CN214032738U - Continuous plating equipment - Google Patents

Abstract

The continuous plating apparatus has a plating tank, a recovery tank, a track and a clamping tool. The plating tank accommodates the plating solution. The recovery tank is in contact with the plating tank, and recovers the plating solution overflowing from the plating tank. The rail is arranged above each of the plating tank and the recovery tank, and extends in the direction in which the plating tank and the recovery tank are arranged. The clamping tool has guide rollers that move along the inner wall surface of the rail. The track includes: a first area whose inner wall surface interval is a first width; a second area whose inner wall surface interval has a second width greater than the first width; and a third area, which goes from the first area toward the second area and the width of the inner wall surface becomes larger. The second area and the third area are located above the plating tank. The first region is located above the boundary between the plating tank and the recovery tank.

Description

Continuous plating device

Technical Field

The utility model relates to a continuous plating device.

Background

Japanese patent application laid-open No. 2018-3150 (patent document 1) describes a continuous plating apparatus. In the continuous plating apparatus, a clamping tool holds the substrate before the substrate is conveyed to the plating tank.

Patent document 1: japanese patent laid-open publication No. 2018-3150

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a continuous plating apparatus capable of gripping a substrate in a stable state.

The utility model relates to a continuous plating device is provided with a plating tank, a recovery tank, a track and a clamping tool. The plating tank contains a plating solution. The recovery tank is in contact with the plating tank and recovers the plating solution overflowing from the plating tank. The rail is disposed above each of the plating tank and the recovery tank and extends in a direction in which the plating tank and the recovery tank are arranged. The clamp tool has a guide roller that moves along an inner wall surface of the rail. The track comprises: the interval of the inner wall surface is the 1 st area of the 1 st width; a 2 nd region separated from the 1 st region and having a 2 nd width larger than the 1 st width at an interval of the inner wall surface; and a 3 rd region which is continuous with the 1 st region and the 2 nd region, is located between the 1 st region and the 2 nd region, and has an inner wall surface with a larger width from the 1 st region to the 2 nd region. The 2 nd region and the 3 rd region are each located above the plating bath. The No. 1 region is located above the boundary between the plating tank and the recovery tank.

Effect of the utility model

According to the present invention, a continuous plating apparatus capable of gripping a substrate in a stable state can be provided.

Drawings

Fig. 1 is a schematic plan view showing the structure of a continuous plating apparatus according to the present embodiment.

Fig. 2 is a schematic side view showing the structure of the continuous plating apparatus according to the present embodiment.

Fig. 3 is a schematic side view showing the structure of the substrate transport mechanism.

Fig. 4 is a schematic plan view showing the structure of the plated region.

Fig. 5 is a schematic sectional view taken along line V-V of fig. 4.

Fig. 6 is a schematic sectional view taken along line VI-VI of fig. 4.

Fig. 7 is a schematic front view showing the structure of a clamping tool for a continuous plating apparatus in a closed state.

Fig. 8 is a schematic front view showing the structure of a clamping tool for a continuous plating apparatus in an open state.

Fig. 9 is a partial cross-sectional view schematically showing the structure of a track.

Fig. 10 is a side view of a plated region and a structure over the plated region.

Fig. 11 is a schematic plan view showing a plated region and a structure above the plated region.

Description of the reference numerals

1 pretreatment area

2 plated area

3 post-treatment area

4 unreeling machine

5 winding machine

6 1 st wheel

7 nd wheel 2

8 chain

9 power supply

10 clamping tool (clamping tool) for continuous plating apparatus

11 guide roller

12 raised part

13 support part

14 connecting part

15 center support member

16 fulcrum shaft component

17 base plate

18 spring component

19 mounting component

20 jet pipe

21 positive electrode

22 plating bath

23 tube part

24 orifice

25 plating solution

27 one end of

28 another end

29 substrate gripping member

30 track

31 inner wall surface

62 recovery tank

71 boundary plate

72 fairing

100 continuous plating apparatus

A base material

Direction of travel of B

In the C direction

D track

Region 1 of S1

Region 2 of S2

Region 3 of S3

Region 4 of S4

Region 5 of S5

W1 1 st Width

W2 2 nd Width

W3 Width No. 3

W4 interval

Detailed Description

[ description of embodiments of the present invention ]

Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.

