CN218764146U - Semiconductor refrigeration refrigerator with internal heat exchange enhancement function - Google Patents

Abstract

The utility model discloses an inside semiconductor refrigeration refrigerator of reinforceing heat transfer, the refrigerator includes inside heat transfer device, semiconductor refrigeration module, outside water-cooling heat abstractor, lagging casing and heat preservation door of reinforceing. The internal enhanced heat exchange device comprises a cold guide inner container, a folded fin heat exchanger and a heat exchange fan, wherein the folded fin heat exchanger is welded or fixed on the inner wall of the cold guide inner container, a plurality of inward bulges are processed on the side wall of the cold guide inner container, and the heat exchange fan is a cross flow fan arranged above and below the folded fin heat exchanger or an axial flow fan arranged on the front surface of the folded fin radiator. The technical scheme of the utility model, inside heat transfer means that reinforces passes through folding sheet heat exchanger and protruding structure increase semiconductor refrigerator's in limited space cold area of leading and force convection heat transfer effect, helps the release of semiconductor refrigerator cold energy, has greatly promoted semiconductor refrigerator's efficiency.

Description

A semi-conductor refrigeration refrigerator with enhanced internal heat exchange

technical field

The utility model relates to the technical field of semiconductor refrigeration refrigerators, in particular to a semiconductor refrigeration refrigerator with enhanced internal heat exchange.

Background technique

Compared with traditional compressor refrigeration refrigerators, semiconductor refrigeration refrigerators have the advantage of not requiring refrigeration fluid and mechanical moving parts, and are environmentally friendly and noiseless.

However, the direct cooling area of the semiconductor refrigeration device is small, and the cooling capacity needs to be quickly and efficiently transferred to a large range of refrigerators. There are problems such as low conduction efficiency, slow cooling efficiency of the refrigerator, or uneven temperature distribution inside the refrigerator. Therefore, a semiconductor refrigeration refrigerator with internally enhanced heat transfer is needed.

Utility model content

According to the technical problems mentioned in the background art above, a semiconductor refrigeration refrigerator with enhanced internal heat exchange is provided. The utility model is mainly equipped with an internal enhanced heat exchange device, so as to improve the cooling efficiency of the semiconductor refrigeration refrigerator and solve the problem of uneven distribution of internal temperature.

The technical means adopted in the utility model are as follows:

A semiconductor refrigerated refrigerator with enhanced internal heat exchange, including an internal enhanced heat exchange device; the internal enhanced heat exchange device includes: a cold conduction liner, a folded sheet heat exchanger, and a heat exchange fan; the cool conduction liner is provided with A plurality of inward protruding structures, and a plurality of semiconductor module installation grooves are scattered on the back of the cooling liner.

Further, the folded-sheet heat exchanger is made of stacked metal sheets, which are welded or fixed on the inner wall of the cold-conducting liner through a heat-conducting medium; the heat exchange fan is a cross-flow fan installed above the folded-sheet heat exchanger and the bottom absorb the cold energy of the folded sheet heat exchanger and release the cold air to the inside of the refrigerator or the heat exchange fan is arranged on the front of the folded sheet radiator to absorb the cold energy of the folded sheet heat exchanger and release the cold air to the inside of the refrigerator Release the cool air.

Compared with the prior art, the utility model has the following advantages:

The internal enhanced heat exchange device of the utility model is conducive to the release of cold energy of the semiconductor refrigeration module, which can effectively increase the cooling rate of the refrigerator and reduce the consumption of electric energy. Among them, the circular protrusions on the cooling liner can greatly increase the heat exchange area of the liner without affecting the effective volume inside the refrigerator; the folded plate heat exchanger is light in weight, large in area, and small in space, and can pass through with the heat exchange fan Two options: the heat exchange fan is a cross-flow fan installed above and below the folded sheet heat exchanger to absorb the cold energy of the folded sheet heat exchanger and release cold air to the inside of the refrigerator or the heat exchange fan is an axial flow fan installed on the front of the folded sheet radiator It absorbs the cooling capacity of the folded sheet heat exchanger and releases cold air into the refrigerator, and enhances the heat exchange effect inside the refrigerator through forced convection heat exchange, and this device can balance the cooling of various parts inside the refrigerator, improving the refrigeration module of semiconductor refrigeration refrigerators. The shortcomings of severe frosting at the cold end, slow accumulation and release of cold energy, and uneven temperature inside the refrigerator;

