CN115429000A - Electronic atomization device, atomizer and heating assembly thereof - Google Patents

Abstract

The application discloses electron atomizing device, atomizer and heating element thereof. This heating element includes: the liquid collecting micro-groove comprises a base body, wherein the base body is provided with a micro-groove part, and the micro-groove part is provided with a plurality of liquid collecting micro-grooves; the heating element is arranged on the micro-groove part, and the liquid-gathering micro-groove is used for locking liquid to form a liquid film on the surface of the heating element; wherein the micro-groove part is at least partially higher than the heating element. Be equipped with the microgroove portion on through the base member, the microgroove portion is equipped with a plurality of liquid microgrooves that gather, with the surface area of atomizing area in the effective increase base member, and by more liquid matrix of capillary force and surface tension gathering, microgroove portion part at least is higher than heating element, thereby the liquid film thickness on the multiplicable base member, the heating element that this application provided can increase the liquid film thickness on the base member, with the liquid supply volume of increase to heating element, avoid the dry combustion method situation that takes place among the atomization process, and can promote the content of big liquid drop in the produced aerosol of atomizing, and then improve the taste that can inhale atomizing gas.

Description

Electronic atomization device, atomizer and heating components thereof

technical field

The present application relates to the technical field of atomization, in particular to an electronic atomization device, an atomizer and a heating component thereof.

Background technique

Electronic atomization devices are also known as aerosol generating devices and electronic atomizers. The electronic atomization device is mainly composed of an atomizer and a power supply. The atomizer is the core device for generating atomized gas in the electronic atomization device, and its atomization effect determines the quality and taste of the atomized gas. The existing ceramic atomizing core adopts the method of porous ceramic plus heating film, and the heating film is formed on the surface of porous ceramic by screen printing and other processes.

During the atomization process, the liquid in the liquid reservoir is adsorbed on the porous ceramic through the porous ceramic, and then heated and atomized by the heating film on the surface. However, due to the limited liquid storage near the heating film, the electronic atomization device with this structure tends to have insufficient liquid supply in the second half of the atomization process, resulting in dry burning and burning smell.

Therefore, during the atomization process, increasing the height of the liquid film on the atomization surface and ensuring sufficient liquid supply are of positive significance for reducing the burnt smell during the pumping process of the electronic atomization device.

Relevant studies have shown that the fragrance and sweetness in electronic atomization devices mainly come from people's taste perception. The taste experience is mainly due to the positive correlation between the number and proportion of large droplets in the aerosol. The formation of large droplets is highly correlated with liquid films. In the case of sufficient oil supply, large droplets are easy to form; in the case of insufficient oil supply, small droplets are more inclined to form. Therefore, under the premise of keeping the amount of atomization unchanged, increasing the number of large aerosol droplets produced during the atomization process of the electronic atomization device has obvious effects on improving the taste-related indicators such as aroma and sweetness of the electronic atomization device. Positive meaning.

Contents of the invention

The present application mainly provides an electronic atomization device, an atomizer and its heating components to solve the problem of dry burning caused by insufficient liquid supply during the atomization process.

In order to solve the above technical problems, a technical solution adopted by the present application is to provide a heating component. The heating component includes: a base body, the base body is provided with a micro-groove portion, and the micro-groove portion is provided with a plurality of liquid-collecting micro-grooves; a heating element, the heating element is arranged in the micro-groove portion, and the liquid-collecting The microgrooves are used to lock liquid to form a liquid film on the surface of the heating element; wherein the microgrooves are at least partly higher than the heating element.

In some embodiments, the microgroove part is further provided with a sinker, and the sinker straddles the plurality of liquid collecting microgrooves; the heating element is arranged on the bottom wall of the sinker.

In some embodiments, the sinking tank has a notch, and the notch is formed on the surface of the micro-grooves, the heating element is arranged on the bottom wall of the sinking tank through the notch, and the heating element The surface of the element remote from the bottom wall of the sink is lower than the notch of the sink.

In some embodiments, the distance between the surface of the heating element away from the bottom wall of the sink and the notch of the sink is in the range of 0.1 mm to 0.2 mm.

In some embodiments, at least some of the plurality of liquid accumulation microgrooves are in communication with the sinker.

In some embodiments, the sinker has a depth ranging from 0.2 mm to 0.3 mm.

In some embodiments, the groove depth of the liquid collecting microgroove is less than or equal to the groove depth of the sinker groove.

In some embodiments, the depth of the liquid collecting microgroove is in the range of 0.15 mm to 0.3 mm.

In some embodiments, the plurality of liquid-accumulating microgrooves are arranged in an array, the groove width of the liquid-accumulating microgrooves gradually decreases with the increase of groove depth, and the distance between the liquid-accumulating microgrooves is 0.2 mm to 0.5mm range.

