CN112736021B - Clamping device for ultrathin silicon wafer - Google Patents
Clamping device for ultrathin silicon wafer Download PDFInfo
- Publication number
- CN112736021B CN112736021B CN202110033994.7A CN202110033994A CN112736021B CN 112736021 B CN112736021 B CN 112736021B CN 202110033994 A CN202110033994 A CN 202110033994A CN 112736021 B CN112736021 B CN 112736021B
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- clamping
- controller
- base
- silicon wafer
- carrier
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 51
- 239000010703 silicon Substances 0.000 title claims abstract description 51
- 230000007246 mechanism Effects 0.000 claims abstract description 32
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 235000012431 wafers Nutrition 0.000 claims description 46
- 238000003466 welding Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000877 morphologic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application discloses a clamping device for an ultrathin silicon wafer, which comprises a structural main body, wherein the structural main body comprises a clamping base and a carrier base, the clamping base is connected with the carrier base, both the clamping base and the carrier base are provided with sliding rails, one side of the clamping base is provided with a servo motor, the clamping base is also provided with a clamping frame, the carrier base is provided with an arched carrier, the middle part of the clamping frame is provided with a connecting rod in a penetrating way, the clamping frame is also provided with a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism are symmetrically arranged on two sides of the clamping frame, and both the first clamping mechanism and the second clamping mechanism comprise a plurality of clamping pieces.
Description
Technical Field
The invention relates to the technical field of clamping devices, in particular to a clamping device for an ultrathin silicon wafer.
Background
The chip made of silicon chip is a so-called "magic operator" and has a remarkable computing capability. No matter how complex the mathematical problem, the physical problem and the engineering problem are, and no matter how much the workload is calculated, the staff only needs to tell the problem through a computer keyboard and give the thought and the instruction for solving the problem, and the computer can tell the answer to you in a very short time. Regardless of the thickness of the silicon wafer, manufacturers of crystalline silicon photovoltaic cells place extremely high demands on the quality of the silicon wafer. The silicon wafer cannot have surface damage (microcrack and wire saw mark), so that the morphological defects (bending, concave-convex and uneven thickness) are minimized, and the requirements on additional back-end treatment such as polishing and the like are also minimized;
However, the silicon wafer clamping device in the prior art is poor in stability, the silicon wafer is clamped by adopting a traditional harder clamping piece, the damage to the silicon wafer is large, the clamping quantity is small, and the production and processing efficiency is affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a clamping device for an ultrathin silicon wafer.
The technical scheme adopted for solving the technical problems is as follows:
The utility model provides a clamping device of ultra-thin silicon chip, includes the structure main part, the structure main part includes clamping base and carrier base, the clamping base with the carrier base links to each other, the clamping base with the carrier base all is equipped with the slide rail, clamping base one side is equipped with servo motor, the clamping base still is equipped with the clamping frame, the carrier base is equipped with and is arched carrier, the connecting rod has been worn in the middle part of clamping frame, the clamping frame still is equipped with first fixture and second fixture, first fixture with second fixture symmetry is located the both sides of clamping frame, just first fixture with second fixture all includes a plurality of holders;
The connecting rod is internally sleeved with a rotating shaft, the connecting rod is movably connected with the rotating shaft, the rotating shaft is meshed with the servo motor and is connected with the clamping piece, a clamping controller is arranged at the joint of the rotating shaft and the clamping piece, bearings are arranged on two sides of the clamping controller, the clamping piece consists of clamping jaws, a jacking device and a vacuum generator, positioning sensors are arranged on two sides of the vacuum generator, a hollow sleeve is arranged between the jacking device and the clamping jaws, a pusher is arranged in the jacking device, and a vacuum suction nozzle is further arranged on the clamping jaws;
The connecting rod bottom is equipped with first controller and second controller respectively, first controller with the both sides of second controller are equipped with the slide, the slide with the connecting rod welding, first controller embeds has the control unit chip, the control unit chip is used for receiving positioning sensor's signal to form output servo motor control signal through CAN interface circuit, first controller with the centre gripping controller control is connected, the second controller respectively with vacuum generator reaches positioning sensor control is connected.