(1) The continuous plating apparatus 100 of the present invention includes a plating tank 22, a recovery tank 62, a rail 30, and a clamping tool 10. The plating tank 22 contains a plating solution 25. The recovery tank 62 is in contact with the plating tank 22 and recovers the plating solution 25 overflowing from the plating tank 22. The rail 30 is disposed above each of the plating tank 22 and the recovery tank 62, and extends in the direction in which the plating tank 22 and the recovery tank 62 are arranged. The clamp tool 10 has a guide roller 11 that moves along an inner wall surface 31 of the rail 30. The rail 30 includes: a 1 st region S1 having an interval of the 1 st width W1 between the inner walls 31; a 2 nd region S2 separated from the 1 st region S1 and having a 2 nd width W2 of the interval of the inner wall surface 31 larger than the 1 st width W1; and a 3 rd region S3 which is continuous with each of the 1 st region S1 and the 2 nd region S2, is located between the 1 st region S1 and the 2 nd region S2, and increases the width of the inner wall surface 31 from the 1 st region S1 toward the 2 nd region S2. The 2 nd region S2 and the 3 rd region S3 are each located above the plating bath 22. The 1 st region S1 is located above the boundary between the plating tank 22 and the recovery tank 62.

According to the continuous plating apparatus 100 of the above (1), each of the 2 nd region S2 and the 3 rd region S3 is located above the plating bath 22. The 1 st region S1 is located above the boundary between the plating tank 22 and the recovery tank 62. The 3 rd region S3 in which the width of the inner wall surface 31 becomes larger as going from the 1 st region S1 toward the 2 nd region S2 is located between the 1 st region S1 and the 2 nd region S2. The clamping tool 10 begins to grip the substrate in zone 3S 3. Therefore, the clamp tool 10 can hold the substrate not in the recovery tank 62 but in the plating tank 22. Therefore, the clamp tool 10 can hold the substrate without being affected by the plating solution 25 overflowing from the plating tank 22 to the recovery tank 62. As a result, the clamp tool 10 can grip the substrate in a stable state.

(2) The continuous plating apparatus 100 according to the above (1) may include: a boundary plate 71 that separates the plating tank 22 and the recovery tank 62; and a pair of flow regulating plates 72 provided in the recovery tank 62 and connected to the boundary plate 71. The pair of flow regulating plates 72 are disposed so that the base material passes between the pair of flow regulating plates 72, whereby the base material can be prevented from shaking due to the influence of the plating solution 25 overflowing from the plating tank 22 into the recovery tank 62. As a result, the position where the substrate is held can be suppressed from shifting from the desired position.

(3) In the continuous plating apparatus 100 according to the above (2), the distance W4 between the pair of current plates 72 may be smaller than the 1 st width W1.

(4) The continuous plating apparatus 100 according to any one of (1) to (3) above may further include an unreeling machine 4 that sends out the substrate. It may be that the recovery tank 62 is located between the unreeling machine 4 and the plating tank 22 in the traveling direction of the substrate.

(5) The continuous plating apparatus 100 according to the above (4) may further include a winder 5 for collecting the base material. It may be that the plating tank 22 is located between the winder 5 and the recovery tank 62 in the traveling direction of the base material.

[ details of the embodiment of the present invention ]

(continuous plating apparatus)

First, a structure of a continuous plating apparatus 100 according to an embodiment of the present invention (also referred to as the present embodiment) will be described.

Fig. 1 is a schematic plan view showing the configuration of a continuous plating apparatus using a chuck according to the present embodiment. As shown in fig. 1, the continuous plating apparatus 100 mainly includes an unwinder 4, a winder 5, a pretreatment area 1, a plating area 2, and a post-treatment area 3. The unwinder 4 is a machine that feeds out the substrate a before plating. The substrate a before plating is wound in a roll shape around the unwinder 4. The winder 5 is a machine for collecting the plated substrate a. The plated substrate a is wound in a roll shape around a winder 5. The type of the substrate A is not particularly limited, and may be, for example, CCL (Copper Clad amine). The CCL has a copper layer formed on a polyimide layer, for example.

Fig. 2 is a schematic side view showing the structure of the continuous plating apparatus using a clamping tool according to the present embodiment. As shown in fig. 2, the pretreatment area 1 is disposed between the unreeling machine 4 and the plating area 2. The plating region 2 is disposed between the pretreatment region 1 and the post-treatment region 3. The post-treatment zone 3 is disposed between the plating zone 2 and the winder 5.