In some embodiments, the substrate is a porous substrate, the heating element is a heating film, and the heating film is installed on the bottom wall of the sink by bonding with resistance paste.

In some embodiments, the base body is also provided with an electrode groove and an electrode arranged in the electrode groove, the electrode groove is arranged at the end of the sink groove, and the electrode groove communicates with the sink groove , the electrode is electrically connected to the heating element.

In some embodiments, the base body is provided with two electrode grooves, and the two electrode grooves are respectively arranged at both ends of the sinking groove, and the bottom surface of the sinking groove and the bottom surface of the electrode groove The two electrodes are arranged in the corresponding electrode slots respectively, one of the two electrodes is electrically connected to one end of the heating element, and the other is electrically connected to the other end of the heating element.

In some embodiments, the sinker includes a first connecting segment, a first arc segment, a second arc segment and a second connecting segment connected in sequence, the opening of the first arc segment is connected to the opening of the second arc segment The openings are in opposite directions, the first connection section communicates with one of the electrode slots, and the second connection section communicates with the other electrode slot.

In some embodiments, the sinker further includes a straight section through which the first arc section and the second arc section are connected, and the first connecting section, the straight section and the The second connection sections are arranged in parallel in turn.

In some embodiments, the substrate has a surface, and at least part of the microgrooves protrude from the surface; or

the microgrooves are flush with the surface; or

The micro-grooves are sunken relative to the surface.

In order to solve the above technical problems, another technical solution adopted by the present application is to provide an atomizer. The atomizer includes the above-mentioned heating element.

In order to solve the above technical problems, another technical solution adopted by the present application is to provide an electronic atomization device. The electronic atomization device includes a power supply and the aforementioned atomizer, the power supply is connected to the atomizer and supplies power to the atomizer.

Different from the situation in the prior art, the present application discloses an electronic atomization device, an atomizer and a heating component thereof. The substrate is provided with micro-grooves, and the micro-grooves are provided with multiple liquid-accumulating micro-grooves, which can effectively increase the surface area of the atomization area in the substrate, so that the liquid matrix that can be gathered in the atomization area by capillary force and surface tension is more efficient. more, and then the thickness of the liquid film on one side of the micro-groove can be increased, and the heating element is arranged on the micro-groove, and the micro-groove is at least partly higher than the heating element, so that the heating element can be covered by the liquid film, and can improve the resistance to heat. The liquid supply volume of the heating element makes it possible to avoid contact with the air during the atomization of the heating element, avoiding the phenomenon of dry burning during the atomization process, and because the heating element can be covered by the liquid film, the energy in the atomization process can also be increased Utilization rate, so the heating element provided by this application can increase the liquid supply to the heating element installed on it, so as to avoid the dry burning condition that occurs during the atomization process, and can improve the large liquid in the aerosol produced by atomization. Drop content, thereby improving the taste of inhalable aroma atomized gas.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative work, wherein:

Fig. 1 is a schematic structural view of an embodiment of a heating component provided by the present application;

Fig. 2 is a schematic diagram of the axial structure of the matrix in the heating component shown in Fig. 1;

Fig. 3 is a top view structural schematic diagram of the substrate shown in Fig. 2;

Fig. 4 is a schematic diagram of the cross-sectional structure of the substrate shown in Fig. 3 along the A-A viewing direction;

Figure 5 is a comparison diagram of the height of the liquid film on the traditional type and each sunken type heating element;

Figure 6 is a comparison diagram of the content of large droplets in the aerosol produced by the traditional type and the sinking type heating element;

Figure 7 is a comparison of the taste of aerosols produced by traditional and sunken heating components;

Fig. 8 is a schematic structural diagram of an embodiment of the atomizer provided by the present application;

Fig. 9 is a schematic cross-sectional structural view of the atomizer shown in Fig. 8;

Fig. 10 is a partially enlarged view of area A in the atomizer shown in Fig. 9;

Fig. 11 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

The terms "first", "second", and "third" in the embodiments of the present application are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features. Thus, features defined as "first", "second", and "third" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes unlisted steps or units, or optionally further includes For other steps or units inherent in these processes, methods, products or devices.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

The present application provides a heating component 100 , referring to FIG. 1 to FIG. 2 , FIG. 1 is a schematic structural view of an embodiment of the heating component provided in the present application, and FIG. 2 is a schematic axial structure diagram of the base body in the heating component shown in FIG. 1 .

The heating component 100 includes a base 10 and a heating element 20 , the heating element 20 is disposed on the base 10 , and the heating element 20 is used to generate heat to atomize the liquid base accumulated on one side of the base 10 .

