CN213977948U - Continuous plating device - Google Patents

Abstract

The continuous plating apparatus comprises an unreeling machine, a plating area, a reeling machine, a 1 st movable roller, a 1 st position sensor, and a 1 st control unit. The unreeling machine sends out the base material. The plating area plates the substrate. The winder recovers the plated base material. The 1 st movable roller is disposed between the unreeling machine and the plating region in the traveling direction of the substrate, and rotates in accordance with the movement of the substrate. The 1 st position sensor detects the position of the 1 st movable roller. The 1 st control unit controls the pay-off speed of the pay-off machine based on the 1 st position information of the 1 st movable roller detected by the 1 st position sensor.

Description

Continuous plating device

Technical Field

The utility model relates to a continuous plating device.

Background

Japanese patent application laid-open No. 2018-3150 (patent document 1) describes a continuous plating apparatus. The continuous plating apparatus has an unwinder, a plating zone, and a winder.

Patent document 1: japanese patent laid-open publication No. 2018-3150

SUMMERY OF THE UTILITY MODEL

An object of the present invention is to provide a continuous plating apparatus capable of reducing fluctuation in quality of a plating film.

The utility model relates to a continuous plating device has unreeling machine, plating region, winder, the 1 st movable roll, the 1 st position sensor and the 1 st control part. The unreeling machine sends out the base material. The plating area plates the substrate. The winder recovers the plated base material. The 1 st movable roller is disposed between the unreeling machine and the plating region in the traveling direction of the substrate, and rotates in accordance with the movement of the substrate. The 1 st position sensor detects the position of the 1 st movable roller. The 1 st control unit controls the pay-off speed of the pay-off machine based on the 1 st position information of the 1 st movable roller detected by the 1 st position sensor.

Effect of the utility model

According to the present invention, a continuous plating apparatus capable of reducing fluctuation in quality of a plating film can be provided.

Drawings

Fig. 1 is a schematic plan view showing the structure of a continuous plating apparatus according to the present embodiment.

Fig. 2 is a schematic side view showing the structure of the continuous plating apparatus according to the present embodiment.

Fig. 3 is a schematic plan view showing the structure of the 1 st tension adjusting mechanism.

Fig. 4 is a schematic side view showing the structure of the 1 st tension adjusting mechanism.

Fig. 5 is a schematic plan view showing the 1 st state of the 1 st tension adjusting mechanism.

Fig. 6 is a schematic side view showing the 1 st state of the 1 st tension adjusting mechanism.

Fig. 7 is a schematic plan view showing the 2 nd state of the 1 st tension adjusting mechanism.

Fig. 8 is a schematic side view showing the 2 nd state of the 1 st tension adjusting mechanism.

Fig. 9 is a schematic plan view showing the structure of the 2 nd tensioning mechanism.

Fig. 10 is a schematic side view showing the structure of the 2 nd tensioning mechanism.

Fig. 11 is a schematic plan view showing the 1 st state of the 2 nd tension adjusting mechanism.

Fig. 12 is a schematic side view showing the 1 st state of the 2 nd tensioning mechanism.

Fig. 13 is a schematic plan view showing a 2 nd state of the 2 nd tensioning mechanism.

Fig. 14 is a schematic side view showing the 2 nd state of the 2 nd tensioning mechanism.

Fig. 15 is a schematic side view showing the structure of the substrate transport mechanism.

Fig. 16 is a schematic plan view showing the structure of the plated region.

FIG. 17 is a schematic cross-sectional view taken along line XVII-XVII of FIG. 16.

FIG. 18 is a schematic sectional view taken along line XVIII-XVIII in FIG. 16.

Description of the reference numerals

1 pretreatment area

2 plated area

3 post-treatment area

4 unreeling machine

5 winding machine

61 st wheel

7 nd wheel 2

8 chain

9 power supply

10 clamping tool

20 jet pipe

21 positive electrode

22 plating bath

23 tube part

24 orifice

25 plating solution

30 st tension adjusting mechanism

31 1 st upstream side fixing roller

32 1 st downstream side fixed roller

33 st movable roller

34 st movable part

35 st belt wheel

36 line 1

37 1 st weight part

38 the 1 st connection part

40 nd 2 tension adjusting mechanism

41 nd 2 upstream side fixed roller

42 nd 2 downstream side fixed roller

43 nd 2 movable roll

44 nd 2 nd movable part

45 nd 2 nd belt wheel

46 line 2

47 number 2 weight part

48 No. 2 connecting part

51 st fixed part

52 st pendulum part

53 1 st position sensor

54 st control part

61 nd 2 nd fixing part

62 nd 2 pendulum part

63 2 nd position sensor

64 nd control part 2

100 continuous plating apparatus

A base material

Direction of travel of B

C1 No. 1

C2 Direction 2

P1 position 1

P2 position 2

P3 reference position

Detailed Description

[ description of embodiments of the present invention ]

Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the same or corresponding portions are denoted by the same reference numerals, and description thereof will not be repeated.

