CN203482483U - Circuit board - Google Patents

Abstract

A circuit board, comprising a first flexible circuit board, a first adhesive layer, a first reinforcing board, a second adhesive layer and a second flexible circuit board which are sequentially pasted together, the first reinforcing board has A through first opening, the area of the circuit board corresponding to the first opening is a flexible area.

Description

circuit board

technical field

The utility model relates to a circuit board structure.

Background technique

Flexible circuit boards are widely used in many electronic products due to their flexible properties. The flexible circuit board is relatively soft, which is not conducive to welding and supporting parts. In order to facilitate the welding and supporting parts of the parts, it is necessary to paste a reinforcing plate on the back of the flexible circuit board area of the welding parts, but this causes the bonding reinforcement The flexible circuit board area of the board cannot solder parts, so it is generally necessary to adopt a staggered design of the front and back of the parts, so that the front and back of the flexible circuit board can be soldered at the same time, and the back of the flexible circuit board area of the soldered parts can be pasted But this design will increase the area of the flexible circuit board, which is not conducive to the assembly of the circuit board.

Because the rigid circuit board has better hardness, the back of the rigid circuit board area where the parts are welded does not need to be pasted with a reinforcing plate, so the rigid circuit board can weld parts on the front and back at the same time without position restrictions. However, the rigid circuit board does not It has the characteristics of being flexible.

Utility model content

In view of this, it is necessary to provide a circuit board that can be flexed and whose two sides are facing each other so that parts can be soldered simultaneously.

A circuit board, comprising a first flexible circuit board, a first adhesive layer, a first reinforcement board, a second adhesive layer and a second flexible circuit board which are sequentially pasted together, the first reinforcement board has A through first opening, the area of the circuit board corresponding to the second opening is a flexible area.

Preferably, the first adhesive layer has a through second fracture, the second adhesive layer has a through third fracture, and the first fracture, the second fracture and the third fracture correspond to each other and have substantially the same shape thereby connecting.

Preferably, the first flexible circuit board includes a first cover film layer, a first conductive circuit layer, and a first substrate layer that are sequentially attached, and the second flexible circuit board includes a first layer that is sequentially attached. Two cover film layers, a second conductive circuit layer and a second substrate layer, the first substrate layer is directly attached to the first adhesive layer, and the second substrate layer is directly attached to the second adhesive layer stick together.

Preferably, the first cover film layer is formed with a plurality of through first openings, part of the first conductive circuit layer is exposed through the first openings, and the exposed through the first openings The first conductive circuit layer forms a first welding pad, and a first electronic component is welded on the surface of the first welding pad, and the first fracture and the first opening are arranged in a staggered manner.

Preferably, the second cover film layer is formed with a plurality of through second openings, part of the second conductive circuit layer is exposed from the second openings, and the exposed The second conductive circuit layer forms a second welding pad, and a second electronic component is welded on the surface of the second welding pad, and the first fracture and the second opening are staggered.

Preferably, the first opening is located opposite to the second opening.

Preferably, the circuit board further includes a fourth adhesive layer and a third flexible circuit board sequentially attached to a side of the second flexible circuit board facing away from the second adhesive layer.

Preferably, the first flexible circuit board has a through second fracture, the first adhesive layer has a through third fracture, the second adhesive layer has a through fourth fracture, the The fourth adhesive layer has a through seventh fracture, the third flexible circuit board has a through eighth fracture, and the first, second, third, fourth, seventh and eighth fractures are all The positions are corresponding and the shapes are substantially the same, and the first fracture, the third fracture, the second fracture and the fourth fracture are interconnected, and the seventh fracture and the eighth fracture are interconnected.

Preferably, the circuit board further includes a third adhesive layer and a second reinforcing plate, and the third adhesive layer is adjacent to the second flexible circuit board, and the second reinforcing plate Adhering to the fourth adhesive layer, the third adhesive layer has a through fifth fracture, the second reinforcing plate has a through sixth fracture, the fifth fracture and the sixth fracture They are all corresponding to the position of the first fracture and have substantially the same shape, and the fifth fracture, the sixth fracture, the seventh fracture and the eighth fracture are connected.

