CN216019118U

CN216019118U - Electronic atomization device, atomizer and heating assembly thereof

Info

Publication number: CN216019118U
Application number: CN202121251378.0U
Authority: CN
Inventors: 向绍斌; 崔望; 陈鹏; 黄容基; 蒋金峰
Original assignee: Shenzhen Smoore Technology Ltd
Current assignee: Shenzhen Smoore Technology Ltd
Priority date: 2021-06-04
Filing date: 2021-06-04
Publication date: 2022-03-15
Anticipated expiration: 2031-06-04

Abstract

The application discloses electron atomizing device, atomizer and heating element thereof. This heating element includes: the liquid collecting micro-groove comprises a base body, wherein the base body is provided with a micro-groove part, and the micro-groove part is provided with a plurality of liquid collecting micro-grooves; the heating element is arranged on the micro-groove part, and the liquid-gathering micro-groove is used for locking liquid to form a liquid film on the surface of the heating element; wherein the micro-groove part is at least partially higher than the heating element. Be equipped with the microgroove portion on through the base member, the microgroove portion is equipped with a plurality of liquid microgrooves of gathering, with the surface area of atomization zone in the effective increase base member, and by more liquid matrix of capillary force and surface tension gathering, the microgroove portion part at least is higher than heating element, thereby the liquid film thickness on the multiplicable base member, the heating element that this application provided can increase the liquid film thickness on the base member, with the liquid supply amount of increase to heating element, avoid the dry combustion method situation that the atomizing in-process takes place, and can promote the content of big liquid drop in the produced aerosol of atomizing, and then improve the taste that can inhale the atomizing gas.

Description

Electronic atomization device, atomizer and heating assembly thereof

Technical Field

The application relates to the technical field of atomization, in particular to an electronic atomization device, an atomizer and a heating component of the atomizer.

Background

The electronic atomization device is also called an aerosol generating device and an electronic atomizer. The electronic atomization device mainly comprises an atomizer and a power supply. The atomizer is used as a core device for generating atomizing gas in the electronic atomizing device, and the atomizing effect of the atomizer determines the quality and the taste of the atomizing gas. The existing ceramic atomizing core adopts a mode of adding a heating film into porous ceramic, and the heating film is formed on the surface of the porous ceramic through processes such as screen printing and the like.

In the atomization process, liquid in the liquid storage is adsorbed on the porous ceramic through the porous ceramic, and then is heated and atomized by the heating film on the surface. However, in the electronic atomizing device having such a structure, since the liquid storage amount in the vicinity of the heat generating film is limited, the liquid supply amount tends to be insufficient in the latter half of the atomizing process, and dry burning and scorched smell tend to occur.

Therefore, in the atomization process, the height of the liquid film of the atomization surface is increased, sufficient liquid supply is ensured, and the device has positive significance for reducing scorched smell in the suction process of the electronic atomization device.

Relevant studies have shown that the perception of flavor and sweetness in an electrospray device is primarily from human taste perception. The taste sensation is mainly related to the number and the proportion of large liquid drops in the aerosol. The formation of large droplets is highly correlated with the liquid film. Under the condition of sufficient oil supply, large liquid drops are easy to form and generate; in the case of insufficient oil supply, the formation of droplets is more likely to occur. Therefore, on the premise of ensuring that the atomization amount is not changed, the large aerosol droplet amount generated in the atomization process of the electronic atomization device is increased, and the method has obvious positive significance for increasing related indexes of the electronic atomization device such as fragrance, sweetness and the like.

SUMMERY OF THE UTILITY MODEL

The application mainly provides an electron atomizing device, atomizer and heating element thereof to solve the not enough dry combustion problem that leads to of liquid supply volume among the atomizing process.

In order to solve the technical problem, the application adopts a technical scheme that: a heat generating component is provided. The heat generating component includes: the liquid collecting device comprises a substrate, a liquid collecting device and a liquid collecting device, wherein the substrate is provided with a micro-groove part, and the micro-groove part is provided with a plurality of liquid collecting micro-grooves; the heating element is arranged on the micro-groove part, and the liquid-gathering micro-groove is used for locking liquid to form a liquid film on the surface of the heating element; wherein the micro-groove is at least partially higher than the heat-generating element.

In some embodiments, the microchannel portion is further provided with a sink spanning the plurality of liquid collecting microchannels; the heating element is arranged on the bottom wall of the sinking groove.

In some embodiments, the sinking groove has a notch formed on a surface of the micro-groove, the heat generating element is disposed on the bottom wall of the sinking groove through the notch, and a surface of the heat generating element away from the bottom wall of the sinking groove is lower than the notch of the sinking groove.