(1) The continuous plating apparatus 100 of the present invention includes an unreeling machine 4, a plating zone 2, a winding machine 5, a 1 st movable roller 33, a 1 st position sensor 53, and a 1 st control unit 54. The unreeling machine 4 sends out the substrate a. The plating area 2 plates the substrate a. The winder 5 recovers the plated base material a. The 1 st movable roller 33 is disposed between the unwinder 4 and the plating area 2 in the traveling direction of the substrate a, and rotates in accordance with the movement of the substrate a. The 1 st position sensor 53 detects the position of the 1 st movable roller 33. The 1 st control unit 54 controls the unwinding speed of the unwinding machine 4 based on the 1 st position information of the 1 st movable roller 33 detected by the 1 st position sensor 53.

If the tension of the base material A becomes large, the tensile stress of the base material A becomes large. Conversely, if the tension of the base material a becomes small, the tensile stress of the base material a becomes small. That is, if the tension of the base material a is different, the tensile stress of the base material a changes. If the fluctuation of the tensile stress of the base material a is large, the fluctuation of the quality of the plating film formed on the base material a also becomes large.

The continuous plating apparatus 100 according to the above (1) includes the 1 st control unit 54, and the 1 st control unit 54 controls the feeding speed of the unreeling machine 4 based on the 1 st position information of the 1 st movable roller 33 detected by the 1 st position sensor 53. This enables the tension of the base material a to be controlled. As a result, the tensile stress of the base material a can be suppressed from changing greatly. Therefore, the variation in the quality of the plating film formed on the base material a can be reduced.

(2) The continuous plating apparatus 100 according to the above (1) may further include: a 1 st movable section 34 on which the 1 st movable roller 33 is placed; a 1 st wire 36 attached to the 1 st movable portion 34; and a 1 st weight 37 attached to the 1 st wire 36. This allows the 1 st movable roller 33 to be pulled with a constant force. As a result, when the tension of the base material a changes, the position of the 1 st movable roller 33 changes. By controlling the unwinding speed of the unwinding machine 4 based on the position information of the 1 st movable roller 33, the tension of the base material a can be controlled with high accuracy.

(3) The continuous plating apparatus 100 according to the above (1) or (2) may include the 2 nd movable roller 43, the 2 nd position sensor 63, and the 2 nd control unit 64. The 2 nd movable roller 43 is disposed between the unwinder 4 and the plating zone 2 in the traveling direction of the substrate a, and rotates in accordance with the movement of the substrate a. The 2 nd position sensor 63 detects the position of the 2 nd movable roller 43. The 2 nd control unit 64 controls the winding speed of the winder 5 based on the 2 nd position information of the 2 nd movable roller 43 detected by the 2 nd position sensor 63. This enables the tension of the base material a to be controlled. As a result, it is possible to prevent the substrate a from being stretched due to an excessive increase in the tension of the substrate a, and thus to prevent the plating film formed on the substrate a from being cracked. Therefore, the quality of the plating film formed on the substrate a can be improved.

(4) The continuous plating apparatus 100 according to the above (3) may further include: a 2 nd movable portion 44 on which the 2 nd movable roller 43 is placed; a 2 nd wire 46 attached to the 2 nd movable portion 44; and a 2 nd weight portion 47 attached to the 2 nd wire 46. This allows the 2 nd movable roller 43 to be pulled with a constant force. As a result, when the tension of the base material a changes, the position of the 2 nd movable roller 43 changes. By controlling the winding speed of the winder 5 based on the positional information of the 2 nd movable roller 43, the tension of the base material a can be controlled with high accuracy.

(5) The continuous plating apparatus 100 according to the above (1) or (2) may have the clamping tool 10. The clamping tool 10 conveys the substrate a in the plating region 2 while holding the substrate a.

