CN213835610U

CN213835610U - Continuous plating device

Info

Publication number: CN213835610U
Application number: CN202022529537.0U
Authority: CN
Inventors: 上田胜志; 山本真; 酒井将一郎
Original assignee: Sumitomo Electric Industries Ltd; Sumitomo Electric Printed Circuits Inc
Current assignee: Sumitomo Electric Industries Ltd; Sumitomo Electric Printed Circuits Inc
Priority date: 2020-11-05
Filing date: 2020-11-05
Publication date: 2021-07-30
Anticipated expiration: 2030-11-05

Abstract

The continuous plating apparatus includes a position sensor, a roller mechanism, an electric actuator, and a control unit. The position sensor detects the height of the base material. The roller mechanism controls the inclination of the base material. The electric actuator controls the roller mechanism. The control unit controls the driving of the electric actuator based on the height of the base material detected by the position sensor.

Description

Continuous plating device

Technical Field

The utility model relates to a continuous plating device.

Background

Japanese patent application laid-open No. 2018-3150 (patent document 1) describes a continuous plating apparatus. The continuous plating apparatus has an unwinder, a plating zone, and a winder.

Patent document 1: japanese patent laid-open publication No. 2018-3150

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a continuous plating apparatus capable of controlling the height of a base material with high accuracy.

The continuous plating apparatus of the present invention includes a position sensor, a roller mechanism, an electric actuator, and a control unit. The position sensor detects the height of the base material. The roller mechanism controls the inclination of the base material. The electric actuator controls the roller mechanism. The control unit controls the driving of the electric actuator based on the height of the base material detected by the position sensor.

Effect of the utility model

According to the present invention, a continuous plating apparatus capable of controlling the height of a base material with high accuracy can be provided.

Drawings

Fig. 1 is a schematic plan view showing the structure of a continuous plating apparatus according to the present embodiment.

Fig. 2 is a schematic side view showing the structure of the continuous plating apparatus according to the present embodiment.

Fig. 3 is a schematic plan view showing a structure of a substrate inclination adjusting mechanism.

Fig. 4 is a schematic front view showing a structure of a substrate inclination adjusting mechanism.

Fig. 5 is a schematic side view showing a structure of a substrate tilt adjusting mechanism.

Fig. 6 is a schematic side view showing the tilt adjusting mechanism for the base material in state 1.

Fig. 7 is a schematic side view showing the 2 nd state of the tilt adjusting mechanism for the base material.

Fig. 8 is a schematic side view showing the structure of the substrate transport mechanism.

Fig. 9 is a schematic plan view showing the structure of the plated region.

Fig. 10 is a schematic sectional view taken along line X-X of fig. 9.

Fig. 11 is a schematic sectional view taken along line XI-XI of fig. 9.

Description of the reference numerals

1 pretreatment area

2 plated area

3 post-treatment area

4 unreeling machine

5 winding machine

61 st wheel

7 nd wheel 2

8 chain

9 power supply

10 clamping tool

20 jet pipe

21 positive electrode

22 plating bath

23 tube part

24 orifice

25 plating solution

30-roller mechanism

31 st roll

32 nd roll

33 rd roll

34 supporting plate

35 upper plate

36 rotating shaft

37 mounting part

40 changing mechanism

41 st connection part

42 nd connecting part

43 No. 3 connecting part

50 accommodation part

51 control part

52 position sensor

53 electric actuator

61 bearing

62 bench part

90-gradient adjusting mechanism

100 continuous plating apparatus

A base material

Direction of travel of B

C1 st direction

D2 nd direction

E arrow 3

Detailed Description

[ description of embodiments of the present invention ]

Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.

(1) The continuous plating apparatus 100 according to the present invention includes a position sensor 52, a roller mechanism 30, an electric actuator 53, and a control unit 51. The position sensor 52 detects the height of the base material a. The roller mechanism 30 controls the inclination of the base material a. The electric actuator 53 controls the roller mechanism 30. The control unit 51 controls the driving of the electric actuator 53 based on the height of the base material a detected by the position sensor 52.

According to the continuous plating apparatus 100 of the above (1), the roll mechanism 30 for controlling the inclination of the base material a is controlled by using the electric actuator 53. Therefore, the height of the base material a can be controlled with high accuracy.

(2) In the continuous plating apparatus 100 according to the above (1), the roller mechanism 30 includes: a 1 st roller 31 disposed on one side of the base material a; a 2 nd roller 32 disposed on the other side of the base material a and disposed downstream of the 1 st roller 31 in the moving direction of the base material a; and a 3 rd roller 33 disposed on the other side of the base material a and disposed upstream of the 1 st roller 31 in the moving direction of the base material a.