The base body 10 can be a porous base body, which can introduce liquid bases such as liquid containing nicotine or flavor components or medicinal liquid from one side to the other side. The porous substrate may be a porous ceramic substrate or a porous glass substrate or the like. In this embodiment, the matrix 10 is a porous ceramic matrix. The porous ceramic material is generally a ceramic material sintered at high temperature by components such as aggregates, binders, and pore-forming agents. Pore structure, so that the liquid substrate can be introduced from the liquid absorption surface to the atomization surface. Due to the high porosity, stable chemical properties, large specific surface area, low bulk density, low thermal conductivity and high temperature and corrosion resistance of porous ceramic materials, they have many applications in metallurgy, biology, energy, environmental protection and other fields.

The substrate 10 can also be a dense body, which is not used for liquid conduction. The liquid substrate is sprayed to one side of the substrate 10 through the nozzle, and the heating element 20 can also atomize the liquid substrate. The substrate 10 can be a glass substrate or a ceramic substrate.

In this embodiment, the substrate 10 is a porous substrate, which has a liquid-absorbing surface and an atomizing surface, and the porous substrate is used to introduce liquid substrates such as liquids or medicinal liquids containing nicotine or flavor components from the liquid-absorbing surface to the atomizing surface, generating heat Element 20 is disposed on the atomizing face of the porous substrate. Wherein, the side where the liquid-absorbing surface is located may also be provided with grooves to increase the liquid-absorbing area and improve the liquid-absorbing efficiency. Alternatively, the liquid-absorbing surface may also be a plane, which is not specifically limited in the present application.

The heating element 20 may be a heating film or a heating resistor, and the application does not limit its specific material.

In the present application, the substrate 10 is provided with a microgroove 12 , the microgroove 12 is provided with a plurality of liquid-collecting microgrooves 122 , and the heating element 20 is disposed in the microgroove 12 . Wherein, the liquid collecting micro-groove 122 is used to lock the liquid to form a liquid film on the surface of the heating element 20 , and the micro-groove part 12 is at least partly higher than the heating element 20 .

Optionally, referring to FIG. 1 , the substrate 10 has a surface 11 , and at least part of the microgrooves 12 protrude from the surface 11 . Wherein, the microgroove portion 12 can partially protrude from the surface 11, so that the liquid-collecting microgroove 122 can be partially positioned under the surface 11; The bottom surface is coplanar with the surface 11 .

Optionally, referring to FIG. 1 , the micro-groove portion 12 is sunken relative to the surface 11, so that a sinker can be formed above the micro-groove portion 12, which can be used for liquid accumulation, and can prevent the collected liquid matrix from flowing around. , which is beneficial to increase the thickness of the liquid film on the surface of the heating element 20 .

In this embodiment, as shown in FIG. 1 , the microgrooves 12 are flush with the surface 11 , that is, the top surface of the microgrooves 12 is coplanar and flush with the surface 11 .

In this embodiment, the microgroove part 12 is also provided with a sinking groove 124, the sinking groove 124 straddles a plurality of liquid collecting microgrooves 122, and the sinking groove 124 is configured to be used for installing the heating element 20, in other words, the heating element 20 is arranged on The bottom wall of the sinking groove 124 , and the micro groove portion 12 is at least partially higher than the heating element 20 .

The heating element 20 has an opposite first surface and a second surface, the first surface faces the bottom wall of the sinking groove 124 and is used to be fixed to the bottom wall of the sinking groove 124, the second surface is opposite to the first surface, that is, the second surface The two surfaces are away from the bottom wall of the sinker 124 .

In this embodiment, the sinking groove 124 has a notch, and the notch is formed on the surface of the microgroove portion 12, and the heating element 20 is arranged on the bottom wall of the sinking groove 124 through the notch, that is, the heating element 20 is arranged in the sinking groove 124, And the second surface of the heating element 20 is lower than the notch of the sinker 124, so that the liquid film formed by the liquid matrix on the microgroove portion 12 covers the entire heating element 20, thereby ensuring that the second surface of the heating element 20 does not touch. The air is covered by the liquid film, which can relatively increase the thickness of the liquid film on the second surface side to avoid dry burning during the atomization process.

Optionally, the heating element 20 is arranged in the sinking groove 124, and the second surface of the heating element 20 can also be flush with the notch of the sinking groove 124, so that the heating element 20 does not protrude from the top surface of the microgroove portion 12, It is also possible to make the liquid film on the microgrooves 12 cover the entire heating element 20 .

Optionally, the heating element 20 can also partially protrude from the sinking groove 124 , that is, the second surface of the heating element 20 is higher than the notch of the sinking groove 124 . Compared with the scheme of directly fixing the heating element 20 on the surface of the atomizing surface 13, by partially accommodating the heating element 20 in the sinker 124, the distance between the second surface and the top surface of the microgroove portion 12 can be reduced , so that the liquid film on the microgroove portion 12 can cover the second surface, so as to avoid dry burning caused by the heating element 20 contacting air during operation.