[ details of the embodiment of the present invention ]

(continuous plating apparatus)

First, a structure of a continuous plating apparatus 100 according to an embodiment of the present invention (also referred to as the present embodiment) will be described.

Fig. 1 is a schematic plan view showing the structure of a continuous plating apparatus according to the present embodiment. As shown in fig. 1, the continuous plating apparatus 100 mainly includes an unwinder 4, a winder 5, a pretreatment area 1, a plating area 2, a post-treatment area 3, a 1 st tension adjusting mechanism 30, and a 2 nd tension adjusting mechanism 40. The unwinder 4 is a machine that feeds out the substrate a before plating. The substrate a before plating is wound in a roll shape around the unwinder 4. The winder 5 is a machine for collecting the plated substrate a. The plated substrate a is wound in a roll shape around a winder 5. The type of the substrate A is not particularly limited, and may be, for example, CCL (Copper Clad amine). The CCL has a copper layer formed on a polyimide layer, for example.

Fig. 2 is a schematic side view showing the structure of the continuous plating apparatus according to the present embodiment. As shown in fig. 2, the 1 st tension adjusting mechanism 30 is disposed between the unreeling machine 4 and the pretreatment area 1 in the traveling direction of the base material a. The 1 st tension adjusting mechanism 30 is disposed between the unreeling machine 4 and the pretreatment area 1 in the traveling direction of the base material a. The pretreatment area 1 is disposed between the 1 st tension adjusting mechanism 30 and the plating area 2 in the traveling direction of the substrate a. The plating region 2 is disposed between the pretreatment region 1 and the post-treatment region 3. The post-treatment zone 3 is disposed between the plating zone 2 and the 2 nd tension adjusting mechanism 40 in the traveling direction of the substrate a. The 2 nd tension adjusting mechanism 40 is disposed between the post-processing area 3 and the winder 5 in the traveling direction of the base material a.

The substrate a paid out from the payout reel 4 is conveyed to the pretreatment area 1 by the 1 st tension adjusting mechanism 30. The cleaning of the substrate a before plating is performed in the pretreatment area 1. In the pretreatment area 1, for example, degreasing treatment is performed. Specifically, the pretreatment area 1 is subjected to acid treatment, water washing treatment, and the like. The substrate a having passed through the pretreatment area 1 is conveyed to the plating area 2. The substrate a is subjected to plating treatment in the plating region 2. The substrate a having passed through the plating zone 2 is conveyed to the post-treatment zone 3. The cleaning of the plated substrate a is performed in the post-treatment area 3. The plating solution 25 adhering to the substrate a is removed in the post-treatment region 3, for example. The post-processing area 3 is subjected to water washing processing, drying processing, and the like. The base material a discharged from the post-processing area 3 passes through the 2 nd tension adjusting mechanism 40 and is wound by the winder 5.

Fig. 3 is a schematic plan view showing the structure of the 1 st tension adjusting mechanism. As shown in fig. 3, the 1 st tensioning mechanism 30 mainly includes a 1 st movable roller 33, a 1 st upstream side fixed roller 31, a 1 st downstream side fixed roller 32, a 1 st movable portion 34, a 1 st wire 36, a 1 st pulley 35, a 1 st weight portion 37, a 1 st position sensor 53, and a 1 st link portion 38. The 1 st movable roller 33 is disposed between the unwinder 4 and the plating area 2 in the traveling direction of the substrate a. The 1 st movable roller 33 rotates in accordance with the movement of the base material a.

The 1 st upstream side fixed roller 31 is located upstream in the traveling direction of the base material a as viewed from the 1 st movable roller 33. The 1 st downstream side fixed roller 32 is located downstream in the traveling direction of the base material a as viewed from the 1 st movable roller 33. The 1 st upstream fixing roller 31 and the 1 st downstream fixing roller 32 rotate in accordance with the movement of the substrate a. The 1 st upstream side fixing roller 31 and the 1 st downstream side fixing roller 32 are fixed to, for example, a floor.

As shown in fig. 3, the substrate a fed from the unwinder 4 moves to the 1 st upstream side fixed roller 31, the 1 st movable roller 33, and the 1 st downstream side fixed roller 32 in this order. The substrate a having passed through the 1 st downstream side fixing roller 32 is conveyed toward the front processing area 1. The traveling direction of the substrate a fed from the unwinder 4 is changed by the 1 st upstream fixing roller 31. The traveling direction of the substrate a from the 1 st upstream side fixed roller 31 toward the 1 st movable roller 33 is opposite to the traveling direction of the substrate a from the 1 st movable roller 33 toward the 1 st downstream side fixed roller 32. The 1 st downstream side fixed roller 32 changes the traveling direction of the base material a passing through the 1 st movable roller 33.