The water tank of the external water-cooled heat dissipation device of the utility model is arranged under the refrigerator, and the water-cooled row is arranged on both sides of the water tank. The water-cooled plate and the water pipe are installed close to the back of the refrigerator, which occupies a small space and has a strong heat dissipation capacity. Compared with the external air-cooled heat dissipation method, The external water cooling device can keep the hot end of the semiconductor refrigeration module at a lower temperature for a long time and stably under high temperature, high humidity and other environments, so that the semiconductor refrigeration module is in an efficient cooling state;

The utility model is a semi-conductor refrigeration refrigerator with enhanced internal heat exchange, which has strong refrigeration capacity, the refrigeration temperature range can be as low as below 0 DEG C, has a certain freezing effect, and has a fast cooling rate.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description The drawings are some embodiments of the utility model, and those skilled in the art can also obtain other drawings according to these drawings on the premise of not paying creative labor.

Fig. 1 is a schematic diagram of the front internal structure of a semiconductor refrigeration refrigerator with internally enhanced heat transfer of the present invention.

Fig. 2 is a schematic diagram of the back structure of a semiconductor refrigeration refrigerator with internally enhanced heat transfer of the present invention.

Fig. 3 is a schematic diagram of the side structure of a semiconductor refrigeration refrigerator with enhanced internal heat exchange in the present invention.

Fig. 4 is a structural schematic diagram of a folded fin radiator of a semi-conductor refrigeration refrigerator with internally enhanced heat exchange in the present invention.

Fig. 5 is a diagram of the test results of Embodiment 1 of a semiconductor refrigeration refrigerator with internally enhanced heat exchange of the present invention.

In the figure: 101, the cooling liner; 102, the folded sheet heat exchanger; 103, the heat exchange fan; 104, the raised structure on the cooling liner; 201, the water-cooling plate of the external water cooling device, 202, the water tank, 203, water pump, 204, water cooling row, 205, water pipe, 300, semiconductor refrigeration module, 400, heat preservation shell and heat preservation door.

Detailed ways

In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the utility model. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

It should be noted that the terms "first" and "second" in the specification and claims of the present utility model and the above drawings are used to distinguish similar objects, but not necessarily used to describe a specific order or sequence . It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process, method, system, product or device comprising a sequence of steps or elements is not necessarily limited to the expressly listed instead, may include other steps or elements not explicitly listed or inherent to the process, method, product or apparatus.

Example 1

Fig. 1 is a schematic diagram of the front internal structure of a semiconductor refrigeration refrigerator with internal enhanced heat exchange according to an embodiment of the present invention, which mainly includes 101 a cold-conducting liner of an internal enhanced heat exchange device, 102 a folded sheet heat exchanger, and 103 a heat exchange fan , The raised structure on the 104 cooling liner. The cooling liner is a shell made of aluminum alloy with a depth of 250mm, a width of 250mm, a height of 320mm, and a wall thickness of 0.5mm. The internal effective volume is about 18L. The aluminum alloy material is light and easy to process, and has good cooling capacity, which can quickly transfer the cold energy of the semiconductor refrigeration module to various parts of the inner tank, and the circular protrusion on the cooling inner tank can greatly increase the replacement of the inner tank. The thermal area does not affect the effective volume of the refrigerator, thereby enhancing the heat exchange effect inside the refrigerator, and releasing the cold energy to the air inside the refrigerator and the refrigerated items more efficiently. Figure 4 The folded sheet heat exchanger is formed by stamping and stacking aluminum alloy sheets with a thickness of 0.2mm. The length is 300mm, the width is 200mm, and the height is 20mm. Stable and large heat dissipation area, the folded sheet heat exchanger is glued to the inner wall of the cold conduction liner through thermal silica gel, and its range covers the semiconductor refrigeration module installed on the back. The heat exchange fans are two cross-flow fans with a length of 300mm, which absorb the folded sheet The cooling capacity of the heat exchanger blows the cold air to the inside of the refrigerator and the refrigerated items, enhances the heat exchange effect inside the refrigerator through forced convection heat exchange, and makes all the spaces inside the refrigerator cool down quickly and evenly. There is no frosting problem at the end due to cold accumulation.

