CN221573935U - Light emitting device package frame - Google Patents
Light emitting device package frame Download PDFInfo
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- CN221573935U CN221573935U CN202323060616.1U CN202323060616U CN221573935U CN 221573935 U CN221573935 U CN 221573935U CN 202323060616 U CN202323060616 U CN 202323060616U CN 221573935 U CN221573935 U CN 221573935U
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Abstract
The application discloses a light emitting device package frame. The packaging frame comprises a lead frame, a control chip, a plastic package body, an electroplating circuit layer and a plurality of light-emitting devices; wherein the lead frame comprises a base island and a plurality of bonding wire pins arranged on at least one side of the base island; the control chip is attached to the base island and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin respectively; the plastic package body encapsulates the control chip on the lead frame, part of bonding wire pins are exposed from the plastic package body from the front surface to form first patch pins, and part of the base island is exposed from the plastic package body from the front surface to form second patch pins; the electroplating circuit layer is formed on the plastic package body and is electrically connected with the second patch pin; one end of the light-emitting device is attached to the corresponding first patch pin, and the other end of the light-emitting device is attached to the electroplating circuit layer. The packaging frame is simple in structure, and can realize high-density integrated packaging of the light emitting device so as to reduce the volume of the packaged light emitting device.
Description
Technical Field
The present application relates to the field of light emitting device packaging technology, and in particular, to a light emitting device packaging frame.
Background
A light emitting diode, abbreviated as LED, is a commonly used light emitting device that emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination.
In the traditional LED lamp bead packaging products, most of the traditional LED lamp bead packaging products are packaged correspondingly on a plane by adopting one driving chip and one LED lamp bead, the process is simple, certain production and use function requirements can be met, but when multiple lamp beads are required to be installed and used, the traditional LED lamp bead packaging products are large in size, defects with low integration level can be exposed, and further customer requirements cannot be met.
Therefore, it is necessary to improve and perfect the packaging structure of the existing LED lamp beads.
Disclosure of utility model
The application provides a light-emitting device packaging frame, which aims to solve the problems of large volume and low integration level in the prior art when a plurality of LED lamp beads are packaged.
To achieve the above object, the present application provides a light emitting device package frame comprising:
A lead frame including a base island and a plurality of wire bond pins arranged on at least one side of the base island;
The control chip is attached to the base island and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin respectively;
The control chip is packaged on the lead frame, part of the bonding wire pins are exposed from the plastic package body to form first patch pins, and part of the base islands are exposed from the plastic package body to form second patch pins;
The electroplating circuit layer is formed on the plastic package body and is electrically connected with the second patch pin;
The light-emitting devices are arranged on the first surface-mounted pins in a pasting mode, and the other ends of the light-emitting devices are arranged on the electroplating circuit layer in a pasting mode.
In some embodiments, the plurality of first patch pins are disposed on one side of the plating circuit layer and are disposed at equal intervals between the first patch pins and the plating circuit layer.
In some embodiments, a plurality of bonding wire pins exposed from the plastic package body are arranged on two opposite sides of the base island, the number of the electroplating circuit layers is two, and a plurality of first patch pins are arranged on one side of each electroplating circuit layer.
In some embodiments, the electroplated wiring layer is a solder layer.
In some embodiments, the bonding wire pin includes a bonding wire portion and a patch portion of an integral structure, the patch portion is formed on the bonding wire portion, a top surface of the patch portion is exposed from the plastic package body to form the first patch pin, and a top surface of the patch portion is higher than the control chip.
In some embodiments, the control chip is bonded to the bonding wire portion through a metal wire, and the top surface of the patch portion is further higher than the metal wire.
In some embodiments, the metal wire is one of gold wire, copper wire, and aluminum wire.
In some embodiments, the plastic package is made of epoxy thermosetting resin.
In some embodiments, the plurality of light emitting devices includes LED beads that emit red, green, and blue light, respectively.
In some embodiments, the wire bond pins and the islands are also exposed from the plastic package from the opposite side of the leadframe for use as signal input pins.
