and the light emitting cover plate 402 covers the light emitting base 401, so that the light emitting assembly is placed in an emitting cavity formed by the light emitting base 401 and the light emitting cover plate 402.

The light emitting assembly comprises a laser set 403, a collimating lens set 404, a converging lens set 406 and an optical fiber coupler set 407, wherein the laser set 403 is arranged on the emitting base 401, the wire bonding surface of the laser set 403 is the same as the front surface of the circuit board 300, and the laser set 403 receives the electric signals transmitted by the circuit board 300 so that the laser set 403 generates multiple paths of signal light.

The collimating lens group 404 is mounted on the emission base 401, the collimating lens group 404 is located in the light emitting direction of the laser group 403, the collimating lens group 404 includes a plurality of collimating lenses, each of the collimating lenses is located in the light emitting direction of each of the lasers, and the collimating lenses convert signal light generated by the lasers into collimated light.

A converging lens group 406 is mounted on the emission base 401, and the converging lens group 406 includes a plurality of converging lenses, which convert the collimated light emitted from the collimating lenses into converging light.

The optical fiber coupler group 407 is mounted on the emission base 401, and the optical fiber coupler group 407 includes a plurality of optical fiber couplers, the optical fiber couplers are located in the light emitting direction of the converging lens, and the converging light emitted by the converging lens is coupled into the internal optical fiber through the optical fiber couplers.

The multiple paths of signal light generated by the laser set 403 are converted into multiple paths of collimated light by the collimating lens set 404, the multiple paths of collimated light are converted into multiple paths of converging light by the converging lens set 406, the multiple paths of converging light are converged into multiple internal optical fibers by the optical fiber coupler set 407, and the multiple paths of light are transmitted to the first optical fiber adapter set 700 by the multiple internal optical fibers so as to realize the emission of multiple paths of light.

In some embodiments, if a path of light is emitted through one optical fiber, so that the number of optical fibers in the optical module is greater, in order to reduce the number of optical fibers, the light emitting assembly further includes a combiner set 405, where the combiner set 405 is mounted on the emission base 401, the combiner set 405 is located between the collimating lens set 404 and the converging lens set 406, the combiner set 405 includes a plurality of combiners, and multiple paths of collimated light emitted by the collimating lenses enter one combiner, where the combiner combines multiple paths of collimated light into a path of composite light.

The right side of the combiner comprises four light inlets for inputting signal light with various wavelengths, and each light inlet is used for inputting signal light with one wavelength; the left side of the combiner comprises a light outlet for emitting light. Taking 4 wavelengths of incidence lambda 1, lambda 2, lambda 3 and lambda 4 of the combiner as an example, lambda 1 signal light enters the combiner through a first light inlet, and is reflected for six times by six different positions in the combiner to reach a light outlet; the lambda 2 signal light enters the combiner through the second light inlet, and reaches the light outlet after four different reflections at four different positions in the combiner; the lambda 3 signal light enters the combiner through the third light inlet, and reaches the light outlet after being reflected twice and differently at two different positions in the combiner; and 4, the signal light enters the combiner through the fourth light inlet and is directly transmitted to the light outlet. Thus, the signal light with different wavelengths is input through different light inlets and output through the same light outlet through the combiner, and the combination of the signal light with different wavelengths is further realized.

Each converging lens is located in the light emitting direction of each combiner, the converging lens converges the composite light emitted by the combiner into the optical fiber coupler, the composite light is coupled into one inner optical fiber through the optical fiber coupler, and the inner optical fiber transmits the composite light to the outer optical fiber through the first optical fiber adapter set 700, so that the number of the optical fibers is reduced.

In some embodiments, for an optical module with a high transmission rate, such as an 800G optical module, to achieve the transmission rate of the 800G optical module, the laser set 403 includes 8 lasers, the collimating lens set 404 includes 8 collimating lenses, the combiner set 405 includes 2 combiners, the converging lens set includes 2 converging lenses, the optical fiber coupler set 407 includes 2 optical fiber couplers, the 8 lasers generate 8 paths of signal light, the 8 paths of signal light are respectively converted into 8 paths of collimated light by the 8 collimating lenses, the 8 paths of collimated light are respectively synthesized into 2 paths of composite light by the 2 combiners, and the 2 paths of composite light are respectively converged into the 2 optical fiber couplers by the 2 converging lenses, so as to achieve that the 8 paths of emitted light are emitted by the 2 optical fibers.

Fig. 11 is a block diagram of a light emitting housing in an optical module according to some embodiments of the present disclosure, and fig. 12 is a partial assembly diagram of a circuit board and a light emitting component in an optical module according to some embodiments of the present disclosure. As shown in fig. 11 and 12, the emission base 401 includes a first mounting surface 4010, the first mounting surface 4010 extends from a left side surface to a right side surface of the emission base 401, when the emission base 401 is embedded in the mounting hole 302, the first mounting surface 4010 is bonded to a back surface of the circuit board 300, and a side surface of the emission base 401 can be bonded to the back surface of the circuit board 300 through a solid glue, so as to realize fixed connection between the emission base 401 and the circuit board 300.

One end of the first mounting surface 4010 is formed with a mounting groove 4011, the mounting surface in the mounting groove 4011 is recessed from the first mounting surface 4010, the laser group 403 is positioned in the mounting groove 4011, and the wiring height of the laser group 403 is made the same as the front surface of the circuit board 300 by the recessed mounting groove 4011.

Fig. 13 is a partial view of an emission optical path of an optical module provided according to some embodiments of the present disclosure, and fig. 14 is a partial assembly cross-sectional view of a circuit board and an optical emission part in an optical module provided according to some embodiments of the present disclosure. As shown in fig. 13 and 14, the laser group 403 includes a laser, a laser heat sink 409 and a substrate 410, the substrate 410 is located on the mounting surface in the mounting groove 4011, the laser heat sink 409 is located on the substrate 410, the laser is located on the laser heat sink 409, and the laser is raised by the mounting height of the laser heat sink 409 and the substrate 410, so that the wire bonding height of the laser is the same as the front surface of the circuit board 300.

The laser operation generates heat which is conducted to the emitter base 401 via the laser heat sink 409 and the substrate 410, and the heat is conducted to the lower housing 202 via the emitter base 401 to avoid temperature effects on the laser performance.

In some embodiments, the laser set 403 further includes a semiconductor refrigerator (Thermoelectric cooler, TEC) 411, the TEC411 is mounted on the mounting surface of the mounting slot 4011, the TEC411 is used for supporting and fixing the substrate 410, the substrate 410 is used for supporting and fixing the laser heat sink 409, and the laser heat sink 409 is used for supporting and fixing the laser, so that heat generated by the laser operation is sequentially conducted to the laser heat sink 409, the substrate 410 and the TEC411, and the TEC411 adjusts the temperature of the laser, so that heat dissipation of the laser is effectively achieved.

Heat generated by the operation of the TEC411 is conducted to the emission base 401, and the emission base 401 conducts the heat to the lower housing 202, so that heat dissipation of the TEC411 is achieved.

