CN219124437U - double sided circuit board - Google Patents

Abstract

The utility model discloses a double-sided circuit board. The upper surface of the substrate layer is bonded with several upper metal wires through the first adhesive layer, and the lower surface is bonded with several lower metal wires through the second adhesive layer. The upper protective film and the lower protective film are bonded to the first adhesive layer and the second adhesive layer respectively, a plurality of first upper electrode strips are arranged on one side of the upper surface of the substrate layer at intervals, and a plurality of second upper electrode strips set at intervals on the other side of the upper surface of the substrate layer, several first lower electrode strips are arranged at intervals on one side of the lower surface of the substrate layer, and several second lower electrode strips are arranged at intervals on the other side of the lower surface of the substrate layer On the side, the outer surfaces of the upper metal wire and the lower metal wire are covered with an insulating layer. The double-sided circuit board technology of the utility model is simple and environmentally friendly, and avoids the stability of signal transmission affected by long-term large-scale bending or large-angle bending, thereby ensuring the reliability of signal transmission on the circuit board, and the metal wires will not conduct electricity.

Description

double sided circuit board

technical field

The utility model relates to the technical field of circuit boards, in particular to a double-sided circuit board.

Background technique

Double-sided circuit boards are suitable for electronic products with high performance, small size and multiple functions, which improves the utilization rate of space and greatly reduces the volume of electronic products. It is widely used in the production and processing of electronic products.

In the prior art double-sided circuit boards, the polyimide film is coated with a metal conductive layer, and then the conductive pattern is formed by chemical etching. When bent at an angle, the conductive pattern is prone to displacement or breakage, which affects the stability of signal transmission.

Contents of the invention

The purpose of this utility model is to provide a double-sided circuit board. The double-sided circuit board process is simple and environmentally friendly, avoiding the stability of signal transmission affected by long-term large-scale bending or large-angle bending, thereby ensuring the stability of signal transmission on the circuit board. Reliability, and there will be no conduction between metal wires.

In order to achieve the above purpose, the technical solution adopted by the utility model is: a double-sided circuit board, comprising: a base material layer, an upper protective film and a lower protective film, the upper surface of the base material layer is glued by the first adhesive layer A plurality of upper metal wires are connected, and a plurality of lower metal wires are bonded to the lower surface through the second adhesive layer, and the upper protective film and the lower protective film are respectively bonded to the first adhesive layer and the second adhesive layer;

Several first upper electrode strips are arranged at intervals on one side of the upper surface of the substrate layer, and several second upper electrode strips are arranged at intervals on the other side of the upper surface of the substrate layer. One upper electrode strip is electrically connected, and the other ends of several upper metal wires are electrically connected to several second upper electrode strips;

Several first lower electrode strips are arranged at intervals on one side of the lower surface of the substrate layer, several second lower electrode strips are arranged at intervals on the other side of the lower surface of the substrate layer, and each end of several lower metal wires is connected to several The first lower electrode strips are electrically connected, and the other ends of the plurality of lower metal wires are electrically connected with the plurality of second lower electrode strips. The outer surfaces of the upper metal wires and the lower metal wires are covered with insulating layers.

The scheme of further improvement in above-mentioned technical scheme is as follows:

1. In the above solution, the first upper electrode strip and the second upper electrode strip are pad strips or golden fingers.

2. In the above solution, the substrate layer is a polyimide layer or a polyester film layer.

3. In the above solution, the protective film is PET film, PE film or PC film.

Due to the application of the above-mentioned technical solution, the utility model has the following advantages compared with the prior art:

In the double-sided circuit board of the utility model, several first upper electrode strips are arranged at intervals on one side of the upper surface of the substrate layer, and several second upper electrode strips are arranged at intervals on the other side of the upper surface of the substrate layer. One end of each metal wire is electrically connected to several first upper electrode strips, and the other end of each of several upper metal wires is electrically connected to several second upper electrode strips; several first lower electrode strips are arranged at intervals under the substrate layer On one side of the surface, several second lower electrode strips are arranged at intervals on the other side of the lower surface of the substrate layer, one end of each of several lower metal wires is electrically connected to several first lower electrode strips, each of several lower metal wires The other end is electrically connected to several second lower electrode strips, the outer surfaces of the upper metal wire and the lower metal wire are covered with an insulating layer, the metal wires will not conduct electricity, and the upper surface of the base material layer is bonded by the first adhesive layer There are several upper metal wires, and the lower surface is bonded with several lower metal wires through the second adhesive layer, which avoids the etching of the metal layer to form a conductive pattern. Bending affects the stability of signal transmission, thereby ensuring the reliability of signal transmission on the circuit board.

Description of drawings

Accompanying drawing 1 is the structural representation of the utility model flexible circuit board;

Accompanying drawing 2 is the sectional enlarged schematic diagram of the utility model flexible circuit board;

Accompanying drawing 3 is the sectional structure diagram of A-A of accompanying drawing 1.

In the above drawings: 1. Substrate layer; 2. Upper protective film; 3. Upper metal wire; 4. First adhesive layer; 5. First upper electrode strip; 6. Second upper electrode strip; 7. Insulation 7. The first reinforcing plate; 8. The second reinforcing plate; 9. The lower protective film; 10. The second adhesive layer; 11. The first lower electrode strip; 12. The second lower electrode strip; 13. Lower the metal wire.

Detailed ways

This patent can be further clearly understood by the specific examples given below, but they are not a limitation of this patent.

