CN219106084U

CN219106084U - Wafer stripping device

Info

Publication number: CN219106084U
Application number: CN202223612697.7U
Authority: CN
Inventors: 朱伟杰; 刘东立; 杨猛; 刘霄
Original assignee: West Lake Instruments Hangzhou Technology Co ltd
Current assignee: West Lake Instruments Hangzhou Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-05-30
Anticipated expiration: 2032-12-30

Abstract

The utility model relates to a wafer stripping device which comprises a frame, a fixture and a lifting mechanism, a stripping fixture, a force value detection module and a control module, wherein the fixture and the lifting mechanism are arranged on the frame, the stripping fixture is arranged above the fixture, the force value detection module is arranged between an output end of the lifting mechanism and the stripping fixture, and a signal input end of the control module is electrically connected with the force value detection module and a signal output end of the control module is electrically connected with the lifting mechanism. According to the utility model, the lifting mechanism and the stripping clamp are used for stripping the crystal ingot on the fixture clamp, the force value detection module and the control module are used for assisting in ensuring that the stripping clamp and the crystal ingot are kept at the preset adsorption pressure, the installation position, the stripping pressure and the stripping operation are all controlled mechanically, and the stripping device has a simple structure, is convenient to maintain, and can ensure the parallel precision of the stripped wafer while considering the stripping efficiency.

Description

Wafer stripping device

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a wafer stripping device.

Background

Wafers play a significant role in the semiconductor industry as a base material for manufacturing semiconductor devices and chips. The wafer manufacturing process comprises crystal bar manufacturing and wafer manufacturing, wherein the wafer manufacturing comprises the steps of crystal bar cutting and detecting, outer diameter grinding, slicing, round edge and grinding, etching, defect removing, cleaning, checking, packaging and the like. At present, after the ingot is sliced by laser, a very thin modified layer mixed with amorphous silicon, amorphous carbon and amorphous silicon carbide is formed, in which molecular bonding of materials is broken, connection of materials is weakened, and then the materials are split into two pieces for the next grinding operation.

Existing wafer lift-off generally employs thermal or cold separation techniques. The thermal separation technology comprises the steps of coating thermoplastic glue on a stripping clamp, then driving the thermoplastic glue to adhere to the surface of a workpiece of the tool clamp, and naturally cooling stress splits generated by means of thermal expansion coefficient differences to obtain a thin-layer wafer; the cold separation technology is to adsorb the upper surface of the ingot by an adsorption sheet, place the whole ingot in a liquid environment, apply ultrasonic action to reduce the strength of the stripping layer, and then control the adsorption sheet to rise by a cylinder to separate the wafer. The two stripping devices have complex structures, the adsorption pressure on the wafer in the stripping process is uncontrollable, and finally, the wafer obtained by stripping has larger poor precision and needs to be improved.

Disclosure of Invention

The utility model aims to solve the problems of complex structure and uncontrollable adsorption pressure in the stripping process of the device used in the existing cold and hot separation technology, and achieves the effects of simple structure and capability of ensuring the parallel precision of the stripped wafer.

The above object of the present utility model is achieved by the following technical solutions:

the wafer stripping device comprises a frame, a fixture and a lifting mechanism arranged on the frame, a stripping fixture arranged above the fixture, a force value detection module arranged between an output end of the lifting mechanism and the stripping fixture, and a control module, wherein a signal input end of the control module is electrically connected with the force value detection module, and a signal output end of the control module is electrically connected with the lifting mechanism.

By adopting the technical scheme, when the ingot is stripped, the ingot which is subjected to laser slicing is fixedly arranged on the fixture clamp in advance, the stripping clamp is driven to move towards the ingot by the lifting mechanism, after the adsorption surface of the stripping clamp is attached to the surface of the ingot, the force value detection module detects a pressure signal and feeds back the pressure signal to the control module, the control module controls the lifting mechanism to stop feeding action until the detection pressure reaches a preset value, after the pressure is maintained for a certain time, the stripping clamp and the ingot are kept at a preset adsorption pressure, and then the stripping clamp is driven to move away from the ingot by the lifting mechanism, so that mechanical stripping is completed; in the process, the lifting mechanism and the stripping clamp are used for stripping the ingot on the tool clamp, the force value detection module and the control module are used for assisting in keeping the preset adsorption pressure between the stripping clamp and the ingot, the installation position, the stripping pressure and the stripping operation are controlled by a machine, the stripping device is simple in structure and convenient to maintain, and the parallel precision of the stripped wafer can be ensured while the stripping efficiency is considered.

The utility model is further provided with: the tool clamp comprises a bottom plate, a top plate, a plurality of clamping cylinders and clamping jaws, wherein the top plate is arranged on the bottom plate in a clearance way and provided with a feed inlet, the clamping cylinders are circumferentially arranged along the feed inlet and arranged between the bottom plate and the top plate, the clamping jaws are arranged on piston rods of the clamping cylinders, and a moving path of the clamping jaws passes through the lower part of the feed inlet.