In particular, the carrier is connected with the carrier base, a plurality of silicon wafer containing frames are arranged on the carrier, clamping pins for fixing are arranged on the silicon wafer containing frames in a penetrating mode, the silicon wafer containing frames have inclination angles, and the silicon wafer containing frames correspond to the first clamping mechanism and the second clamping mechanism respectively.
Particularly, the slide rail is connected with the slide plate, the slide plate is connected with the first controller, the slide plate is annular, the slide plate is used for driving the connecting rod to move onto the carrier in a translational mode, and the slide plate and the slide rail are electrically driven.
Particularly, the inside spout that is equipped with of axis of rotation, the location sensor is located in the spout, the location sensor with holder fixed connection, the location sensor passes through the spout and slides to the position of predetermineeing to drive the holder and translate.
Specifically, the vacuum suction nozzle is arranged at two sides of the clamping jaw, the vacuum suction nozzle is connected with the hollow sleeve, the hollow sleeve is communicated with the vacuum suction nozzle, the hollow sleeve is connected with the vacuum generator, and the vacuum suction nozzle generates negative pressure by utilizing a positive pressure air source through the vacuum generator so as to enable the vacuum suction nozzle to generate suction for clamping.
In particular, the clamping pieces are annularly distributed on the connecting rod, the clamping pieces rotate through connection between the rotating shaft and the servo motor, and the servo motor is in control connection with the first controller.
Compared with the prior art, the invention has the beneficial effects that:
The invention relates to a clamping device for ultrathin silicon wafers, which is characterized in that a clamping base and a carrier base are mutually connected in parallel in the use process, slide rails are arranged on the clamping base and the carrier base, a servo motor is arranged on one side of the clamping base, a connecting rod is penetrated by the clamping frame arranged on the clamping base, a first clamping mechanism and a second clamping mechanism are respectively arranged on the connecting rod through a slide plate connecting the connecting rod, a rotating shaft is arranged in the connecting rod, a clamping controller is arranged on the rotating shaft, the first clamping mechanism and the second clamping mechanism are composed of a plurality of clamping pieces, clamping pieces are provided with clamping jaws, a lifter and a vacuum generator, the vacuum generator is connected with the clamping controller, when the clamping is needed through the vacuum generator, suction force is generated to suck the silicon wafers, positioning sensors are arranged on two sides of the vacuum generator, the positioning sensors are arranged in the sliding grooves and fixedly connected with the clamping controllers, after the positioning sensors are driven through the first controller, the positioning sensors slide on the sliding grooves, the clamping pieces move to the clamping frames correspondingly, the clamping jaws are moved to the clamping frames, the clamping frames can be moved synchronously, the silicon wafers can be transported until the clamping frames are in a high-efficient state, and the silicon wafers are damaged, the silicon wafers can be transported and the silicon wafers can be continuously and easily and rapidly placed in the vibration mode, and the clamping device is damaged when the clamping frames are in the process of the state, and the silicon wafer is in the state when the state, and the silicon wafer is easy to be transported and damaged when the silicon wafer is transported, the cost is effectively saved, and the safety and reliability are realized.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic view of a clamping frame according to the present invention;
FIG. 3 is a schematic view of another structure of the clamping frame of the present invention;
FIG. 4 is a schematic view of a rotating shaft according to the present invention;
FIG. 5 is a schematic view of the portion A of FIG. 2 according to the present invention;
fig. 6 is a schematic diagram illustrating the internal operation principle of the first controller according to the present invention.