Fig. 4 is a schematic side view showing the structure of the 1 st tension adjusting mechanism. As shown in fig. 4, the 1 st movable roller 33 is placed on the 1 st movable portion 34. The 1 st wire 36 is attached to the 1 st movable portion 34. The 1 st weight 37 is attached to the 1 st line 36. The 1 st wire 36 connects the 1 st weight portion 37 and the 1 st movable portion 34. The 1 st wire 36 is attached to the 1 st pulley 35. The 1 st movable portion 34 is configured to be movable in the horizontal direction. The 1 st movable portion 34 may be attached to a rail not shown.

The 1 st weight 37 is attached to one end of the 1 st wire 36. A portion of the 1 st line 36 between the 1 st weight portion 37 and the 1 st pulley 35 extends in the vertical direction. The portion of the 1 st wire 36 between the 1 st pulley 35 and the 1 st movable portion 34 extends in the horizontal direction. The 1 st movable portion 34 is pulled in the direction toward the 1 st pulley 35 by the 1 st weight portion 37. The 1 st movable roller 33 is fixed to the 1 st movable portion 34. The 1 st movable roller 33 is pulled in the left direction in the drawing by the 1 st weight portion 37. The 1 st movable roller 33 is movable in the horizontal direction.

As shown in fig. 3, the 1 st position sensor 53 has a 1 st fixing portion 51 and a 1 st pendulum portion 52. The 1 st pendulum part 52 may be attached to the 1 st movable part 34 via the 1 st connecting part 38. The 1 st position sensor 53 can detect the position of the 1 st movable roller 33. The method of detecting the position of the 1 st movable roller 33 will be described later.

Fig. 5 is a schematic plan view showing the 1 st state of the 1 st tension adjusting mechanism. If the feeding speed of the substrate a in the 1 st upstream side fixing roller 31 is larger than the winding speed of the substrate a in the 1 st downstream side fixing roller 32, the tension of the substrate a between the 1 st downstream side fixing roller 32 and the 1 st upstream side fixing roller 31 becomes small. In this case, the force with which the 1 st movable roller 33 is pulled by the tension of the base material a is smaller than the gravity of the 1 st weight portion 37. As a result, the 1 st movable roller 33 moves in a direction approaching the 1 st pulley 35.

As shown in fig. 5, the 1 st pendulum part 52 is inclined in the direction in which the 1 st pulley 35 is located, in a plan view. The 1 st position sensor 53 detects the 1 st position information of the 1 st movable roller 33 based on, for example, the tilt direction and tilt angle of the 1 st pendulum part 52. The 1 st position information of the 1 st movable roller 33 is, for example, a moving direction and a moving distance of the 1 st movable roller 33.

Fig. 6 is a schematic side view showing the 1 st state of the 1 st tension adjusting mechanism. If the tension of the base material a is reduced, the 1 st movable roller 33 moves in the 1 st direction C1. The 1 st direction C1 is a direction in which the 1 st movable roller 33 approaches the 1 st pulley 35. The position of the rotation shaft of the 1 st movable roller 33 moves from the reference position P3 to the 1 st position P1.

Fig. 7 is a schematic plan view showing the 2 nd state of the 1 st tension adjusting mechanism. If the feeding speed of the substrate a in the 1 st upstream side fixed roll 31 is smaller than the winding speed of the substrate a in the 1 st downstream side fixed roll 32, the tension of the substrate a between the 1 st downstream side fixed roll 32 and the 1 st upstream side fixed roll 31 becomes large. In this case, the force with which the 1 st movable roller 33 is pulled by the tension of the base material a becomes larger than the gravity of the 1 st weight portion 37. As a result, the 1 st movable roller 33 moves in a direction away from the 1 st pulley 35.

As shown in fig. 7, the 1 st pendulum portion 52 is inclined in a direction opposite to the direction in which the 1 st pulley 35 is located, in a plan view. The 1 st position sensor 53 detects the 1 st position information of the 1 st movable roller 33 based on, for example, the tilt direction and tilt angle of the 1 st pendulum part 52. The 1 st position information of the 1 st movable roller 33 is, for example, a moving direction and a moving distance of the 1 st movable roller 33.