In some embodiments, in order to improve the heat dissipation efficiency, a heat conducting member 412 is disposed on the bottom surface (the side facing the lower housing 202) of the emission base 401, the emission base 401 is in contact with the lower housing 202 through the heat conducting member 412, the emission base 401 conducts heat to the heat conducting member 412, and the heat is conducted to the lower housing 202 through the heat conducting member 412, so that the heat dissipation efficiency of the emission base 401 is improved through the heat conducting member 412.

The TEC411 can adjust the temperature of the laser and raise the mounting height of the laser, so that the wire bonding height of the laser is the same as the front height of the circuit board 300, so as to shorten the wire bonding length of the laser and the circuit board 300.

A plurality of collimating lenses of the collimating lens group 404 are mounted on the substrate 410, so that the mounting height of the collimating lenses is raised by the TEC411 and the substrate 410, so that the optical axis of the collimating lenses coincides with the optical axis of the laser, and laser light generated by the laser is converted into collimated light by the collimating lenses.

Referring to fig. 11, a second mounting surface 4012 is provided on the first mounting surface 4010, the second mounting surface 4012 protrudes from the first mounting surface 4010, and the second mounting surface 4012 is located between the mounting groove 4011 and the left side surface of the emission base 401; two wave combiners of the wave combiners 405 are mounted on the second mounting surface 4012, and one wave combiners is disposed corresponding to the 4 collimating lenses, so that the 4 paths of collimated light emitted by the 4 collimating lenses respectively enter one wave combiners, and the wave combiners combine the 4 paths of collimated light into one path of composite light.

In some embodiments, a glue guiding groove 4013 is formed on the second mounting surface 4012, the glue guiding groove 4013 is recessed in the second mounting surface 4012, the combiner is placed on the second mounting surface 4012, and glue is injected into the glue guiding groove 4013, so that the adhesion and fixation of the combiner and the emission base 401 are realized through the glue.

In some embodiments, a first baffle 4014 and a second baffle 4015 are formed on a first mounting surface 4010 of the emission base 401, the first baffle 4014 and the second baffle 4015 respectively extend from the first mounting surface 4010 in a direction toward the upper housing 201, the first baffle 4014 and the second baffle 4015 respectively are parallel to two lower side plates 2022 of the lower housing 202, and the second mounting surface 4012 is located between the first baffle 4014 and the second baffle 4015.

In some embodiments, the distance between the first baffle 4014 and the second baffle 4015 in the width direction of the launch base 401 is less than the width dimension of the launch base 401, the first baffle 4014 has a distance from the side of the launch base 401 facing the lower side plate 2022, and the second baffle 4015 has a distance from the side of the launch base 401 facing the other lower side plate 2022 only i.

Referring to fig. 12, when the emission base 401 is fitted into the mounting hole 302, the first mounting surface 4010 abuts against the back surface of the circuit board 300, the first damper 4014 and the second damper 4015 are positioned in the mounting hole 302, the first damper 4014 abuts against the front side surface of the mounting hole 302, and the second damper 4015 abuts against the rear side surface of the mounting hole 302, so that the emission base 401 is limited by the first damper 4014 and the second damper 4015.

Since the combiner set 405 includes two combiners, two glue guide grooves 4013 are formed on the second mounting surface 4012, an opening is formed on one side (front side) of one glue guide groove 4013 facing the first baffle 4014, a gap exists between the glue guide groove 4013 and the first baffle 4014, and glue can be injected into the glue guide groove 4013 through the gap.

The other glue guide groove 4013 is formed with an opening toward one side (rear side) of the second baffle 4015, and a gap exists between the glue guide groove 4013 and the second baffle 4015, through which glue can be injected into the glue guide groove 4013.

When the two wave combiners are mounted on the second mounting surface 4012, the front side surface of one wave combiners is abutted against the first baffle 4014 so as to limit the wave combiners through the first baffle 4014; the rear side of the other combiner is abutted against the second baffle 4015 so as to limit the combiner through the second baffle 4015.

Referring to fig. 11, the other end (left end) of the first mounting surface 4010 is formed with a mounting table 4016, the mounting table 4016 extends from the first mounting surface 4010 in the direction of the upper case 201, a width dimension of the mounting table 4016 is smaller than a width dimension of the emission base 401 in a width direction of the emission base 401, and the width dimension of the mounting table 4016 is smaller than a distance between the first baffle 4014 and the second baffle 4015, a distance between a front side surface of the mounting table 4016 and a front side surface of the mounting hole 302 is a first width, a distance between a rear side surface of the mounting table 4016 and a rear side surface of the mounting hole 302 is a second width, and the first width and the second width may be the same.

In some embodiments, the first width and the second width may also be different due to the coupling connection between the optical combiner and the optical fiber coupler, e.g., the first width is smaller than the second width when the light outlet of the optical combiner is near the first baffle 4014.

Two through holes 4017 are formed in the mounting table 4016, the through holes 4017 are arranged in the left-right direction, each through hole 4017 is arranged corresponding to the light outlet of each combiner, and the two optical fiber couplers of the optical fiber coupler group 407 are respectively inserted into the two through holes 4017, so that the optical fiber couplers are arranged corresponding to the combiners, and the composite light emitted by the combiners is injected into the optical fiber couplers.

In some embodiments, a converging lens group 406 is mounted on the second mounting surface 4012, the converging lens group 406 is located between the combiner group 405 and the mounting table 4016, the converging lens corresponds to a light outlet of the combiner, and the composite light output by the combiner is converged into the fiber coupler through the converging lens.

Because of different transmission media, the composite light is easy to reflect at the optical fiber end face in the optical fiber coupler, most of the composite light is injected into the optical fiber, and a small part of the composite light is reflected at the optical fiber end face, and the reflected composite light can return to the laser along the original path, so that the luminous performance of the laser is affected.

Referring to fig. 14, in order to avoid the reflected light from returning to the laser, an optical fiber plug and an isolator 408 are disposed in the optical fiber coupler, an internal optical fiber is inserted into the optical fiber coupler through the optical fiber plug, the isolator 408 is located at one end of the optical fiber coupler facing the converging lens, the composite light emitted from the combiner is converged into the optical fiber coupler through the converging lens, and the converged light is directly coupled into the internal optical fiber through the isolator 408, so as to realize the transmission of the composite light.

When the composite light is reflected at the end face of the optical fiber, the reflected light is isolated by the isolator 408 and cannot penetrate through the isolator 408, so that the reflected light cannot return to the laser, and the light emitting performance of the laser is ensured.

The TEC411 is installed in the installation groove 4011 of the emission base 401, the laser is installed on the TEC411 through the laser heat sink 409 and the substrate 410, the collimating lens is installed on the TEC411 through the substrate 410, the two wave combiners are installed on the second installation surface 4012 of the emission base 401 along the front-back direction, four light inlets of one wave combiners are arranged corresponding to the 4 collimating lenses, 4 paths of collimating light emitted by the 4 collimating lenses are injected into the wave combiners, and the wave combiners combine the 4 paths of collimating light into one path of composite light through multiple reflection, so that 8 paths of emitting light emitted by the 8 lasers are combined into two paths of composite light.