Through adopting above-mentioned technical scheme, form the multiple spot location centre gripping around the ingot through a plurality of movable clamping jaw, can make the installation axial lead of not unidimensional ingot on frock clamp tend to unanimous, the relative position of ingot axis and stripping clamp tends to unanimous promptly, simultaneously, the mode of centre gripping cylinder drive can make keep suitable precompression between clamping jaw and the ingot, finally realize the centre gripping location to the ingot to can guarantee the uniformity of ingot mounted position, and then guarantee the parallel precision of back wafer of stripping.

The utility model is further provided with: the clamping surface of the clamping jaw is an arc-shaped concave step surface.

By adopting the technical scheme, the clamping stability is better.

The utility model is further provided with: the lifting mechanism comprises a first supporting plate, a lifting motor arranged on the first supporting plate, a plurality of sliding rods arranged between the frame and the first supporting plate, a second supporting plate which is connected to the sliding rods in a sliding mode, a screw pair with a moving end arranged on the second supporting plate, and a belt transmission pair arranged between an output shaft of the lifting motor and a rotating end of the screw pair, wherein the force value detection module is arranged on the second supporting plate.

Through adopting above-mentioned technical scheme, screw transmission has that the starting torque is little, auto-lock is good advantage, and the cooperation belt drive can realize the transmission of the power between the multiple axis, and then at the power value detection module detection pressure in-process, realizes the accurate regulation to the second layer board height to the absorption pressure between accurate regulation stripping jig and the ingot reaches the predetermined value.

The utility model is further provided with: the screw rod pair is provided with at least two, the belt transmission pair comprises a driving wheel arranged on an output shaft of the lifting motor, a driven wheel arranged at a rotating end of the screw rod pair, and at least two transmission belts respectively sleeved on the driving wheel and the driven wheel or on two adjacent driven wheels.

By adopting the technical scheme, the belt transmission has the advantages of stable operation, low noise and shock absorption and buffering, and can drive the rotating ends of the screw rod pairs to rotate stably.

The utility model is further provided with: the belt transmission pair further comprises a plurality of tensioning wheels, the tensioning wheels are arranged in one-to-one correspondence with the transmission belts on the two adjacent driven wheels, and the positions of the tensioning wheels on the first supporting plate are adjustable.

Through adopting above-mentioned technical scheme, the tight pulley that rises slides through the fastener and locks on first layer board, after the drive belt pine takes off, can establish it on the tight pulley that rises, is favorable to guaranteeing transmission efficiency.

The utility model is further provided with: the screw rod pair comprises a screw rod shaft which is arranged on the belt transmission auxiliary output shaft and is rotationally connected to the rack, and a transmission nut which is arranged on the second supporting plate and is in threaded connection with the screw rod shaft.

Through adopting above-mentioned technical scheme, elevator motor passes through the vice lead screw axle rotation that drives of belt drive, owing to receive the guide effect of slide bar, and drive nut drives second layer board and removes along lead screw axle length direction, realizes the accurate regulation to second layer board height.

The utility model is further provided with: the stripping clamp is provided with a vacuum chuck.

By adopting the technical scheme, the mechanical stripping efficiency is higher.

The utility model is further provided with: the force value detection module comprises a pressure sensor arranged at the output end of the lifting mechanism, a guide rod arranged on the stripping clamp and a pressure spring sleeved on the guide rod, wherein two ends of the pressure spring are respectively arranged at the output end of the lifting mechanism and the stripping clamp.

By adopting the technical scheme, after the adsorption surface of the stripping clamp is attached to the surface of the ingot, the lifting mechanism continues to feed, the pressure spring is compressed, and meanwhile, the detection end of the pressure sensor can be abutted against the stripping clamp to measure the contact pressure; when the pressure sensor is stripped, the pressure spring utilizes the self-pretightening effect to reset the pressure sensor.

The utility model is further provided with: the control module is set as a singlechip, a microprocessor, a control panel or a main control chip.

By adopting the technical scheme, the lifting mechanism can be regulated and controlled.

In summary, the beneficial technical effects of the utility model are as follows: the lifting mechanism and the stripping clamp are used for stripping the crystal ingot on the tool clamp, the force value detection module and the control module are used for assisting in ensuring that the stripping clamp and the crystal ingot are kept at preset adsorption pressure, the installation position, the stripping pressure and the stripping operation are controlled by a machine, and the stripping device is simple in structure and convenient to maintain, and can ensure the parallel precision of the stripped wafer while considering the stripping efficiency.

Drawings

Fig. 1 is a schematic structural view of a wafer stripping apparatus of the present utility model.

FIG. 2 is a schematic diagram of the connection between the tool clamp and the lifting mechanism.