Preferably, the first flexible circuit board includes a first cover film layer, a first conductive circuit layer, and a first substrate layer that are attached in sequence, and the third flexible circuit board includes a first layer that is attached in sequence. Two cover film layers, a second conductive circuit layer and a second substrate layer, the first substrate layer is directly attached to the first adhesive layer, and the second substrate layer is directly attached to the fourth adhesive layer stick together.

Preferably, the first cover film layer is formed with a plurality of through first openings, part of the first conductive circuit layer is exposed through the first openings, and the exposed through the first openings The first conductive circuit layer forms a first welding pad, and the surface of the first welding pad is soldered with a first electronic component.

Preferably, the second cover film layer is formed with a plurality of through second openings, part of the second conductive circuit layer is exposed from the second openings, and the exposed The second conductive circuit layer forms a second welding pad, and the surface of the second welding pad is soldered with a second electronic component.

Preferably, the first opening is located opposite to the second opening.

The reinforcing boards of the circuit board provided by this technical solution are all located in the inner layer of the circuit board, so the opposite positions on both sides of the circuit board can simultaneously weld electronic components, thereby reducing the area of the circuit board. Furthermore, it also facilitates the assembly of the circuit board and saves the production cost of the circuit board.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a circuit board provided by the first embodiment of the technical solution.

FIG. 2 is a schematic cross-sectional view of a circuit board provided by a second embodiment of the technical solution.

Description of main component symbols

circuit board 100,900 The first flexible circuit board 110,910 first adhesive layer 120,920 reinforcement board 130,930 Second adhesive layer 140,940 Second flexible circuit board 150,950 first cover film 111,911 first conductive circuit layer 112,912 first substrate layer 113,913 first bonding layer 1111, 9111 first dielectric layer 1112, 9112 first fracture 131,931 second fracture 121,916 third fracture 141,921 second cover film 151,991 second conductive line layer 152,992 second substrate layer 153,993 second bonding layer 1511, 9911 second dielectric layer 1512, 9912 first opening 1113, 9113 first pad 1121, 9121 First Solder Paste Layer 114,914 First Electronic Components 115,915 second opening 1513, 9913 second pad 1521, 9921 Second Solder Paste Layer 154,957 Second electronic component 155,958 first conductive hole 101, 901 The third glue layer 960 Second reinforcing plate 970 Fourth glue layer 980 The third flexible circuit board 990 fourth fracture 941 The fourth covering layer 951 The fourth conductive circuit layer 952 third substrate layer 953 third conductive circuit layer 954 third cover film 955 Fourth adhesive layer 9511 fourth dielectric layer 9512 third adhesive layer 9551 third dielectric layer 9552 fifth fracture 961 sixth fracture 971 seventh fracture 981 eighth fracture 996 Second Conductive Via 956 first blind hole 902 second blind hole 903

The following specific embodiments will further illustrate the utility model in conjunction with the above-mentioned accompanying drawings.

Detailed ways

The circuit board provided by the technical solution will be further described in detail below in conjunction with the drawings and embodiments.

Please refer to FIG. 1, the circuit board 100 provided by the first embodiment of the technical solution includes a first flexible circuit board 110, a first adhesive layer 120, a first reinforcing plate 130, a second adhesive layer 140 and The second flexible circuit board 150 .

The first flexible circuit board 110 is a single-sided flexible circuit board, which includes a first cover film layer 111 , a first conductive circuit layer 112 and a first base material layer 113 which are sequentially attached. The first cover film layer 111 includes a first adhesive layer 1111 and a first dielectric layer 1112 that are attached together, wherein the first adhesive layer 1111 is directly attached to the first conductive circuit layer 112 . The first bonding layer 1111 is made of flexible bonding materials such as epoxy acrylate resin or epoxy resin. The materials of the first dielectric layer 1112 and the first substrate layer 113 are polyimide (PI), polyethylene phthalate (PET) and polyethylene naphthalate ( PEN) and other flexible dielectric materials. Certainly, the first covering film layer 111 may also be only one layer of solder resist layer; a bonding layer may also be included between the first conductive circuit layer 112 and the first substrate layer 113; A flexible circuit board 110 can also be a double-sided flexible circuit board or a multi-layer flexible circuit board. At this time, the first flexible circuit board 110 also includes conductive fractures that are electrically connected to the circuits of each layer; Preferably, both outermost sides of the first flexible circuit board 110 are insulating layers, so as to insulate and protect the conductive circuit pattern.