The two converging lenses are mounted on the second mounting surface 4012 along the front-rear direction, the two optical fiber couplers are respectively inserted into the two through holes 4017 of the mounting table 4016, so that the light-emitting optical axis of the combiner, the optical axis of the converging lenses and the optical axis of the optical fiber couplers coincide, the composite light emitted by the combiner is coupled to the optical fiber couplers through the converging lenses, the optical fiber couplers couple the composite light into the internal optical fibers, the internal optical fibers transmit the composite light to the first optical fiber adapter group 700, and the two paths of composite light are respectively transmitted into the two external optical fibers through the first optical fiber adapter group 700, thereby realizing single-fiber transmission of multipath light.

After the laser set 403, the collimating lens set 404, the combiner set 405, the converging lens set 406 and the optical fiber coupler set 407 are mounted on the emission base 401 along the light emission direction, the assembled emission base 401 is embedded into the mounting hole 302, so that the first mounting surface 4010 of the emission base 401 is adhered to the back surface of the circuit board 300, and the wire bonding height of the laser set 403 is the same as the front surface height of the circuit board 300, thereby realizing the fixed connection of the light emission component 400 and the circuit board 300.

Fig. 15 is a block diagram of a transmitting cover plate in an optical module according to some embodiments of the present disclosure, and fig. 16 is a block diagram of a light transmitting part in an optical module according to some embodiments of the present disclosure. As shown in fig. 15 and 16, the emission cover 402 includes a top plate 4020, a first side plate 4021, a second side plate 4022, a third side plate 4023, a fourth side plate 4024, a fifth side plate 4025, a sixth side plate 4027, and a seventh side plate 4028, wherein an outer side surface of the top plate 4020 contacts the upper case 201, and the first side plate 4021, the second side plate 4022, the third side plate 4023, the fourth side plate 4024, the fifth side plate 4025, the sixth side plate 4027, and the seventh side plate 4028 are fixedly connected to an inner side surface of the top plate 4020.

The second side plate 4022 is located on the right side of the transmitting cover plate 402, an opening is formed in the left side of the transmitting cover plate 402, the first side plate 4021 and the third side plate 4023 are oppositely arranged, the fifth side plate 4025 and the sixth side plate 4027 are oppositely arranged, the first side plate 4021 and the sixth side plate 4027 are located on the same side, the third side plate 4023 and the fifth side plate 4025 are located on the same side, the fifth side plate 4025 and the sixth side plate 4027 are located on the left side of the transmitting cover plate 402, two ends of the second side plate 4022 are connected with the first side plate 4021 and the third side plate 4023 respectively, and the distance between the first side plate 4021 and the third side plate 4023 is larger than the distance between the fifth side plate 4025 and the sixth side plate 4027.

In some embodiments, when the first width between mounting table 4016 and mounting hole 302 is less than the second width, first side plate 4021 is connected to sixth side plate 4027 by a seventh side plate 4028, seventh side plate 4028 being parallel to second side plate 4022 such that first side plate 4021 protrudes from sixth side plate 4027; the third side plate 4023 is connected to the fifth side plate 4025 through a fourth side plate 4024, and the fourth side plate 4024 is disposed obliquely such that the third side plate 4023 protrudes from the fifth side plate 4025.

When the emission cover plate 402 is covered on the emission base 401, the inner side surface of the top plate 4020 contacts with the top surface of the mounting table 4016, and the first side plate 4021, the second side plate 4022, the third side plate 4023, the fourth side plate 4024, the fifth side plate 4025, and the sixth side plate 4027 are connected to the seventh side plate 4028 and the front support of the circuit board 300 so as to support the emission cover plate 402 through the circuit board 300.

The fifth side plate 4025 and the sixth side plate 4027 are respectively connected to the front and rear sides of the mounting table 4016 in a contact manner, so that the front and rear direction limitation of the emission cover 402 is performed by the fifth side plate 4025 and the sixth side plate 4027.

In some embodiments, a buckle 4026 is formed on the left side of the top plate 4020, the buckle 4026 extends from the top plate 4020 to the direction of the circuit board 300, the buckle 4026 is located between the fifth side plate 4025 and the sixth side plate 4027, and when the transmitting cover plate 402 is covered on the transmitting base 401, the buckle 4026 is clamped with the left side surface of the mounting table 4016, so that the transmitting cover plate 402 is limited in the left-right direction through the buckle 4026.

Fig. 17 is a second partial assembly view of a circuit board and a light emitting component in an optical module according to some embodiments of the present disclosure. As shown in fig. 17, a laser set 403, a collimating lens set 404, a combiner set 405 and a converging lens set 406 are mounted on a transmitting base 401, then the transmitting base 401 is embedded into a mounting hole 302, and the side surface of the transmitting base 401 is bonded with the back surface of a circuit board 300 through solid glue, so as to realize the fixed connection between the transmitting base 401 and the circuit board 300; the fiber coupler is then inserted into the through-hole 4017 of the mounting table 4016 to effect a coupling connection of the light emitting assembly to the internal optical fiber through the fiber coupler.

Then, the emission cover plate 402 is covered on the emission base 401, and the first side plate 4021, the second side plate 4022 and the third side plate 4023 are respectively bonded with the front surface of the circuit board 300 through solid glue, so that the emission cover plate 402 is fixedly connected with the circuit board 300, and therefore the assembly of the light emitting component 400 and the circuit board 300 is realized.

In some embodiments, the structures of the emission base 401 and the emission cover 402 in the light emitting component 400 are not limited to the above structures, and it is within the scope of the embodiments of the disclosure that the emission base 401 is fixedly connected to the emission cover 402 and the circuit board 300, and the laser set 403 is wire-bonded to the circuit board 300, as long as the light emitting component 400 is embedded in the mounting hole 302.

Referring to fig. 6, for an 800G optical module, the optical module provided in this embodiment of the disclosure includes a first optical receiving component 510 and a second optical receiving component 520, where the first optical receiving component 510 and the second optical receiving component 520 are mounted on the back surface of the circuit board 300, the first optical receiving component 510 and the second optical receiving component 520 may be symmetrically disposed on two sides of the mounting hole 302, and the first optical receiving component 510 is connected with an optical fiber adapter of the second optical fiber adapter group 800 through an internal optical fiber, so that one external light beam received by the optical fiber adapter is transmitted to the first optical receiving component 510 through the internal optical fiber, so as to implement receiving one composite light beam.

The second light receiving part 520 is connected with another optical fiber adapter of the second optical fiber adapter group 800 through an internal optical fiber, so that another external light beam received by the optical fiber adapter is transmitted to the second light receiving part 520 through the internal optical fiber, so as to realize the receiving of another composite light beam.

Fig. 18 is a partially exploded view of a first light receiving element in an optical module according to some embodiments of the present disclosure, and fig. 19 is a partially block diagram of the first light receiving element in an optical module according to some embodiments of the present disclosure. As shown in fig. 18 and 19, the first light receiving element 510 and the second light receiving element 520 may have the same structure, where the first light receiving element 510 includes a light collimator 511, a light splitter 512, a detector group 309 and a transimpedance amplifier group 310, the detector group 309 and the transimpedance amplifier group 310 are mounted on the back surface of the circuit board 300, the light emitting end of the light collimator 511 is connected to the light incident end of the light splitter 512, the output end of the light splitter 512 is a reflecting surface, the reflecting surface is obliquely arranged, and the reflecting surface of the light splitter 512 is located right above the detector group 309.