The technical scheme of the application provides a light-emitting device packaging frame, which comprises a lead frame, a control chip, a plastic package body, an electroplating circuit layer and a plurality of light-emitting devices; the control chip is electrically connected with each bonding wire pin, part of the bonding wire pins are exposed from the plastic package body from the front surface to form first patch pins, and part of the base island is exposed from the plastic package body from the front surface to form second patch pins; and forming an electroplating circuit layer electrically connected with the second patch pin on the plastic package body, and further packaging a plurality of light emitting devices on the front surface of the frame based on the electroplating circuit layer and the first patch pin. The structure is simple, the control chip controls the operation of the corresponding light emitting device after receiving the electric signal, the high-density integrated packaging is realized, and the volume of the integrated packaging of the light emitting device is reduced.
Drawings
For a clearer description of embodiments of the application or of solutions in the prior art, the drawings that are necessary for the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the application, from which, without the inventive effort, other drawings can be obtained for a person skilled in the art, in which:
Fig. 1 is a schematic structural view of a light emitting device package frame according to an embodiment of the present application;
FIG. 2 is a flow chart of a method of packaging a light emitting device according to an embodiment of the present application;
FIG. 3 is a process diagram of a method of packaging a light emitting device according to an embodiment of the present application;
FIG. 4 is a schematic top view of the leadframe of FIG. 1 after etching;
FIG. 5 is a schematic top view of the package frame of FIG. 1 after mounting a light emitting device;
fig. 6 is a top view of a light emitting device integrated package according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
It will also be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present application.
Referring to fig. 1, fig. 4 and fig. 5, the present application proposes a light emitting device package frame, which includes a lead frame, a control chip 30, a plastic package body 60, an electroplated circuit layer 70 and a plurality of light emitting devices 80; wherein the leadframe includes a base island 10 and a plurality of wire bond pins 20 arranged on at least one side of the base island 10; the control chip 30 is mounted on the base island 10 and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin 20 respectively; the plastic package body 60 encapsulates the control chip 30 on the lead frame, and part of the bonding wire pins 20 are exposed from the plastic package body 60 from the front surface to form first patch pins 210, part of the base island 10 is exposed from the plastic package body 60 from the front surface to form second patch pins 220, the electroplating circuit layer 70 is formed on the plastic package body 60, and is electrically connected with the second patch pins 220; one end of the light emitting device 80 is attached to the corresponding first patch pin 210, and the other end is attached to the plating circuit layer 70.
Among them, a lead frame is a connector material for use in electric and electronic devices, which has high conductivity and good heat resistance. The control chip 30 can be fixed on the base island 10 through the adhesive, and the control chip 30 is attached to the base island 10 to establish electrical connection.
The light emitting device 80 may be an LED lamp bead emitting red light, green light and blue light, the control chip 30 is an LED chip, and is disposed on the base island 10 in the middle area of the lead frame, and then packaged by the plastic package body 60, where the plastic package body 60 includes one of epoxy thermosetting resin, silica gel and organic glass. Furthermore, the technical scheme of the application can realize the encapsulation of a plurality of LED lamp beads, and after external signals are received through the bonding wire pins 20, the control chip 30 controls the corresponding LED lamp beads to emit light. It is understood that the light emitting device 80 includes, but is not limited to, an LED light bead.
In the application, the control chip 30 and each bonding wire pin 20 are electrically connected, part of the bonding wire pins 20 are exposed from the plastic package body 60 from the front surface to form the first patch pins 210, and part of the base island 10 is exposed from the plastic package body 60 from the front surface to form the second patch pins 220; to form the plating circuit layer 70 electrically connected to the second chip pins 220 on the plastic package body 60, and to package the plurality of light emitting devices 80 on the front surface of the frame based on the plating circuit layer 70 and the first chip pins 210. The structure is simple, the control chip 30 controls the corresponding light emitting device 80 to operate after receiving the electric signal, high-density integrated packaging is realized, and the volume of the integrated packaging of the light emitting device 80 is reduced.
It will be appreciated that some of the wire bond pins 20 are not exposed from the front side of the plastic package 60, but are still electrically connected to the control chip 30, and that these wire bond pins 20 that are not exposed from the front side of the plastic package 60 are typically exposed from the back side of the frame from the plastic package 60 for connection to an external circuit board as signal input pins for transmitting input signals.
Further, other wire bonding pins 20 and islands 10 are also exposed from the plastic package 60 from the opposite side of the lead frame, and are also connected to an external circuit board as signal input pins for inputting signals. Further, the control chip 30 controls the corresponding light emitting device 80 to emit light after receiving the input signals transmitted from the bonding wire pins 20 and the island 10.