In other embodiments, the microgrooves 12 are provided with through grooves, and the through grooves of the microgrooves 12 cooperate with the surface 11 of the base body 10 to form a sinking groove for accommodating the heating element 20. The heating element 20 is arranged on the surface 11, and the microgrooves Portion 12 is at least partially higher than heating element 20 .

In this embodiment, the heating element 20 is a heating film, and the heating film is mounted on the sinker 124 by bonding with resistance paste. The resistance slurry has the characteristics of good fluidity, strong adhesion, high leveling property and strong binding force of the film base, so that the heating film can be firmly bonded to the bottom wall of the sinking tank 124, avoiding the use of the sinking type of the substrate 10. Due to the design of the sinker 124, the current screen printing method cannot be used to form the heating film.

Wherein, the depth of the sinker 124 is in the range of 0.2mm to 0.3mm, for example, the depth of the sinker 124 may be 0.2mm, 0.25mm or 0.3mm.

The thickness of the heating element 20 is approximately 0.1mm, wherein, the thickness of the heating element 20 refers to the size of the heating element 20 in the depth direction of the sink groove 124; The distance between the notch of the sinking groove 124 is in the range of 0.1mm to 0.2mm, that is, the second surface is located in the sinking groove 124 and the distance between the second surface and the notch of the sinking groove 124 can be 0.1mm, 0.15 mm or 0.2mm etc.

Through experimental verification and simulation analysis, when the groove depth of sinking groove 124 is in the range of 0.2 mm to 0.3 mm, more specifically, the sinking distance of the second surface relative to the top surface of the micro groove part 12 is in the range of 0.1 mm to 0.2 mm , the liquid base stored on the side of the second surface can just meet the nebulization amount during each inhalation and nebulization.

When the groove depth of the sinking groove 124 exceeds the upper limit value of 0.3mm, or the distance that the second surface sinks relative to the top surface of the microgroove portion 12 exceeds 0.2mm, the liquid film on the second surface side will be too thick , causing the atomized gas produced by atomization to pass through the liquid film at a slower rate, and further causing the isolation between the second surface and the liquid substrate, so that the amount of atomization generated by atomization is reduced, and the atomization rate becomes slower . If the groove depth of the sinking groove 124 is less than the lower limit of 0.2mm, or the sinking distance of the second surface relative to the top surface of the microgroove portion 12 is less than 0.1mm, there will be a risk of dry burning. Therefore, through experimental verification and simulation analysis, when the groove depth of the sinking groove 124 is in the range of 0.2mm to 0.3mm, and the sinking distance of the second surface relative to the top surface of the microgroove portion 12 is in the range of 0.1mm to 0.2mm, it can be Effectively avoid dry burning caused by insufficient liquid supply, and can significantly increase the thickness of the liquid film, thereby ensuring sufficient liquid supply, and making the proportion of large droplets in the aerosol produced by atomization obvious Therefore, it has obvious positive significance for improving the aroma and sweetness of atomized gas.

Referring to FIGS. 2 to 4 , FIG. 3 is a schematic top view of the base shown in FIG. 2 , and FIG. 4 is a schematic cross-sectional view of the base shown in FIG. 3 along the A-A viewing direction.

The microgroove portion 12 is also provided with a plurality of liquid-gathering microgrooves 122, and a plurality of liquid-gathering microgrooves 122 are distributed around the sinker 124, and the extension path of the sinker 124 passes at least part of the liquid-gathering microgrooves 122, and a plurality of liquid-gathering microgrooves 122 At least part of the liquid collecting microgroove 122 communicates with the sinking groove 124 .

Optionally, a plurality of liquid-collecting microgrooves 122 are annularly arranged on the micro-groove part 12, and the extension path of the sinker 124 can pass through part of the liquid-collecting microgrooves 122 and communicate with part of the liquid-collecting microgrooves 122, so that The liquid substrate enriched in the liquid collecting microgroove 122 is supplied to the heating element 20 .

In the present embodiment, a plurality of liquid-collecting micro-grooves 122 are arranged at intervals in parallel and have the same length. The extending path of 124 passes through the plurality of liquid-accumulating microgrooves 122 , so that each liquid-accumulating microgroove 122 is connected to the sinker 124 .

By arranging a plurality of liquid-gathering microgrooves 122 in the microgroove part 12, the surface area of the atomization area in the base body 10 is increased, thereby increasing the reserve amount of the liquid substrate in the atomization area, thereby alleviating or even avoiding the heating component 100 in the second half. The phenomenon of dry burning caused by insufficient liquid supply during the working process can avoid the burnt smell in the second half of the atomization process.