Fig. 3 is a schematic structural view of the tool fixture of the present utility model.

In the figure, 1, a rack; 2. a fixture clamp; 21. a bottom plate; 22. a top plate; 221. a feed inlet; 23. a clamping cylinder; 24. a clamping jaw; 241. a step surface; 3. a lifting mechanism; 31. a first pallet; 32. a lifting motor; 33. a slide bar; 34. a second pallet; 35. a screw pair; 351. a screw shaft; 352. a drive nut; 36. a belt drive pair; 361. a driving wheel; 362. driven wheel; 363. a transmission belt; 364. a tensioning wheel; 4. stripping the clamp; 5. a force value detection module; 51. a pressure sensor; 52. a guide rod; 53. a pressure spring; 6. and a control module.

Detailed Description

The utility model will be further described with reference to the drawings and detailed description in order to make the technical means, the creation characteristics, the achievement of the objects and the functions of the utility model more clear and easy to understand.

Referring to fig. 1, a wafer stripping device disclosed in the utility model comprises a frame 1, a fixture 2 and a lifting mechanism 3 arranged on the frame 1, a stripping fixture 4 arranged above the fixture 2, a force value detection module 5 arranged between an output end of the lifting mechanism 3 and the stripping fixture 4, and a control module 6. Wherein, peel off anchor clamps 4 and set up to vacuum chuck, control module 6 sets up to singlechip, microprocessor, control panel or main control chip, and this embodiment is preferably microprocessor, and control module 6's signal input part electricity is connected in power value detection module 5, signal output part electricity is connected in elevating system 3.

Specifically, the force value detection module 5 includes a pressure sensor 51 disposed at an output end of the lifting mechanism 3, a guide rod 52 disposed on the peeling clamp 4, and a compression spring 53 sleeved on the guide rod 52, where two ends of the compression spring 53 are disposed on the output end of the lifting mechanism 3 and the peeling clamp 4, respectively. After the adsorption surface of the peeling jig 4 is attached to the ingot surface, the lifting mechanism 3 continues to feed, the compression spring 53 compresses, and the detection end of the pressure sensor 51 can abut on the peeling jig 4 to measure the contact pressure. When the pressure sensor 51 is peeled off, the pressure spring 53 resets by its own pretension.

Referring to fig. 2, the elevating mechanism 3 includes an elevating motor 32 provided on the first pallet 31, a plurality of slide bars 33 provided between the frame 1 and the first pallet 31, a second pallet 34 slidably connected to the slide bars 33, a screw pair 35 having a moving end provided on the second pallet 34, and a belt transmission pair 36 provided between an output shaft of the elevating motor 32 and a rotating end of the screw pair 35. The two screw pairs 35 are provided, the screw pair 35 includes a screw shaft 351 rotatably connected to the frame 1, and a transmission nut 352 disposed on the second support plate 34 and screwed to the screw shaft 351, and the pressure sensor 51 is disposed on the second support plate 34. In addition, the belt transmission pair 36 includes a driving wheel 361 disposed on an output shaft of the lifting motor 32, a driven wheel 362 disposed on the screw shaft 351, two driving belts 363 respectively sleeved on the driving wheel 361 and the driven wheel 362 or on two adjacent driven wheels 362, and a tensioning wheel 364, where the tensioning wheel 364 is disposed corresponding to the driving belts 363 on two adjacent driven wheels 362, and the tensioning wheel 364 slides and is locked on the first supporting plate 31 through a fastener, and after the driving belts 363 are released, they can be sleeved on the tensioning wheel 364, so as to be beneficial to ensuring transmission efficiency.

Referring to fig. 3, in addition, the installation form between the tool fixture 2 and the frame 1 may be a fixed connection, a detachable connection or a sliding connection. The tool fixture 2 comprises a bottom plate 21 arranged on the frame 1, a top plate 22 which is arranged on the bottom plate 21 in a clearance way and provided with a feed inlet 221, four clamping cylinders 23 which are circumferentially arranged along the feed inlet 221 and are arranged between the bottom plate 21 and the top plate 22, and clamping claws 24 arranged on piston rods of the clamping cylinders 23. Wherein the clamping surface of the clamping jaw 24 is provided as an arc-shaped concave step surface 241, and the moving path of the clamping jaw 24 passes below the feeding hole 221. The movable clamping jaws 24 form multi-point positioning clamping around the ingot, so that the installation axes of the ingots with different sizes on the tool clamp 2 tend to be consistent, namely, the relative positions of the central axes of the ingot and the stripping clamp 4 tend to be consistent, meanwhile, the clamping cylinder 23 is driven to keep proper pre-pressure between the clamping jaws 24 and the ingot, the clamping and positioning of the ingot are finally realized, the consistency of the installation positions of the ingot can be ensured, and the parallel precision of stripped wafers is further ensured.