Fig. 8 is a schematic side view showing the 2 nd state of the 1 st tension adjusting mechanism. If the tension of the base material a increases, the 1 st movable roller 33 moves in the 2 nd direction C2. The 2 nd direction C2 is a direction in which the 1 st movable roller 33 is away from the 1 st pulley 35. The position of the rotation shaft of the 1 st movable roller 33 moves from the reference position P3 to the 2 nd position P2.

The 1 st control unit 54 can control the unwinding speed of the unwinding machine 4 based on the 1 st position information of the 1 st movable roller 33 detected by the 1 st position sensor 53. From another viewpoint, the 1 st position information of the 1 st movable roller 33 detected by the 1 st position sensor 53 is fed back to the unwinding machine 4 by the 1 st control unit 54. Specifically, when the position of the rotation shaft of the 1 st movable roller 33 is moved from the reference position P3 in the direction in which the 1 st pulley 35 is located, the unwinding speed of the unwinding machine 4 is reduced. This can increase the tension of the base material a. Conversely, when the position of the rotation shaft of the 1 st movable roller 33 is shifted from the reference position P3 to the opposite side of the direction in which the 1 st pulley 35 is located, the unwinding speed of the unwinding machine 4 is increased. This can reduce the tension of the base material a. As described above, the 1 st control portion 54 can control the tension of the base material a so that the tension of the base material a is maintained within a predetermined range.

Fig. 9 is a schematic plan view showing the structure of the 2 nd tensioning mechanism. As shown in fig. 9, the 2 nd tensioning mechanism 40 mainly includes a 2 nd movable roller 43, a 2 nd upstream side fixed roller 41, a 2 nd downstream side fixed roller 42, a 2 nd movable portion 44, a 2 nd wire 46, a 2 nd pulley 45, a 2 nd weight portion 47, a 2 nd position sensor 63, and a 2 nd connecting portion 48. The 2 nd movable roller 43 is disposed between the winder 5 and the plating zone 2 in the traveling direction of the base material a. The 2 nd movable roller 43 rotates in accordance with the movement of the base material a.

The 2 nd upstream side fixed roller 41 is located upstream in the traveling direction of the substrate a as viewed from the 2 nd movable roller 43. The 2 nd downstream side fixed roller 42 is located downstream in the traveling direction of the base material a as viewed from the 2 nd movable roller 43. The 2 nd upstream side fixing roller 41 and the 2 nd downstream side fixing roller 42 each rotate in accordance with the movement of the base material a. The 2 nd upstream side fixing roller 41 and the 2 nd downstream side fixing roller 42 are fixed to, for example, a floor.

As shown in fig. 9, the substrate a fed out from the post-processing area 3 moves to the 2 nd upstream side fixed roller 41, the 2 nd movable roller 43, and the 2 nd downstream side fixed roller 42 in this order. The base material a having passed through the 2 nd downstream side fixing roller 42 is conveyed to the winder 5. The traveling direction of the substrate a sent out from the post-processing area 3 is changed by the 2 nd upstream side fixing roller 41. The traveling direction of the substrate a from the 2 nd upstream side fixed roller 41 toward the 2 nd movable roller 43 is opposite to the traveling direction of the substrate a from the 2 nd movable roller 43 toward the 2 nd downstream side fixed roller 42. The 2 nd downstream side fixed roller 42 changes the traveling direction of the substrate a passing the 2 nd movable roller 43.

Fig. 10 is a schematic side view showing the structure of the 2 nd tensioning mechanism. As shown in fig. 10, the 2 nd movable roller 43 is placed on the 2 nd movable portion 44. The 2 nd wire 46 is attached to the 2 nd movable portion 44. The 2 nd weight 47 is attached to the 2 nd wire 46. The 2 nd wire 46 connects the 2 nd weight portion 47 and the 2 nd movable portion 44. The 2 nd wire 46 is attached to the 2 nd pulley 45. The 2 nd movable portion 44 is configured to be movable in the horizontal direction. The 2 nd movable portion 44 may be attached to a rail not shown.

