CN114474441A - Silicon rod cutting equipment and system - Google Patents

Abstract

The embodiment of the application provides a silicon rod cutting equipment and system, wherein, silicon rod cutting equipment includes: the wire cutting machine comprises a base, a main frame, a bearing table and a wire cutting device; a cutting space is formed between the top plate and the base of the main frame; the bearing platform is used for bearing the silicon rod; the linear cutting device and the bearing table can relatively slide along the horizontal direction; the wire cutting device comprises two first cutting wire wheel sets and at least three second cutting wire wheel sets, cutting wires wound on the first cutting wire wheel sets are parallel to each other respectively, and the wire cutting device is used for cutting the silicon rod along the first cutting wires; the cutting lines wound on the second cutting line wheel sets are parallel to each other and are used for cutting the silicon rod along a second cutting plane; the second section is vertical to the first section to obtain at least two small silicon rods with rectangular sections and the edge skin material. The silicon rod cutting equipment and the silicon rod cutting system provided by the embodiment of the application can solve the technical problem existing in the traditional scheme that small silicon wafers are cut through large silicon wafers.

Description

Silicon rod cutting equipment and system

technical field

The present application relates to the cutting technology of hard and brittle materials, and in particular, to a device and system for cutting silicon rods.

Background technique

With the development of heterojunction cells, the market demand for small silicon wafers is increasing, and the demand for thin wafers is also increasing. The thickness is from 180 microns to 150 microns. , 80 micron thickness silicon wafer, and the thinner the silicon wafer, the smaller the silicon wafer specification is to ensure the cutting quality and process.

In the traditional solution, small pieces of monocrystalline silicon cells are usually first cut from monocrystalline silicon rods into large pieces of silicon wafers, and then diced and cut into small pieces of silicon wafers using laser technology, but in the process of laser scribing. , which will cause damage and defect states to the cross-section of the small silicon wafer, which will seriously affect the conversion efficiency of the final processed heterojunction cell.

Now the size of silicon rods is getting bigger and bigger, from 166mm to 182mm, and then to 210mm, and may reach 230mm or even 250mm in the future. high, easily broken.

SUMMARY OF THE INVENTION

In order to solve one of the above technical defects, a silicon rod cutting device and system are provided in the embodiments of the present application.

According to a first aspect of the embodiments of the present application, a silicon rod cutting device is provided, comprising:

pedestal;

The main frame is arranged on the base, and a cutting space is formed between the top plate of the main frame and the base;

a bearing platform, arranged on the main frame, for bearing the silicon rod;

The wire cutting device is arranged on the base; the wire cutting device and the carrying platform can slide relatively along the horizontal direction; the wire cutting device includes two first cutting wire wheel groups and at least three second cutting wire wheels The cutting lines respectively wound around the first cutting wire wheel groups are parallel to each other, and are used to cut the silicon rod along the first cut surface; the cutting lines respectively wound around the second cutting wire wheel groups are parallel to each other, using The silicon rod is cut along the second cut surface; the second cut surface is perpendicular to the first cut surface, and at least two small silicon rods and edge leathers with rectangular cross-sections are obtained.

According to a second aspect of the embodiments of the present application, a silicon rod cutting system is provided, including:

The above-mentioned cutting equipment is used for cutting silicon rods to obtain at least two small silicon rods and edge leathers with rectangular cross-sections;

Grinding equipment for grinding small silicon rods;

Edge leather cutting equipment, used for cutting edge leather;

and/or a slicing device for slicing small silicon rods.

However, in this embodiment, the silicon rods are cut simultaneously by using two first cut planes and at least three second cut planes, and at least two small silicon rods with smaller cross-sectional areas are directly obtained. The cutting steps are less and the efficiency is high. High, and the subsequent slicing of small silicon rods can directly obtain small silicon wafers that meet the size requirements of silicon wafers for the preparation of small-piece heterojunction cells, without the need for laser scribing steps, which improves the product quality of small silicon wafers, and then The conversion efficiency of the heterojunction cell is guaranteed.

Description of drawings

The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The schematic embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation of the present application. In the attached image:

1 is a flowchart of a method for cutting a silicon rod according to an embodiment of the present application;

2 is a schematic diagram of the method for cutting a silicon rod provided by an embodiment of the present application for cutting a silicon rod;

3 is a schematic structural diagram of cutting edge leather in the silicon rod cutting method provided by the embodiment of the present application;

4 is a schematic structural diagram of a silicon rod cutting device provided by an embodiment of the present application;

Fig. 5 is the structural representation of the wire cutting device in the cutting equipment shown in Fig. 4;

Fig. 6 is the structural representation that the wire cutting device in the cutting equipment shown in Fig. 4 cuts the silicon rod;

7 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application;

8 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application;

FIG. 9 is a schematic structural diagram of another silicon rod cutting device provided by an embodiment of the present application;

10 is a first structural schematic diagram of a wire cutting device in a silicon rod cutting device provided by an embodiment of the application;

11 is a second structural schematic diagram of a wire cutting device in a silicon rod cutting device provided in an embodiment of the application;

12 is a schematic structural diagram of a carrying table in a cutting device provided by an embodiment of the application;

13 is a cross-sectional view of a clamping mechanism in a cutting device provided by an embodiment of the application;

14 is a schematic structural diagram of another bearing platform in the cutting device provided by the embodiment of the application;

15 is a cross-sectional view of a cutting wire wheel in a cutting device provided by an embodiment of the application;

FIG. 16 is a first structural schematic diagram of the gripping device gripping the edge leather in the cutting device provided by the embodiment of the application;

FIG. 17 is a second structural schematic diagram of the gripping device gripping the edge leather in the cutting device provided by the embodiment of the application;

18 is a schematic structural diagram of a silicon rod grinding device provided by an embodiment of the application;

Fig. 19 is a schematic view of the structure of the small silicon rod clamped on the sliding table device in the grinding equipment shown in Fig. 18;

FIG. 20 is a schematic structural diagram of the sliding table device in the grinding equipment shown in FIG. 18;

FIG. 21 is a schematic structural diagram of a grinding assembly in the grinding apparatus shown in FIG. 18 .