In some embodiments, the light collimator 511 includes a single-mode fiber flange and a collimator, where the inner fiber is inserted into the light collimator 511 through the single-mode fiber flange, the collimator is disposed on the light exit surface of the inner fiber, and the collimator is used to convert the external light transmitted by the inner fiber into collimated light.

An internal optical fiber connected to an optical fiber adapter of the second optical fiber adapter group 800 is inserted into the optical collimator 511, external composite light transmitted by the internal optical fiber is transmitted to the optical splitter 512 through the optical collimator 511, one path of composite light is demultiplexed into multiple paths of demultiplexed light by the optical splitter 512, the multiple paths of demultiplexed light are reflected at the reflecting surface of the optical splitter 512, and a light beam parallel to the back surface of the circuit board 300 is reflected to a light beam perpendicular to the back surface of the circuit board 300, so that the reflected light beam is emitted into the detector group 309, so as to realize light reception.

In some embodiments, the first light receiving part 510 further includes a converging lens 515, and the light reflected at the reflecting surface of the optical demultiplexer 512 is converged to the detector by the converging lens 515 to ensure the receiving performance of the detector by the converging lens 515.

After the detector receives the reflected light beam, the detector converts the optical signal into an electric signal, the electric signal is transmitted to the transimpedance amplifier group 310 through the wire bonding, the electric signal is amplified by the transimpedance amplifier and then transmitted to the golden finger 301 through the signal wire, and the amplified electric signal is transmitted to the upper computer through the golden finger 301, so that the receiving of multipath light is realized.

In some embodiments, when the light reflected via the output end of the optical demultiplexer 512 enters the detector, the light may be reflected at the photosensitive surface of the detector due to the difference of the transmission medium, the reflected light may return to the optical demultiplexer 512 along the original path, and the reflected light returns to the optical collimator 511 via the optical demultiplexer 512, so that the crosstalk occurs between the reflected light and the composite light transmitted by the internal optical fiber in the optical collimator 511.

In order to avoid optical signal crosstalk, the first light receiving part 510 further includes a support plate 513, a bottom surface of the support plate 513 is mounted on a rear surface of the circuit board 300, a top surface of the support plate 513 is obliquely disposed, and the optical splitter 512 is mounted on the top surface of the support plate 513 such that the optical splitter 512 is obliquely disposed, i.e., a distance between the optical splitter 512 and the rear surface of the circuit board 300 is gradually reduced in a left-right direction (light receiving direction). Thus, the light reflected at the photosensitive surface of the detector returns to the reflecting surface of the optical demultiplexer 512, and the reflected light is reflected again at the reflecting surface, and since the optical demultiplexer 512 is obliquely disposed, the light reflected at the reflecting surface and the received light transmitted by the optical demultiplexer 512 are disposed at a certain angle, so that crosstalk between the reflected light and the received light is avoided.

In some embodiments, the optical demultiplexer 512 may employ an optical demultiplexer device based on arrayed waveguide grating (Arrayed Waveguide Grating, AWG) technology to achieve optical demultiplexing and coupling effects, with an inclination angle between the optical demultiplexer 512 and the circuit board 300 of 2 degrees.

Fig. 20 is a block diagram of a first receiving housing in an optical module according to some embodiments of the present disclosure. As shown in fig. 20, the first light receiving component 510 further includes a receiving housing 514, where the receiving housing 514 is covered on the back surface of the circuit board 300, and a cavity is formed between the receiving housing 514 and the back surface of the circuit board 300, and a part of the optical splitter 512, the detector group 309 and the transimpedance amplifier group 310 are located in the cavity, so as to protect the detector group 309 and the transimpedance amplifier group 310 by the receiving housing 514.

The receiving housing 514 includes a cover plate 5140, a first side 5141, a second side 5142 and a third side 5143, the outer side of the cover plate 5140 faces the downward housing 202, the first side 5141, the second side 5142 and the third side 5143 are respectively and fixedly connected with the cover plate 5140, the second side 5142 is a right side of the receiving housing 514, two ends of the second side 5142 are respectively and fixedly connected with the first side 5141 and the third side 5143, and the first side 5141 and the third side 5143 are opposite to each other, so that the cover plate 5140, the first side 5141, the second side 5142 and the third side 5143 form a housing with an upper side and a left side.

When the receiving housing 514 is covered on the back surface of the circuit board 300, the first side 5141, the second side 5142 and the third side 5143 are in supporting connection with the back surface of the circuit board 300, and the first side 5141, the second side 5142 and the third side 5143 are respectively bonded with the back surface of the circuit board 300 through solid glue so as to realize the fixed connection of the receiving housing 514 and the circuit board 300.

Referring to fig. 8, a first positioning groove 305 and a second positioning groove 306 are formed on the back surface of the circuit board 300, the first positioning groove 305 is close to the side surface of the circuit board 300, and an opening is formed on the side of the first positioning groove 305 facing the side surface of the circuit board 300.

The first side 5141 is formed with a first positioning claw 5144, the first positioning claw 5144 extends from the inner side surface of the first side 5141 to the direction of the third side 5143, and the left side surface of the first positioning claw 5144 is flush with the left side surface of the first side 5141.

The third side 5143 is formed with a second positioning pawl 5145, the second positioning pawl 5145 extends from the inner side of the third side 5143 toward the first side 5141, and the left side of the second positioning pawl 5145 is flush with the left side of the third side 5143.

When the receiving housing 514 is covered on the back surface of the circuit board 300, the first positioning claw 5144 is inserted into the first positioning groove 305, and the second positioning claw 5145 is inserted into the second positioning groove 306, so that the positioning connection of the transmitting housing 514 and the circuit board 300 is realized through the positioning claw and the positioning groove.

In some embodiments, a third positioning groove 307 and a fourth positioning groove 308 are further formed on the back surface of the circuit board 300, the third positioning groove 307 is disposed corresponding to the fourth positioning groove 308 and the receiving housing of the second light receiving component 520, and when the receiving housing of the second light receiving component 520 is covered on the back surface of the circuit board 300, the positioning claws on the receiving housing are respectively inserted into the third positioning groove 307 and the fourth positioning groove 308, so as to realize positioning connection of the second light receiving component 520 and the circuit board 300 through the positioning claws and the positioning grooves.

Fig. 21 is an assembled cross-sectional view of a circuit board and a first light receiving part in an optical module provided according to some embodiments of the present disclosure. As shown in fig. 21, the detector group 309 and the transimpedance amplifier group 310 are mounted on the back surface of the circuit board 300, and then the support plate 513 is mounted on the back surface of the circuit board 300, the support plate 513 being located on the left side of the detector group 309; then, the optical demultiplexer 512 is mounted on the support plate 513, and the optical demultiplexer 512 is disposed obliquely; then, the light emitting end of the optical collimator 511 is fixedly connected with the light entering end of the optical demultiplexer 512, so that the optical collimator 511 is fixed by the optical demultiplexer 512, one path of composite light emitted by the optical collimator 511 is transmitted to the optical demultiplexer 512, the optical demultiplexer 512 demultiplexes the one path of composite light into 4 paths of light, the 4 paths of light are reflected by the reflecting surface of the optical demultiplexer 512, the reflected light is converged to the detector by the converging lens 515, the detector converts a received optical signal into an electrical signal, the electrical signal is amplified by the transimpedance amplifier and then transmitted to the golden finger 301, and the amplified electrical signal is transmitted to the upper computer by the golden finger 301, so that light receiving is realized.