In some embodiments, a spacing between a surface of the heat generating element away from the bottom wall of the sink tank and the notch of the sink tank is in a range of 0.1mm to 0.2 mm.

In some embodiments, at least a portion of the plurality of liquid accumulation micro-grooves are in communication with the sink groove.

In some embodiments, the sink groove has a groove depth in the range of 0.2mm to 0.3 mm.

In some embodiments, the groove depth of the liquid collecting micro groove is equal to or less than the groove depth of the sinking groove.

In some embodiments, the groove depth of the liquid trap micro-groove is in the range of 0.15mm to 0.3 mm.

In some embodiments, the plurality of liquid collecting micro-grooves are arranged in an array, the groove width of the liquid collecting micro-grooves gradually decreases with increasing groove depth, and the distance between the liquid collecting micro-grooves is in the range of 0.2mm to 0.5 mm.

In some embodiments, the base is a porous base, the heating element is a heating film, and the heating film is attached to the bottom wall of the sink by resistance paste bonding.

In some embodiments, the substrate is further provided with an electrode groove and an electrode arranged in the electrode groove, the electrode groove is arranged at the end of the sinking groove and is communicated with the sinking groove, and the electrode is electrically connected with the heating element.

In some embodiments, the substrate is provided with two electrode grooves, the two electrode grooves are respectively arranged at two ends of the sinking groove, the bottom surface of the sinking groove is flush with the bottom surface of the electrode groove, the two electrodes are respectively arranged in the corresponding electrode grooves, one of the two electrodes is electrically connected with one end of the heating element, and the other electrode is electrically connected with the other end of the heating element.

In some embodiments, the sinking groove comprises a first connecting section, a first arc section, a second arc section and a second connecting section which are connected in sequence, wherein the opening of the first arc section is opposite to the opening of the second arc section in direction, the first connecting section is communicated with one electrode groove, and the second connecting section is communicated with the other electrode groove.

In some embodiments, the sinking groove further comprises a straight line section, the first arc section and the second arc section are connected through the straight line section, and the first connecting section, the straight line section and the second connecting section are sequentially arranged in parallel.

In some embodiments, the substrate has a surface, at least a portion of the microchannel portion protruding from the surface; or

The micro-groove is flush with the surface; or

The micro-groove part is arranged in a sinking way relative to the surface.

In order to solve the above technical problem, another technical solution adopted by the present application is: an atomizer is provided. The atomizer comprises the heating component.

In order to solve the above technical problem, another technical solution adopted by the present application is: an electronic atomizer is provided. The electronic atomization device comprises a power supply and the atomizer, wherein the power supply is connected with the atomizer and supplies power to the atomizer.

Be different from prior art's condition, this application discloses an electron atomizer, atomizer and heating element thereof. The micro-groove part is arranged on the substrate, the micro-groove part is provided with a plurality of liquid gathering micro-grooves, the surface area of the atomizing area in the substrate can be effectively increased, more liquid substrates can be gathered in the atomizing area by capillary force and surface tension, the thickness of a liquid film on one side of the micro-groove part can be further increased, the heating element is arranged in the micro-groove part, at least part of the micro-groove part is higher than the heating element, the heating element can be covered by the liquid film, the liquid supply amount of the heating element can be increased, the heating element can not contact with air during atomizing work, the dry burning phenomenon in the atomizing process is avoided, the energy utilization rate in the atomizing process can be increased due to the fact that the heating element is covered by the liquid film, therefore, the heating component provided by the application can increase the liquid supply amount of the heating element arranged on the heating element, the dry burning condition in the atomizing process is avoided, and the content of large liquid drops in aerosol generated by atomizing can be increased, thereby improving the taste of the fragrant and atomized gas which can be sucked.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts, wherein:

FIG. 1 is a schematic structural diagram of an embodiment of a heat generating component provided herein;

FIG. 2 is a schematic axial side view of the base of the heating element of FIG. 1;

FIG. 3 is a schematic top view of the substrate shown in FIG. 2;

FIG. 4 is a schematic view of the substrate shown in FIG. 3 taken along line A-A;

FIG. 5 is a graph comparing the heights of liquid films on conventional and various submerged heating elements;

FIG. 6 is a graph comparing the large droplet content of aerosols generated by conventional and submerged heating elements;

FIG. 7 is a graph comparing the texture of aerosols generated by conventional and submerged heating elements;

FIG. 8 is a schematic structural view of an embodiment of an atomizer provided herein;

FIG. 9 is a schematic cross-sectional view of the atomizer shown in FIG. 8;

FIG. 10 is an enlarged fragmentary view of region A of the atomizer shown in FIG. 9;

fig. 11 is a schematic structural diagram of an embodiment of an electronic atomization device provided in the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to 2, fig. 1 is a schematic structural diagram of an embodiment of a heating element 100, and fig. 2 is a schematic structural diagram of an axial side of a substrate in the heating element shown in fig. 1.