Embodiment 1: A double-sided circuit board, comprising: a substrate layer 1, an upper protective film 2 and a lower protective film 9, the upper surface of the substrate layer 1 is bonded with several upper metal substrates through the first adhesive layer 4 The wire 3 has several lower metal wires 13 bonded to the lower surface through the second adhesive layer 10, and the upper protective film 2 and the lower protective film 9 are respectively bonded to the first adhesive layer 4 and the second adhesive layer 10 , avoiding the stability of signal transmission affected by long-term large number of times or large-angle bending, thus ensuring the reliability of circuit board signal transmission;

Several first upper electrode strips 5 are arranged at intervals on one side of the upper surface of the substrate layer 1, and several second upper electrode strips 6 are arranged at intervals on the other side of the upper surface of the substrate layer 1. One end is electrically connected to several first upper electrode strips 5, and the other ends of several upper metal wires 3 are electrically connected to several second upper electrode strips 6;

Several first lower electrode strips 11 are arranged at intervals on one side of the lower surface of the substrate layer 1, and several second lower electrode strips 12 are arranged at intervals on the other side of the lower surface of the substrate layer 1. Several lower metal wires 13 are respectively One end of a plurality of first lower electrode strips 11 is electrically connected, and the other end of several lower metal wires 13 is electrically connected with a plurality of second lower electrode strips 12, and the outer surfaces of the upper metal wires 3 and the lower metal wires 13 are both Covered with an insulating layer 7, the formation of conductive patterns by etching the metal layer is avoided, and the process is simple and environmentally friendly.

The above-mentioned first upper electrode strips 5 and second upper electrode strips 6 are pad strips.

The base material layer 1 is a polyimide layer, and the protective film 2 is a PET film.

The above-mentioned upper metal wire 3 and lower metal wire 13 are copper wires.

Embodiment 2: a double-sided circuit board, comprising: a substrate layer 1, an upper protective film 2 and a lower protective film 9, the upper surface of the substrate layer 1 is bonded with several upper metal layers through the first adhesive layer 4 The wire 3 has several lower metal wires 13 bonded to the lower surface through the second adhesive layer 10, and the upper protective film 2 and the lower protective film 9 are respectively bonded to the first adhesive layer 4 and the second adhesive layer 10 ;

Several first upper electrode strips 5 are arranged at intervals on one side of the upper surface of the substrate layer 1, and several second upper electrode strips 6 are arranged at intervals on the other side of the upper surface of the substrate layer 1. One end is electrically connected to several first upper electrode strips 5, and the other ends of several upper metal wires 3 are electrically connected to several second upper electrode strips 6;

Several first lower electrode strips 11 are arranged at intervals on one side of the lower surface of the substrate layer 1, and several second lower electrode strips 12 are arranged at intervals on the other side of the lower surface of the substrate layer 1. Several lower metal wires 13 are respectively One end of a plurality of first lower electrode strips 11 is electrically connected, and the other end of several lower metal wires 13 is electrically connected with a plurality of second lower electrode strips 12, and the outer surfaces of the upper metal wires 3 and the lower metal wires 13 are both Covered with an insulating layer 7, there will be no conduction between the metal wires.

The first upper electrode strip 5 and the second upper electrode strip 6 are golden fingers.

The base material layer 1 is a polyester film layer, and the protective film 2 is a PE film.

The above-mentioned upper metal wire 3 and lower metal wire 13 are aluminum wires.

When the above-mentioned double-sided circuit board is used, the process is simple and environmentally friendly, avoiding the stability of signal transmission affected by long-term large-scale bending or large-angle bending, thereby ensuring the reliability of signal transmission on the circuit board, and there will be no contact between metal wires. conduct electricity.

The above-mentioned embodiments are only to illustrate the technical concept and characteristics of the present utility model, and its purpose is to enable those familiar with this technology to understand the content of the present utility model and implement it accordingly, and not to limit the protection scope of the present utility model. All equivalent changes or modifications made according to the spirit of the utility model shall fall within the protection scope of the utility model.

Claims (4)

1. A double-sided circuit board, characterized in that: comprising the following steps: the upper surface of the base material layer (1) is adhered with a plurality of upper metal wires (3) through a first adhesive layer (4), the lower surface of the base material layer (1) is adhered with a plurality of lower metal wires (13) through a second adhesive layer (10), and the upper protective film (2) and the lower protective film (9) are adhered with the first adhesive layer (4) and the second adhesive layer (10) respectively;

the first upper electrode strips (5) are arranged on one side of the upper surface of the base material layer (1) at intervals, the second upper electrode strips (6) are arranged on the other side of the upper surface of the base material layer (1) at intervals, one end of each of the upper metal wires (3) is electrically connected with the first upper electrode strips (5), and the other end of each of the upper metal wires (3) is electrically connected with the second upper electrode strips (6);

the first lower electrode strips (11) are arranged on one side of the lower surface of the base material layer (1) at intervals, the second lower electrode strips (12) are arranged on the other side of the lower surface of the base material layer (1) at intervals, one ends of the lower metal wires (13) are electrically connected with the first lower electrode strips (11), the other ends of the lower metal wires (13) are electrically connected with the second lower electrode strips (12), and the outer surfaces of the upper metal wires (3) and the lower metal wires (13) are respectively covered with an insulating layer (7).

2. The double-sided circuit board according to claim 1, wherein: the first upper electrode strips (5) and the second upper electrode strips (6) are bonding pad strips or golden fingers.

3. The double-sided circuit board according to claim 1, wherein: the substrate layer (1) is a polyimide layer or a polyester film layer.

4. The double-sided circuit board according to claim 1, wherein: the protective film (2) is a PET film, a PE film or a PC film.

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