Reference number:

a1-silicon rod; a4-small silicon rod; a5-small raw material sheet; a6-edge leather; a61-arc top; a62-corner; a63-edge leather rod;

b1-the first section; b2-the second section; b3-the third section; b4-the fourth section;

1 - base;

2-bearing table; 211-1-main bearing part; 211-2-auxiliary bearing part; 221-limiting mechanism; 23-clamping mechanism; 321-clamping drive mechanism; 232-telescopic rod; 233-clamping Head; 251-Flat Type Abutment Plate; 252-L Type Abutment Plate; 261-Preset Opening;

301-main support; 302-line wheel support; 31-cutting line wheel; 311-line groove; 32-cutting line; 34-line pay-off mechanism; 35-line mechanism; 36-line take-up mechanism;

401-feeding area; 402-grinding area; 41-base assembly; 42-feeding assembly; 421-feeding slide; 422-headstock; 423-tailstock; 424-headstock chuck; 425-tail Rack chuck; 426-grinding holder; 427-chuck; 431-grinding head;

51-fixture; 52-claw; 521-installation part; 522-claw body.

Detailed ways

In order to make the technical solutions and advantages of the embodiments of the present application more clear, the exemplary embodiments of the present application will be described in further detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and Not all embodiments are exhaustive. It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict.

This embodiment provides a device for cutting a silicon rod, which is used to cut a silicon rod to obtain a small-piece silicon wafer. The silicon rod may be a polycrystalline silicon material, a single crystal silicon material, or the like. This embodiment only takes the single crystal silicon material as an example to describe the cutting method in detail. Those skilled in the art can directly apply the technical solutions provided in this embodiment to cutting other materials, and can also apply them to cutting other materials after adaptability improvement.

The cutting equipment provided in this embodiment includes: a base, a main frame, a carrying table and a wire cutting device. The main frame is arranged on the base, and a cutting space is formed between the top plate of the main frame and the base; the bearing table is arranged on the main frame to carry the silicon rod; the wire cutting device is arranged on the base; The bearing platform can slide relatively along the horizontal direction; the wire cutting device includes two first cutting wire wheel groups and at least three second cutting wire wheel groups, and the cutting lines respectively wound around the first cutting wire wheel groups are parallel to each other, and the cutting the silicon rod along the first cut surface; the cutting lines respectively wound around the second cutting wire wheel sets are parallel to each other for cutting the silicon rod along the second cut surface; the second cut surface and the first cut surface are parallel to each other. Vertically, at least two small silicon rods and edge leathers with rectangular cross-sections are obtained.

In order to describe the cutting equipment in detail, the present embodiment also provides a cutting method as follows:

FIG. 1 is a flowchart of a method for cutting a silicon rod provided by an embodiment of the present application, and FIG. 2 is a schematic diagram of a method for cutting a silicon rod provided by an embodiment of the present application for cutting a silicon rod. As shown in Figure 1 and Figure 2, the cutting method provided by this embodiment includes:

Step 101 , confine the silicon rod to the cutting device.

Step 102: Cut the silicon rod simultaneously with the first section and the second section parallel to the length direction of the silicon rod, the number of the first section is two, and the two first sections are parallel; the number of the second section is At least three, at least three second cut surfaces are parallel to each other; the second cut surface is perpendicular to the first cut surface, so as to obtain at least two small silicon rods and an edge leather with a flat surface and an arc surface.

In this embodiment, the silicon rod is a single crystal silicon rod, and its shape is a cylinder, and the length direction of the silicon rod is the direction of the center line of the cylinder, which may also be referred to as the axis direction.

The two first cut planes b1 are parallel and can be symmetrically arranged on both sides of the center line of the silicon rod a1, and the edge skin material at the top and the edge skin material at the bottom of the silicon rod are cut off. At least three second cut planes b2 are parallel and spaced apart, the second cut planes b2 are perpendicular to the first cut plane b1, and the second cut planes b2 located on both sides cut off the left edge leather and the right edge leather. Simultaneously cut the silicon rod a1 through two first cut planes b1 and at least three second cut planes b2 to obtain at least two small silicon rods a4 and the left and right side skins, the top edge skin and the bottom edge skin.

The left and right side leathers have a flat surface and an arc surface, and the arc surface is connected with the flat surface. The top and bottom edge leathers have two vertical planes and an arc surface connected between the two vertical planes.

In the traditional scheme, the cylindrical silicon rod is first cut into a rectangular square rod, and then the square rod is sliced to obtain a large silicon wafer with a larger size, and then the large silicon wafer is cut into small silicon wafers by laser scribing technology. , will damage the small silicon wafer.

In this embodiment, in step 102, two first sections and at least three second sections are used to cut the silicon rod, and at least two small silicon rods a4 with smaller cross-sectional areas are directly obtained. There are fewer steps and high efficiency, and the subsequent slicing of the small silicon rod a4 can directly obtain a small silicon wafer that meets the size requirements of the silicon wafer for the preparation of small-piece heterojunction cells, without the need for laser scribing. The product quality of the sheet is improved, thereby ensuring the conversion efficiency of the heterojunction cell.

The step of cutting the small silicon rod a4 is as follows: slicing the small silicon rod a4 along the length direction of the small silicon rod a4 with a section perpendicular to the length direction of the small silicon rod a4 to obtain a plurality of small raw material sheets a5. The step of slicing may be performed by a prior art slicer.