The heating assembly 100 includes a base 10 and a heating element 20, the heating element 20 is disposed on the base 10, and the heating element 20 is used for generating heat to atomize a liquid matrix gathered on one side of the base 10.

The substrate 10 may be a porous substrate capable of introducing a liquid substrate such as a nicotine or flavor containing liquid or drug solution from one side of the substrate to the other. The porous substrate may be a porous ceramic substrate or a porous glass substrate, or the like. In this embodiment, the substrate 10 is a porous ceramic substrate, which is generally a ceramic material sintered at a high temperature from components such as aggregates, binders, pore-forming agents, etc., and has a large number of pore structures therein that are communicated with each other and with the surface of the material, so that the liquid matrix can be introduced from the liquid-absorbing surface to the atomizing surface. The porous ceramic material has the advantages of high porosity, stable chemical property, large specific surface area, small volume density, low thermal conductivity, high temperature resistance, corrosion resistance and the like, and has a plurality of applications in the fields of metallurgy, biology, energy, environmental protection and the like.

The substrate 10 may also be a dense body which is not used for guiding liquid and sprays a liquid substrate to one side of the substrate 10 through a spray head, the heating element 20 may also atomize the liquid substrate, and the substrate 10 may be a glass substrate or a ceramic substrate.

In this embodiment, the base 10 is a porous base having a liquid absorbing surface and an atomizing surface, the porous base is used for introducing a liquid base material such as a liquid or a drug solution containing nicotine or a flavor component from the liquid absorbing surface to the atomizing surface, and the heating element 20 is provided on the atomizing surface of the porous base. Wherein, one side at imbibition face place can also be provided with the recess to increase the imbibition area, promote imbibition efficiency. Alternatively, the liquid-absorbing surface may be a flat surface, which is not particularly limited in this application.

The heating element 20 may be a heating film or a heating resistor, and the specific material thereof is not limited in the present application.

In the present application, the substrate 10 is provided with the micro-groove 12, the micro-groove 12 is provided with the plurality of liquid collecting micro-grooves 122, and the heating element 20 is provided in the micro-groove 12. The liquid-collecting micro-groove 122 is used for locking liquid to form a liquid film on the surface of the heating element 20, and the micro-groove 12 is at least partially higher than the heating element 20.

Alternatively, referring to fig. 1, the substrate 10 has a surface 11, and at least a portion of the micro-groove 12 protrudes from the surface 11. Wherein, the micro-groove part 12 can partially protrude from the surface 11, so that the liquid-collecting micro-groove 122 can partially be located under the surface 11; the micro-grooves 12 may also be entirely raised from the surface 11, i.e. the bottom surfaces of the micro-grooves 12 are coplanar with the surface 11.

Alternatively, referring to fig. 1, the micro-groove 12 is disposed in a sunken manner relative to the surface 11, so that a sunken groove can be formed above the micro-groove 12, and the sunken groove can be used for collecting liquid, blocking the collected liquid matrix from flowing around, and facilitating to increase the thickness of the liquid film on the surface of the heating element 20.

In this embodiment, as shown in fig. 1, the micro-groove 12 is flush with the surface 11, i.e., the top surface of the micro-groove 12 is flush with the surface 11.

In this embodiment, the micro-groove portion 12 is further provided with a sinking groove 124, the sinking groove 124 spans the plurality of liquid collecting micro-grooves 122, the sinking groove 124 is configured for mounting the heating element 20, in other words, the heating element 20 is disposed on the bottom wall of the sinking groove 124, and the micro-groove portion 12 is at least partially higher than the heating element 20.

The heat generating element 20 has a first surface facing the bottom wall of the sinking groove 124 and used for being fixed to the bottom wall of the sinking groove 124, and a second surface opposite to the first surface, that is, the second surface is away from the bottom wall of the sinking groove 124.

In this embodiment, the sinking groove 124 has a notch formed on the surface of the micro-groove 12, the heating element 20 is disposed on the bottom wall of the sinking groove 124 through the notch, that is, the heating element 20 is disposed in the sinking groove 124, and the second surface of the heating element 20 is lower than the notch of the sinking groove 124, so that the liquid film formed by the liquid substrate on the micro-groove 12 covers the whole heating element 20, thereby ensuring that the second surface is not contacted with air but covered by the liquid film when the heating element 20 works, and relatively increasing the thickness of the liquid film on one side of the second surface, thereby avoiding dry burning during atomization.