The first and second adhesive layers 120 and 140 are made of flexible adhesive materials such as epoxy acrylate resin or epoxy resin. The first reinforcing board 130 is a commonly used insulation reinforcing material in the industry, for example, it can be a substrate material (FR1, FR2, FR3, FR4...) formed by impregnating resin such as paper, glass fiber cloth or non-woven fabric, or it can be Materials such as polyimide. The first adhesive layer 120 is directly attached to the first substrate layer 113 . The first adhesive layer 120 has a through second fracture 121, and the second fracture 121 divides the first adhesive layer 120 into two, that is, the second fracture 121 is located in the middle of the circuit board 100 Location. The first reinforcing plate 130 has a through first fracture 131 , and the first fracture 131 divides the first reinforcing plate 130 into two. The second adhesive layer 140 has a through third fracture 141 , and the third fracture 141 divides the second adhesive layer 140 into two. The second fracture 121 , the first fracture 131 and the third fracture 141 have corresponding positions and substantially the same shape so as to pass through each other, so that the area of the circuit board 100 corresponding to the second fracture 121 does not include the first reinforcing plate 130, is the flexible folding area. Certainly, the second fracture 121, the first fracture 131 and the third fracture 141 may also be located at one end of the circuit board 100; the second fracture 121 and the third fracture 141 may not be provided. A glue layer 120 and the second glue layer 140 also fill the first fracture 131, because the first glue layer 120 and the second glue layer 140 of this case are all flexible materials, so the circuit board 100 The area corresponding to the second fracture 121 can still be bent.

The second flexible circuit board 150 is similar to the first flexible circuit board 110 . In this embodiment, the second flexible circuit board 150 is a single-sided flexible circuit board, which includes a second cover film layer 151, a second conductive circuit layer 152, and a second substrate layer 153 that are sequentially attached to each other. , wherein, the second substrate layer 153 is directly attached to the second adhesive layer 140 . The second cover film layer 151 includes a second adhesive layer 1511 and a second dielectric layer 1512 that are attached together, wherein the second adhesive layer 1511 is directly attached to the second conductive circuit layer 152 . The second bonding layer 1511 is made of flexible bonding materials such as epoxy acrylate resin or epoxy resin. The materials of the second dielectric layer 1512 and the second substrate layer 153 are polyimide (PI), polyethylene phthalate (PET) and polyethylene naphthalate ( PEN) and other flexible dielectric materials. Of course, the second cover film layer 151 can also be only one layer of solder resist layer; a bonding layer can also be included between the second conductive circuit layer 152 and the second base material layer 153; The second flexible circuit board 150 can also be a double-sided flexible circuit board or a multi-layer flexible circuit board. Graphics for insulation protection; when the second flexible circuit board 150 is a double-sided or multi-layer flexible circuit board, the second flexible circuit board 150 also includes conductive fractures that are electrically connected to its various layers of circuits .

In this embodiment, the first cover film layer 111 of the circuit board 100 is formed with a plurality of first openings 1113, and the first openings 1113 pass through the first adhesive layer 1111 and the first dielectric layer 1112 Part of the first conductive circuit layer 112 is exposed from the first opening 1113 , and the first conductive circuit layer 112 exposed from the first opening 1113 forms a first pad 1121 . A first solder paste layer 114 is formed on the surface of the first solder pad 1121, and a first electronic component 115 is welded on the surface of the first solder paste layer 114, and the first electronic component 115 is electrically connected to the first solder pad 1121. connect. A plurality of second openings 1513 are formed on the second cover film layer 151, and the second openings 1513 pass through the second adhesive layer 1511 and the second dielectric layer 1512, and part of the second conductive circuit layer 152 Exposed from the second opening 1513 , the second conductive circuit layer 152 exposed from the second opening 1513 forms a second pad 1521 . A second solder paste layer 154 is formed on the surface of the second solder pad 1521, and a second electronic component 155 is welded on the surface of the second solder paste layer 154, and the second electronic component 155 is electrically connected to the second solder pad 1521. connect. Wherein, the first opening 131 and the first opening 1113 are staggered, and the first opening 131 and the second opening 1513 are also staggered, that is, the circuit board 100 corresponds to the first opening 131 The first opening 1113 and the second opening 1513 are not provided in the region. Moreover, since the first reinforcing plate 130 is located on the inner layer of the circuit board 100, the first electronic component 115 and the second electronic component 155 can be located on the front side of both sides of the circuit board 100. The opposite position, that is, the first opening 1113 and the second opening 1513 may be located on opposite sides of the circuit board 100 . Of course, a first gold layer may also be formed on the surface of the first pad 1121 , and the first electronic component 115 is soldered to the surface of the first gold layer through the first solder paste layer 114 . A second gold layer may also be formed on the surface of the second welding pad 1521 , and the second electronic component 155 is soldered to the surface of the second gold layer through the second solder paste layer 154 .