Fig. 2 is a schematic diagram of the external back structure of a semiconductor refrigeration refrigerator with internally enhanced heat exchange according to an embodiment of the present invention, which mainly includes 201 a water-cooled plate of an external water-cooled heat dissipation device, 202 a water tank, 203 a water pump, 204 a water-cooled row, and 205 a water pipe. The volume of the water tank is about 12L, which can be used for various cooling liquids. In this embodiment, tap water is used as the cooling water, and the cooling water is lifted to the water-cooled plate that fits the hot end of the semiconductor refrigeration module through an 8W water pump to absorb the heat generated by the semiconductor refrigeration module. The heat will flow through the water-cooling row at the bottom of the refrigerator and return to the water tank for the next cycle. There is a heat dissipation grill on the side of the refrigerator where the water-cooling row is installed, and the cooling liquid quickly releases heat in the long water pipe and water-cooling row. At higher ambient temperatures, the hot end of the semiconductor refrigeration module can also be stably controlled at a lower temperature for a long time. Under the condition of room temperature 25°C-32°C, the coolant in the water tank can be maintained at 35°C during the entire working cycle of the refrigerator. ℃, so that the semiconductor refrigeration module is in a high-efficiency cooling state, and the cooling capacity will not be weakened due to temperature fluctuations at the hot end.

Fig. 3 is a schematic diagram of the side structure of a semiconductor refrigeration refrigerator with enhanced internal heat exchange in the utility model, which mainly includes 300 semiconductor refrigeration modules, 400 insulation shells and insulation doors. In this embodiment, the 300 semiconductor refrigeration module is composed of four 4cm×4cm semiconductor refrigeration devices connected in series, which are divided into upper and lower groups, with two pieces in each group, and are installed in the installation groove on the back of the cooling liner. In order to make the refrigeration module efficient To work, apply heat-conducting silicone grease evenly on the cold and hot ends of the refrigeration module to reduce the interface thermal resistance, and install the cooling liner, refrigeration module and water-cooled plate tightly through bolts. 400 Insulation shell and heat insulation door are made of aluminum alloy structure as the shell in this embodiment, and the insulation layer is formed by filling foam material between the shell and the outer wall of the cooling liner.

In this embodiment, the working method and cooling effect of a semiconductor refrigeration refrigerator with internal enhanced heat exchange are as follows: the power supply of the refrigerator is turned on, and the semiconductor refrigeration module, water pump and heat exchange fan work at the same time, wherein the power of the semiconductor refrigeration module is 100W, and the power of the water pump is 8W. The power of the heat exchange fan is 2.4W, and 10 bottles of 380ml mineral water are placed in the refrigerator as the tested object. Inside the refrigerator, the cold generated by the cold end of the semiconductor refrigeration module is first transferred to the aluminum alloy cooling liner and the folded radiator in the form of heat conduction, so that the temperature of the two drops rapidly, and the metal cooling liner and the raised structure on it The cold energy is released to the inner space of the refrigerator, and secondly, the heat exchange inside the refrigerator is strengthened by the forced convection of the folded sheet radiator under the blowing of the heat exchange fan, and the cold air is blown to the object to be tested inside the refrigerator, so that the temperature inside the refrigerator can be cooled quickly, uniform. Outside the refrigerator, the water pump drives the cooling water inside the water tank to flow through the water cooling plate, taking away the heat generated by the hot end of the semiconductor refrigeration module. The heated circulating water then flows through the water cooling row for heat dissipation and cooling, and finally flows back to the water tank for the next cycle of heat dissipation . As a result, the internal temperature of the refrigerator drops rapidly, and the inner wall of the refrigerator's internal cooling liner, the folded fin radiator, and the object under test can all drop to 0°C, and the external water-cooled heat sink is always maintained at 35°C to keep the semiconductor refrigeration module at a power of 100W. The good working condition has no performance attenuation. The refrigerator test results are shown in Figure 5. The 10L test object can be reduced from 27°C to 5°C within 2.5 hours, and can be lowered to below 0°C within 6 hours, which has a strong cooling effect. Effect.