Alternatively, the heating element 20 is disposed in the sinking groove 124, and the second surface of the heating element 20 may be flush with the notch of the sinking groove 124, so that the heating element 20 does not protrude from the top surface of the micro-groove 12, and the liquid film on the micro-groove 12 may cover the entire heating element 20.

Alternatively, the heating element 20 may also partially protrude from the sinking groove 124, that is, the second surface of the heating element 20 is higher than the notch of the sinking groove 124. Compared with the scheme of directly fixing the heating element 20 on the surface of the atomization surface 13, the heating element 20 is partially accommodated in the sinking groove 124, so that the distance from the second surface to the top surface of the micro-groove part 12 can be reduced, the liquid film on the micro-groove part 12 can cover the second surface, and the dry burning phenomenon caused by the contact of the heating element 20 with air during operation is avoided.

In other embodiments, the micro-groove 12 is provided with a through-groove, the through-groove of the micro-groove 12 cooperates with the surface 11 of the substrate 10 to form a sunken groove for accommodating the heat-generating element 20, the heat-generating element 20 is disposed on the surface 11, and the micro-groove 12 is at least partially higher than the heat-generating element 20.

In this embodiment, the heating element 20 is a heating film, and the heating film is attached to the sink 124 by bonding with resistance paste. The resistance paste has the characteristics of good fluidity, strong adhesive force, high leveling property, strong film-substrate binding force and the like, so that the heating film can be firmly bonded on the bottom wall of the sinking groove 124, and the phenomenon that the heating film cannot be formed by adopting the existing screen printing mode due to the fact that the base body 10 adopts the design of the sinking groove 124 is avoided.

The depth of the sinking groove 124 is in the range of 0.2mm to 0.3mm, for example, the depth of the sinking groove 124 may be 0.2mm, 0.25mm, or 0.3 mm.

The thickness of the heating element 20 is approximately 0.1mm, wherein the thickness of the heating element 20 refers to the dimension of the heating element 20 in the depth direction of the sinking groove 124; the heating element 20 is accommodated in the sinking groove 124, and the distance between the second surface of the heating element 20 and the notch of the sinking groove 124 is in the range of 0.1mm to 0.2mm, i.e. the second surface is located in the sinking groove 124 and the distance between the second surface and the notch of the sinking groove 124 may be 0.1mm, 0.15mm or 0.2mm, etc.

Through experimental verification and simulation analysis, when the groove depth of the sinking groove 124 is in the range of 0.2mm to 0.3mm, and more specifically, the sinking distance of the second surface relative to the top surface of the micro-groove part 12 is in the range of 0.1mm to 0.2mm, the liquid substrate stored on the side of the second surface can just satisfy the atomization amount per suction atomization.

When the groove depth of the sink groove 124 exceeds the upper limit of 0.3mm, or the second surface sinks more than 0.2mm from the top surface of the micro-groove part 12, the liquid film on the side of the second surface is excessively thick, the rate of the mist generated by the atomization passing through the liquid film is slow, and further the separation between the second surface and the liquid substrate is caused, so that the amount of the mist generated by the atomization is reduced, and the atomization rate becomes slow. If the depth of the sinking groove 124 is less than the lower limit of 0.2mm, or the sinking distance of the second surface relative to the top surface of the micro-groove 12 is less than 0.1mm, there is a risk of dry burning. Therefore, through experimental verification and simulation analysis, when the depth of the sinking groove 124 is in the range of 0.2mm to 0.3mm, and the sinking distance of the second surface relative to the top surface of the micro-groove part 12 is in the range of 0.1mm to 0.2mm, the dry burning phenomenon caused by insufficient liquid supply amount can be effectively avoided, and the thickness of the liquid film can be remarkably increased, so that sufficient liquid supply amount is ensured, the number ratio of large liquid drops in aerosol generated by atomization is remarkably increased, and the positive significance for improving the fragrance and sweetness of the atomized gas is remarkable.

Referring to fig. 2 to 4, fig. 3 is a schematic top view of the substrate shown in fig. 2, and fig. 4 is a schematic sectional view of the substrate shown in fig. 3 along the a-a direction.

The micro-groove part 12 is further provided with a plurality of liquid collecting micro-grooves 122, the plurality of liquid collecting micro-grooves 122 are distributed around the sinking groove 124, the extending path of the sinking groove 124 at least passes through part of the liquid collecting micro-grooves 122, and at least part of the plurality of liquid collecting micro-grooves 122 is communicated with the sinking groove 124.