A first conductive hole 101 electrically connecting the first conductive circuit layer 112 and the second conductive circuit layer 152 is formed on the circuit board 100 . The first conductive hole 101 extends from the first conductive circuit layer 112 to the second conductive circuit layer 152, and the first conductive hole 101 may pass through the first conductive circuit layer 112, the first substrate layer 113. The first adhesive layer 120, the first reinforcing plate 130, the second adhesive layer 140, the second substrate layer 153, the second conductive circuit layer 152 and stop at the second conductive circuit layer 152, or Through the first conductive circuit layer 112, the first substrate layer 113, the first adhesive layer 120, the first reinforcing plate 130, the second adhesive layer 140, the second substrate layer 153 and stop at the second substrate Material layer 153. The first conductive hole 101 can be formed by electroplating metal, or can be formed by filling conductive paste.

Please refer to FIG. 2 , the circuit board 900 provided by the second embodiment of the technical solution includes a first flexible circuit board 910 , a first adhesive layer 920 , a first reinforcing plate 930 , a second adhesive layer 940 , The second flexible circuit board 950 , the third adhesive layer 960 , the second reinforcing plate 970 , the fourth adhesive layer 980 and the third flexible circuit board 990 .

The first flexible circuit board 910 is a single-sided flexible circuit board, which includes a first cover film layer 911 , a first conductive circuit layer 912 and a first substrate layer 913 which are sequentially attached. The first covering film layer 911 includes a first adhesive layer 9111 and a first dielectric layer 9112 that are attached together. The first adhesive layer 9111 is directly attached to the first conductive circuit layer 912 . The first bonding layer 9111 is made of flexible bonding materials such as epoxy acrylate resin or epoxy resin. The materials of the first dielectric layer 9112 and the first substrate layer 913 are polyimide (PI), polyethylene phthalate (PET) and polyethylene naphthalate (PEN) and other flexible dielectric materials. Of course, the first cover film layer 911 may also be only one layer of solder resist layer; a second adhesive layer may also be included between the first conductive circuit layer 912 and the first base material layer 913; The first flexible circuit board 910 can also be a double-sided or multi-layer flexible circuit board, at this time, the first flexible circuit board 110 also includes conductive openings that are electrically connected to its various layers of circuits; preferably the Both outermost sides of the first flexible circuit board 110 are insulating layers, so as to insulate and protect the conductive circuit pattern.

The first adhesive layer 920 and the second adhesive layer 940 are made of flexible adhesive materials such as epoxy acrylate resin or epoxy resin. The first reinforcement board 930 is an insulation reinforcement material commonly used in the industry, for example, it can be a substrate material (FR1, FR2, FR3, FR4...) formed by impregnating resin such as paper, glass fiber cloth or non-woven fabric, or it can be Materials such as polyimide. The first adhesive layer 920 is directly attached to the first substrate layer 913 .

The first flexible circuit board 910 also has a second fracture 916 passing through the first cover film layer 911, the first conductive circuit layer 912 and the first substrate layer 913, and the second fracture 916 connects the first The flexible circuit board 910 is divided into two, that is, the second cutout 916 is located in the middle of the circuit board 900 . The first adhesive layer 920 has a through third fracture 921 . The first reinforcing plate 930 has a first through opening 931 . The second adhesive layer 940 has a through fourth fracture 941 . The positions of the second fracture 916 , the third fracture 921 , the first fracture 931 and the fourth fracture 941 are corresponding, the shapes are substantially the same, and they are connected.