On the basis of the above technical solutions, before slicing the small silicon rods a4, the small silicon rods a4 also need to be ground. Referring to the above steps, a small silicon rod a4 is obtained, the cross section of which is a rectangle, and the four surfaces parallel to the longitudinal direction thereof are the side surfaces. After the small silicon rod a4 is obtained, the four sides of the small silicon rod a4 are ground, and then the edges and corners between the two adjacent sides in the small silicon rod a4 are ground to form a chamfered surface between the two sides. , to obtain a small silicon rod a4' after grinding.

The side of the small silicon rod is ground to make the surface smoother, and the edge of the small silicon wafer formed in the subsequent slicing is relatively smooth, and there is no need to trim the edge by laser scribing, and the quality of the small silicon wafer is improved. Grinding the edges and corners of the small silicon rods to form chamfered surfaces can prevent the cutting lines from contacting the edges and corners of the small silicon rods during the slicing process, thereby causing damage to the edges and corners of the silicon wafers.

In the above scheme, when the number of the second tangent planes b2 is three, the two second tangent planes located on the outside are symmetrically arranged on both sides of the center line of the silicon rod, and the ratio of the cross-sectional areas of the two small silicon rods a4 obtained is: 1:1-1:6. The number and specific cutting positions of the third cut planes b3 can be determined according to the size of the small silicon rod a4 and the size of the small silicon wafers to be produced, so as to meet the preparation requirements of small cells of different sizes. In this embodiment, the number of the second cut planes b2 is three, and the second cut plane b2 located in the middle passes through the center line of the silicon rod a1, so that the cross-sectional areas of the two small silicon rods s4 are equal.

An implementation method: the number of the second cut planes b2 is three, and the distance between the two second cut planes b2 located on the outer side is equal to the distance between the two first cut planes b1, and the obtained cross-section of the small silicon rod a4 is The aspect ratio is 2:1.

Further, it is also possible to cut the left and right edge leather obtained by the above cutting to obtain a silicon rod with a smaller cross-sectional area, which can be used to reduce the waste of raw materials.

FIG. 3 is a schematic structural diagram of cutting edge leather in the silicon rod cutting method provided by the embodiment of the present application. As shown in Figure 3, cut the edge leather a6 with the third cut surface b3 parallel to the length direction of the edge skin, and the third cut surface b3 is parallel to the bottom surface of the edge skin a6, so as to cut off the arc top a61 of the edge skin .

Cut the edge leather a6 with the fourth cut surface b4 parallel to the length direction of the edge skin, the fourth cut surface b4 is perpendicular to the bottom surface of the edge skin a6; the number of the fourth cut surface b4 is two, symmetrically arranged on the edge skin The edges and corners a62 on both sides of the edge skin material a6 are cut off on both sides of a6 to obtain edge skin silicon rods a63 with a rectangular cross-section.

The order of the above-mentioned cutting edge leather arc top a61 and corner a62 can be interchanged, that is, the arc top a61 can be cut first, and then the corner a62 can be cut; the corner a62 can also be cut first, and then the arc can be cut off. Top a61.

On the basis of the above technical solutions, this embodiment also provides a device for cutting silicon rods, which uses the above cutting method to cut the silicon rods.

FIG. 4 is a schematic structural diagram of a silicon rod cutting device provided by an embodiment of the present application. As shown in FIG. 4 , the cutting equipment includes: a base 1 , a main frame 301 , a carrying table 2 and a wire cutting device. The main frame 301 is arranged on the base 1 , and the main frame 301 includes a top plate and legs connected between the top plate and the base. A certain gap is left between the top plate and the base to form a cutting space. Both the carrying table and the wire cutting device are located in the cutting space for cutting operations.

The silicon rod a1 is arranged on the support table 2 along the horizontal direction. Parts for fixing and limiting the silicon rod a1 may also be provided on the support table 2, so as to limit the movement of the silicon rod a1 during the cutting process.

The wire cutting device and the carrying table 2 can move relatively in the horizontal direction, specifically along the length direction of the silicon rod a1. One way is: the carrying table 2 is fixed on the base 1 or the vertical base 11, and the wire cutting device Moving relative to the carrying table 2, for example, the wire cutting device includes: a wire wheel support and a support driving mechanism, and the wire wheel support moves relative to the carrying table 2 under the driving action of the support driving mechanism. Another way is: the wire cutting device is fixed, and the carrying table 2 moves relative to the wire cutting device under the driving action of the carrying table driving mechanism.

Specifically, the main frame 301 or the base 1 is provided with a horizontally extending sliding guide, and the wire cutting device cooperates with the sliding guide to slide horizontally, or the carrying platform cooperates with the sliding guide to slide horizontally.

The wire cutting device is provided with a cutting wire wheel set, and the cutting wire wound on the cutting wire wheel set is used to form a first section and a second section to cut the silicon rod.

A specific implementation manner, FIG. 5 is a schematic structural diagram of a wire cutting device in the cutting equipment shown in FIG. 4 , and FIG. 6 is a structural schematic diagram of the wire cutting device in the cutting equipment shown in FIG. 4 cutting a silicon rod. As shown in FIGS. 4 to 6 , the bearing platform 2 is fixedly arranged in the middle of the lower surface of the top plate of the main frame, the silicon rod a1 is placed horizontally on the bearing platform 2, and the two ends of the bearing platform 2 are respectively provided with a limiting mechanism and a jacking mechanism, Tighten the silicon rod a1 from both ends.

The base 1 is provided with a sliding guide, for example, two sliding rails are arranged in parallel on the upper surface of the base 1 . The wire cutting device includes: a wire wheel support 302 and a cutting wire wheel 31 . The wire wheel support 302 cooperates with the slide rail and moves along the slide rail under the driving action of the support driver.