Alternatively, a plurality of liquid collecting micro grooves 122 are arranged circumferentially on the micro groove part 12, and the extending path of the sinking groove 124 can pass through part of the liquid collecting micro grooves 122 and communicate with part of the liquid collecting micro grooves 122, so that the liquid matrix enriched in the liquid collecting micro grooves 122 can be supplied to the heating element 20.

In this embodiment, the liquid collecting micro grooves 122 are arranged in parallel at intervals and have the same length, two ends of the sinking groove 124 are respectively located at two sides of the liquid collecting micro grooves 122 in the extending direction perpendicular to the arrangement of the liquid collecting micro grooves, and the extending path of the sinking groove 124 passes through the liquid collecting micro grooves 122, so that each liquid collecting micro groove 122 is communicated with the sinking groove 124.

Through set up a plurality of liquid microgrooves 122 of gathering in microgroove portion 12 to the surface area in the atomizing district in the increase base member 10, thereby increase the reserve volume of liquid matrix in the atomizing district, thereby can alleviate or even avoid the dry combustion phenomenon that heating element 100 leads to because of supplying liquid inadequately in the course of operation in the latter half, can avoid producing burnt flavor when atomizing in the latter half.

For example, during the atomization process, the storage amount of the liquid matrix on the liquid absorption surface side of the porous matrix is gradually reduced, so that insufficient liquid supply on the atomization surface side may be caused in the second half of atomization, and by providing the micro-groove part 12, and providing the plurality of liquid collecting micro-grooves 122 on the micro-groove part 12, the liquid matrix can be stored in the liquid collecting micro-grooves 122, and the liquid collecting micro-grooves 122 are further communicated to the sink groove 124, and the liquid matrix stored in the liquid collecting micro-grooves 122 can be timely supplemented into the sink groove 124 for atomization of the heating element 20, thereby avoiding dry burning and generation of scorched smell.

Specifically, the liquid storage mode of the atomization zone in the substrate 10 mainly depends on capillary force and surface tension, and by arranging the micro-groove part 12, and arranging the plurality of liquid-collecting micro-grooves 122 on the micro-groove part 12, the surface area of the atomization zone in the substrate 10 includes the top surface of the micro-groove part 12 and the surface area of the liquid-collecting micro-grooves 122, the surface area of the atomization zone can be relatively increased by 30% to 60%, so that more liquid can be collected by the capillary force and the surface tension, which is beneficial to increasing the thickness of the liquid film on one side of the top surface of the micro-groove part 12, and further by changing the groove depth and the groove width of the liquid-collecting micro-grooves 122, the liquid matrix can be enriched in the liquid-collecting micro-grooves 122, the storage amount of the liquid matrix in the atomization zone is further increased, the storage amount of the liquid matrix in the atomization zone can be increased by 30% to 60%, thus dry burning and scorched smell caused by insufficient liquid supply in the latter half of atomization can be avoided, and different amounts of liquid substrates can be stored by changing the groove depth and the groove width of the liquid gathering micro-groove 122, so that the selection of different types of liquid substrates and different atomization powers can be met, and the dry burning and burnt smell can be avoided.

As shown in fig. 4, the groove depth of the liquid collecting micro-groove 122 is less than or equal to the groove depth of the sinking groove 124, so as to reduce the processing difficulty of the liquid collecting micro-groove 122 and the sinking groove 124, and also to reduce the residual amount of the liquid matrix in the liquid collecting micro-groove 122, so that the liquid matrix can be fully atomized.

The groove depth of the liquid collecting micro-groove 122 is in the range of 0.15mm to 0.3mm, for example, the groove depth of the liquid collecting micro-groove 122 may be 0.15mm, 0.2mm, 0.25mm, or 0.3mm, etc.

In this embodiment, the groove depth of the liquid collecting micro-groove 122 is equal to the groove depth of the sinking groove 124, the plurality of liquid collecting micro-grooves 122 are arranged in an array, the groove width of the liquid collecting micro-grooves 122 gradually decreases along with the increase of the groove depth, the width of the notch of the liquid collecting micro-groove 122 ranges from 0.2mm to 0.6mm, the width can be 0.2mm, 0.3mm or 0.6mm, the distance between the liquid collecting micro-grooves 122 ranges from 0.2mm to 0.5mm, and the distance can be 0.2mm, 0.3mm or 0.5 mm.

Optionally, the cross section of the liquid collecting micro-groove 122 may be V-shaped, arc-shaped, or U-shaped, so that the groove width of the liquid collecting micro-groove 122 gradually decreases with the increase of the groove depth, which is beneficial to increase the strength of the matrix between the liquid collecting micro-grooves 122, and avoids the matrix between the liquid collecting micro-grooves 122 being easily damaged due to insufficient strength.