The substrate a discharged from the unreeling machine 4 is conveyed to the pretreatment area 1. The cleaning of the substrate a before plating is performed in the pretreatment area 1. In the pretreatment area 1, for example, degreasing treatment is performed. Specifically, the pretreatment area 1 is subjected to acid treatment, water washing treatment, and the like. The substrate a having passed through the pretreatment area 1 is conveyed to the plating area 2. The substrate a is subjected to plating treatment in the plating region 2. The substrate a having passed through the plating zone 2 is conveyed to the post-treatment zone 3. The cleaning of the plated substrate a is performed in the post-treatment area 3. The plating solution 25 adhering to the substrate a is removed in the post-treatment region 3, for example. The post-processing area 3 is subjected to water washing processing, drying processing, and the like.

Fig. 3 is a schematic side view showing the structure of the substrate transport mechanism. As shown in fig. 3, the continuous plating apparatus 100 further has, for example, a plurality of clamping tools 10, a 1 st wheel 6, a 2 nd wheel 7, and a chain 8. The 1 st wheel 6 is disposed on the side of the pretreatment area 1 when viewed from the plating area 2. The 2 nd wheel 7 is disposed on the side of the post-treatment region 3 when viewed from the plating region 2. The chain 8 is mounted on the 1 st and 2 nd wheels 6 and 7. The 1 st and 2 nd wheels 6, 7 rotate, whereby the chain 8 rotates.

A plurality of clamping tools 10 are attached to the chain 8. The traveling direction of the lower chain 8 is the same as the traveling direction B of the base material a. The upper chain 8 travels in the direction opposite to the direction B of travel of the base material a. The clamping tool 10 mounted on the portion of the chain 8 that passes through the 1 st wheel 6 grips the substrate a. The clamping tool 10 conveys the substrate a while holding the substrate a while the clamping tool 10 is passing over the plating region 2. The clamping tool 10 mounted at the portion of the chain 8 near the 2 nd wheel 7 releases the substrate a. The gripping tool 10, which releases the substrate a, is rotated around the 2 nd wheel 7.

Fig. 4 is a schematic plan view showing the structure of the plated region. As shown in fig. 4, the plating region 2 mainly has a plating tank 22, a plating solution 25, a positive electrode 21, and a jet pipe 20. As shown in fig. 4, the positive electrodes 21 and the jet pipes 20 are alternately arranged in a direction parallel to the traveling direction B of the substrate a. The positive electrode 21 is disposed on both sides of the substrate a. The blast pipes 20 are disposed on both sides of the substrate a. The positive electrode 21 has a plate shape, for example.

Fig. 5 is a schematic sectional view taken along line V-V of fig. 4. As shown in fig. 5, each of the pair of positive electrodes 21 is immersed in the plating solution 25. The pair of positive electrodes 21 are each electrically connected to a positive electrode of the power supply 9. One of the pair of positive electrodes 21 faces one surface of the base material a. The other of the pair of positive electrodes 21 faces the other surface of the substrate a. The clamp 10 holds the substrate a so as to sandwich the upper end portion of the substrate a. The clamping tool 10 is electrically connected to the negative pole of the power supply 9. A voltage is applied to the substrate a via the clamping tool 10. A part of the clamping tool 10 is immersed in the plating solution 25.

Fig. 6 is a schematic sectional view taken along line VI-VI of fig. 4. As shown in fig. 6, each of the pair of blast pipes 20 has a pipe portion 23 and a plurality of blast holes 24. The number of the spouting holes 24 formed in the 1 tube portion 23 is not particularly limited, and is, for example, 5 or more and 10 or less. A plurality of jet holes 24 formed in one of the pair of jet pipes 20 is opposed to one surface of the substrate a. A plurality of jet holes 24 formed in the other of the pair of jet pipes 20 are opposed to the other surface of the substrate a. The plating solution 25 is discharged from the plurality of discharge holes 24 toward the surface of the substrate a.

(clamping tool)

Next, the structure of the clamping tool for a continuous plating apparatus will be described.