For example, during the atomization process, the liquid matrix storage capacity on the side of the liquid-absorbing surface of the porous substrate gradually decreases, which may lead to insufficient liquid supply on the side of the atomization surface in the second half of the atomization process, and the By setting the micro-groove part 12, and the micro-groove part 12 is provided with a plurality of liquid-gathering micro-grooves 122, the liquid-state substrate can be stored in the liquid-gathering micro-grooves 122, and the liquid-gathering micro-grooves 122 are also connected to the sinking tank 124, and the liquid-gathering micro-grooves 122 are also connected to the sink tank 124, and the liquid-gathering micro-grooves 122 The liquid substrate stored in the tank 122 can be replenished in the sink tank 124 in time for atomization of the heating element 20, so as to avoid dry burning and burnt smell.

Specifically, the liquid storage method in the atomization area of the base 10 mainly relies on capillary force and surface tension, and by setting the micro-groove portion 12, and the micro-groove portion 12 is provided with a plurality of liquid-collecting micro-grooves 122, so that in the base body 10 The surface area of the atomization zone comprises the top surface of the microgroove portion 12 and the surface area of the liquid-collecting microgroove 122, which can make the surface area of the atomization zone relatively increased by 30% to 60%, so that the liquid that can be gathered by capillary force and surface tension The amount is more, it is beneficial to promote the liquid film thickness on the top surface side of the microgroove part 12, and further by changing the groove depth and groove width of the liquid-gathering microgroove 122, the liquid matrix can be enriched in the liquid-gathering microgroove 122 , further increasing the storage capacity of the liquid substrate in the atomization area can increase the storage capacity of the liquid substrate in the atomization area by 30% to 60%, thus avoiding dry burning and scorching caused by insufficient liquid supply in the second half of the atomization process paste, and by changing the groove depth and groove width of the liquid-gathering microgroove 122, different amounts of liquid substrates can be stored, so as to meet the selection of different types of liquid substrates and different atomization powers, so as to avoid dry burning and Burnt smell.

As shown in Figure 4, the groove depth of liquid-gathering microgroove 122 is less than or equal to the groove depth of sinking groove 124, so that reduce the processing difficulty of liquid-gathering microgroove 122 and sinking groove 124, and also help to reduce the liquid state in the liquid-gathering microgroove 122. The residual amount of the substrate allows the liquid substrate to be fully atomized.

The groove depth of the liquid collecting microgroove 122 is in the range of 0.15mm to 0.3mm, for example, the groove depth of the liquid collecting microgroove 122 may be 0.15mm, 0.2mm, 0.25mm or 0.3mm.

In this embodiment, the groove depth of the liquid-gathering microgroove 122 is equal to the groove depth of the sinking groove 124, and a plurality of liquid-gathering microgrooves 122 are arranged in an array, and the groove width of the liquid-gathering microgroove 122 decreases gradually with the increase of the groove depth. , and the width of the notch of the liquid-gathering microgroove 122 is in the range of 0.2mm to 0.6mm, the width can be 0.2mm, 0.3mm or 0.6mm, and the spacing between the liquid-gathering microgrooves 122 is in the range of 0.2mm to 0.5mm In this case, the spacing can be 0.2mm, 0.3mm or 0.5mm.

Optionally, the cross-section of the liquid-collecting micro-groove 122 can be V-shaped, arc-shaped or U-shaped, etc., so that the groove width of the liquid-collecting micro-groove 122 gradually decreases with the increase of the depth of the groove, which is conducive to increasing the liquid-collecting micro-groove. The strength of the matrix between the grooves 122 prevents the matrix between the liquid-collecting micro-grooves 122 from being easily damaged due to insufficient strength.

In this embodiment, a plurality of liquid-gathering microgrooves 122 are uniformly arranged along the length direction of the substrate 10, and the distance between the liquid-gathering microgrooves 122 is in the range of 0.2mm to 0.5mm, which can make the microgroove portion 12 more distributed. With a large number of liquid-collecting microgrooves 122, the strength of the substrate between the liquid-collecting microgrooves 122 is also sufficient, and the storage capacity of the liquid substrate in the atomization area can also be increased.

A plurality of liquid-gathering microgrooves 122 can also be arranged obliquely along the length direction of the substrate 10; or a plurality of liquid-gathering microgrooves 122 can be divided into multiple rows, and the liquid-gathering microgrooves 122 of the same column are connected to each other; or, each fluid-gathering microgrooves 122 can also be connected to each other, which is not specifically limited in the present application.