(3) In the continuous plating apparatus 100 according to the above (2), the roller mechanism 30 further includes a support plate 34, and the 1 st roller 31, the 2 nd roller 32, and the 3 rd roller 33 are disposed on the support plate 34, respectively. The electric actuator 53 controls the inclination of the support plate 34.

(4) The continuous plating apparatus 100 according to any one of (1) to (3) above may further include: an unreeling machine 4 that sends out the substrate a; a plating region 2 for plating the base material A; and a winder 5 for collecting the plated substrate a. A roller mechanism 30 may be located at the plating zone 2.

(5) The continuous plating apparatus 100 according to the above (4) further includes a clamp tool 10, and the clamp tool 10 conveys the substrate a while holding the substrate a in the plating zone 2.

[ details of the embodiment of the present invention ]

(continuous plating apparatus)

First, a structure of a continuous plating apparatus 100 according to an embodiment of the present invention (also referred to as the present embodiment) will be described.

Fig. 1 is a schematic plan view showing the structure of a continuous plating apparatus according to the present embodiment. As shown in fig. 1, the continuous plating apparatus 100 mainly includes an unwinder 4, a winder 5, a pretreatment area 1, a plating area 2, a post-treatment area 3, a 1 st tension adjusting mechanism 30, and a 2 nd tension adjusting mechanism 40. The unwinder 4 is a machine that feeds out the substrate a before plating. The substrate a before plating is wound in a roll shape around the unwinder 4. The winder 5 is a machine for collecting the plated substrate a. The plated substrate a is wound in a roll shape around a winder 5. The type of the substrate A is not particularly limited, and may be, for example, CCL (Copper Clad amine). The CCL has a copper layer formed on a polyimide layer, for example.

Fig. 2 is a schematic side view showing the structure of the continuous plating apparatus according to the present embodiment. As shown in fig. 2, the pretreatment area 1 is disposed between the unreeling machine 4 and the plating area 2. The plating region 2 is disposed between the pretreatment region 1 and the post-treatment region 3. The post-treatment zone 3 is disposed between the plating zone 2 and the winder 5.

The substrate a paid out from the payout reel 4 is conveyed to the pretreatment area 1. The cleaning of the substrate a before plating is performed in the pretreatment area 1. In the pretreatment area 1, for example, degreasing treatment is performed. Specifically, the pretreatment area 1 is subjected to acid treatment, water washing treatment, and the like. The substrate a having passed through the pretreatment area 1 is conveyed to the plating area 2. The substrate a is subjected to plating treatment in the plating region 2. The substrate a having passed through the plating zone 2 is conveyed to the post-treatment zone 3. The cleaning of the plated substrate a is performed in the post-treatment area 3. The plating solution 25 adhering to the substrate a is removed in the post-treatment region 3, for example. The post-processing area 3 is subjected to water washing processing, drying processing, and the like.

Fig. 3 is a schematic plan view showing a structure of a substrate inclination adjusting mechanism. As shown in fig. 3, the continuous plating apparatus 100 according to the present embodiment includes a base material inclination adjustment mechanism 90. The inclination adjusting mechanism 90 for the base material is located, for example, in the plating zone 2 (see fig. 2). As shown in fig. 3, the base material inclination adjusting mechanism 90 mainly includes a position sensor 52, a roller mechanism 30, an electric actuator 53, a control unit 51, a bearing 61, a housing unit 50, a table unit 62, and a changing mechanism 40. The position sensor 52 detects the height of the base material a. The roller mechanism 30 controls the inclination of the base material a. The electric actuator 53 controls the roller mechanism 30.

The roller mechanism 30 has a 1 st roller 31, a 2 nd roller 32, a 3 rd roller 33, a support plate 34, an upper plate 35, a rotation shaft 36, and a mounting portion 37. The 1 st roller 31 is disposed on one side (upper side in fig. 3) of the base material a. The 2 nd roller 32 is disposed on the other side (lower side in fig. 3) of the base material a. The 2 nd roller 32 is disposed downstream of the 1 st roller 31 in the traveling direction B of the base material a. The 3 rd roller 33 is disposed on the other side (lower side in fig. 3) of the base material a. The 3 rd roller 33 is disposed upstream of the 1 st roller 31 in the traveling direction B of the base material a.

The 1 st roller 31, the 2 nd roller 32, and the 3 rd roller 33 are disposed on the support plate 34, respectively. From another point of view, the supporting plate 34 rotatably supports each of the 1 st roller 31, the 2 nd roller 32, and the 3 rd roller 33. As shown in fig. 3, a part of the 1 st roller 31 is positioned between the 2 nd roller 32 and the 3 rd roller 33 when viewed from a direction perpendicular with respect to the supporting plate 34. Thereby, the 1 st roll 31, the 2 nd roll 32, and the 3 rd roll 33 sandwich the substrate a therebetween.