Fig. 7 is a schematic front view showing the structure of a clamping tool for a continuous plating apparatus in a closed state. As shown in fig. 7, the continuous plating apparatus clamping tool 10 according to the present embodiment mainly includes a set of fulcrum shaft members 16, a set of connecting members 14, a set of base plates 17, a set of substrate gripping members 29, a set of guide rollers 11, a set of spring members 18, a center support member 15, and a mounting member 19.

A set of connecting members 14 are located on each side of the central support member 15. A set of guide rollers 11 are located on each side of the central support member 15. A set of spring members 18 are located on either side of the central support member 15. A set of connecting members 14 are each located between the central support member 15 and a set of base plates 17.

The set of connecting members 14 are each configured to be rotatable about a respective one of the set of fulcrum shaft members 16. The rotation of the link member 14 about the fulcrum shaft member 16 means that the link member 14 moves along an arc of a virtual circle centered on the fulcrum shaft member 16. The set of connecting members 14 are each rod-shaped members. A set of fulcrum shaft members 16 may each be mounted to the central support member 15.

The base plates 17 are attached to one end side of the connecting members 14. The substrate gripping members 29 are each attached to the other end side of the connecting member 14. The fulcrum shaft member 16 is located between the one end 27 of the link member 14 and the other end 28 of the link member 14 in a direction parallel to a straight line connecting the one end 27 of the link member 14 and the other end 28 of the link member 14. The one end side of the connecting member 14 refers to a region of the connecting member 14 between the fulcrum shaft member 16 and the one end 27 of the connecting member 14. The other end side of the connecting member 14 refers to a region of the connecting member 14 between the fulcrum shaft member 16 and the other end 28 of the connecting member 14.

A set of guide rollers 11 is each mounted to a respective base plate 17 of a set of base plates 17. A set of spring members 18 are each located between the central support member 15 and a respective one 14 of the set of connecting members 14. A set of base plates 17 are each located between a set of fulcrum shaft members 16 and a set of guide rollers 11.

The set of substrate gripping members 29 has a set of support portions 13 and a set of projections 12. The one set of supporting portions 13 are each attached to the other end side of the one set of connecting members 14. A set of projections 12 are each mounted to a respective support 13 of a set of supports 13. The set of projections 12 are each a portion that contacts the substrate a. The attachment member 19 is attached to the chain 8 (see fig. 3), for example.

Fig. 8 is a schematic front view showing the structure of a clamping tool for a continuous plating apparatus in an open state. As shown in fig. 8, if an external force is applied to each of the guide rollers 11 of the one set in a direction from the outside toward the inside, the interval between the guide rollers 11 of the one set becomes small. The direction from the outside toward the inside refers to a direction from each of the set of guide rollers 11 toward the center support member 15. By reducing the interval of the one set of guide rollers 11, the one set of connecting members 14 are each rotated about the one set of fulcrum shaft members 16. Thereby, the interval between the one set of substrate gripping members 29 becomes large.

Without applying an external force to each of the guide rollers 11, the resilient force of the spring members 18 applies a force to each of the connecting members 14 in a direction away from the rail 30 from the central support member 15. Thereby, the one set of connecting members 14 are each rotated about the one set of fulcrum shaft members 16. As a result, the interval between the pair of substrate holding members 29 is reduced (see fig. 7). By disposing the substrate a between the set of substrate holding members 29, the substrate a is held by the set of substrate holding members 29.

Fig. 9 is a partial cross-sectional view schematically showing the structure of a track. As shown in fig. 9, the rail 30 mainly has a 1 st section S1, a 2 nd section S2, a 3 rd section S3, a 4 th section S4, and a 5 th section S5. In the 1 st region S1, the interval of the inner wall surface 31 of the rail 30 is the 1 st width W1. In the 2 nd region S2, the interval of the inner wall surface 31 of the rail 30 is the 2 nd width W2. The 2 nd width W2 is greater than the 1 st width W1. The 2 nd region S2 is separated from the 1 st region S1. The 3 rd region S3 is located between the 1 st region S1 and the 2 nd region S2. The 3 rd region S3 is connected to each of the 1 st region S1 and the 2 nd region S2. In the 3 rd region S3, the width of the inner wall surface 31 of the rail 30 becomes larger as going from the 1 st region S1 to the 2 nd region S2.