The heating component 100 further includes two electrodes 30 , and the two electrodes 30 may be disposed on the surface 11 of the substrate 10 , and two ends of the heating element 20 are respectively connected to one electrode 30 .

In this embodiment, the base body 10 is further provided with an electrode groove 134 , the electrode groove 134 is disposed at the end of the sinker groove 124 , and the electrode groove 134 communicates with the sinker groove 124 . By setting the electrode groove 134 to install the electrode 30, the electrode 30 is also sunk correspondingly, and the electrode groove 134 communicates with the sink groove 124, thereby facilitating the electrical connection between the heating element 20 and the electrode 30, reducing or even avoiding the electric connection between the heating element 20 and the electrode 30. Difficulty in connection due to height difference during connection.

Generally speaking, the heating element 20 is a heating film or the like. For example, the heating element 20 is installed in the sinker 124, and the electrode 30 is installed on the surface 11. Because there is a height difference between the bottom wall of the sinker 124 and the surface 11, the When making the heating element 20, the connection between the heating element 20 and the electrode 30 is difficult and there is a risk of breakage at the connection. By setting the electrode groove 134 to reduce or even eliminate the height difference, the difficulty of connecting the heating element 20 and the electrode 30 can be simplified, and Eliminates the risk of breakage at the connection.

In this embodiment, two electrode grooves 134 are provided on the surface 11, and the two electrode grooves 134 are respectively arranged at the two ends of the sinking groove 124, and the bottom wall of the sinking groove 124 is flush with the bottom wall of the electrode groove 134, so that The heating element 20 is connected to the electrode 30 located in the electrode groove 134 . Two electrodes 30 are respectively disposed in the corresponding electrode slots 134 , one of the two electrodes 30 is electrically connected to one end of the heating element 20 , and the other is electrically connected to the other end of the heating element 20 .

In other embodiments, an electrode groove 134 is provided on the atomizing surface 13, and the two electrodes 30 are installed in the electrode groove 134 and are insulated from each other. Both ends of the element 20 are respectively connected to an electrode 30 .

In this embodiment, as shown in FIG. 3 , the sinker 124 includes a first connecting segment 1241 , a first arc segment 1242 , a second arc segment 1244 and a second connecting segment 1245 connected in sequence, and the opening of the first arc segment 1242 is connected to the The openings of the second arc section 1244 face oppositely, the openings of the first arc section 1242 and the openings of the second arc section 1244 face different electrode slots 134, the first connecting section 1241 communicates with one electrode slot 134, and the second connecting section 1245 communicates with the other electrode slot 134. An electrode slot 134 .

The sinker 124 also includes a straight section 1243, the first arc section 1242 and the second arc section 1244 are connected by the straight section 1243, and the first connecting section 1241, the straight section 1243 and the second connecting section 1245 are arranged in parallel in turn, so that the first connecting section The segment 1241 , the straight segment 1243 and the second connecting segment 1245 can pass through the same part of the liquid-accumulating microgroove 122 multiple times, so as to guide the stored liquid matrix into the sinker 124 more easily.

The first connection section 1241, the straight line section 1243 and the second connection section 1245 are arranged in parallel, and they are more evenly distributed on the top surface of the micro-groove part 12, so that when the heating element 20 is arranged in the sinker groove 124, it can be more efficient And reasonably atomize the liquid substrate. The opening of the first arc section 1242 is opposite to the opening of the second arc section 1244, so that it occupies the middle area of the atomizing surface 13 as much as possible, and improves the atomization efficiency of the middle area when the heating element 20 is installed thereon. .

In other embodiments, the sinker 124 may not include the straight line segment 1243 , and the first arc segment 1242 and the second arc segment 1244 are directly connected. Alternatively, the first connecting section 1241 and the second connecting section 1245 may also be arcuate sections, which is not specifically limited in the present application.

Now compare various data with the traditional heating element and the sunken heating element 100 provided by this application. Among them, in the traditional heating element, the atomizing surface of the porous substrate is not provided with sinking grooves and liquid-conducting microgrooves, and the heating element is arranged on the atomizing surface.

Referring to Fig. 5, Fig. 5 is a comparison chart of the height of the liquid film on the traditional type and each sunken type heating element. Wherein, the height difference of the heating element relative to the atomizing surface is the height difference of the second surface relative to the atomizing surface. In a traditional heating element, the first surface of the heating element is set on the atomizing surface, its height is usually 0.1mm, and the measured thickness of its liquid film is about 0.05mm, that is, the thickness of the liquid film is about half of the height of the heating element.