In this embodiment, the liquid collecting micro grooves 122 are uniformly arranged along the length direction of the substrate 10, and the distance between the liquid collecting micro grooves 122 is in the range of 0.2mm to 0.5mm, so that a large number of liquid collecting micro grooves 122 are distributed on the micro groove portion 12, the strength of the substrate between the liquid collecting micro grooves 122 is sufficient, and the storage amount of the liquid matrix in the atomization area can be increased.

The plurality of liquid collecting micro-grooves 122 may also be arranged obliquely along the length direction of the substrate 10; or the liquid collecting micro grooves 122 can be arranged in multiple rows, and the liquid collecting micro grooves 122 in the same column are communicated with each other; alternatively, the liquid collecting micro-grooves 122 may be communicated with each other, which is not particularly limited in the present application.

The heating element 100 further includes two electrodes 30, the two electrodes 30 may be disposed on the surface 11 of the substrate 10, and two ends of the heating element 20 are respectively connected to one electrode 30.

In this embodiment, the base 10 is further provided with an electrode groove 134, the electrode groove 134 is disposed at an end of the sinking groove 124, and the electrode groove 134 is communicated with the sinking groove 124. By arranging the electrode groove 134 to mount the electrode 30, the electrode 30 is correspondingly sunk, and the electrode groove 134 is communicated with the sinking groove 124, so that the heating element 20 is conveniently and electrically connected with the electrode 30, and the connection difficulty caused by the height difference existing when the heating element 20 is connected with the electrode 30 is reduced or even avoided.

Generally, the heating element 20 is a heating film, for example, the heating element 20 is installed in the sinking groove 124, and the electrode 30 is installed on the surface 11, because there is a height difference between the bottom wall of the sinking groove 124 and the surface 11, when the heating element 20 is manufactured, the connection difficulty between the heating element 20 and the electrode 30 is large and there is a risk of fracture at the connection, and by providing the electrode groove 134 to reduce or even eliminate the height difference, the connection difficulty between the heating element 20 and the electrode 30 can be simplified, and the risk of fracture at the connection can be eliminated.

In this embodiment, two electrode slots 134 are disposed on the surface 11, the two electrode slots 134 are disposed at two ends of the sinking slot 124, and the bottom wall of the sinking slot 124 is flush with the bottom wall of the electrode slot 134, so that the heating element 20 is connected to the electrode 30 in the electrode slot 134. The two electrodes 30 are respectively disposed in the corresponding electrode grooves 134, and one of the two electrodes 30 is electrically connected to one end of the heating element 20, and the other is electrically connected to the other end of the heating element 20.

In other embodiments, an electrode groove 134 is disposed on the atomizing surface 13, two electrodes 30 are installed in the electrode groove 134 and are spaced apart from each other and insulated from each other, the heating element 20 is rotatably disposed in the sinking groove 124, and two ends of the heating element 20 are respectively connected to one electrode 30.

In this embodiment, as shown in fig. 3, the sinking groove 124 includes a first connection segment 1241, a first arc segment 1242, a second arc segment 1244 and a second connection segment 1245 which are connected in sequence, the opening of the first arc segment 1242 is opposite to the opening of the second arc segment 1244, the openings of the first arc segment 1242 and the second arc segment 1244 are facing different electrode grooves 134, the first connection segment 1241 communicates with one electrode groove 134, and the second connection segment 1245 communicates with the other electrode groove 134.

The sink 124 further includes a straight line segment 1243, the first arc segment 1242 and the second arc segment 1244 are connected by the straight line segment 1243, and the first connection segment 1241, the straight line segment 1243 and the second connection segment 1245 are sequentially arranged in parallel, so that the first connection segment 1241, the straight line segment 1243 and the second connection segment 1245 can pass through the liquid collecting micro-tank 122 in the same portion for multiple times, so as to guide the stored liquid substrate into the sink 124.

The first connecting section 1241, the straight section 1243 and the second connecting section 1245 are disposed in parallel and distributed more uniformly on the top surface of the micro-groove 12, so that the liquid substrate can be atomized more efficiently and reasonably when the heating element 20 is disposed in the sink 124. The openings of the first curved sections 1242 are oriented opposite to the openings of the second curved sections 1244 so that they occupy as much of the central area on the atomizing surface 13 as possible, improving the atomizing efficiency to the central area when the heating element 20 is mounted thereon.

In other embodiments, sink 124 may not include straight segment 1243, and first curved segment 1242 and second curved segment 1244 are directly connected. Alternatively, the first and

second connection sections

1241 and 1245 may also be arc-shaped sections, which is not particularly limited in this application.