In the 4 th region S4, the interval of the inner wall surface 31 of the rail 30 is the 3 rd width W3. The 3 rd width W3 is greater than the 1 st width W1. The 3 rd width W3 may be the same as the 2 nd width W2. The 4 th region S4 is separated from the 1 st region S1. The 5 th region S5 is located between the 1 st region S1 and the 4 th region S4. The 5 th region S5 is connected to the 1 st region S1 and the 4 th region S4, respectively. In the 5 th region S5, the width of the inner wall surface 31 of the rail 30 becomes larger as going from the 1 st region S1 to the 4 th region S4. The 1 st region S1 is located between the 5 th region S5 and the 3 rd region S3.

As shown in fig. 9, a set of guide rollers 11 moves along an inner wall surface 31 of the rail 30. The rail 30 is disposed above the plating tank 22, for example. The rail 30 extends, for example, in the traveling direction B of the substrate a.

The set of guide rollers 11 moves, for example, from the 4 th section S4 toward the 2 nd section S2. In the case where one set of guide rollers 11 is located in the 1 st area S1, the interval of the one set of guide rollers 11 becomes smaller. In this case, the interval between the one set of substrate gripping members 29 becomes large. From another perspective, a set of substrate gripping members 29 is open. When the pair of guide rollers 11 is located in each of the 2 nd area S2 and the 4 th area S4, the interval between the pair of guide rollers 11 is increased. In this case, the interval of the one set of substrate gripping members 29 becomes smaller. From another perspective, a set of substrate gripping members 29 is closed.

If one set of guide rollers 11 passes through the 3 rd region S3 in the direction from the 1 st region S1 toward the 2 nd region S2, the interval of the one set of guide rollers 11 becomes gradually larger. The spacing of the set of substrate gripping members 29 becomes progressively smaller. From another perspective, the set of substrate gripping members 29 is progressively closed. If one set of guide rollers 11 passes through the 5 th region S5 in the direction from the 4 th region S4 toward the 1 st region S1, the interval of the one set of guide rollers 11 becomes gradually smaller. The spacing of the set of substrate gripping members 29 becomes progressively larger. From another perspective, a set of substrate gripping members 29 are progressively opened. As described above, the pair of guide rollers 11 passes through the rails 30 having different widths of the inner wall surface 31, and thereby opening and closing of the pair of substrate gripping members 29 can be controlled.

Fig. 10 is a side view of a plated region and a structure over the plated region. As shown in fig. 10, the continuous plating apparatus 100 has a rail 30 (see fig. 9). As shown in fig. 10, the rail 30 is disposed between the plating zone 2 and the chain 8. The track 30 is disposed on the outer circumferential side of the chain 8. The plating zone 2 has a plating tank 22 and a recovery tank 62. The plating tank 22 contains a plating solution 25. The recovery tank 62 is connected to the plating tank 22. The recovery tank 62 recovers the plating solution 25 overflowing from the plating tank 22.

The plating tank 22 is positioned forward of the recovery tank 62 in the traveling direction B of the substrate a. The recovery tank 62 is located between the unreeling machine 4 and the plating tank 22 in the traveling direction B of the substrate a. The plating tank 22 is located between the winder 5 and the recovery tank 62 in the traveling direction B of the base material a.

The rail 30 is disposed above each of the plating tank 22 and the recovery tank 62. The rail 30 extends in the direction in which the plating tank 22 and the recovery tank 62 are aligned. From another point of view, the rails 30 are arranged along the traveling direction B of the substrate a. As shown in fig. 10, the rail 30 positioned above the recovery tank 62 may have an arc shape in a side view. The rail 30 located above the plating bath 22 may have a linear portion and an arc-shaped portion in a side view.

Fig. 11 is a schematic plan view showing a plated region and a structure above the plated region. As shown in fig. 11, the track 30 has a 1 st section S1, a 2 nd section S2, a 3 rd section S3, a 4 th section S4, and a 5 th section S5. As shown in fig. 11, the 1 st region S1 is located above the boundary between the plating tank 22 and the recovery tank 62. The 2 nd region S2 and the 3 rd region S3 are each located above the plating bath 22. The 4 th and 5 th regions are each located above the recovery tank 62.