Referring to fig. 1 and 3, in some embodiments, a heat-dissipating glue 40 is disposed between the control chip 30 and the base island 10 to provide good heat dissipation through the heat-dissipating glue 40.
Referring to fig. 1, fig. 4, and fig. 5, in some embodiments, the plurality of first patch pins 210 are disposed on one side of the plating circuit layer 70 and are disposed at equal intervals from the plating circuit layer 70.
The plating circuit layer 70 is a long tin soldering layer based on a plating trunk formed by connecting with the second patch pins 220, and when a plurality of first patch pins 210 are arranged at one side of the plating trunk at equal intervals, the other end of the light emitting device 80 arranged based on each first patch pin 210 can be conveniently connected with the plating trunk, and the structural complexity is reduced.
A solder layer may be disposed on the top of the first chip pin 210 corresponding to the first chip pin 210 to form an electroplating point 710, as shown in fig. 5, and then one end of the light emitting device 80 is connected to the electroplating point 710, and the other end is connected to the electroplating trunk.
Referring to fig. 1, 4 and 5, in some embodiments, a plurality of bonding wires 20 exposed from the plastic package 60 are arranged on two opposite sides of the base island 10, the number of the plated circuit layers 70 is two, and a plurality of first bonding pads 210 are disposed on one side of each plated circuit layer 70. In this way, the plurality of groups of corresponding electroplating circuit layers 70 and the first patch pins 210 are arranged, which is favorable for improving the mounting position of the light emitting devices 80 and mounting more light emitting devices 80 in a limited space.
Referring to fig. 1, in some embodiments, the bonding wire pin 20 includes a bonding wire portion 21 and a patch portion 22 integrally formed, the patch portion 22 is formed on the bonding wire portion 21, and a top surface of the patch portion 22 is exposed from the plastic package 60 to form a first patch pin 210, and a top surface of the patch portion is higher than the control chip 30.
It can be appreciated that the bonding portion 22 is formed by etching the bonding wire pin 20, for example, the bonding wire pin 20 is etched to form a "convex" structure, wherein the bonding portion 22 is located at the upper half, and the bonding wire portion 21 is located at the lower half, and in part of the bonding wire pin 20, the bonding portion 22 is exposed from the plastic package 60 from the front, and the exposed bonding wire pin 20 is used for mounting the light emitting device 80. In the case where the bonding wire leads 20 are not exposed from the front surface, the bonding wire leads 20 are not exposed from the plastic package 60 to the external circuit board, and the bonding wire leads 22 are not etched to protrude from the front surface, and thus the bonding wire leads 22 and the bonding wire leads 21 are not layered in steps. The specific placement of wire bond pins 20 is divided based on their use.
Referring to fig. 1, in some embodiments, the control chip 30 is bonded to the bonding wire portion 21 through the metal wire 50, and the top surface of the patch portion 22 is further higher than the metal wire 50. In this way, the control chip 30 and the metal wire 50 can be prevented from being damaged when the plastic package 60 is ground.
Wherein the metal wire 50 is one of gold wire, copper wire and aluminum wire.
Referring to fig. 1, in some embodiments, the light emitting device 80 is covered with a pressing film 90, and the light emitting device 80 emits light outwards through the pressing film 90. Thus, the lamp bead covered with the pressed film 90 is hard, the temperature resistance is improved, and the lamp bead has the characteristics of UV resistance and no deformation.
The present application also provides a light emitting device packaging method for preparing the light emitting device 80 package frame as described above, the packaging method comprising the flow as shown in fig. 2:
Step S110, etching the front surface of the lead frame to form a base island 10 and a plurality of bonding wire pins 20 arranged on at least one side of the base island 10;
Step S210, attaching the control chip 30 to the base island 10 and located at one side of the front surface of the lead frame;
Step S310, bonding the control chip 30 and the plurality of bonding wire pins 20 by using the metal wire 50;
Step S410, molding the control chip 30 and the metal wire 50 on the lead frame to form a frame molding body;
Step S510, grinding the front surface of the frame molding body to expose a portion of the bonding wire pins 20 from the molding body 60 to form the first chip pins 210, and exposing a portion of the base island 10 from the molding body 60 to form the second chip pins 220;
Step S610, setting an electroplating circuit layer 70 electrically connected with the second patch pin 220;
In step S710, the light emitting device 80 is mounted between the plating circuit layer 70 and the first chip pins 210.
