CN211507684U - Semiconductor heat radiation structure - Google Patents
Semiconductor heat radiation structure Download PDFInfo
- Publication number
- CN211507684U CN211507684U CN202020387695.4U CN202020387695U CN211507684U CN 211507684 U CN211507684 U CN 211507684U CN 202020387695 U CN202020387695 U CN 202020387695U CN 211507684 U CN211507684 U CN 211507684U
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- supporting piece
- superconducting
- heat dissipation
- semiconductor
- air duct
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 230000005855 radiation Effects 0.000 title description 6
- 238000005057 refrigeration Methods 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000012792 core layer Substances 0.000 claims description 8
- 239000003566 sealing material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002887 superconductor Substances 0.000 description 1
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Abstract
The utility model discloses a semiconductor heat dissipation structure, which comprises a semiconductor refrigeration element, wherein the hot end of the semiconductor refrigeration element is connected with a superconducting radiating fin, a first air duct supporting piece and a second air duct supporting piece are arranged below the superconducting radiating fin, the first air duct supporting piece and the superconducting radiating fin form a first air cavity, the second air duct supporting piece and the superconducting radiating fin form a second air cavity, a groove body for fixing the semiconductor refrigeration element is arranged on the second air duct supporting piece, the semiconductor refrigeration element is fixed in the groove body and adopts superconducting materials, the heat dissipation capability is greatly improved, the double-layer air cavity flow passage design effectively utilizes the heat dissipation property of the two sides of the radiator to strengthen heat exchange, the radiator adopts a single-plate structure, does not need heat dissipation fins, saves materials, and has the advantages of light weight and a single-plate radiator, the air cavity is designed to be thin in height, and the whole heat dissipation device has the advantage of being thin in thickness.
Description
Technical Field
The utility model relates to a thing to sit on technical field specifically is a semiconductor heat radiation structure.
Background
The semiconductor refrigeration technology is a brand-new green environment-friendly technology, converts electric energy into heat energy for heating or refrigeration, has the advantages of no fluid medium pollution, no noise, small volume, light weight, accurate temperature control, long service life and the like, and is widely applied to various industries. The semiconductor refrigerating element is provided with a cold end and a hot end, and because the semiconductor refrigerating element is thin and generally 2-5 mm in thickness, the cold end and the hot end are close to each other in distance, and generated heat must be continuously discharged in order to keep the cold end continuously absorbing heat during refrigeration. The heat generated at the hot end is the sum of the heat generated by consuming electric energy and the heat absorbed from the cold end. A large amount of heat is generated due to its low cooling efficiency. Therefore, timely and rapid heat dissipation is a difficult problem for semiconductor refrigeration application. The heat dissipation mode of the hot end includes natural heat dissipation, forced convection, liquid circulation, heat pipes and the like. The natural convection heat dissipation effect is poor, and the required radiator is huge in size, so that the radiator is not economical and practical. The heat dissipation is carried out in a general forced convection mode, the effect is improved, and the occupied space volume is larger. Liquid circulation is a relatively high-efficient heat dissipation mode, but needs to establish a liquid circulation system, and spare part is various and complicated, and it is great to be applied to the product limitation that has the requirement for portability. The heat pipe method has strong heat dissipation capability but high cost.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor heat radiation structure for solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a semiconductor heat dissipation structure comprises a semiconductor refrigeration element, wherein the hot end of the semiconductor refrigeration element is connected with a superconducting radiating fin, a first air channel supporting piece and a second air channel supporting piece are arranged below the superconducting radiating fin, the first air channel supporting piece and the superconducting radiating fin form a first air cavity, the second air channel supporting piece and the superconducting radiating fin form a second air cavity, a groove body used for fixing the semiconductor refrigeration element is arranged on the second air channel supporting piece, and the semiconductor refrigeration element is fixed in the groove body.
Preferably, the superconducting heat sink is made of superconducting material,
preferably, the superconducting heat sink comprises a core layer, and the surface of the core layer is wrapped with a superconducting material.
The core layer is made of metal with good heat-conducting property such as aluminum or copper. This structure can reduce the cost.
Preferably, at least one air guide structure is arranged on the first air duct supporting piece.
The air guide structure is arranged at the position close to the front part in the middle of the corresponding semiconductor refrigeration element, so that air flow in the air cavity carries out air blowing and heat exchange on the superconducting radiating fins below the semiconductor refrigeration element along the air guide structure, and heat below the semiconductor refrigeration element is taken away rapidly.
Preferably, the first air duct supporting member is parallel to or at an angle to the superconducting heat sink.
Preferably, the height of the first wind chamber is gradually reduced along the airflow direction.
The purpose is to enhance the heat exchange between the air flow and the superconducting heat sink.
Preferably, an opening is formed in the second air duct supporting member, the edge of the opening extends downwards to form a lower rib structure for fixing the semiconductor refrigerating element, and sealing materials are filled around the lower rib structure and the semiconductor refrigerating element.
Preferably, the second air duct supporting member is provided with a second air guiding structure for shunting the air flow along two sides of the semiconductor refrigeration element.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides a semiconductor heat radiation structure, adopt superconducting material, heat-sinking capability improves greatly, double-deck wind chamber runner design, effectively utilize radiator two sides thermal diffusivity, reinforce the heat transfer, the radiator adopts the monolithic plate structure, need not heat radiation fins, save with the material, whole heat abstractor has light in weight advantage, the monolithic radiator, wind chamber high design is very thin, whole heat abstractor has thickness thinner advantage, support the wind-guiding structure on through the wind channel, the heat transfer is reinforceed fast to guide air current and the corresponding superconductive position of semiconductor refrigeration component, reduce semiconductor refrigeration component hot junction high heat flux density rapidly. The refrigerating effect of the semiconductor is guaranteed, the fan is shared by the double-layer flow channels, the fan efficiency is fully exerted, and the novel heat dissipation device jointly formed by the fan can be completely applied to products with requirements on weight and thickness.