The 2 nd weight 47 is attached to one end of the 2 nd wire 46. A portion of the 2 nd wire 46 between the 2 nd weight portion 47 and the 2 nd pulley 45 extends in the vertical direction. The portion of the 2 nd wire 46 between the 2 nd pulley 45 and the 2 nd movable portion 44 extends in the horizontal direction. The 2 nd movable portion 44 is pulled in a direction toward the 2 nd pulley 45 by the 2 nd weight portion 47. The 2 nd movable roller 43 is fixed to the 2 nd movable portion 44. The 2 nd movable roller 43 is pulled in the left direction in the drawing by the 2 nd weight portion 47. The 2 nd movable roller 43 can move in the horizontal direction.

As shown in fig. 9, the 2 nd position sensor 63 has a 2 nd fixing portion 61 and a 2 nd pendulum portion 62. The 2 nd pendulum part 62 may be attached to the 2 nd movable part 44 via the 2 nd connecting part 48. The 2 nd position sensor 63 can detect the position of the 2 nd movable roller 43. The method of detecting the position of the 2 nd movable roller 43 will be described later.

Fig. 11 is a schematic plan view showing the 1 st state of the 2 nd tension adjusting mechanism. If the feed speed of the substrate a in the 2 nd upstream side fixing roller 41 is higher than the winding speed of the substrate a in the 2 nd downstream side fixing roller 42, the tension of the substrate a between the 2 nd downstream side fixing roller 42 and the 2 nd upstream side fixing roller 41 becomes small. In this case, the force with which the 2 nd movable roller 43 is pulled by the tension of the base material a is smaller than the gravity of the 2 nd weight portion 47. As a result, the 2 nd movable roller 43 moves in a direction approaching the 2 nd pulley 45.

As shown in fig. 11, the 2 nd pendulum part 62 is inclined in the direction in which the 2 nd pulley 45 is located in a plan view. The 2 nd position sensor 63 detects the 2 nd position information of the 2 nd movable roller 43 based on, for example, the tilt direction and the tilt angle of the 2 nd weight 62. The 2 nd position information of the 2 nd movable roller 43 is, for example, the moving direction and the moving distance of the 2 nd movable roller 43.

Fig. 12 is a schematic side view showing the 1 st state of the 2 nd tensioning mechanism. If the tension of the base material a is reduced, the 2 nd movable roller 43 moves in the 1 st direction C1. The 1 st direction C1 is a direction in which the 2 nd movable roller 43 approaches the 2 nd pulley 45. The position of the rotation shaft of the 2 nd movable roller 43 moves from the reference position P3 to the 1 st position P1.

Fig. 13 is a schematic plan view showing a 2 nd state of the 2 nd tensioning mechanism. If the feed speed of the substrate a in the 2 nd upstream side fixed roll 41 is smaller than the winding speed of the substrate a in the 2 nd downstream side fixed roll 42, the tension of the substrate a between the 2 nd downstream side fixed roll 42 and the 2 nd upstream side fixed roll 41 becomes large. In this case, the force with which the 2 nd movable roller 43 is pulled by the tension of the base material a becomes larger than the gravity of the 2 nd weight portion 47. As a result, the 2 nd movable roller 43 moves in a direction away from the 2 nd pulley 45.

As shown in fig. 13, the 2 nd pendulum part 62 is inclined in a direction opposite to the direction in which the 2 nd pulley 45 is located, in a plan view. The 2 nd position sensor detects the 2 nd position information of the 2 nd movable roller 43 based on, for example, the tilt direction and tilt angle of the 2 nd pendulum part 62. The 2 nd position information of the 2 nd movable roller 43 is, for example, the moving direction and the moving distance of the 2 nd movable roller 43.

Fig. 14 is a schematic side view showing the 2 nd state of the 2 nd tensioning mechanism. When the tension of the base material a increases, the 2 nd movable roller 43 moves in the 2 nd direction C2. The 2 nd direction C2 is a direction in which the 2 nd movable roller 43 moves away from the 2 nd pulley 45. The position of the rotation shaft of the 2 nd movable roller 43 moves from the reference position P3 to the 2 nd position P2.