The wire wheel bracket 302 is provided with a first cutting wire wheel set and a second cutting wire wheel set, wherein the first cutting wire wheel set includes: cutting wire wheels 31-1, 31-2, 31-3 and 31-4; The second cutting wire set includes: 31-5, 31-6, 31-7, 31-8, 31-9 and 31-10.

5 and 6 only, the cutting wire wheels 31-1, 31-2 are at the same height, the cutting wire wheels 31-3, 31-4 are at the same height and located at the cutting wire wheels 31-1, 31 -2 below. The cutting wire wheels 31-1 and 31-2 are wound with annular cutting lines, which are used as the first section to cut the silicon rod; the cutting wire wheels 31-3 and 31-4 are wound with annular cutting lines as The other first section faces the silicon rod for cutting. The cutting wire pulleys 31-1 and 31-3 are respectively disposed on the wire pulley support 302, or both can be disposed on the same rotating shaft. The cutting wire pulleys 31-2 and 31-4 are respectively disposed on the wire pulley support 302, or they can also be disposed on the same rotating shaft.

The cutting reels 31-5 and 31-6 are arranged up and down as a pair of reels, the cutting reels 31-7 and 31-8 are arranged up and down as a pair of reels, and the cutting reels 31-9 and 31-10 are arranged up and down as a pair. Alignment wheel. Three pairs of wire pulleys are arranged side by side, the annular cutting line wound on the cutting wire pulleys 31-5 and 31-6 is used as the second cutting surface, and the annular cutting wire wound on the cutting wire pulleys 31-57 and 31-8 is used as the second cutting surface. For the second cut surface in the middle, the annular cutting line wound around the cutting wire wheels 31-9 and 31-10 is used as another second cut surface to cut the silicon rod. The cutting wire wheels 31-5, 31-7, 31-9 can be arranged on the same rotating shaft. Alternatively, 31-5 and 31-9 are respectively arranged on the reel bracket 302, and 31-7 and 31-5 can be arranged on the same rotating shaft, or 31-9 can be arranged on the same rotating shaft.

It can be understood that the cutting wire wheel set includes at least two cutting wire wheels, wherein the two cutting wire wheels are coplanar, and the annular cutting wire is wound around the two cutting wire wheels. Further, the cutting wire wheel set also includes: a tension wheel and a driving wheel, the annular cutting wire is also wound around the tension wheel and the driving wheel, the driving wheel is connected to the output end of the wire wheel driver, and the driving wheel is driven to rotate by the wire wheel driver, Then, the cutting wire is driven to rotate around each wire wheel.

A space for the silicon rod to pass through is left in the middle of the area where each cutting wire wheel is arranged. During the relative movement of the wire wheel support and the silicon rod, the silicon rod is cut by the cutting wire.

As shown in FIGS. 5 and 6 , among the two sets of cutting wire pulleys arranged on the left and right, the wire pulleys can be fixed to the wire pulley brackets 302 on the side through the rotating shaft. The left and right sides of the wire pulley bracket 302 respectively protrude outward to form spaces for accommodating the cutting wire pulley. Alternatively, the cutting wire pulleys 31-1 and 31-3 can be arranged on the same rotating shaft to rotate synchronously and driven by the same driver. The cutting wire wheels 31-2 and 31-4 can be arranged on the same rotating shaft to rotate synchronously and driven by the same driver.

Among the three sets of cutting wire pulleys arranged up and down, the left and right two sets of wire pulleys can be fixed to the wire pulley bracket 302 on the side through the rotating shaft, and the middle wire pulley can be set on the same rotating shaft as the left The wheels are arranged on the same shaft. For example, the cutting wire wheels 31-5 and 31-7 are arranged on the same rotating shaft to rotate synchronously. The rotating shaft and the driving motor are connected by means of direct connection drive, belt drive, chain drive or gear drive, so that the drive motor drives the rotating shaft to rotate, and then drives the cutting wire wheel 31 to rotate. The lower reels in each group are connected in the same way.

The bearing platform is provided with a limiting mechanism, one end of which is fixed to the bearing platform, and the other end is provided with a plurality of limiting parts, respectively abutting against each end to be cut to form small silicon rods and edge leather. The number of clamping heads is multiple, and they are respectively pressed against the other end of each small silicon rod and edge leather to be cut. The two ends of each small silicon rod and edge leather are respectively provided with a clamping head and a limit mechanism. , to clamp the small silicon rod and edge leather through the limit mechanism and the clamping head.

The clamping mechanism includes: a clamping driving mechanism, a telescopic rod and a clamping head, the rod is horizontally arranged between the clamping driving mechanism and the clamping head, and the telescopic rod extends relative to the clamping driving mechanism and pushes the clamping head Clamp the silicon rod from both ends with the limit mechanism. One end of the limiting mechanism is fixed to the bearing platform, and at least two limiting parts are branched out from the other end, respectively abutting against one end to be cut to form a small silicon rod. The number of clamping heads is at least two, which are respectively abutted against the other ends of the small silicon rods to be cut. The number of clamping heads is the same as the number of the small silicon rods to be formed, so as to be pressed against the end of each small silicon rod with the limiting mechanism.

Further, an edge leather stopper mechanism can also be arranged on the bearing platform to abut against the outer circumference of the silicon rod, so as to hold the edge leather material tightly and prevent it from falling. When it is necessary to unload the edge leather, open the stopper mechanism in turn to remove the corresponding edge leather.