Finally, the receiving housing 514 is covered on the back surface of the circuit board 300, the reflecting surface of the optical demultiplexer 512, the converging lens 515, the detector group 309 and the transimpedance amplifier group 310 are located in a cavity formed by the receiving housing 514 and the circuit board 300, and the detector group 309 and the transimpedance amplifier group 310 are protected by the cavity.

In some embodiments, the light emitting component 400 is connected to the first fiber optic adapter set 700 by internal optical fibers such that 8 paths of emitted light are emitted through 2 optical fibers; the first light receiving part 510 and the second light receiving part 520 are connected to the second optical fiber adapter group 800 through internal optical fibers, respectively, so that 2 optical fibers transmit 8 paths of received light, thereby realizing the transmission and reception of the 800G optical module.

Fig. 22 is a first structural diagram of an optical fiber holder in an optical module according to some embodiments of the present disclosure, and fig. 23 is a second structural diagram of an optical fiber holder in an optical module according to some embodiments of the present disclosure. As shown in fig. 22 and 23, the optical module provided in the embodiment of the disclosure further includes an optical fiber fixing frame 900, where the optical fiber fixing frame 900 is installed in the lower housing 202, and the first optical fiber adapter set 700 and the second optical fiber adapter set 800 are fixedly installed on the optical fiber fixing frame 900, so that the first optical fiber adapter set 700 and the second optical fiber adapter set 800 are installed in the lower housing 202 through the optical fiber fixing frame 900.

The optical fiber fixing frame 900 comprises a connecting plate 901 and a fixing plate 902, wherein the connecting plate 901 is parallel to a bottom plate 2021 of the lower shell 202, the connecting plate 901 is arranged in the lower shell 202, the fixing plate 902 is fixedly connected with the connecting plate 901, and the fixing plate 902 is vertical to the connecting plate 901; the fixing plate 902 is formed with a plurality of first assembly holes 9020, and the optical fiber adapters of the first optical fiber adapter group 700 and the second optical fiber adapter group 800 are respectively inserted into the first assembly holes 9020, so as to realize supporting connection between the optical fiber fixing frame 900 and the optical fiber adapters.

In assembling the first fiber optic adapter group 700 and the second fiber optic adapter group 800, one ends of the first fiber optic adapter group 700 and the second fiber optic adapter group 800 are first inserted into the first assembly holes 9020 of the fiber optic holder 900, respectively, and then the fiber optic holder 900 is mounted in the lower housing 202, so that the fiber optic adapters are fixed in the lower housing 202 by the fiber optic holder 900.

In some embodiments, the first mounting holes 9020 on the mounting plate 902 include a first row of mounting holes and a second row of mounting holes, the first row of mounting holes and the second row of mounting holes being disposed one above the other, e.g., the first row of mounting holes being located in an upper portion of the mounting plate 902, the second row of mounting holes being located in a lower portion of the mounting plate 902, one end of the first fiber optic adapter group 700 being inserted into the first row of mounting holes, and one end of the second fiber optic adapter group 800 being inserted into the second row of mounting holes.

Referring to fig. 23, the first row of assembly holes includes two assembly holes disposed along a width direction of the fixing plate 902, a first gap 9023 is formed in each of the two assembly holes, the first fiber optic adapter group 700 is located at a left side of the fixing plate 902, an internal optical fiber connected to the first fiber optic adapter group 700 is placed in the first row of assembly holes through the first gap 9023, and then the first fiber optic adapter group 700 is moved rightward, and two optical fiber adapters of the first fiber optic adapter group 700 are respectively inserted into the first row of assembly holes to achieve connection of the first fiber optic adapter group 700 with the optical fiber fixing frame 900.

The second row of assembly holes comprises two assembly holes, the two assembly holes are arranged along the width direction of the fixing plate 902, a second gap 9024 is formed in each assembly hole, the second optical fiber adapter group 800 is located on the left side of the fixing plate 902, internal optical fibers connected with the second optical fiber adapter group 800 penetrate through the second gap 9024 to be placed in the second row of assembly holes, then the second optical fiber adapter group 800 is moved rightwards, and two optical fiber adapters of the second optical fiber adapter group 800 are respectively inserted into the second row of assembly holes, so that connection between the second optical fiber adapter group 800 and the optical fiber fixing frame 900 is achieved.

In some embodiments, the optical fiber fixing frame 900 further includes a first fixing arm 903 and a second fixing arm 904, where the first fixing arm 903 and the second fixing arm 904 are fixedly connected to the fixing plate 902, respectively, the first fixing arm 903 and the second fixing arm 904 extend from the right side surface of the fixing plate 902 toward the direction of the circuit board 300, the first fixing arm 903 and the second fixing arm 904 are opposite to each other, and when the optical fiber fixing frame 900 is mounted on the lower housing 202, the first fixing arm 903 and the second fixing arm 904 are abutted to the two lower side plates 2022, respectively, so as to limit the optical fiber fixing frame 900 by the first fixing arm 903 and the second fixing arm 904.

In some embodiments, a first gap 9023 is located between the top surface of the fixation plate 902 and the top surface of the first fixation arm 903, the first gap 9023 is located between the top surface of the fixation plate 902 and the top surface of the second fixation arm 904 such that the first row of assembly holes communicates with the exterior through the first gap 9023 to facilitate insertion of the fiber optic adapter into the first assembly holes 9020.

The second gap 9024 is located between the bottom surface of the first fixing arm 903 and the top surface of the connection plate 901, and the second gap 9024 is located between the bottom surface of the second fixing arm 904 and the top surface of the connection plate 901, so that the second row of fitting holes communicate with the outside through the second gap 9024 to facilitate insertion of the optical fiber adapters into the first fitting holes 9020.

Referring to fig. 22, in some embodiments, a first limit protrusion 9031 is formed on the first fixing arm 903, the first limit protrusion 9031 protrudes from a top surface of the first fixing arm 903, and the first limit protrusion 9031 is away from the fixing plate 902 to avoid interfering with the first gap 9023; the second fixing arm 904 is formed with a second limiting protrusion 9041, the second limiting protrusion 9041 protrudes from the top surface of the second fixing arm 904, and the second limiting protrusion 9041 is far away from the fixing plate 902, so as to avoid interfering with the first gap 9023.

After the first optical fiber adapter set 700 and the second optical fiber adapter set 800 are mounted on the optical fiber fixing frame 900, the internal optical fibers connecting the first optical fiber adapter set 700 and the second optical fiber adapter set 800 are located between the first fixing arm 903 and the second fixing arm 904 and between the first limiting protrusion 9031 and the second limiting protrusion 9041, so that the internal optical fibers are prevented from being located outside the optical fiber fixing frame 900, and the internal optical fibers are protected.

In some embodiments, the first fixing arm 903 is formed with a first positioning protrusion, the first positioning protrusion extends from an outer side of the first fixing arm 903 toward the lower side plate 2022, and the first fixing arm 903 is in positioning connection with the lower housing 202 through the first positioning protrusion; the second fixing arm 904 is formed with a second positioning protrusion 9040, the second positioning protrusion 9040 extends from below the outer side surface of the second fixing arm 904 against the direction of the other lower side plate 2022, and the second fixing arm 904 is positionally connected with the lower case 202 through the second positioning protrusion 9040.