Reference numerals in the drawings:
1. Clamping a base; 2. a carrier base; 3. a carrier rack; 4. a clamping frame; 5. a servo motor; 6. A silicon wafer containing frame; 7. a slide rail; 8. a first clamping mechanism; 9. a second clamping mechanism; 10. a clamping member; 11. a connecting rod; 12. a rotating shaft; 13. a slide plate; 14. a second controller; 15. a first controller; 16. a clamp controller; 17. a bearing; 18. a clamping jaw; 19. positioning a sensor; 20. a vacuum generator; 21. a jack; 22. a hollow sleeve; 23. a vacuum suction nozzle; 24. a bayonet lock; 25. and a sliding groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1-6, the invention provides a clamping device for ultrathin silicon wafers, which comprises a structural main body, wherein the structural main body comprises a clamping base 1 and a carrier base 2, the clamping base 1 is connected with the carrier base 2, both the clamping base 1 and the carrier base 2 are provided with sliding rails 7, one side of the clamping base 1 is provided with a servo motor 5, the clamping base 1 is also provided with a clamping frame 4, the carrier base 2 is provided with an arched carrier 3, the middle part of the clamping frame 4 is penetrated with a connecting rod 11, the clamping frame 4 is also provided with a first clamping mechanism 8 and a second clamping mechanism 9, the first clamping mechanism 8 and the second clamping mechanism 9 are symmetrically arranged on two sides of the clamping frame 4, the first clamping mechanism 8 and the second clamping mechanism 9 both comprise a plurality of clamping pieces 10, the connecting rod 11 is internally sleeved with a rotating shaft 12, the connecting rod 11 is movably connected with the rotating shaft 12, the rotating shaft 12 is meshed with the servo motor 5, the rotating shaft 12 is connected with the clamping piece 10, a clamping controller 16 is arranged at the joint of the rotating shaft 12 and the clamping piece 10, bearings 17 are arranged on two sides of the clamping controller 16, the clamping piece 10 consists of clamping jaws 18, a lifter 21 and a vacuum generator 20, positioning sensors 19 are arranged on two sides of the vacuum generator 20, a hollow sleeve 22 is arranged between the lifter 21 and the clamping jaws 18, a pusher is arranged in the lifter 21, a vacuum suction nozzle 23 is also arranged on the clamping jaws 18, a first controller 15 and a second controller 14 are respectively arranged at the bottom of the connecting rod 11, sliding plates 13 are arranged on two sides of the first controller 15 and the second controller 14, the sliding plate 13 is welded with the connecting rod 11, a control unit chip is arranged in the first controller 15 and is used for receiving signals of the positioning sensor 19 and forming output servo motor control signals through a CAN interface circuit, the first controller 15 is in control connection with the clamping controller 16, and the second controller 14 is respectively in control connection with the vacuum generator 20 and the positioning sensor 19.
Further stated, the carrier 3 is connected with the carrier base 2, the carrier 3 is provided with a plurality of silicon wafer holding frames 6, the silicon wafer holding frames 6 are provided with clamping pins 24 for fixing in a penetrating manner, the silicon wafer holding frames 6 have inclination angles, the silicon wafer holding frames 6 respectively correspond to the first clamping mechanisms 8 and the second clamping mechanisms 9, the silicon wafer holding frames 6 are arranged along the arc shape of the carrier 3, the clamping jaws 18 are pushed outwards by the pusher of the jack 21, the silicon wafer holding frames also have a retracting function, the silicon wafer holding frames are fixed and unlocked through the clamping pins 24, the angles of the first clamping mechanisms 8 and the second clamping mechanisms 9 are consistent with those of the silicon wafer holding frames 6 through the rotating shafts 12, and the silicon wafer holding frames 6 are placed from bottom to top in sequence.
Further stated, the sliding rail 7 is connected with the sliding plate 13, the sliding plate 13 is connected with the first controller 15, the sliding plate 13 is annular, the sliding plate 13 is used for driving the connecting rod 11 to move onto the carrier 3 in a translational manner, the sliding plate 13 and the sliding rail 7 are electrically driven, and the sliding plate 13 is controlled to translate left and right on the sliding rail 7 after being electrified by the second controller 14.