FIG. 7 is a schematic structural diagram of another silicon rod cutting device according to an embodiment of the present application. Different from the above solution, in the cutting device shown in FIG. 7 , the wire wheel support 302 is fixed on the base 1 . The lower surface of the top plate of the main frame is provided with a slide rail, and the carrying platform 2 cooperates with the slide rail and slides horizontally along the slide rail under the driving action of the carrying platform drive mechanism, thereby driving the silicon rod to move horizontally relative to the wire wheel bracket.

FIG. 8 is a schematic structural diagram of yet another silicon rod cutting device provided by an embodiment of the present application. The difference from the above scheme is that: in the cutting equipment shown in FIG. 8, the method of long wire cutting is adopted, and the wire cutting device also includes: a wire pay-off mechanism 34, a wire take-up mechanism 36 and a wire-arrangement mechanism 35, a wire pay-off mechanism 34 and a wire take-up mechanism 36 are respectively arranged on both sides of the cutting wire wheel set, and the cutting wire is a single long wire wound between the wire pay-off mechanism 35, the wire take-up mechanism 36, the wire arranging mechanism 35 and the cutting wire wheel set. The wire arranging mechanism 35 is used to make the cutting wire evenly wound on the wire take-up mechanism 36 or the wire pay-off mechanism 34 .

During the cutting process, the cutting wire 32 is wound out from the wire pay-off mechanism 34 , guided by the wire-arranging mechanism 35 , and then passes through each cutting wire wheel 31 , and is then retracted by the wire take-up mechanism 35 . During a cutting process, the wire pay-off mechanism 34 also functions as the wire take-up mechanism 36 , and the wire take-up mechanism 36 also functions as the wire pay-off mechanism 34 to reciprocate the cutting wire 31 .

The cutting wire mentioned in this embodiment is a diamond wire, which is used for cutting a single crystal silicon material.

The above solution can directly cut and process the monocrystalline silicon rod into small pieces of silicon wafers, and solves the drawbacks of processing small pieces of silicon wafers from large pieces of silicon wafers in the prior art.

The length L of the small silicon rod is greater than its width W and height H, and the length direction of the small silicon rod can be understood to be the same as the axial direction of the silicon rod a1.

In some embodiments of the present application, the cross-sectional length and width of the plurality of small silicon rods are equal or unequal. When the cross-sectional length and width of multiple small silicon rods are equal, the size of the small silicon wafer prepared by slicing multiple small silicon rods is the same; when the cross-sectional length and width of multiple small silicon rods are different, the The sizes of the small silicon wafers prepared from the silicon rods are different to meet the production of small cells of different sizes.

In some embodiments of the present application, in the step of "slicing small pieces", each small silicon rod is sliced independently with the cutting plane parallel to the end face of the small silicon rod; or, a plurality of small silicon rods are sliced simultaneously. Simultaneous slicing is preferred for higher efficiency.

In some embodiments of the present application, the processing method further includes the step of trimming the leather: cutting four pieces of the leather with the cutting plane parallel to the axis of the silicon rod, and each piece of leather can be cut to obtain an outer edge Leather and at least one middle edge leather. The outer edge leather and the middle edge leather are used for subsequent processing to improve the utilization rate of silicon rods.

In some embodiments of the present application, the thicknesses of the outer side leather and the middle side leather are equal or unequal to meet the processing requirements of different subsequent products.

This embodiment also provides a device for cutting edge leather. As shown in FIG. 9 , the cutting device includes: a base 1, a carrying table 2 and a wire cutting device, wherein the carrying table 2 and the wire cutting device move relative to each other, The carrying table 2 may be moved relative to the base, or the wire cutting device may be moved relative to the base. The edge leather can be placed on the carrying platform 2 horizontally or vertically. The wire cutting device can use an annular cutting wire, or a single long wire, for details, please refer to the above content.

The wire cutting device includes a gate-shaped wire wheel support 302 on which a plurality of sets of cutting wire wheels 32 are arranged. Figure 9 sets up four stations, which can cut four edge leather materials at the same time. For one of the stations, it includes a set of cutting wire wheels, at least two cutting wire wheels 32, arranged horizontally or up and down, and the cutting lines wound on the two cutting wire wheels 32 extend horizontally or vertically to form cutting planes , to cut off the curved top or corner of the hem leather. Figure 10 shows the horizontal arrangement. When a work station includes two sets of cutting wire wheels, the cutting wire wound on the two sets of cutting wire wheels can cut off two corners of the edge leather at the same time. Figure 11 shows a view of two sets of cutting wire wheels.

For the above-mentioned carrying table 2, this embodiment also provides a specific implementation manner: FIG. 12 is a schematic structural diagram of the carrying table in the cutting device provided by the embodiment of the present application. Figure 12 shows four stations, which can cut four edge leathers at the same time. For one of the stations, the carrier table 2 has a preset opening 261 to make way for the cutting line. The preset opening 261 divides the front end of the carrying platform into a main carrying part 211-1 and an auxiliary carrying part 211-2, and the main carrying part 211-1 and the auxiliary carrying part 211-2 are used to jointly carry the flat leather to be cut. .

When it is necessary to cut the edge leather, first fix the edge leather on the bearing platform in a flat manner. At this time, the edge leather is located on the main bearing part, the auxiliary bearing part and the two preset openings. The vertical cutting line enters between the main bearing part and the auxiliary bearing part from the preset opening, and starts to cut from one end face of the edge leather until it reaches the other end face.

It can be understood that after cutting off the edge and corner of the edge leather first, in the process of cutting off the arc top, the edge leather side of the cut edge can be placed on the bearing platform, and the bearing platform does not need to be provided with a preset. Set an opening.