In some embodiments, the first positioning protrusion is identical in structure to the second positioning protrusion 9040, the second positioning protrusion 9040 is a triangular protrusion, and the width dimension of the left side of the second positioning protrusion 9040 is smaller than the width dimension of the right side thereof.

Fig. 24 is a partial block diagram of a lower housing in an optical module according to some embodiments of the present disclosure, and fig. 25 is an assembly diagram of the lower housing in the optical module, an optical fiber adapter, and an optical fiber fixing frame according to some embodiments of the present disclosure. As shown in fig. 24 and 25, a socket 2024 is formed at the left end of the lower housing 202, the socket 2024 extends from the left side surface of the lower housing 202 to the right, a through hole is formed in the socket 2024, and the optical fiber adapters of the first optical fiber adapter group 700 and the second optical fiber adapter group 800 are respectively inserted into the through holes, so as to realize coupling connection between the optical fiber adapters and external optical fibers through the through holes.

The two lower side plates 2022 of the lower housing 202 are respectively formed with positioning grooves 2023, the positioning grooves 2023 are obliquely arranged, when the optical fiber fixing frame 900 is mounted on the lower housing 202, the left side surface of the fixing plate 902 is abutted against the right side surface of the clamping seat 2024, and the first positioning protrusion and the second positioning protrusion 9040 are respectively inserted into the positioning grooves 2023 on the two lower side plates 2022, so that positioning connection between the optical fiber fixing frame 900 and the lower housing 202 is realized through the positioning protrusions and the positioning grooves.

When the optical fiber adapter is fixed on the lower shell 202 through the optical fiber fixing frame 900, the optical fiber adapter is inserted into the first assembly hole 9020 on the fixing plate 902, so that the optical fiber adapter is inserted into the clamping seat 2024 through the fixing plate 902; then, the connection plate 901 of the optical fiber fixing frame 900 is adhered to the lower bottom plate 2021 of the lower housing 202, and the positioning protrusions on the first fixing arm 903 and the second fixing arm 904 are inserted into the positioning grooves on the lower side plate 2022, so that the left side surface of the fixing plate 902 abuts against the right side surface of the clamping seat 2024, and the optical fiber adapter is fixed in the lower housing 202 through the optical fiber fixing frame 900.

In some embodiments, various electromagnetic wave radiation problems may occur during operation of the electro-optical device on the circuit board 300, the optical device of the light emitting part 400, the electrical device of the light receiving part, and the like, which may easily cause electromagnetic interference (Electro Magnetic Interference, EMI) of the optical module to exceed standards.

In order to avoid EMI overscaling of the optical module, the optical module provided in the embodiments of the present disclosure further includes a shielding plate 1100, where the shielding plate 1100 is located between the optical fiber fixing frame 900 and the card socket 2024, so as to implement electromagnetic compatibility (Electromagnetic Compatibility, EMC) shielding of the optical module through the shielding plate 1100.

Fig. 26 is a block diagram of a shielding plate in an optical module according to some embodiments of the present disclosure, fig. 27 is an assembly diagram of an optical fiber adapter, an optical fiber fixing frame and a shielding plate in an optical module according to some embodiments of the present disclosure, and fig. 28 is a partially exploded view of a lower housing, an optical fiber adapter, an optical fiber fixing frame and a shielding plate in an optical module according to some embodiments of the present disclosure. As shown in fig. 26, 27 and 28, a plurality of second fitting holes 1101 are formed in the shielding plate 1100, the second fitting holes 1101 are disposed opposite to the first fitting holes 9020 in the fixing plate 902, and a left side surface of the shielding plate 1100 is adhered and fixed to a right side surface of the card holder 2024, and a right side surface of the shielding plate 1100 is adhered and fixed to a left side surface of the fixing plate 902, so that the shielding plate 1100 is fixed between the card holder 2024 and the optical fiber fixing frame 900.

In some embodiments, when the shielding plate 1100 is fixed between the card holder 2024 and the optical fiber fixing frame 900, the bottom surface of the shielding plate 1100 is in contact with the bottom plate 2021 of the lower housing 202, so as to achieve a sealed connection between the shielding plate 1100 and the lower housing 202.

In some embodiments, to connect the optical fiber fixing frame 900 with the shielding plate 1100, a protrusion may be formed on the fixing plate 902, where the protrusion is located on a side of the fixing plate 902 facing the card socket 2024, a card slot is formed on the shielding plate 1100, and the protrusion on the fixing plate 902 is inserted into the card slot on the shielding plate 1100, so as to implement a limit connection between the fixing plate 902 and the shielding plate 1100, thereby ensuring an EMI shielding effect at an optical port of the optical module.

The clamping grooves on the shielding plate 1100 can comprise a first clamping groove 1102 and a second clamping groove 1103, the first clamping groove 1102 and the second clamping groove 1103 penetrate through the shielding plate 1100, the first clamping groove 1102 is positioned on the upper side of the shielding plate 1100, and an opening is formed on the top side of the first clamping groove 1102; the second card slot 1103 is located at the lower side of the shielding plate 1100, and an opening is formed at the bottom side of the second card slot 1103.

Referring to fig. 23, the boss on the left side of the fixing plate 902 may include a first boss 9021 and a second boss 9022, the first boss 9021 and the second boss 9022 extend from the left side of the fixing plate 902 toward the direction of the card socket 2024, the first boss 2021 is located on the upper side of the fixing plate 902, and the top surface of the first boss 2021 is flush with the top surface of the fixing plate 902; the second boss 9022 is located at the lower side of the fixing plate 902, and the bottom surface of the second boss 9022 is flush with the bottom surface of the fixing plate 902.

In some embodiments, the first boss 9021 is located between two first fitting holes 9020 on the upper side of the fixing plate 902, and the second boss 9022 is located between two first fitting holes 9020 on the lower side of the fixing plate 902.

Referring to fig. 27, when the shielding plate 1100 is connected to the optical fiber fixing frame 900, the first boss 9021 is inserted into the first clamping groove 1102, and the second boss 9022 is inserted into the second clamping groove 1102, so that the positioning connection between the shielding plate 1100 and the optical fiber fixing frame 900 is realized by the clamping connection between the boss and the clamping groove.

In some embodiments, the shielding plate 1100 may be a square plate, and the shielding plate 1100 may be a shaped plate, for example, a clamping plate may be formed on a side of the shielding plate 1100 facing the fixing plate 902, a top surface of the clamping plate is flush with a top surface of the shielding plate 1100, a right side surface of the clamping plate protrudes from a right side surface of the shielding plate 1100, and a clamping groove is formed on the clamping plate.

When the shielding plate 1100 is connected with the optical fiber fixing frame 900, the left side surface of the fixing plate 902 is contacted with the right side surface of the shielding plate 1100, and the clamping plate abuts against the top surface of the fixing plate 902 so as to limit the limit of the optical fiber fixing plate 900 in the up-down direction; the protrusions on the fixing plate 902 are inserted into the clamping grooves on the clamping plate to limit the limit of the optical fiber fixing plate 900 in the front-rear direction.