Now, each item of data comparison is performed between the conventional heating element and the sinking heating element 100 provided in the present application. In the traditional heating component, the atomization surface of the porous matrix is not provided with a sink groove and a liquid guide micro-groove, and the heating element is arranged on the atomization surface.

Referring to fig. 5, fig. 5 is a graph comparing the heights of liquid films on the conventional and various sinking heating elements. Wherein, the height difference of the heating element relative to the atomizing surface is the height difference of the second surface relative to the atomizing surface. In a conventional heating element, the first surface of the heating element is disposed on the atomizing surface, the height of the first surface is usually 0.1mm, and the thickness of the liquid film is about 0.05mm, i.e., the thickness of the liquid film is about half of the height of the heating element.

The sinking type heating assembly 100 provided by the present application can realize different height differences of the second surface of the heating element 20 relative to the atomizing surface 13 by adjusting the sinking groove depth of the sinking groove 124 and the height of the heating element 20 through the process. Wherein, when the depth of the sinking groove 124 is 0.1mm, the second surface of the heating element is flush with the atomizing surface 13, and the thickness of the liquid film is 0.08 mm; when the depth of the sinking groove 124 is 0.15mm, the height difference between the second surface and the atomization surface 13 is 0.05mm, and the thickness of the liquid film is 0.12 mm; when the depth of the sinking groove 124 is 0.2mm, the height difference between the second surface and the atomization surface 13 is 0.1mm, and the thickness of the liquid film is 0.15 mm; when the depth of the sink 124 is 0.3mm, the height difference between the second surface and the atomizing surface 13 is 0.2mm, and the thickness of the liquid film is 0.23 mm. Therefore, the sinking type heating assembly 100 provided by the present application can significantly increase the thickness of the liquid film.

Specifically, increasing the height difference of the second surface of the heating element 20 with respect to the atomizing surface 13 corresponds to increasing the space in which the liquid medium can climb up and be stored by capillary action, and thus the thickness of the liquid film can be increased.

Referring to fig. 6, fig. 6 is a graph comparing the large droplet content of aerosols generated by conventional and submerged heating elements. The content of large liquid drops in the aerosol generated by the traditional heating component and the content of large liquid drops in the aerosol generated by the sinking type heating component 100 are detected under the same working condition; the depth of the sinking groove 124 in the heating element 100 is 0.3mm, and the height difference between the heating element 20 and the atomizing surface 13 is 0.2 mm.

As shown in FIG. 6, the content of large liquid drops in the aerosol generated by the conventional heat generating component is 0.13mg/puff, while the content of large liquid drops in the aerosol generated by the heat generating component 100 provided by the present application is 0.45 mg/puff. Compared with the traditional heating assembly, the content of large liquid drops in the aerosol generated by the sunken heating assembly 100 is increased by 3.4 times, the substantial increase of the thickness of the visible liquid film ensures the sufficient liquid supply to the heating element 20, and the large liquid drops are easier to form, so that the fragrance and sweetness of the generated aerosol can be increased.

Further, referring to fig. 7, fig. 7 is a comparison of the texture of aerosols generated by conventional and submerged heating elements. Fig. 7 is a comparison graph of the tastes of the aerosol generated by the conventional heat generating component 100 and the sinking heat generating component 100 in fig. 6. As can be seen, the sunken heating element 100 has a better hierarchical sense of fragrance, coordination, reducibility of fragrance, and sweetness than the conventional heating elements.

Based on this, the present application further provides an atomizer 200, referring to fig. 8 to 10, fig. 8 is a schematic structural diagram of an embodiment of the atomizer provided herein; FIG. 9 is a schematic cross-sectional view of the atomizer shown in FIG. 8; fig. 10 is an enlarged view of a portion of the region a of the atomizer shown in fig. 9.

This atomizer 200 includes casing 210, atomizing seat 220, base 230 and as above-mentioned heating element 100, wherein casing 210 is equipped with liquid storage cavity 212, and atomizing seat 220 is from casing 210 open end embedding casing 210 in, and atomizing seat 220 is equipped with atomizing cavity 221, and heating element 100 sets up in atomizing cavity 221, and atomizing seat 220 and base 230 cooperate fixed heating element 100, and base 230 still covers in the open end of casing 210.