The upper plate 35 is attached to the 1 st roller 31, the 2 nd roller 32, and the 3 rd roller 33, respectively. The upper plate 35 rotatably holds each of the 1 st roller 31, the 2 nd roller 32, and the 3 rd roller 33. The position sensor 52 is attached to the housing portion 50. The position sensors 52 are disposed on both sides of the base material a. The position sensor 52 can measure the height of the base material a. Specifically, the position sensor 52 is attached to the housing portion 50 so as to be able to measure the height (displacement) of the upper end of the base material a.

As shown in fig. 3, the electric actuator 53 is disposed outside the housing portion 50. Specifically, the electric actuator 53 is a linear guide. The driving portion of the electric actuator 53 performs a linear motion in the direction of the 3 rd arrow E in fig. 3. The 3 rd arrow E may be parallel to the traveling direction B of the substrate a. The electric actuator 53 controls the inclination of the support plate 34. The control unit 51 controls the driving of the electric actuator 53 based on the height of the base material a detected by the position sensor 52. From another viewpoint, the height of the base material a detected by the position sensor 52 is fed back to the electric actuator 53 by the control unit 51. The control unit 51 is, for example, a personal computer.

Fig. 4 is a schematic front view showing a structure of a substrate inclination adjusting mechanism. The conversion mechanism 40 includes a 1 st link 41, a 2 nd link 42, and a 3 rd link 43. The electric actuator 53 controls the inclination of the roller mechanism 30 via the conversion mechanism 40. The 1 st connecting portion 41 is attached to the electric actuator 53. The 2 nd connection part 42 is attached to the 1 st connection part 41. The 3 rd connection part 43 is attached to the 2 nd connection part 42.

The 3 rd connecting portion 43 is attached to the rotating shaft 36. The rotary shaft 36 is rotatably supported by a bearing 61. The support plate 34 is attached to the rotary shaft 36 via an attachment portion 37. The rotation shaft 36 rotates, whereby the inclination of the support plate 34 changes. The linear motion of the electric actuator 53 is converted into the rotational motion of the rotary shaft 36 via the conversion mechanism 40. The conversion mechanism 40 is a mechanism capable of converting linear motion into rotational motion.

Fig. 5 is a schematic side view showing a structure of a substrate tilt adjusting mechanism. As shown in fig. 5, the table portion 62 is provided inside the housing portion 50. The table portion 62 is disposed below the support plate 34. The table portion 62 is disposed in front of the 1 st roller 31 in the traveling direction B of the base material a.

Fig. 6 is a schematic side view showing the tilt adjusting mechanism for the base material in state 1. As shown in fig. 6, in the case where the base material a is lower than the prescribed height position, the support plate 34 is inclined such that the portion on the upstream side of the support plate 34 is higher than the portion on the downstream side. In this case, the upper end of the 3 rd roller 33 is higher than the upper end of the 1 st roller 31. The upper end of the 1 st roller 31 is higher than the upper end of the 2 nd roller 32. Thereby, the traveling direction B of the base material a changes to the 1 st direction C having an upper component. As a result, the height of the base material a returns to the predetermined height.

Fig. 7 is a schematic side view showing the 2 nd state of the tilt adjusting mechanism for the base material. As shown in fig. 7, in the case where the base material a is higher than a prescribed height position, the support plate 34 is inclined such that the portion on the upstream side of the support plate 34 is lower than the portion on the downstream side. In this case, the upper end of the 3 rd roller 33 is lower than the upper end of the 1 st roller 31. The upper end of the 1 st roller 31 is lower than the upper end of the 2 nd roller 32. Thereby, the traveling direction B of the base material a changes to the 2 nd direction D having a lower component. As a result, the height of the base material a returns to the predetermined height.

As described above, the control unit 51 controls the driving of the electric actuator 53 based on the height of the base material a detected by the position sensor 52, thereby adjusting the height of the base material a. Specifically, in the case where the substrate a is higher than a prescribed height position, the support plate 34 is inclined so that the substrate a moves toward the lower side. Conversely, in the case where the substrate a is below the prescribed height position, the support plate 34 is inclined so that the substrate a moves toward the upper side. This can maintain the height of the base material a at a constant height.

Fig. 8 is a schematic side view showing the structure of the substrate transport mechanism. As shown in fig. 8, the continuous plating apparatus 100 further has, for example, a plurality of clamping tools 10, a 1 st wheel 6, a 2 nd wheel 7, and a chain 8. The 1 st wheel 6 is disposed on the side of the pretreatment area 1 when viewed from the plating area 2. The 2 nd wheel 7 is disposed on the side of the post-treatment region 3 when viewed from the plating region 2. The chain 8 is mounted on the 1 st and 2 nd wheels 6 and 7. The 1 st and 2 nd wheels 6, 7 rotate, whereby the chain 8 rotates.