As shown in fig. 10 and 11, the continuous plating apparatus 100 may further include a boundary plate 71 and a pair of rectifying plates 72. The boundary plate 71 separates the plating tank 22 and the recovery tank 62. The boundary plate 71 may be a part of the plating tank 22 or a part of the recovery tank 62. The plating tank 22 and the recovery tank 62 may share the boundary plate 71. The plating solution 25 overflows from the plating tank 22 to the recovery tank 62 over the boundary plate 71. The pair of flow rectification plates 72 is provided in the recovery tank 62, for example. The pair of current plates 72 is, for example, in contact with the boundary plate 71. The pair of flow regulating plates 72 may extend from the boundary plate 71 in a direction opposite to the traveling direction B of the substrate a. The spacing W4 of the pair of current plates 72 may be less than the 1 st width W1.

As shown in fig. 10 and 11, the direction C in which the plating solution 25 overflows is opposite to the direction B in which the substrate a travels. In fig. 10, a broken line indicates a trajectory D of the front end of the clamp tool 10. In fig. 10 and 11, the two-dot chain line indicates the base material a. As shown in fig. 11, the 3 rd region S3 is located above the plating tank 22. The clamping tool 10 begins to grip the substrate a in zone 3S 3. As shown in fig. 10, the chucking tool 10 starts to hold the substrate a not in the recovery tank 62 but in the plating tank 22.

Next, the operational effects of the continuous plating apparatus according to the present embodiment will be described.

According to the continuous plating apparatus 100 of the present embodiment, each of the 2 nd region S2 and the 3 rd region S3 is located above the plating tank 22. The 1 st region S1 is located above the boundary between the plating tank 22 and the recovery tank 62. The 3 rd region S3 in which the width of the inner wall surface 31 becomes larger as going from the 1 st region S1 toward the 2 nd region S2 is located between the 1 st region S1 and the 2 nd region S2. The clamping tool 10 begins to grip the substrate in zone 3S 3. Therefore, the clamp tool 10 can hold the substrate not in the recovery tank 62 but in the plating tank 22. Therefore, the chuck tool 10 can grip the substrate without being affected by the plating solution 25 overflowing from the plating tank 22 to the recovery tank 62. As a result, the clamp tool 10 can grip the substrate in a stable state.

The continuous plating apparatus 100 according to the present embodiment may further include: a boundary plate 71 that separates the plating tank 22 and the recovery tank 62; and a pair of flow regulating plates 72 provided in the recovery tank 62 and connected to the boundary plate 71. The pair of flow regulating plates 72 are disposed so that the base material passes between the pair of flow regulating plates 72, whereby the base material can be prevented from shaking due to the influence of the plating solution 25 overflowing from the plating tank 22 into the recovery tank 62. As a result, the position of the substrate can be prevented from deviating from the desired position.

The embodiments disclosed herein are illustrative in all respects and should not be construed as being restrictive. The scope of the present invention is defined by the claims of the present invention, rather than the description above, and includes all modifications equivalent in meaning and scope to the claims of the present invention.

Claims (5)

1. A continuous plating device, characterized in that it has: a plating tank, which accommodates the plating solution; a recovery tank, which is connected to the plating tank and recovers the plating solution overflowing from the plating tank; a rail, which is arranged above each of the plating tank and the recovery tank, and extends along the direction in which the plating tank and the recovery tank are arranged; and a clamping tool having guide rollers that move along the inner wall surface of the rail, The track contains: The interval of the inner wall surface is the first area of the first width; a second area separated from the first area and the interval between the inner wall surfaces has a second width greater than the first width; and A third area, which is connected to the first area and the second area, is located between the first area and the second area, and moves from the first area toward the second area. And the width of the inner wall surface becomes larger, The second region and the third region are respectively located above the plating tank, The first region is located above the boundary between the plating tank and the recovery tank. 2 . The continuous plating apparatus according to claim 1 , wherein: 2 . have: a boundary plate separating the plating tank and the recovery tank; and A pair of straightening plates are arranged in the recovery tank and are connected with the boundary plate. 3. The continuous plating apparatus according to claim 2, wherein: The interval between the pair of rectifying plates is smaller than the first width. 4. The continuous plating apparatus according to any one of claims 1 to 3, wherein, It also has an unwinder that sends out the substrate, The recovery tank is located between the unwinder and the plating tank in the direction of travel of the substrate. 5. The continuous plating apparatus according to claim 4, wherein: It also has a winder for recycling the base material, In the direction of travel of the substrate, the plating tank is located between the winder and the recovery tank.

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