In the sunken heating component 100 provided in this application, the depth of the sunken groove 124 and the height of the heating element 20 can be adjusted through the process to achieve different height differences between the second surface of the heating element 20 and the atomizing surface 13 . Wherein, when the groove depth of the sinking groove 124 is 0.1mm, the second surface of the heating element is flush with the atomizing surface 13, and the liquid film thickness is 0.08mm; when the groove depth of the sinking groove 124 is 0.15mm, the second surface and the mist The height difference between the atomization surface 13 is 0.05mm, and the liquid film thickness is 0.12mm; is 0.15 mm; when the depth of the sinker 124 is 0.3 mm, the height difference between the second surface and the atomizing surface 13 is 0.2 mm, and the thickness of the liquid film is 0.23 mm. It can be seen that the sunken heating component 100 provided by the present application can significantly increase the thickness of the liquid film.

Specifically, increasing the height difference between the second surface of the heating element 20 and the atomizing surface 13 is equivalent to increasing the space for the liquid substrate to climb up and store by capillary action, thus increasing the thickness of the liquid film.

Referring to Fig. 6, Fig. 6 is a comparison chart of the content of large droplets in the aerosol generated by the traditional type and the sunken heating element. Among them, the large droplet content in the aerosol produced by the traditional heating element and the large droplet content in the aerosol produced by the sinking heating element 100 are detected under the same working conditions; the sinking tank in the heating element 100 The groove depth of 124 is 0.3 mm, and the height difference between the heating element 20 and the atomizing surface 13 is 0.2 mm.

As shown in Figure 6, the content of large droplets in the aerosol produced by the traditional heating element is 0.13mg/puff, while the content of large droplets in the aerosol produced by the sunken heating element 100 provided by the application is 0.45mg/puff. puff. Compared with the traditional heating element, the content of large droplets in the aerosol generated by the sunken heating element 100 is increased by 3.4 times. It can be seen that the significant increase in the thickness of the liquid film ensures sufficient liquid supply to the heating element 20 and enables Larger droplets are easier to form, which in turn enhances the flavor and sweetness of the resulting aerosol.

Further, refer to FIG. 7 , which is a comparison chart of the taste of aerosols produced by traditional and sunken heating components. Wherein, FIG. 7 is a comparison chart of the taste of the aerosol generated based on the traditional type and the sunken heating element 100 in FIG. 6 . It can be seen that compared with the traditional heating element, the sunken heating element 100 has significantly improved aroma layering, coordination, aroma reduction and sweetness.

Based on this, the present application also provides an atomizer 200, referring to Fig. 8 to Fig. 10, Fig. 8 is a schematic structural diagram of an embodiment of the nebulizer provided by the present application; Fig. 9 is a cross-section of the nebulizer shown in Fig. 8 A schematic view of the structure; FIG. 10 is a partial enlarged view of area A in the atomizer shown in FIG. 9 .

The atomizer 200 includes a housing 210 , an atomizing seat 220 , a base 230 and the above-mentioned heating assembly 100 , wherein the housing 210 is provided with a liquid storage chamber 212 , and the atomizing seat 220 is inserted into the shell from the open end of the housing 210 Inside the body 210, the atomizing seat 220 is provided with an atomizing chamber 221, and the heating element 100 is arranged in the atomizing chamber 221, and the atomizing seat 220 and the base 230 cooperate to fix the heating element 100, and the base 230 is also sealed on the casing 210. open end.

The inside of the casing 210 is provided with a vent pipe 214, and the atomizing seat 220 is provided with a liquid inlet 223 and an atomized gas outlet 224, and the liquid substrate stored in the liquid storage chamber 212 is guided to the porous substrate 10 for liquid absorption through the liquid inlet 223. surface 11, the porous matrix 10 guides the liquid substrate in the liquid storage chamber 212 from the liquid absorption surface 11 to the atomization surface 13, and the heating element 20 atomizes the liquid substrate in the atomization chamber 221 to form atomized gas, and the electrode 30 For receiving power supply, the atomized gas outlet 224 communicates with the atomized gas chamber 221 , and the vent tube 214 is connected with the atomized gas outlet 224 to guide the atomized gas to the mouth of the user through the vent tube 214 .

Based on this, the present application also provides an electronic atomization device 300 . Referring to FIG. 11 , FIG. 11 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application. The electronic atomization device 300 includes a power supply 310 and the aforementioned atomizer 200 , the power supply 310 is connected to the atomizer 200 and supplies power to the atomizer 200 .