After the optical fiber fixing frame 900 and the shielding plate 1100 are fixedly mounted on the lower housing 202, the optical fiber adapters sequentially pass through the first assembly holes 9020 on the fixing plate 902 and the second assembly holes 1101 on the shielding plate 1100, so as to insert the optical fiber adapters into the card holder 2024.

Referring to fig. 28, the optical fiber adapter includes a connection part 701, a limiting plate 702, and an insertion part, the connection part 701 faces the circuit board 300, and the internal optical fiber is inserted into the connection part 701 to achieve connection of the internal optical fiber with the optical fiber adapter through the connection part 701; the limiting plate 702 is located between the connecting portion 701 and the inserting portion, the left side face of the limiting plate 702 is abutted against the right side face of the shielding plate 1100, so that the optical fiber adapter is limited through the limiting plate 702, and the second assembly hole 1101 on the shielding plate 1100 can be sealed through the limiting plate 702, and the EMI shielding effect of the light opening is guaranteed.

The insertion portion is inserted into the card housing 2024 through the second fitting hole 1101, thereby achieving fitting of the optical fiber adapter, the optical fiber holder 900, the shielding plate 1100, and the card housing 2024.

In some embodiments, the diameter dimension of the insert is greater than the diameter dimension of the first mounting hole 9020 such that the insert cannot pass through the fixation plate 902; the limiting plate 702 is positioned in the first assembly hole 9020 of the fixing plate 902, and the right side of the connecting portion 701 protrudes from the right side surface of the fixing plate 902.

In some embodiments, after the optical fiber fixing frame 900 and the shielding plate 1100 are fixed in the lower housing 202, the upper housing 201 is covered on the lower housing 202, the inner side surface of the upper cover 2011 of the upper housing 201 is in contact connection with the top surface of the shielding plate 1100, and electromagnetic waves inside the optical module cannot escape through the optical port through the sealing connection between the shielding plate 1100 and the upper housing 201 and the lower housing 202, so that the EMI shielding effect of the optical module is ensured.

In some embodiments, the shielding plate 1100 is a conductive rubber that is sealingly connected to the upper and lower housings 201, 202 to achieve EMI shielding at the optical ports of the optical module.

In some embodiments, the optical module provided in the embodiments of the present disclosure improves the EMI shielding effect at the optical port of the optical module through the shielding plate 1100, but electromagnetic waves inside the optical module may escape through the electrical port of the optical module, affecting the EMI shielding effect of the optical module.

Fig. 29 is a block diagram of an upper case in an optical module provided according to some embodiments of the present disclosure, fig. 30 is a block diagram of a lower case in an optical module provided according to some embodiments of the present disclosure, and fig. 31 is a partial cross-sectional view of an optical module provided according to some embodiments of the present disclosure. As shown in fig. 29, 30 and 31, a first connection boss 2012 is formed on the right side of the upper case 201, the first connection boss 2012 extends from the inner side surface of the upper cover 2011 toward the circuit board 300, a first connection groove 2013 is formed on the first connection boss 2012, and an opening is formed on the left side surface of the first connection groove 2013.

The right side of the lower case 202 is formed with a second connection boss 2025, the second connection boss 2025 extends from the inner side of the bottom plate 2021 toward the direction of the circuit board 300, a second connection groove 2026 is formed on the second connection boss 2025, and an opening is formed on the left side of the second connection groove 2026.

Referring to fig. 5 and 6, a first shielding bar 303 is formed on the front surface of the circuit board 300, the first shielding bar 303 is disposed along the width direction of the circuit board 300, and the first shielding bar 303 is located between the gold finger 301 and the light emitting member 400; the circuit board 300 has a second shielding bar 304 formed on the back surface thereof, the second shielding bar 304 being disposed along the width direction of the circuit board 300, the second shielding bar 304 being located between the gold finger 301 and the light receiving member.

Referring to fig. 31, when the circuit board 300 is mounted in the lower case 202, the second shielding strip 304 is embedded in the second connection groove 2026 to achieve a sealed assembly of the lower case 202 and the circuit board 300 at the electrical port by the second shielding strip 304.

When the upper case 201 is covered on the lower case 202, the first shielding strip 303 is embedded in the first connection groove 2013, so that the sealing assembly of the upper case 201 and the circuit board 300 at the electric port is realized through the first shielding strip 303.

In the optical module provided in the embodiment of the present disclosure, the back surface of the circuit board 300 is connected with the lower housing 202 in a sealing manner through the second shielding strip 304, and the front surface of the circuit board 300 is connected with the upper housing 201 in a sealing manner through the first shielding strip 303, so that electromagnetic waves inside the optical module cannot escape through the electrical port, and the EMI shielding effect of the optical module is further improved.

Referring to fig. 5 and 30, the optical module provided in some embodiments of the present disclosure further includes a conductive paste 1200, the conductive paste 1200 extending from the shielding plate 1100 to the shielding strip; the top surfaces of the two lower side plates 2022 of the lower housing 202 are provided with slots 2027, the conductive adhesive 1200 is embedded into the slots 2027, and when the upper housing 201 is covered on the lower housing 202, the conductive adhesive 1200 fills a connection gap between the upper housing 201 and the lower housing 202, so as to realize the sealing assembly of the upper housing 201 and the lower housing 202, and further improve the EMI shielding effect of the optical module.

Fig. 32 is a cross-sectional view of an optical module provided in accordance with some embodiments of the present disclosure. As shown in fig. 32, the light emitting part 400 is embedded in the mounting hole 302 on the circuit board 300, the light emitting part 400 is connected with the first optical fiber adapter set 700 through the internal optical fiber, the wire bonding height of the laser in the light emitting part 400 is the same as the front surface height of the circuit board 300, the laser is connected with the circuit board 300 through wire bonding, the circuit board 300 transmits the electric signal transmitted by the golden finger 301 to the light emitting part 400, so that the light emitting part 400 generates multiple paths of optical signals, and the multiple paths of optical signals generated by the light emitting part 400 are transmitted to the first optical fiber adapter set 700 through the internal optical fiber, so that light emission is realized.

The first light receiving part 510 and the second light receiving part 520 are mounted on the back surface of the circuit board 300, the first light receiving part 510 and the second light receiving part 520 are located at two sides of the mounting hole 302, the first light receiving part 510 and the second light receiving part 520 are respectively connected through an internal optical fiber and the second optical fiber adapter set 800, an external optical signal received by the second optical fiber adapter set 800 is transmitted to the first light receiving part 510 and the second light receiving part 520 through the internal optical fiber, the first light receiving part 510 and the second light receiving part 520 convert the external optical signal into an electric signal, and the electric signal is transmitted to an upper computer through the golden finger 301 so as to realize light receiving.

In some embodiments, the light emitting component 400 may also be connected to the second fiber optic adapter group 800 through an internal optical fiber, and the first light receiving component 510 and the second light receiving component 520 may also be connected to the first fiber optic adapter group 700 through an internal optical fiber, so long as the internal optical fiber is ensured not to be excessively bent.