The second flexible circuit board 950 is a double-sided flexible circuit board, which includes a fourth cover film layer 951, a fourth conductive circuit layer 952, a third base material layer 953, a third conductive circuit layer and layer 954 and a third cover film layer 955 . The fourth covering film layer 951 includes a fourth adhesive layer 9511 and a fourth dielectric layer 9512 that are attached together. The fourth dielectric layer 9512 is directly attached to the second adhesive layer 940 . The third covering film layer 955 includes a third adhesive layer 9551 and a third dielectric layer 9552 that are attached together. The third adhesive layer 9551 is directly attached to the third conductive circuit layer 954 . The fourth and third bonding layers 9511, 9551 are made of flexible bonding materials such as epoxy acrylate resin or epoxy resin. The materials of the fourth and third dielectric layers 9512, 9552 and the third substrate layer 953 are polyimide (PI), polyethylene phthalate (PET) and polyethylene naphthalate. Alcohol ester (PEN) and other flexible dielectric materials. A second conductive hole 956 electrically connecting the fourth conductive circuit layer 952 and the third conductive circuit layer 954 is formed on the second flexible circuit board 950 . The second conductive hole 956 extends from the fourth conductive circuit layer 952 to the third conductive circuit layer 954 and terminates at the third conductive circuit layer 954 or at the third substrate layer 953 . The second conductive hole 956 can be formed by electroplating metal on the hole wall, or can be formed by filling the hole with conductive paste. Of course, the second and third cover film layers 951, 955 can also be a solder resist layer; between the fourth conductive circuit layer 952 and the third substrate layer 953, and the third A bonding layer can be included between the conductive circuit layer 954 and the third substrate layer 953; the second flexible circuit board 950 can also be a single-sided or multi-layer flexible circuit board, preferably the most The outer two sides are insulating layers to insulate and protect the conductive circuit pattern.

The third adhesive layer 960 and the fourth adhesive layer 980 are made of flexible adhesive materials such as epoxy acrylate resin or epoxy resin. The second reinforcement board 970 is a commonly used insulation reinforcement material in the industry, for example, it can be a substrate material (FR1, FR2, FR3, FR4...) formed by impregnating resin such as paper, glass fiber cloth or non-woven fabric, or it can be Materials such as polyimide. The third adhesive layer 960 is directly attached to the third dielectric layer 9552 .

The third flexible circuit board 990 is similar to the first flexible circuit board 910 . In this embodiment, the third flexible circuit board 990 is a single-sided flexible circuit board, which includes a second cover film layer 991, a second conductive circuit layer 992 and a second substrate layer that are sequentially attached to each other. 993. The second substrate layer 993 is directly attached to the fourth adhesive layer 980 . The second cover film layer 991 includes a second adhesive layer 9911 and a second dielectric layer 9912 that are attached together. The second adhesive layer 9911 is directly attached to the second conductive circuit layer 992 . The second bonding layer 9911 is made of flexible bonding materials such as epoxy acrylate resin or epoxy resin. The materials of the second dielectric layer 9912 and the second substrate layer 993 are polyimide (PI), polyethylene phthalate (PET) and polyethylene naphthalate ( PEN) and other flexible dielectric materials. Of course, the second covering film layer 991 can also be only one layer of solder resist layer; a bonding layer can also be included between the second conductive circuit layer 992 and the second base material layer 993; The flexible circuit board 990 can also be a double-sided flexible circuit board or a multi-layer flexible circuit board. At this time, the third flexible circuit board 990 also includes conductive openings for electrically connecting the circuits of each layer; Both outermost sides of the third flexible circuit board 990 are insulating layers, so as to insulate and protect the conductive circuit pattern.