Different from the situation in the prior art, the present application discloses an electronic atomization device, an atomizer and a heating component thereof. The substrate is provided with micro-grooves, and the micro-grooves are provided with multiple liquid-accumulating micro-grooves, which can effectively increase the surface area of the atomization area in the substrate, so that the liquid matrix that can be gathered in the atomization area by capillary force and surface tension is more efficient. more, and then the thickness of the liquid film on one side of the micro-groove can be increased, and the heating element is arranged on the micro-groove, and the micro-groove is at least partly higher than the heating element, so that the heating element can be covered by the liquid film, and can improve the resistance to heat. The liquid supply volume of the heating element makes it possible to avoid contact with the air during the atomization of the heating element, avoiding the phenomenon of dry burning during the atomization process, and because the heating element can be covered by the liquid film, the energy in the atomization process can also be increased Utilization rate, so the heating element provided by this application can increase the liquid supply to the heating element installed on it, so as to avoid the dry burning condition that occurs during the atomization process, and can improve the large liquid in the aerosol produced by atomization. Drop content, thereby improving the taste of inhalable aroma atomized gas.

The above is only an embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process conversion made by using the specification and drawings of the application, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of this application in the same way.

Claims (17)

1. A heating component applied to an electronic atomization device, characterized in that the heating component comprises: A base body, the base body is provided with a micro-groove portion, and the micro-groove portion is provided with a plurality of liquid-collecting micro-grooves; A heating element, the heating element is arranged in the micro-groove, and the liquid-collecting micro-groove is used to lock the liquid to form a liquid film on the surface of the heating element; wherein the micro-groove is at least partially higher than the heating element . 2. The heating assembly according to claim 1, characterized in that, the micro-groove part is also provided with a sinker, and the sinker spans the plurality of liquid-collecting micro-grooves; the heating element is arranged on the sinker bottom wall of the tank. 3. The heating assembly according to claim 2, wherein the sinker has a notch, the notch is formed on the surface of the micro-groove portion, and the heating element is arranged on the surface of the micro-groove through the notch. The bottom wall of the sinking tank, the surface of the heating element away from the bottom wall of the sinking tank is lower than the notch of the sinking tank. 4. The heating component according to claim 3, characterized in that, the distance between the surface of the heating element away from the bottom wall of the sinking groove and the notch of the sinking groove is in the range of 0.1mm to 0.2mm . 5 . The heating assembly according to claim 3 , wherein at least part of the plurality of liquid-accumulating microgrooves communicate with the sinker. 6 . 6. The heating component according to claim 3, characterized in that, the depth of the sinking groove is in the range of 0.2mm to 0.3mm. 7 . The heating component according to claim 6 , wherein the depth of the liquid collecting microgroove is less than or equal to the depth of the sinking groove. 7 . 8 . The heating component according to claim 7 , wherein the groove depth of the liquid collecting microgroove is in the range of 0.15mm to 0.3mm. 9. The heating assembly according to claim 3, wherein the plurality of liquid-collecting microgrooves are arranged in an array, and the groove width of the liquid-collecting microgrooves gradually decreases with the increase of groove depth, and the The distance between the liquid-gathering micro-grooves is in the range of 0.2mm to 0.5mm. 10. The heating component according to claim 3, characterized in that, the substrate is a porous substrate, the heating element is a heating film, and the heating film is installed on the bottom wall of the sink tank by bonding with resistance paste . 11. The heating component according to claim 3, wherein the base is further provided with an electrode groove and an electrode arranged in the electrode groove, the electrode groove is arranged at the end of the sinker, and The electrode groove communicates with the sunken groove, and the electrode is electrically connected with the heating element. 12. The heating component according to claim 11, wherein two electrode grooves are provided on the base body, and the two electrode grooves are respectively arranged at both ends of the sink groove, and the sink groove The bottom wall of the groove is flush with the bottom wall of the electrode groove, and the two electrodes are respectively arranged in the corresponding electrode groove, one of the two electrodes is electrically connected to one end of the heating element, and the other is electrically connected to the heating element. One is electrically connected with the other end of the heating element. 13. The heating component according to claim 12, wherein the sinker includes a first connecting segment, a first arc segment, a second arc segment and a second connecting segment connected in sequence, and the first arc segment The opening of the arc segment is opposite to the opening of the second arc segment, the first connecting segment communicates with one electrode slot, and the second connecting segment communicates with the other electrode slot. 14. The heating component according to claim 13, wherein the sinker further comprises a straight section, the first arc section and the second arc section are connected by the straight section, and the first arc section and the second arc section are connected by the straight section, and the first The connecting section, the straight line section and the second connecting section are arranged in parallel in sequence. 15. The heating component according to claim 1, wherein the base body has a surface, and at least part of the microgrooves protrude from the surface; or the microgrooves are flush with the surface; or The micro-grooves are sunken relative to the surface. 16. An atomizer, characterized in that the atomizer comprises the heating component according to any one of claims 1-15. 17. An electronic atomization device, characterized in that the electronic atomization device comprises a power supply and the atomizer according to claim 16, the power supply is connected to the atomizer and supplies the atomizer carburetor power supply.

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