Further, the vacuum nozzles 23 are disposed on two sides of the clamping jaw 18, the vacuum nozzles 23 are connected with the hollow sleeve 22, the hollow sleeve 22 is communicated with the vacuum nozzles 23, the hollow sleeve 22 is connected with the vacuum generator 20, the vacuum nozzles 23 generate negative pressure by using a positive pressure air source through the vacuum generator 20 to enable the vacuum nozzles 23 to generate suction force for clamping, the vacuum generator 20 is connected with the positioning sensor 19, and after the vacuum generator 20 moves to a preset distance through the positioning sensor 19, the vacuum nozzles are automatically placed by releasing air pressure or the suction clamping silicon wafer.
It is further described that the clamping pieces 10 are annularly distributed on the connecting rod 11, the clamping pieces 10 rotate through connection between the rotating shaft 12 and the servo motor 5, the servo motor 5 is in control connection with the first controller 15, a control unit chip is arranged in the first controller 15 and is used for receiving signals of the positioning sensor 19, and output servo motor control signals are formed through a CAN interface circuit, when the servo motor 5 receives the control signals, the movement is stopped, namely, the operation is stopped after the number of silicon wafer containing frames 6 on the carrier frame 3 is full, and the operation is started again until the empty silicon wafer containing frames 6 are replaced.
The specific working principle is as follows: in the use, clamping base 1 and carrier base 2 are parallel connection each other, and set up slide rail 7 on both, carrier 3 through slide 13 translation slip to carrier base 2 on, servo motor 5 has been set up in one side of clamping base 1 and the carrier 4 of setting on clamping base 1 wears to be equipped with a connecting rod 11, connect connecting rod 11 through slide 13 and realize synchronous motion, set up first fixture 8 and second fixture 9 respectively on connecting rod 11, rotation axis 12 has been set up in connecting rod 11's inside, clamping controller 16 has been set up on its rotation axis 12, at first fixture 8 and second fixture 9 by a plurality of clamping pieces 10 constitution, clamping piece 10 is provided with clamping jaw 18, ejector 21 and vacuum generator 20, at vacuum generator 20 connection clamping controller 16, produce the suction and hold the silicon chip in the process that needs the centre gripping through vacuum generator 20, set up positioning sensor 19 in the both sides at vacuum generator 20, positioning sensor 19 sets up in spout 25, and with clamping controller 16 fixed connection first fixture 8 and second fixture 9 have been set up at the position sensor 19, after the position sensor 19 is held at the position 6 is held to the carrier 6 in order to keep on the position after the carrier 6 is held to the carrier is held, the position is held to the carrier is continued to the carrier is held in a position after the position 6, the carrier is kept in the position is moved, the position is kept in order to take place the position and the operator is moved and is held in the position after the position is kept full of the position 6, and the position is kept in order to take up the position and after the position is moved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The clamping device for the ultrathin silicon wafer is characterized by comprising a structural main body, wherein the structural main body comprises a clamping base and a carrier base, the clamping base is connected with the carrier base, both the clamping base and the carrier base are provided with sliding rails, one side of the clamping base is provided with a servo motor, the clamping base is also provided with a clamping frame, the carrier base is provided with an arched carrier, the middle part of the clamping frame is provided with a connecting rod in a penetrating way, the clamping frame is also provided with a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism are symmetrically arranged on both sides of the clamping frame, and both the first clamping mechanism and the second clamping mechanism comprise a plurality of clamping pieces;
The connecting rod is internally sleeved with a rotating shaft, the connecting rod is movably connected with the rotating shaft, the rotating shaft is meshed with the servo motor and is connected with the clamping piece, a clamping controller is arranged at the joint of the rotating shaft and the clamping piece, bearings are arranged on two sides of the clamping controller, the clamping piece consists of clamping jaws, a jacking device and a vacuum generator, positioning sensors are arranged on two sides of the vacuum generator, a hollow sleeve is arranged between the jacking device and the clamping jaws, a pusher is arranged in the jacking device, and a vacuum suction nozzle is further arranged on the clamping jaws;
The connecting rod bottom is equipped with first controller and second controller respectively, first controller with the both sides of second controller are equipped with the slide, the slide with the connecting rod welding, first controller embeds has the control unit chip, the control unit chip is used for receiving positioning sensor's signal to form output servo motor control signal through CAN interface circuit, first controller with the centre gripping controller control is connected, the second controller respectively with vacuum generator reaches positioning sensor control is connected.