FIG. 13 is a cross-sectional view of a clamping mechanism in a cutting device provided by an embodiment of the present application. As shown in FIG. 12 and FIG. 13 , further, the bearing platform is further provided with a limiting mechanism 221 and a clamping mechanism 23 . The clamping mechanism includes a clamping driving mechanism 231, a telescopic rod 232 and a clamping head 233. One end of the telescopic rod is fixed on the side of the clamping driving mechanism, and the other end of the telescopic rod is fixed with the clamping head, and the clamping head 233 is connected to the limiter. Bit mechanism relative settings. The clamping drive mechanism is used to drive the telescopic rod to telescopically adjust the distance between the clamping head 233 and the limiting mechanism 221 to place the edge leather between the clamping head and the limiting mechanism. The limiting mechanism 221 and the clamping head 233 It is used to fix the edge leather at both ends of the edge leather.

Further, the bearing device further includes: a flat plate-type abutting plate 251, which is fixedly installed on the upper surfaces of the main bearing portion 211-1 and the auxiliary bearing portion 211-2, and the upper surface of the main bearing portion 211-1 and the The flat plate-type abutting plate of the bearing portion is in close contact with the plate surface, and the upper surface of the auxiliary bearing portion 211-2 is in close contact with the plate surface of the flat-plate abutting plate fixed on the auxiliary bearing portion.

The flat plate-type abutting plate 251 is a full-length flat-type abutting plate, and a flat plate-type abutting plate is fixed on each of the main bearing portion 211-1 and the auxiliary bearing portion 211-2. Alternatively, at least two flat plate-type abutting plates are respectively fixed on the main bearing portion and the auxiliary bearing portion at intervals.

In order to realize the bearing function of the opposite leather material and the multiple components mounted on the bearing platform, the bearing platform needs to be a bearing platform of rigid material. The edge leather of the brittle and hard material is itself brittle and hard. In order to avoid hard-to-hard contact between the edge leather of the brittle and hard material and the bearing platform of the rigid material, an elastic flat plate-type abutting plate is provided. When the bottom surface of the edge leather with an arc-shaped end surface is placed on the elastic flat plate abutting plate, it provides a buffer for the edge leather and protects the edge leather.

FIG. 14 is a schematic structural diagram of another bearing platform in the cutting device provided by the embodiment of the present application. As shown in FIG. 14 , the L-shaped abutment plate 252 is fixed on at least the upper surface of one of the auxiliary bearing parts 211-2, the transverse arm of the L-shaped abutment plate 252 is fixed on the upper surface of the auxiliary bearing part 211-2, and The auxiliary bearing portion 211-2 is flush with the end of the transverse arm of the L-shaped abutment plate fixed on the auxiliary bearing portion. The shape of the L-shaped abutment plate limits the shape of the stock bar to which the cutting system can be applied. The L-shaped abutment plate can smoothly carry the edge leather with two adjacent vertical planes.

FIG. 15 is a cross-sectional view of a cutting wire wheel in a cutting device provided by an embodiment of the present application. As shown in FIG. 15 , this embodiment provides a structure of a cutting wire wheel. The outer edge of the cutting wire wheel is provided with a plurality of wire grooves 311 arranged in parallel, and the cutting wire 32 is embedded in one of the wire grooves 311 to cut the cutting wire The wire 32 is limited to the wire groove 311 to prevent it from coming off the cutting wire wheel during rotation. In addition, due to the sliding friction between the cutting wire and the wire groove 311, a lot of diamonds are arranged on the cutting wire, so that the wear of the wire groove is serious. After one wire groove is worn out, other wire grooves can be directly used without frequent replacement of the cutting wire wheel, which is convenient for maintenance and saves materials and maintenance costs.

FIG. 16 is a first structural schematic diagram of the clamping device grasping the edge leather in the cutting device provided by the embodiment of the application, and FIG. 17 is a second structural schematic diagram of the clamping device grasping the edge leather material in the cutting device provided by the embodiment of the application. As shown in FIG. 16 and FIG. 17 , the cutting equipment provided in this embodiment further includes a clamping device for grabbing the edge leather and placing it on the carrying table or leaving the carrying table.

Specifically, the clamping device includes: a fixing member 51 and two oppositely arranged clamping jaws 52, at least one clamping jaw 52 is slidably installed on the lower bottom surface of the fixing member 51, so that the distance between the two clamping jaws 52 is adjustable, In order to adapt to the edge leather of different widths.

When it is necessary to clamp the edge leather, adjust the distance between the two jaws to be greater than the width of the edge leather, and move the position of the clamping device, so that the two clamping jaws are located on both sides of the width direction of the edge leather respectively; After that, adjust the distance between the two jaws to become smaller until the width direction of the edge leather is clamped. The cutting device provided by the embodiment of the present application can conveniently realize the clamping of the edge leather material through the clamping device, which provides favorable conditions for the movement of the edge leather material.

Specifically, the clamping jaw 52 includes: a vertical mounting plate 521 and a clamping jaw body 522 . At least one vertical mounting plate 521 is slidably mounted on the lower bottom surface of the fixing member 51 . The jaw body 522 is fixed on the inner plate surface of the mounting plate 521 . The clamping jaw itself is not an integrated structure, but the mounting plate and the clamping jaw body are formed by two independent parts. The vertical mounting plate is the installation base of the gripper body, and also the base for the gripper to move. The mounting plate and the clamping jaw body are two independent parts. During the process of clamping the raw material rod by the clamping jaw body, the clamping jaw body is seriously worn. It is only necessary to replace the clamping jaw body, and the installation plate does not need to be replaced.

By using the cutting equipment for the edge leather of the present application, the cutting of the edge leather with an arc-shaped end surface can be realized. The cutting process is as follows: first, cut the corners of both ends of the edge leather to form the edge leather with the combined shape of the rectangle and the arc; then, cut the top of the edge leather with the combined shape of the rectangle and the arc. The arc is cut to form a rectangular bar with a rectangular end face.