The packaging method can prepare the light emitting device packaging frame, so that the control chip 30 and each bonding wire pin 20 are electrically connected, part of the bonding wire pins 20 are exposed from the plastic package body 60 from the front to form the first patch pins 210, part of the base island 10 is exposed from the plastic package body 60 from the front to form the second patch pins 220, the electroplating circuit layer 70 electrically connected with the second patch pins 220 is formed on the plastic package body 60, and then the plurality of light emitting devices 80 are packaged on the front of the frame based on the electroplating circuit layer 70 and the first patch pins 210. The structure is simple, the control chip 30 controls the corresponding light emitting device 80 to operate after receiving the electric signal, high-density integrated packaging is realized, and the volume of the integrated packaging of the light emitting device 80 is reduced. See in particular the process diagram shown in fig. 5.
In some embodiments, the light emitting device packaging method further includes: step S810, coating the light emitting device 80 with the pressing film 90.
The wire bond pins 20 and the islands 10 are exposed from the back surface of the molding body 60 by one step during molding, or by grinding the back surface of the frame molding body 60 after molding.
As shown in fig. 6, a top view of a multi-group light emitting device integrated package implemented by the packaging method of the present application is shown.
The above description of the preferred embodiments of the present application should not be taken as limiting the scope of the application, but rather should be understood to cover all modifications, variations and adaptations of the present application using its general principles and the following detailed description and the accompanying drawings, or the direct/indirect application of the present application to other relevant arts and technologies.
Claims (10)
1. A light emitting device package frame, comprising:
A lead frame including a base island and a plurality of wire bond pins arranged on at least one side of the base island;
The control chip is attached to the base island and positioned on one side of the front surface of the lead frame, and is electrically connected with each bonding wire pin respectively;
The control chip is packaged on the lead frame, part of the bonding wire pins are exposed from the plastic package body to form first patch pins, and part of the base islands are exposed from the plastic package body to form second patch pins;
The electroplating circuit layer is formed on the plastic package body and is electrically connected with the second patch pin;
The light-emitting devices are arranged on the first surface-mounted pins in a pasting mode, and the other ends of the light-emitting devices are arranged on the electroplating circuit layer in a pasting mode.
2. The light emitting device package frame of claim 1, wherein the plurality of first patch pins are disposed on one side of the plated circuit layer and are disposed at equal intervals from the plated circuit layer.
3. The light-emitting device package frame according to claim 2, wherein a plurality of bonding wire pins exposed from the plastic package body are arranged on two opposite sides of the base island, the number of the electroplating circuit layers is two, and a plurality of the first patch pins are arranged on one side of each electroplating circuit layer.
4. The light emitting device package frame of claim 3, wherein the plated wire layer is a solder layer.
5. The light emitting device package frame of any one of claims 1-4, wherein the wire bond leads comprise a wire bond portion and a patch portion of unitary construction, the patch portion being formed on the wire bond portion, a top surface of the patch portion being exposed from the plastic package body to form the first patch lead, the top surface of the patch portion being higher than the control chip.
6. The light-emitting device package frame according to claim 5, wherein the control chip is bonded to the bonding wire portion via a metal wire, and the top surface of the chip portion is further higher than the metal wire.
7. The light emitting device package frame of claim 6, wherein the metal wire is one of gold wire, copper wire, and aluminum wire.
8. The light emitting device package frame of claim 1, wherein the plastic package body comprises one of epoxy-based thermosetting resin, silicone, and organic glass.
9. The light emitting device package frame of claim 1, wherein the plurality of light emitting devices comprise LED beads that emit red, green, and blue light, respectively.
10. The light emitting device package frame of claim 1, wherein the wire bond leads and the submount are further exposed from the plastic package body from a reverse side of the leadframe for use as signal input leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323060616.1U CN221573935U (en) | 2023-11-13 | 2023-11-13 | Light emitting device package frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323060616.1U CN221573935U (en) | 2023-11-13 | 2023-11-13 | Light emitting device package frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221573935U true CN221573935U (en) | 2024-08-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323060616.1U Active CN221573935U (en) | 2023-11-13 | 2023-11-13 | Light emitting device package frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221573935U (en) |
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2023
- 2023-11-13 CN CN202323060616.1U patent/CN221573935U/en active Active
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