The 2 nd control unit 64 can control the winding speed of the winder 5 based on the 2 nd position information of the 2 nd movable roller 43 detected by the 2 nd position sensor 63. From another viewpoint, the 2 nd control unit 64 feeds back the 2 nd position information of the 2 nd movable roller 43 detected by the 2 nd position sensor 63 to the winding machine 5. Specifically, when the position of the rotation shaft of the 2 nd movable roller 43 is moved from the reference position P3 to the direction in which the 2 nd pulley 45 is located, the winding speed of the winder 5 is increased. This can increase the tension of the base material a. Conversely, when the position of the rotation axis of the 2 nd movable roller 43 is shifted from the reference position P3 to the opposite side of the direction in which the 2 nd pulley 45 is located, the winding speed of the winder 5 is decreased. This can reduce the tension of the base material a. As described above, the 2 nd control portion 64 can control the tension of the base material a so that the tension of the base material a is maintained within a predetermined range.

Fig. 15 is a schematic side view showing the structure of the substrate transport mechanism. As shown in fig. 15, the continuous plating apparatus 100 further has, for example, a plurality of clamping tools 10, a 1 st wheel 6, a 2 nd wheel 7, and a chain 8. The 1 st wheel 6 is disposed on the side of the pretreatment area 1 when viewed from the plating area 2. The 2 nd wheel 7 is disposed on the side of the post-treatment region 3 when viewed from the plating region 2. The chain 8 is mounted on the 1 st and 2 nd wheels 6 and 7. The 1 st and 2 nd wheels 6, 7 rotate, whereby the chain 8 rotates.

A plurality of clamping tools 10 are attached to the chain 8. The traveling direction of the lower chain 8 is the same as the traveling direction B of the base material a. The upper chain 8 travels in the direction opposite to the direction B of travel of the base material a. The clamping tool 10 mounted on the portion of the chain 8 that passes through the 1 st wheel 6 grips the substrate a. The clamping tool 10 conveys the substrate a while holding the substrate a while the clamping tool 10 is passing over the plating region 2. The clamping tool 10 mounted at the portion of the chain 8 near the 2 nd wheel 7 releases the substrate a. The gripping tool 10, which releases the substrate a, is rotated around the 2 nd wheel 7. As described above, the clamping tool 10 conveys the substrate a in the plating region 2 while holding the substrate a. In the plating zone 2, the substrate a is moved at a constant speed. On the other hand, in the region of each of the 1 st and 2 nd tension adjusting mechanisms 30 and 40, the moving speed of the base material a changes.

Fig. 16 is a schematic plan view showing the structure of the plated region. As shown in fig. 16, the plating region 2 mainly has a plating tank 22, a plating solution 25, a positive electrode 21, and a jet pipe 20. As shown in fig. 16, the positive electrodes 21 and the jet pipes 20 are alternately arranged in a direction parallel to the traveling direction B of the substrate a. The positive electrode 21 is disposed on both sides of the substrate a. The blast pipes 20 are disposed on both sides of the substrate a. The positive electrode 21 has a plate shape, for example.

FIG. 17 is a schematic cross-sectional view taken along line XVII-XVII of FIG. 16. As shown in fig. 17, each of the pair of positive electrodes 21 is immersed in the plating solution 25. The pair of positive electrodes 21 are each electrically connected to a positive electrode of the power supply 9. One of the pair of positive electrodes 21 faces one surface of the base material a. The other of the pair of positive electrodes 21 faces the other surface of the base material a. The clamp 10 holds the substrate a so as to sandwich the upper end portion of the substrate a. The clamping tool 10 is electrically connected to the negative pole of the power supply 9. A voltage is applied to the substrate a via the clamping tool 10. A part of the clamping tool 10 is immersed in the plating solution 25.

FIG. 18 is a schematic sectional view taken along line XVIII-XVIII in FIG. 16. As shown in fig. 18, each of the pair of blast pipes 20 has a pipe portion 23 and a plurality of blast holes 24. The number of the spouting holes 24 formed in the 1 tube portion 23 is not particularly limited, and is, for example, 5 or more and 10 or less. A plurality of jet holes 24 formed in one of the pair of jet pipes 20 is opposed to one surface of the substrate a. A plurality of jet holes 24 formed in the other of the pair of jet pipes 20 are opposed to the other surface of the substrate a. The plating solution 25 is discharged from the plurality of discharge holes 24 toward the surface of the substrate a.

Next, the operational effects of the continuous plating apparatus 100 according to the present embodiment will be described.

If the tension of the base material A becomes large, the tensile stress of the base material A becomes large. Conversely, if the tension of the base material a becomes small, the tensile stress of the base material a becomes small. That is, if the tension of the base material a is different, the tensile stress of the base material a changes. If the fluctuation of the tensile stress of the base material a is large, the fluctuation of the quality of the plating film formed on the base material a also becomes large.