The third flexible circuit board 990 also has an eighth fracture 996 passing through the second covering film layer 991, the second conductive circuit layer 992 and the second substrate layer 993, and the third adhesive layer 960 has a The fifth fracture 961 through. The second reinforcing plate 970 has a through sixth fracture 971 . The fourth adhesive layer 980 has a through seventh fracture 981 . The fifth fracture 961, the sixth fracture 971, the seventh fracture 981 and the eighth fracture 996 all correspond to the position of the second fracture 916 and have roughly the same shape, and the fifth fracture 961, the sixth fracture 971, the The seventh break 981 and the eighth break 996 are connected, so that the area of the circuit board 900 corresponding to the second break 916 does not include the first and second reinforcing plates 930, 970, and is a flexible area. Of course, the fractures can also be located at one end of the circuit board 900; in addition, because of the first flexible circuit board 910, the first adhesive layer 920, the second adhesive layer 940, the third adhesive layer 960, the fourth Both the adhesive layer 980 and the third flexible circuit board 990 are flexible, so the second fracture 916, the third fracture 921, the fourth fracture 941, the eighth fracture 996, and the fifth fracture may not be provided. 961 and the seventh fracture 981, at this time, the first adhesive layer 920 and the second adhesive layer 940 are also filled in the first fracture 931, the third adhesive layer 960 and the fourth adhesive layer 980 Said sixth break 971 is also filled.

In this embodiment, the first cover film layer 911 of the circuit board 900 is formed with a plurality of first openings 9113, and the first openings 9113 pass through the first adhesive layer 9111 and the first dielectric layer 9112 Part of the first conductive circuit layer 912 is exposed from the first opening 9113 , and the first conductive circuit layer 912 exposed from the first opening 9113 forms a first pad 9121 . A first solder paste layer 914 is formed on the surface of the first solder pad 9121, and a first electronic component 915 is welded on the surface of the first solder paste layer 914, and the first electronic component 915 is electrically connected to the first solder pad 9121. connect. A plurality of second openings 9913 are formed on the second covering film layer 991, and the second openings 9913 pass through the second adhesive layer 9911 and the second dielectric layer 9912, and part of the second conductive circuit layer 992 Exposed from the second opening 9913 , the second conductive circuit layer 992 exposed from the second opening 9913 forms a second pad 9921 . A second solder paste layer 994 is formed on the surface of the second solder pad 9921, and a second electronic component 995 is welded on the surface of the second solder paste layer 994, and the second electronic component 995 is electrically connected to the second solder pad 9921. connect. Wherein, because the first and second reinforcing plates 930, 970 are located on the inner layer of the circuit board 900, the first electronic component 915 and the second electronic component 995 can be located on the inner layer of the circuit board 900. The opposite positions of the two sides of the circuit board 900 , that is, the first opening 9113 and the second opening 9913 may be located at the opposite positions of the two sides of the circuit board 900 . It can be understood that when the second fracture 916, the third fracture 921, the fourth fracture 941, the eighth fracture 996, the fifth fracture 961 and the seventh fracture 981 are not provided, the second fracture 916 and the first fracture The opening 9113 is staggered, and the second opening 916 and the second opening 9913 are also staggered, that is, the area of the first flexible circuit board 900 corresponding to the second opening 916 is not provided with the first The opening 9113 and the second opening 9913 . In addition, a first gold layer may be formed on the surface of the first welding pad 9121 , and the first electronic component 915 is soldered to the surface of the first gold layer through the first solder paste layer 914 . A second gold layer may also be formed on the surface of the second welding pad 9921 , and the second electronic component 995 is soldered to the surface of the second gold layer through the second solder paste layer 994 .

The circuit board 900 is also formed with a first conductive hole 901, a first blind hole 902 and a second blind hole 903, the first conductive hole 901 is at least electrically connected to the first and second conductive circuit layers 912, 992 . The first blind hole 902 is electrically connected to the first and fourth conductive circuit layers 912 , 952 . The second blind hole 903 is electrically connected to the third and second conductive circuit layers 954 and 992 . The first conductive hole 901 , the first blind hole 902 and the second blind hole 903 can be formed by electroplating metal on the wall of the hole, or can be formed by filling the hole with conductive paste.

Certainly, if the thickness of the first reinforcing plate 930 is sufficient to support each electronic component, the third adhesive layer 960 and the second reinforcing plate 970 may not be provided.

The reinforcing boards of the circuit boards 100, 900 provided by this technical solution are all located on the inner layer of the circuit board 100, 900, so the facing positions on both sides of the circuit board 100, 900 can simultaneously weld electronic parts, thereby The area of the circuit board can be reduced, thereby facilitating the assembly of the circuit board and saving the production cost of the circuit board.