Drawings
Fig. 1 is a side view of the present invention;
fig. 2 is a top view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1-2, the present invention provides a technical solution:
a semiconductor heat dissipation structure comprises a semiconductor refrigeration element, wherein a semiconductor refrigeration element 1 is provided with a cold end and a hot end, the cold end is usually connected with a heat conduction material for heat exchange and cold absorption, the hot end of the semiconductor refrigeration element is connected with a superconducting radiating fin 2, a first air channel support member 3 and a second air channel support member 5 arranged above the superconducting radiating fin are arranged below the superconducting radiating fin, the first air channel support member and the superconducting radiating fin form a first air cavity 4, the second air channel support member 5 and the superconducting radiating fin form a second air cavity 6, and the second air channel support member is made of a heat insulation material; a groove body for fixing a semiconductor refrigeration element is arranged on the second air duct supporting piece, the semiconductor refrigeration element is fixed in the groove body, specifically, an opening is formed in the second air duct supporting piece, the edge of the opening extends downwards to form a lower rib structure 51 for fixing the semiconductor refrigeration element, and sealing materials are filled at the peripheries of the lower rib structure 51 and the semiconductor refrigeration element; preventing the hot air in the air cavity from leaking to the cold end of the semiconductor refrigerating element to influence the refrigerating effect; the superconducting radiating fin is integrally made of superconducting materials, or the superconducting radiating fin comprises a core layer, and the surface of the core layer is wrapped with the superconducting materials. The core layer is made of metal with good heat conducting property such as aluminum or copper, and the cost can be reduced by the structure. At least one air guiding structure 31 is arranged on the first air duct supporting member. The air guide structure is arranged at the front part in the middle of the corresponding semiconductor refrigeration element, so that air flow in the first air cavity 4 can blow and exchange heat with the superconducting radiating fins below the semiconductor refrigeration element along the air guide structure, heat below the semiconductor refrigeration element is rapidly taken away, the first air channel supporting piece is parallel to the superconducting radiating fins or is at a certain angle, and when the air channel supporting piece is at a certain angle, the height of the first air cavity is gradually reduced along the air flow direction. The purpose is to enhance the heat exchange between the air flow and the superconducting heat sink. The second air duct supporting member is provided with a second air guiding structure 52 for shunting air flow along two sides of the semiconductor refrigerating element to prevent the air flow from directly impacting the semiconductor refrigerating element to cause large air loss.
The heat sink is not limited to the superconducting material or the superconducting coating material, but may be a material having a thermal conductivity close to that of the superconductor. The superconducting radiating fin is directly used as a cold-end substrate of the semiconductor refrigerating element or is connected with the superconducting radiating fin through an interface heat conduction material.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A semiconductor heat dissipation structure is characterized in that: the semiconductor refrigeration device comprises a semiconductor refrigeration element, wherein the hot end of the semiconductor refrigeration element is connected with a superconducting radiating fin, a first air duct supporting piece and a second air duct supporting piece are arranged below the superconducting radiating fin, the first air duct supporting piece and the superconducting radiating fin form a first air cavity, the second air duct supporting piece and the superconducting radiating fin form a second air cavity, a groove body used for fixing the semiconductor refrigeration element is arranged on the second air duct supporting piece, and the semiconductor refrigeration element is fixed in the groove body.
2. The semiconductor heat dissipation structure of claim 1, wherein: the superconducting radiating fin is integrally made of superconducting materials.
3. The semiconductor heat dissipation structure of claim 1, wherein: the superconducting heat radiating fin comprises a core layer, and a superconducting material is wrapped on the surface of the core layer.
4. The semiconductor heat dissipation structure of claim 1, wherein: at least one air guide structure is arranged on the first air duct supporting piece.
5. The semiconductor heat dissipation structure of claim 1, wherein: the first air duct supporting piece is parallel to the superconducting radiating fins or forms a certain angle with the superconducting radiating fins.
6. The semiconductor heat dissipation structure of claim 1, wherein: along the airflow direction, the height of the first air cavity is gradually reduced.
7. The semiconductor heat dissipation structure of claim 1, wherein: an opening is formed in the second air duct supporting piece, the edge of the opening extends downwards to form a lower rib structure used for fixing the semiconductor refrigerating element, and sealing materials are filled around the lower rib structure and the semiconductor refrigerating element.
8. The semiconductor heat dissipation structure of claim 1, wherein: and a second air guide structure is arranged on the second air duct supporting piece and used for shunting air flow along two sides of the semiconductor refrigeration element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020387695.4U CN211507684U (en) | 2020-03-24 | 2020-03-24 | Semiconductor heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020387695.4U CN211507684U (en) | 2020-03-24 | 2020-03-24 | Semiconductor heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211507684U true CN211507684U (en) | 2020-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020387695.4U Expired - Fee Related CN211507684U (en) | 2020-03-24 | 2020-03-24 | Semiconductor heat radiation structure |
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| Country | Link |
|---|---|
| CN (1) | CN211507684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113218104A (en) * | 2021-04-28 | 2021-08-06 | 杨军辉 | Ultrathin semiconductor refrigerating device |
-
2020
- 2020-03-24 CN CN202020387695.4U patent/CN211507684U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113218104A (en) * | 2021-04-28 | 2021-08-06 | 杨军辉 | Ultrathin semiconductor refrigerating device |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200915 Termination date: 20210324 |
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| CF01 | Termination of patent right due to non-payment of annual fee |