The first optical fiber adapter group 700 and the second optical fiber adapter group 800 are fixed in the lower housing 202 by the optical fiber fixing frame 900, and the positions of the first optical fiber adapter group 700 and the second optical fiber adapter group 800 can be adjusted by the optical fiber fixing frame 900, so that the coupling accuracy of the light emitting member 400 and the first optical fiber adapter group 700 can be improved, and the coupling accuracy of the first light receiving member 510, the second light receiving member 520 and the second optical fiber adapter group 800 can be improved.

After the circuit board 300, the light emitting member 400, the first light receiving member 510, and the second light receiving member 520 are assembled, the circuit board 300 is mounted in the lower case 202, and is hermetically connected to the lower case 202 through the second shielding strip 304 on the back surface of the circuit board 300.

The first fiber optic adapter group 700 and the second fiber optic adapter group 800 are mounted in the lower housing 202 by the fiber optic fixing frame 900 to ensure the fixation of the first fiber optic adapter group 700 and the second fiber optic adapter group 800.

The upper case 201 is covered on the lower case 202, and is hermetically connected with the upper case 201 through the first shielding strip 303 on the front surface of the circuit board 300, thereby realizing EMI shielding at the electrical port of the optical module.

A shielding plate 1100 is provided between the optical fiber fixing frame 900 and the card holder 2024 at the left side of the lower case 202, and the shielding plate 1100 is hermetically connected with the upper case 201 and the lower case 202, thereby realizing EMI shielding at the optical port of the optical module.

Finally, it should be noted that: the above embodiments are merely for illustrating the technical solution of the present disclosure, and are not limiting thereof; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, comprising:

a clamping seat is formed at one end of the lower shell;

the light emitting assembly is arranged on the emitting base and is used for generating multiple paths of composite light signals;

the emission cover plate is covered on the emission base and is bonded with the front surface of the circuit board;

the detector group is arranged on the back surface of the circuit board;

2. The optical module of claim 1, wherein the fiber mount comprises:

the connecting plate is arranged on the bottom plate of the lower shell;

the fixing plate is fixedly connected with the connecting plate, the fixing plate is in contact connection with the clamping seat, a plurality of first assembly holes are formed in the fixing plate, gaps are formed in each first assembly hole, the internal optical fibers penetrate through the gaps and are arranged in the first assembly holes, and the optical fiber adapters of the optical fiber adapter group are inserted into the first assembly holes;

the first fixing arm is connected with one end of the fixing plate, which faces the circuit board, and is provided with a first positioning protrusion;

The second fixing arm is connected with one end of the fixing plate, which faces the circuit board, and is provided with a second positioning protrusion, and the second fixing arm is in positioning connection with the other lower side plate of the lower shell through the second positioning protrusion.

3. The optical module of claim 2, wherein the set of fiber optic adapters comprises:

the first optical fiber adapter group is connected with the light emitting component through an internal optical fiber and comprises at least two optical fiber adapters, and one ends of the at least two optical fiber adapters are inserted into the first assembly holes;

the second optical fiber adapter group is arranged in a stacked mode with the first optical fiber adapter group, the second optical fiber adapter group is connected with the light receiving component through an internal optical fiber, the second optical fiber adapter group comprises at least two optical fiber adapters, and one ends of the at least two optical fiber adapters are inserted into the first assembly holes.

4. A light module as recited in claim 3, wherein the first mounting hole comprises:

the first row of assembly holes are positioned on the fixed plate, one end of the first optical fiber adapter group is inserted into the first row of assembly holes, and a gap in the first row of assembly holes is positioned between the top surface of the fixed plate and the top surface of the fixed arm;

The second row of assembly holes are arranged up and down with the first row of assembly holes, one end of the second optical fiber adapter group is inserted into the second row of assembly holes, and a gap in the second row of assembly holes is positioned between the bottom surface of the fixed arm and the top surface of the connecting plate.

5. The light module of claim 1 wherein a bottom surface of the emission base is in contact with the lower housing, the emission base including a first mounting surface bonded to a back surface of the circuit board;

one end of the first mounting surface is provided with a mounting groove, the mounting surface of the mounting groove is recessed in the first mounting surface, a laser group of the light emitting assembly is positioned in the mounting groove, the wire bonding height of the laser group is the same as the front height of the circuit board, and the laser group is used for generating multiple paths of optical signals;

the first mounting surface is provided with a second mounting surface, the second mounting surface protrudes out of the first mounting surface, a combiner set of the light emitting assembly is arranged on the second mounting surface, and the combiner set is used for combining the multipath optical signals into a composite optical signal;

the other end of the first mounting surface is provided with a mounting table, a through hole is formed in the mounting table, and an optical fiber coupler group of the light emitting component is inserted into the through hole and is used for coupling the composite optical signal to the internal optical fiber.

6. The light module of claim 5 wherein the first mounting surface has a first baffle and a second baffle formed thereon, the second mounting surface is located between the first baffle and the second baffle, the first baffle and the second baffle are respectively abutted against sides of the mounting hole, and a distance between the first baffle and the second baffle is smaller than a width dimension of the emission base.

7. The light module of claim 5 wherein the emission cover comprises a top plate and first, second, third, fourth, fifth, sixth and seventh side plates fixedly connected to the top plate, the outer side of the top plate being in contact with the upper housing, the first, second, third, fourth, fifth and sixth side plates being in supporting connection with the front side of the seventh and circuit boards;

the top plate is provided with a buckle, the buckle is positioned between the fifth side plate and the sixth side plate, and the buckle is clamped with the side surface of the mounting table;

the first side plate and the third side plate are arranged oppositely, the fifth side plate and the sixth side plate are arranged oppositely, the distance between the first side plate and the third side plate is larger than the distance between the fifth side plate and the sixth side plate, and two opposite side surfaces of the mounting table are respectively in contact connection with the fifth side plate and the sixth side plate;

The two ends of the second side plate are respectively connected with the first side plate and the third side plate, the first side plate is connected with the sixth side plate through the seventh side plate, and the sixth side plate is arranged opposite to the second side plate; the third side plate is connected with the fifth side plate through the fourth side plate, and the fourth side plate is obliquely arranged.

8. The optical module of claim 1, wherein the light receiving component further comprises a receiving housing, the receiving housing being covered on the back side of the circuit board, a cavity being formed between the receiving housing and the back side of the circuit board, the reflecting surface of the optical splitter and the detector group being located within the cavity;

a plurality of positioning grooves are formed on the back surface of the circuit board, and positioning claws are formed on the receiving shell and inserted into the positioning grooves.

9. The optical module of claim 2, further comprising:

the shielding plate is positioned between the clamping seat and the fixing plate and is respectively in sealing connection with the upper shell and the lower shell; the shielding plate is provided with a clamping groove, the fixing plate is provided with a boss, the boss extends from the fixing plate to the direction of the clamping seat, and the boss is inserted into the clamping groove;

The shielding plate is provided with a second assembly hole, and one end of the optical fiber adapter is inserted into the clamping seat through the second assembly hole.

10. The light module of claim 1, wherein a gold finger is formed at one end of the circuit board, a first shielding strip is formed on the front surface of the circuit board, the first shielding strip is located between the gold finger and the light emitting component, and the circuit board is connected with the upper housing in a sealing manner through the first shielding strip;

the back of the circuit board is provided with a second shielding strip, the second shielding strip is positioned between the golden finger and the light receiving part, and the circuit board is in sealing connection with the lower shell through the second shielding strip.