Before cutting the edges and corners of the edge leather, after placing the edge leather on the carrier device, firstly, the laser marking positioning is carried out by the laser positioning device, so as to ensure that the edge leather is placed in the proper and correct position. A bottom sensing device is fixed on the bearing platform 2 to detect whether the edge leather is installed in place. Only after all the detection conditions are met, the clamping mechanism will move to tighten the edge leather, and it will be pressed and fixed together with the limit mechanism. Edge leather.

Before the cutting equipment cuts the top of the arc, the edge leather is placed on the bearing device and the material sensing switch is triggered to detect that the edge leather is placed in place. At this time, the edge leather is marked and positioned by the laser locator and the side sensing device fixed on the auxiliary bearing part of the bearing device, so as to ensure that the edge leather is placed in the correct position and meet all the detection conditions to complete the edge leather positioning. . Start the clamping mechanism and start the extension movement to complete the positioning and clamping process of the edge leather.

As shown in FIG. 9 , a laser alignment device 38 and a spray lubricating device 39 are also included.

The laser alignment device is set above the edge leather cutting table to realize the precise installation and feeding function of the edge leather. A plurality of laser generators are set on the laser alignment device. Before the edge leather is installed on the edge leather cutting table, the laser generators are turned on to form a linear laser, which is projected onto the carrying device. When the edge leather is installed on the bearing device, it is firstly aligned with the linear laser, so that the rectangular block of brittle and hard material formed after cutting is exactly the required size. Among them, the position and distance of each laser generator can be adjusted, which is determined according to the specifications of different edge leather materials.

The specific working process of the laser alignment device is: using tooling or measuring tools (vernier calipers, steel rulers) to find the center line of the two rounds. Adjust the position of the focused laser reticle so that the laser emitted by the laser reticle is aligned with the center line of the two wheels, and fix the laser reticle. Find the position of the center line on the edge leather and mark it. When feeding, adjust the position of the edge leather so that the center line of the edge leather is aligned with the laser emitted by the laser marking device.

The spray lubricating device continuously sprays the cutting fluid on the vertical diamond wire during the cutting process to improve the quality of the edge leather after cutting. The spray lubrication device also needs to be installed above the edge leather cutting table. During the cutting process, the cutting fluid is continuously sprayed on the vertical diamond wire, and the cutting fluid will flow vertically to the position of the edge skin to be cut to achieve the purpose of cooling and lubrication. .

Before cutting the silicon rod, after placing the silicon rod on the bearing table, the laser marking line is firstly positioned by the laser positioning device to ensure that the silicon rod is placed in the proper and correct position. The bottom or side of the bearing platform is provided with an induction device to detect whether the silicon rod is installed in place. Only after all the detection conditions are met, the jacking mechanism will move to tighten the silicon rod, and press and fix the silicon rod together with the limit mechanism. Great.

Further, a position detection device is used to detect the position of the silicon rod, and control the cutting wire wheel to move to the target cutting position according to the position of the silicon rod. The position of the silicon rod is detected by the position detection device, and the detection result is sent to the controller, and the controller controls the cutting wire wheel to move and adjust to the target cutting position to cut the silicon rod.

The equipment structure for cutting edge leather provided in this embodiment can also be applied to cutting the above-mentioned silicon rods, such as: wire wheel structure, detection device, induction device, spray lubrication device, laser alignment device etc., can be used for the above equipment.

Further, this embodiment also provides a grinding device for grinding the small silicon rods in the above steps. As shown in FIGS. 18 to 21 , the grinding equipment includes: a base assembly 41 , a feeding assembly 42 , and a grinding assembly 43 . The whole grinding equipment includes: a feeding area 401 and a grinding area 402 . The feeding assembly 42 is disposed in the feeding area 401 , and the small silicon rods to be ground are assembled from the feeding area 401 to the feeding assembly 42 , and then sent to the grinding area 402 . The grinding component 43 is arranged in the grinding area 402 to grind the surface and/or the edge of the small silicon rod.

Taking the grinding of the small silicon rod a4 as an example, Figures 19 and 20 show the implementation of the feeding assembly 42 and the grinding assembly 43: the feeding assembly 42 includes: a feeding slide table 421, a headstock 422 and a tailstock 423. One implementation method is: the slide table is fixed, and the headstock 422 and the tailstock 423 move relative to the slide table; the other way is that the headstock 422 is fixed relative to the slide table, and the tailstock 423 moves relative to the slide table, The slide table is movable relative to the base. Take the second solution as an example: place the small silicon rod a4 between the headstock 422 and the tailstock 423, adjust the position of the tailstock 423 relative to the slide table, and clamp the small silicon rod a4. By moving the sliding table, the small silicon rod a4 is moved to the model area 402 for grinding by the grinding assembly 43 .

The headstock 422 is provided with a headstock chuck 424, the tailstock 423 is provided with a tailstock chuck 425, the headstock chuck 424 is arranged opposite to the tailstock chuck 425, and the small silicon rod a4 is arranged between the headstock chuck 424 and the tailstock chuck 425. Between the tailstock chucks 425, the headstock chucks 424 and the tailstock chucks 425 clamp the small silicon rod a4 from both ends.

As shown in FIG. 21 , in another implementation manner, the feeding assembly includes: a grinding fixed seat 426 and a chuck 427 , which are arranged up and down. The small silicon rod a3 is vertically disposed between the grinding fixed seat 426 and the chuck 427, and the chuck 427 clamps the small silicon rod downward. The grinding assembly includes a grinding head 431 and a grinding head driver, which are respectively located on the left and right sides of the small silicon rod. The grinding head driver is used to drive the grinding head 431 to move horizontally to contact with the small silicon rod or move in the opposite direction away from the small silicon rod.