The inside of the housing 210 is provided with a vent pipe 214, the atomizing base 220 is provided with a liquid inlet 223 and an atomizing outlet 224, a liquid substrate stored in the liquid storage cavity 212 is guided to the liquid absorption surface 11 of the porous substrate 10 through the liquid inlet 223, the porous substrate 10 guides the liquid substrate in the liquid storage cavity 212 to the atomizing surface 13 from the liquid absorption surface 11, the heating element 20 atomizes the liquid substrate in the atomizing cavity 221 to form atomizing gas, the electrode 30 is used for receiving power supply, the atomizing outlet 224 is communicated with the atomizing cavity 221, and the vent pipe 214 is connected with the atomizing outlet 224 so as to guide the atomizing gas to the oral cavity of a user through the vent pipe 214.

Based on this, this application still provides an electronic atomization device 300. Referring to fig. 11, fig. 11 is a schematic structural diagram of an embodiment of an electronic atomization device provided in the present application. The electronic atomizer 300 includes a power supply 310 and the atomizer 200 as described above, the power supply 310 being connected to the atomizer 200 and supplying power to the atomizer 200.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims

1. A heating element for an electronic atomizer, comprising:

the liquid collecting device comprises a substrate, a liquid collecting device and a liquid collecting device, wherein the substrate is provided with a micro-groove part, and the micro-groove part is provided with a plurality of liquid collecting micro-grooves;

the heating element is arranged on the micro-groove part, and the liquid-gathering micro-groove is used for locking liquid to form a liquid film on the surface of the heating element; wherein the micro-groove is at least partially higher than the heat-generating element.

2. The heating element as claimed in claim 1, wherein the micro-groove portion is further provided with a sinking groove, and the sinking groove spans the plurality of liquid collecting micro-grooves; the heating element is arranged on the bottom wall of the sinking groove.

3. The heating element as claimed in claim 2, wherein the sinking groove has a notch formed on a surface thereof, the heating element is disposed on the bottom wall of the sinking groove through the notch, and a surface of the heating element away from the bottom wall of the sinking groove is lower than the notch of the sinking groove.

4. The heat generating component of claim 3 wherein a spacing between a surface of the heat generating element distal from the bottom wall of the sink and the slot opening of the sink is in the range of 0.1mm to 0.2 mm.

5. The heat-generating component of claim 3, wherein at least some of the plurality of liquid-collecting micro-grooves are in communication with the sink.

6. The heat generating component of claim 3 wherein the sink has a groove depth in the range of 0.2mm to 0.3 mm.

7. The heating element as claimed in claim 6, wherein the groove depth of the liquid collecting micro groove is less than or equal to the groove depth of the sinking groove.

8. The heat-generating component of claim 7, wherein the liquid-collecting micro-grooves have a groove depth in the range of 0.15mm to 0.3 mm.

9. The heating element as claimed in claim 3, wherein the plurality of liquid collecting micro-grooves are arranged in an array, the groove width of the liquid collecting micro-grooves gradually decreases with the increase of the groove depth, and the distance between the liquid collecting micro-grooves is in the range of 0.2mm to 0.5 mm.

10. The heating assembly as claimed in claim 3, wherein the base is a porous base, the heating element is a heating film, and the heating film is attached to the bottom wall of the sinking groove by bonding with resistance paste.

11. The heating assembly as set forth in claim 3, wherein the base body is further provided with an electrode groove and an electrode disposed in the electrode groove, the electrode groove is disposed at an end of the sink, the electrode groove is communicated with the sink, and the electrode is electrically connected to the heating element.

12. The heating assembly as claimed in claim 11, wherein the base body is provided with two electrode grooves, the two electrode grooves are respectively disposed at two ends of the sinking groove, the bottom wall of the sinking groove is flush with the bottom wall of the electrode groove, the two electrodes are respectively disposed in the corresponding electrode grooves, one of the two electrodes is electrically connected to one end of the heating element, and the other electrode is electrically connected to the other end of the heating element.

13. The heating assembly as claimed in claim 12, wherein the sinking groove comprises a first connecting section, a first arc section, a second arc section and a second connecting section which are connected in sequence, the opening of the first arc section and the opening of the second arc section are opposite in direction, the first connecting section is communicated with one electrode groove, and the second connecting section is communicated with the other electrode groove.

14. The heating assembly as claimed in claim 13, wherein the sinking groove further comprises a straight line segment, the first arc segment and the second arc segment are connected by the straight line segment, and the first connecting segment, the straight line segment and the second connecting segment are sequentially arranged in parallel.

15. The heating element as claimed in claim 1, wherein the base has a surface, at least a portion of the micro-groove portion protruding from the surface; or

The micro-groove is flush with the surface; or

The micro-groove part is arranged in a sinking way relative to the surface.

16. A nebuliser, characterised in that it comprises a heat-generating component according to any one of claims 1 to 15.

17. An electronic atomizer device, comprising a power source and an atomizer according to claim 16, said power source being connected to and supplying power to said atomizer.