The continuous plating apparatus 100 according to the present embodiment includes the 1 st control unit 54, and the 1 st control unit 54 controls the feeding speed of the unwinding machine 4 based on the 1 st position information of the 1 st movable roller 33 detected by the 1 st position sensor 53. This enables the tension of the base material a to be controlled. As a result, the tensile stress of the base material a can be suppressed from changing greatly. Therefore, the variation in the quality of the plating film formed on the base material a can be reduced.

The continuous plating apparatus 100 according to the present embodiment may further include: a 1 st movable section 34 on which the 1 st movable roller 33 is placed; a 1 st wire 36 attached to the 1 st movable portion 34; and a 1 st weight 37 attached to the 1 st wire 36. This allows the 1 st movable roller 33 to be pulled with a constant force. As a result, when the tension of the base material a changes, the position of the 1 st movable roller 33 changes. By controlling the unwinding speed of the unwinding machine 4 based on the 1 st position information of the 1 st movable roller 33, the tension of the base material a can be controlled with high accuracy.

The continuous plating apparatus 100 according to the present embodiment may further include a 2 nd movable roller 43, a 2 nd position sensor 63, and a 2 nd control unit 64. The 2 nd movable roller 43 is disposed between the unwinder 4 and the plating zone 2 in the traveling direction of the substrate a, and rotates in accordance with the movement of the substrate a. The 2 nd position sensor 63 detects the position of the 2 nd movable roller 43. The 2 nd control unit 64 can control the winding speed of the winder 5 based on the 2 nd position information of the 2 nd movable roller 43 detected by the 2 nd position sensor 63. This enables the tension of the base material a to be controlled. As a result, it is possible to suppress the occurrence of cracks in the plating film formed on the base material a due to the base material a stretching caused by excessively increasing the tension of the base material a. Therefore, the quality of the plating film formed on the substrate a can be improved.

The continuous plating apparatus 100 according to the present embodiment may further include: a 2 nd movable portion 44 on which the 2 nd movable roller 43 is placed; a 2 nd wire 46 attached to the 2 nd movable portion 44; and a 2 nd weight portion 47 attached to the 2 nd wire 46. This allows the 2 nd movable roller 43 to be pulled with a constant force. As a result, when the tension of the base material a changes, the position of the 2 nd movable roller 43 changes. By controlling the winding speed of the winder 5 based on the 2 nd position information of the 2 nd movable roller 43, the tension of the base material a can be controlled with high accuracy.

The embodiments disclosed herein are illustrative in all respects and should not be construed as being restrictive. The scope of the present invention is defined by the claims of the present invention, rather than the description above, and includes all modifications equivalent in meaning and scope to the claims of the present invention.

Claims (5)

1. A continuous plating apparatus, comprising:

an unreeling machine that sends out the base material;

a plating region that plates the substrate;

a winder that collects the plated base material;

a 1 st movable roller that is disposed between the unreeling machine and the plating region in a traveling direction of the substrate and rotates in accordance with movement of the substrate;

a 1 st position sensor that detects a position of the 1 st movable roller; and

and a 1 st control unit that controls the unwinding speed of the unwinding machine based on the position information of the 1 st movable roller detected by the 1 st position sensor.

2. The continuous plating apparatus according to claim 1, wherein,

comprising:

a 1 st movable unit on which the 1 st movable roller is mounted;

a 1 st wire attached to the 1 st movable portion; and

and a 1 st weight portion attached to the 1 st wire.

3. The continuous plating apparatus according to claim 1 or 2, wherein,

comprising:

a 2 nd movable roller which is disposed between the unreeling machine and the plating region in a traveling direction of the substrate and rotates in accordance with movement of the substrate;

a 2 nd position sensor that detects a position of the 2 nd movable roller; and

and a 2 nd control unit that controls a winding speed of the winding machine based on the 2 nd position information of the 2 nd movable roller detected by the 2 nd position sensor.

4. The continuous plating apparatus according to claim 3, wherein,

comprising:

a 2 nd movable unit on which the 2 nd movable roller is mounted;

a 2 nd wire attached to the 2 nd movable portion; and

and a 2 nd weight portion attached to the 2 nd wire.

5. The continuous plating apparatus according to claim 1 or 2, wherein,

there is a clamping means for conveying the substrate in a state of holding the substrate in the plating region.

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