The implementation principle of the embodiment is as follows: when the ingot is stripped, the ingot which is subjected to laser slicing is fixedly arranged on the tool fixture 2 in advance, the stripping fixture 4 is driven to move towards the ingot through the lifting mechanism 3, after the adsorption surface of the stripping fixture 4 is attached to the surface of the ingot, the force value detection module 5 detects a pressure signal and feeds back the pressure signal to the control module 6, the control module 6 controls the lifting mechanism 3 to stop feeding action until the detection pressure reaches a preset value, after the pressure is maintained for a certain time, the stripping fixture 4 and the ingot are kept at a preset adsorption pressure, and the stripping fixture 4 is driven to move away from the ingot through the lifting mechanism 3, so that mechanical stripping is completed. In the process, the lifting mechanism 3 and the stripping clamp 4 are used for stripping the ingot on the tool clamp 2, the force value detection module 5 and the control module 6 are assisted to ensure that the stripping clamp 4 and the ingot are kept at a preset adsorption pressure, the installation position, the stripping pressure and the stripping operation are all completed by mechanical control, and the stripping device has a simple structure and is convenient to maintain, so that the stripping efficiency is considered, and the parallel precision of the stripped wafer is ensured.

Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present utility model and not for limiting the same, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present utility model, which is intended to be covered by the scope of the claims of the present utility model.

Claims

1. The utility model provides a wafer stripping off device which characterized in that: including frame (1), set up in frock clamp (2) and elevating system (3) on frame (1), arrange in peel off anchor clamps (4) of frock clamp (2) top, set up in force value detection module (5) between elevating system (3) output and peel off anchor clamps (4), and control module (6), the signal input part electricity of control module (6) connect in force value detection module (5), signal output part electricity connect in elevating system (3).

2. The wafer lift-off apparatus of claim 1, wherein: the tool clamp (2) comprises a bottom plate (21), a top plate (22) which is arranged on the bottom plate (21) in a clearance way and provided with a feed inlet (221), a plurality of clamping cylinders (23) which are circumferentially arranged along the feed inlet (221) and are arranged between the bottom plate (21) and the top plate (22), and clamping jaws (24) which are arranged on piston rods of the clamping cylinders (23), wherein a moving path of the clamping jaws (24) passes through the lower part of the feed inlet (221).

3. The wafer lift-off apparatus of claim 2, wherein: the clamping surface of the clamping jaw (24) is an arc-shaped concave step surface (241).

4. The wafer lift-off apparatus of claim 1, wherein: the lifting mechanism (3) comprises a first supporting plate (31), a lifting motor (32) arranged on the first supporting plate (31), a plurality of sliding rods (33) arranged between the frame (1) and the first supporting plate (31), a second supporting plate (34) connected to the sliding rods (33) in a sliding mode, a screw pair (35) with a moving end arranged on the second supporting plate (34) and a belt transmission pair (36) arranged between an output shaft of the lifting motor (32) and a rotating end of the screw pair (35), wherein the force value detection module (5) is arranged on the second supporting plate (34).

5. The wafer lift-off apparatus of claim 4, wherein: the screw pair (35) is provided with at least two, the belt transmission pair (36) comprises a driving wheel (361) arranged on an output shaft of the lifting motor (32), a driven wheel (362) arranged at a rotating end of the screw pair (35), and at least two transmission belts (363) respectively sleeved on the driving wheel (361) and the driven wheel (362) or on two adjacent driven wheels (362).

6. The wafer lift-off apparatus of claim 5, wherein: the belt transmission pair (36) further comprises a plurality of tensioning wheels (364), the tensioning wheels (364) are arranged in one-to-one correspondence with the transmission belts (363) on the two adjacent driven wheels (362), and the positions of the tensioning wheels (364) on the first supporting plate (31) are adjustable.

7. The wafer lift-off apparatus of claim 4, wherein: the screw pair (35) comprises a screw shaft (351) which is arranged on an output shaft of the belt transmission pair (36) and is rotationally connected to the frame (1), and a transmission nut (352) which is arranged on the second supporting plate (34) and is in threaded connection with the screw shaft (351).

8. The wafer lift-off apparatus of claim 1, wherein: the stripping clamp (4) is provided with a vacuum chuck.

9. The wafer lift-off apparatus of claim 1, wherein: the force value detection module (5) comprises a pressure sensor (51) arranged at the output end of the lifting mechanism (3), a guide rod (52) arranged on the stripping clamp (4) and a pressure spring (53) sleeved on the guide rod (52), wherein two ends of the pressure spring (53) are respectively arranged at the output end of the lifting mechanism (3) and the stripping clamp (4).

10. The wafer lift-off apparatus of claim 1, wherein: the control module (6) is set as a singlechip, a microprocessor, a control panel or a main control chip.