The grinding head 431 can move vertically to grind the surface of the small silicon rod during the lifting process. Alternatively, the grinding holder and the chuck drive the small silicon rod up and down, and the grinding head is fixed.

The grinding holder 426 and the chuck can drive the small silicon rod to rotate horizontally. After grinding the two sides of the small silicon rod, the grinding fixed base drives the small silicon rod to rotate 90°, and grinds the other two sides. . After all sides are ground, turn the small silicon rod 45° to grind the edges and corners of the small silicon rod; then turn 90° in turn to grind the remaining three edges and corners.

The above-mentioned grinding assembly 43 is provided with a grinding wheel, which is used for grinding the small silicon rod a4. The grinding wheel includes a rough grinding wheel and a fine grinding wheel, which respectively perform rough grinding and fine grinding on the small silicon rod a4.

In the above scheme, the small silicon rods are ground, usually on the side faces, and also on the end faces in special cases.

This embodiment also provides a silicon rod cutting system, including: a cutting device provided with two sets of first cutting wire wheel sets and at least three sets of cutting wire wheel sets, for synchronously cutting silicon with the first cutting plane and the second cutting plane The rod is cut to obtain at least two small silicon rods; a grinding device for grinding the small silicon rods; and a slicing device for slicing the small silicon rods. It may further include a cutting device for cutting the edge leather. The silicon rods are cut through various cutting equipment according to the assembly line operation to obtain small silicon wafers.

Claims (11)

1. A silicon rod cutting apparatus, comprising:

a base;

the main frame is arranged on the base, and a cutting space is formed between a top plate of the main frame and the base;

the bearing table is arranged on the main rack and used for bearing a silicon rod;

the wire cutting device is arranged on the base; the linear cutting device and the bearing table can relatively slide along the horizontal direction; the wire cutting device comprises two first cutting wire wheel sets and at least three second cutting wire wheel sets, cutting wires wound on the first cutting wire wheel sets are parallel to each other respectively, and the wire cutting device is used for cutting the silicon rod along the first cutting wires; the cutting lines wound on the second cutting line wheel sets are parallel to each other and are used for cutting the silicon rod along a second cutting plane; the second section is vertical to the first section to obtain at least two small silicon rods with rectangular sections and the edge skin material.

2. The cutting apparatus of claim 1, further comprising: the bearing table is fixed to the lower surface of the main frame;

the wire cutting device includes: the wire wheel bracket and the bracket driving mechanism; the wire wheel bracket moves relative to a sliding rail arranged on the surface of the base under the driving action of the bracket driving mechanism; the cutting line wheel set is arranged on the wire wheel support.

3. The cutting apparatus according to claim 1, wherein the wire cutting device comprises: a wire wheel bracket; the wire wheel bracket is fixedly arranged on the base; the cutting wire wheel set is arranged on the wire wheel bracket;

the bearing table slides relative to the base under the driving action of the bearing table driving mechanism.

4. The cutting apparatus according to claim 2 or 3, characterized in that each set of cutting line wheels comprises at least two cutting reels, wherein the two cutting reels are coplanar and form a first or a second tangent plane around the annular cutting line provided on the two cutting reels.

5. The cutting apparatus of claim 4, wherein a set of cutting line wheels further comprises: a tension pulley and a driving pulley; the annular cutting line is still around locating tension pulley and action wheel, and the action wheel is connected to the output of line wheel driver.

6. The cutting apparatus according to claim 2 or 3, wherein the wire cutting device further comprises: the pay-off mechanism and the take-up mechanism are respectively arranged on two sides of the cutting line wheel set, and the cutting line is formed by winding a single long line between the pay-off mechanism, the take-up mechanism, the pay-off mechanism and the take-up mechanism.

7. The cutting equipment according to claim 2 or 3, wherein the bearing table is provided with a clamping mechanism and a limiting mechanism which are respectively positioned at two ends of the silicon rod; the clamping mechanism includes: the silicon rod clamping device comprises a clamping driving mechanism, a telescopic rod and a clamping head, wherein the telescopic rod is horizontally arranged between the clamping driving mechanism and the clamping head, and the telescopic rod extends out relative to the clamping driving mechanism and pushes the clamping head and a limiting mechanism to clamp the silicon rod from two ends.

8. The cutting apparatus according to claim 7, wherein one end of the limiting mechanism is fixed to the bearing platform, and the other end is bifurcated into at least two limiting parts which respectively abut against one end of the small silicon rod to be cut and formed;

the number of the clamping heads is at least two, and the clamping heads are respectively propped against the other end of the small silicon rod to be cut.

9. The cutting apparatus according to claim 2 or 3, further comprising: and the position detection device is used for detecting the position of the silicon rod and controlling the cutting wire wheel to move to the target cutting position according to the position of the silicon rod.

10. A silicon rod cutting system, comprising:

the cutting apparatus as claimed in any of claims 1 to 9, for cutting silicon rods to obtain at least two small silicon rods with rectangular cross sections and a boundary material;

the grinding equipment is used for grinding the small silicon rod;

the edge leather cutting equipment is used for cutting the edge leather;

and/or the slicing equipment is used for slicing the small silicon rod.

11. The silicon rod cutting system as recited in claim 10, wherein the edge trim cutting apparatus comprises:

a base;

the bearing table is arranged on the base and used for bearing the edge leather;

the linear cutting device is arranged on the base and can move relative to the bearing table along the length direction of the edge leather; the wire cutting device comprises at least one cutting wire wheel set, and cutting lines wound on the cutting wire wheel sets are used for cutting arc tops or corner parts of the side leather materials to obtain the side leather silicon rods with rectangular sections.

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