The serial numbers of the above-mentioned embodiments of the utility model are only for description, and do not represent the advantages and disadvantages of the embodiments.

In the above-mentioned embodiments of the present invention, the descriptions of each embodiment have their own emphases, and for the parts not described in detail in a certain embodiment, reference may be made to the relevant descriptions of other embodiments. In the several embodiments provided in this application, it should be understood that the disclosed technical content can be realized in other ways.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand : It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the various embodiments of the present invention Scope of technical solutions.

Claims (6)

1. A semiconductor refrigerating refrigerator with internal enhanced heat exchange, characterized in that it includes an internal enhanced heat exchange device; The internal enhanced heat exchange device includes: a cooling liner, a folded sheet heat exchanger, and a heat exchange fan; The cooling liner is provided with a plurality of inward convex structures, and the back of the cooling liner is scattered with a plurality of semiconductor module installation grooves; The folded sheet heat exchanger is made of stacked metal sheets, which are welded or fixed on the inner wall of the cold-conducting liner through a heat-conducting medium; The heat exchange fan is a cross-flow fan installed above and below the folded sheet heat exchanger to absorb the cooling capacity of the folded sheet heat exchanger and release cold air to the inside of the refrigerator, or the heat exchange fan is an axial flow fan installed on the folded sheet heat exchanger The front side of the refrigerator absorbs the cold energy of the folded sheet heat exchanger and releases the cold air to the inside of the refrigerator. 2. A semiconductor refrigerating refrigerator with enhanced internal heat exchange according to claim 1, characterized in that, the semiconductor refrigerating refrigerator is also provided with an external water cooling device; The external water-cooling heat dissipation device includes: a water-cooling plate, a water-cooling row, a water tank, a water pump and a water pipe. 3. A semiconductor refrigeration refrigerator with enhanced internal heat exchange according to claim 1, characterized in that, the semiconductor refrigeration refrigerator is also provided with a semiconductor refrigeration module; the semiconductor refrigeration module is arranged on the back of the cooling liner In the installation slot of the semiconductor refrigeration module, the cold end of the semiconductor refrigeration module is attached to the cooling inner tank, and the hot end of the semiconductor refrigeration module is attached to the water cooling plate of the external water cooling system. 4. A semiconductor refrigerating refrigerator with enhanced internal heat exchange according to claim 1, characterized in that, the semiconductor refrigerating refrigerator is also provided with a thermal insulation shell; the thermal insulation shell is filled with a foaming agent, An insulation layer is formed between the cooling inner tanks of the internal enhanced heat exchange device. 5. A semiconductor refrigeration refrigerator with enhanced internal heat exchange according to claim 2, characterized in that, the water tank of the external water-cooling heat dissipation device is arranged below the cooling inner tank, and the water-cooling row is arranged in the water tank On both sides of the refrigerator, the lower casing of the refrigerator corresponding to the water-cooling row is provided with a water-cooling row cooling grille. 6. A semiconductor refrigeration refrigerator with enhanced internal heat exchange according to claim 2, characterized in that, the water pump of the external water-cooling heat dissipation device is externally arranged at the bottom of the water tank, and the water pipe is arranged at the heat-preservation panel on the back of the refrigerator. layer.

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