A plurality of clamping tools 10 are attached to the chain 8. The traveling direction of the lower chain 8 is the same as the traveling direction B of the base material a. The upper chain 8 travels in the direction opposite to the direction B of travel of the base material a. The clamping tool 10 mounted on the portion of the chain 8 that passes through the 1 st wheel 6 grips the substrate a. The clamping tool 10 conveys the substrate a while holding the substrate a while the clamping tool 10 is passing over the plating region 2. The clamping tool 10 mounted at the portion of the chain 8 near the 2 nd wheel 7 releases the substrate a. The gripping tool 10, which releases the substrate a, is rotated around the 2 nd wheel 7. As described above, the clamping tool 10 conveys the substrate a in the plating region 2 while holding the substrate a.

Fig. 9 is a schematic plan view showing the structure of the plated region. As shown in fig. 9, the plating region 2 mainly has a plating tank 22, a plating solution 25, a positive electrode 21, and a jet pipe 20. As shown in fig. 9, the positive electrodes 21 and the jet pipes 20 are alternately arranged in a direction parallel to the traveling direction B of the substrate a. The positive electrode 21 is disposed on both sides of the substrate a. The blast pipes 20 are disposed on both sides of the substrate a. The positive electrode 21 has a plate shape, for example.

Fig. 10 is a schematic sectional view taken along line X-X of fig. 9. As shown in fig. 10, each of the pair of positive electrodes 21 is immersed in the plating solution 25. The pair of positive electrodes 21 are each electrically connected to a positive electrode of the power supply 9. One of the pair of positive electrodes 21 faces one surface of the base material a. The other of the pair of positive electrodes 21 faces the other surface of the base material a. The clamp 10 holds the substrate a so as to sandwich the upper end portion of the substrate a. The clamping tool 10 is electrically connected to the negative pole of the power supply 9. A voltage is applied to the substrate a via the clamping tool 10. A part of the clamping tool 10 is immersed in the plating solution 2.

Fig. 11 is a schematic sectional view taken along line XI-XI of fig. 9. As shown in fig. 11, each of the pair of blast pipes 20 has a pipe portion 23 and a plurality of blast holes 24. The number of the spouting holes 24 formed in the 1 tube portion 23 is not particularly limited, and is, for example, 5 or more and 10 or less. A plurality of jet holes 24 formed in one of the pair of jet pipes 20 is opposed to one surface of the substrate a. A plurality of jet holes 24 formed in the other of the pair of jet pipes 20 are opposed to the other surface of the substrate a. The plating solution 25 is discharged from the plurality of discharge holes 24 toward the surface of the substrate a.

Next, the operational effects of the continuous plating apparatus 100 according to the present embodiment will be described.

The substrate a after plating was heavier than the substrate a before plating. Therefore, when the continuous plating apparatus 100 is used to plate the substrate a, the downstream substrate a becomes heavier than the upstream substrate a. In this case, the upstream base material a moves downward relative to the downstream base material a. As a result, the height of the base material a may vary.

According to the continuous plating apparatus 100 of the present embodiment, the electric actuator 53 is used to control the roller mechanism 30 that controls the inclination of the base material a. Therefore, the height of the base material a can be controlled with high accuracy. In particular, in the case where the inclination of the base material a is controlled using the electric actuator 53, the height of the base material a can be controlled with higher accuracy than in the case where the inclination of the base plate is controlled using the air cylinder.

The embodiments of the present invention are not intended to be limited to the embodiments described above. The scope of the present invention is defined by the claims of the present invention, rather than the description above, and includes all modifications equivalent in meaning and scope to the claims of the present invention.

Claims

1. A continuous plating apparatus, comprising:

a position sensor that detects the height of the base material;

a roller mechanism that controls the inclination of the base material;

an electric actuator that controls the roller mechanism; and

and a control unit that controls driving of the electric actuator based on the height of the base material detected by the position sensor.

2. The continuous plating apparatus according to claim 1, wherein,

the roller mechanism includes:

a first roller 1 disposed on one side of the base material;

a 2 nd roller disposed on the other side of the base material and disposed downstream of the 1 st roller in the moving direction of the base material; and

and a 3 rd roller disposed on the other side of the base material and upstream of the 1 st roller in the moving direction of the base material.

3. The continuous plating apparatus according to claim 2, wherein,

the roller mechanism further includes a support plate on which the 1 st roller, the 2 nd roller, and the 3 rd roller are disposed,

the electric actuator controls the inclination of the support plate.

4. The continuous plating apparatus according to any one of claims 1 to 3, wherein,

further comprising:

an unreeling machine that sends out the substrate;

a plating region that plates the substrate; and

a winder that collects the plated base material,

the roller mechanism is located in the plating zone.

5. The continuous plating apparatus according to claim 4, wherein,

the plating apparatus further comprises a clamping means for conveying the substrate in a state of holding the substrate in the plating region.