2. The clamping device for ultrathin silicon wafers according to claim 1, wherein the carrier is connected with the carrier base, a plurality of silicon wafer containing frames are arranged on the carrier, clamping pins for fixing are arranged on the silicon wafer containing frames in a penetrating mode, the silicon wafer containing frames have inclination angles, and the silicon wafer containing frames correspond to the first clamping mechanism and the second clamping mechanism respectively.
3. The device for clamping an ultrathin silicon wafer according to claim 1, wherein the sliding rail is connected with the sliding plate, the sliding plate is connected with the first controller, the sliding plate is annular, the sliding plate is used for driving the connecting rod to move onto the carrier in a translational manner, and the sliding plate and the sliding rail are electrically driven.
4. The device for clamping the ultrathin silicon wafer according to claim 1, wherein a chute is arranged on the inner side of the rotating shaft, the positioning sensor is arranged in the chute and fixedly connected with the clamping piece, and the positioning sensor slides to a preset position through the chute and drives the clamping piece to translate.
5. The device for clamping an ultrathin silicon wafer according to claim 1, wherein the vacuum suction nozzles are arranged on two sides of the clamping jaw, the vacuum suction nozzles are connected with the hollow sleeve, the hollow sleeve is communicated with the vacuum suction nozzles, the hollow sleeve is connected with the vacuum generator, and the vacuum suction nozzles generate negative pressure by utilizing a positive pressure air source through the vacuum generator so as to enable the vacuum suction nozzles to generate suction for clamping.
6. The clamping device for ultrathin silicon wafers according to claim 1, wherein the clamping pieces are annularly distributed on the connecting rod, the clamping pieces rotate through connection between a rotating shaft and a servo motor, and the servo motor is in control connection with the first controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110033994.7A CN112736021B (en) | 2021-01-19 | 2021-01-19 | Clamping device for ultrathin silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110033994.7A CN112736021B (en) | 2021-01-19 | 2021-01-19 | Clamping device for ultrathin silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112736021A CN112736021A (en) | 2021-04-30 |
| CN112736021B true CN112736021B (en) | 2024-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110033994.7A Active CN112736021B (en) | 2021-01-19 | 2021-01-19 | Clamping device for ultrathin silicon wafer |
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| CN (1) | CN112736021B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113808974B (en) * | 2021-09-07 | 2024-02-20 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214012924U (en) * | 2021-01-19 | 2021-08-20 | 意诚新能(苏州)科技有限公司 | Clamping device of ultra-thin silicon chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104701233B (en) * | 2015-03-10 | 2017-10-17 | 北京七星华创电子股份有限公司 | A kind of disk clamping device |
| CN108376668A (en) * | 2018-02-26 | 2018-08-07 | 上海提牛机电设备有限公司 | A kind of silicon chip clamping jaw and wafer clamping device |
| CN111341722A (en) * | 2020-03-14 | 2020-06-26 | 青岛博展智能科技有限公司 | Adjustable limiting and clamping device for chip processing |
| CN211788955U (en) * | 2020-04-13 | 2020-10-27 | 金寨嘉悦新能源科技有限公司 | Silicon wafer clamping mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN214012924U (en) * | 2021-01-19 | 2021-08-20 | 意诚新能(苏州)科技有限公司 | Clamping device of ultra-thin silicon chip |
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