It can be understood that, for those skilled in the art, various other corresponding changes and deformations can be made according to the technical concept of the present utility model, and all these changes and deformations should belong to the protection of the claims of the present utility model. scope.

Claims (13)

1. A circuit board, comprising a first flexible circuit board, a first adhesive layer, a first reinforcement board, a second adhesive layer and a second flexible circuit board that are attached in sequence, the first reinforcement The board has a first through opening, and the area of the circuit board corresponding to the first opening is a flexible area. 2. The circuit board according to claim 1, wherein the first adhesive layer has a through second fracture, the second adhesive layer has a through third fracture, the first fracture, The second fracture and the third fracture correspond to each other and have substantially the same shape so as to communicate with each other. 3. The circuit board according to claim 1, wherein the first flexible circuit board comprises a first cover film layer, a first conductive circuit layer and a first base material layer which are sequentially pasted together, and the The second flexible circuit board includes a second cover film layer, a second conductive circuit layer, and a second substrate layer that are sequentially attached, the first substrate layer is directly attached to the first adhesive layer, and the first substrate layer is directly attached to the first adhesive layer. The second substrate layer is directly attached to the second adhesive layer. 4. The circuit board according to claim 3, wherein the first covering film layer is formed with a plurality of through first openings, and part of the first conductive circuit layer is exposed from the first openings , the first conductive circuit layer exposed from the first opening forms a first pad, the surface of the first pad is soldered with a first electronic component, and the first fracture is staggered from the first opening set up. 5. The circuit board according to claim 4, wherein the second covering film layer is formed with a plurality of through second openings, and part of the second conductive circuit layer is exposed from the second openings , the second conductive circuit layer exposed from the second opening forms a second pad, the surface of the second pad is soldered with a second electronic component, and the first fracture is staggered from the second opening set up. 6 . The circuit board according to claim 5 , wherein the first opening is opposite to the second opening. 7. The circuit board according to claim 1, characterized in that, the circuit board further comprises a fourth adhesive layer attached to the side of the second flexible circuit board facing away from the second adhesive layer in sequence and the third flexible circuit board. 8. The circuit board according to claim 7, wherein the first flexible circuit board has a through second fracture, the first adhesive layer has a through third fracture, and the first flexible circuit board has a through second fracture. The second glue layer has a through fourth fracture, the fourth glue layer has a through seventh fracture, the third flexible circuit board has a through eighth fracture, the first, second, The positions of the third, fourth, seventh and eighth fractures correspond to each other and have approximately the same shape, and the first fracture, the third fracture, the second fracture and the fourth fracture are connected, and the seventh fracture and the eighth fracture interlinked. 9. The circuit board according to claim 8, characterized in that, the circuit board further comprises a third adhesive layer and a second reinforcing plate, and the third adhesive layer and the second flexible The second reinforcing plate is attached to the fourth adhesive layer, the third adhesive layer has a through fifth fracture, and the second reinforcing plate has a through sixth Fractures, the fifth fracture and the sixth fracture correspond to the first fracture and have substantially the same shape, and the fifth fracture, the sixth fracture, the seventh fracture and the eighth fracture are connected. 10. The circuit board according to claim 8 or 9, characterized in that, the first flexible circuit board comprises a first cover film layer, a first conductive circuit layer and a first substrate layer which are sequentially attached to each other, The third flexible circuit board includes a second cover film layer, a second conductive circuit layer, and a second substrate layer that are sequentially attached, the first substrate layer is directly attached to the first adhesive layer, The second substrate layer is directly attached to the fourth adhesive layer. 11. The circuit board according to claim 10, wherein the first covering film layer is formed with a plurality of through first openings, and part of the first conductive circuit layer is exposed from the first openings , the first conductive circuit layer exposed from the first opening forms a first pad, and a first electronic component is welded on the surface of the first pad. 12. The circuit board according to claim 11, wherein the second covering film layer is formed with a plurality of through second openings, part of the second conductive circuit layer is exposed from the second openings , the second conductive circuit layer exposed from the second opening forms a second welding pad, and a second electronic component is welded on the surface of the second welding pad. 13. The circuit board according to claim 12, wherein the first opening is disposed opposite to the second opening.

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