CN211317014U - Combined radiating fin device - Google Patents

Abstract

The utility model discloses a modular fin device, it includes the radiating seat, the radiating seat is provided with side board and top panel, side board setting is in the top panel both sides, a plurality of grooves have been seted up on the top panel, the groove link up the top panel setting, the top panel encloses with the side board and establishes and form the heat dissipation chamber, be provided with fin group in the heat dissipation chamber, the laminating of fin group sets up in the top panel below, fin group is provided with the substrate, the substrate passes through screw spare lock solid in the top panel below, the interval is provided with a plurality of heat radiation fins on the substrate, be provided with the connection piece between the heat radiation fins. The utility model discloses a set up the cross slot on the top panel of radiating seat, improve the radiating efficiency of top panel, the cooperation is fixed in the top panel below and is set up fin group, utilizes the screw spare to accomplish fin group and top panel's fixed, and the packaging efficiency of improving device utilizes radiating fin to carry out heat conduction with the heat that work substrate produced at last and disperses, has improved radiating efficiency greatly.

Description

Combined heat sink device

technical field

The utility model relates to the technical field of heat dissipation, in particular to a combined heat sink device.

Background technique

Heat dissipation fins are a common form of air-cooled heat dissipation. By setting heat dissipation fins in the heat dissipation device, the heat dissipation area can be increased, the thermal resistance of convection heat transfer can be reduced, and the overall heat dissipation capacity of the heat dissipation device can be enhanced.

In some application scenarios, the heat dissipation fins need to be arranged on the heat dissipation base, and the heat dissipation base is used to absorb heat and then dissipate through the heat dissipation fins. Affected by the inner cavity space or the external size of the heat sink, the processing difficulty is increased, which is not conducive to the improvement of the manufacturing efficiency of the heat sink.

Utility model content

Based on this, it is necessary to provide a combined heat sink device with convenient installation and good heat dissipation effect, aiming at the shortcomings of the prior art.

In order to solve the above technical problems, the technical scheme adopted by the present invention is: a combined heat sink device, which includes a heat sink, the heat sink is provided with a side panel and a top panel, and the side panel is arranged on two sides of the top panel. The top panel is provided with a plurality of through grooves, the through grooves are arranged through the top panel, the top panel and the side panel are surrounded to form a heat dissipation cavity, the heat dissipation cavity is provided with a heat dissipation fin group, and the heat dissipation The chip group is arranged under the top panel, the heat sink group is provided with a base sheet, the base sheet is locked under the top panel by screws, and a plurality of heat dissipation fins are arranged on the base sheet at intervals. A connecting piece is arranged between the fins.

In one embodiment, the inner side of the bottom end of the side panel is concavely provided with a snap groove.

In one embodiment, the top panel is provided with heat-conducting pipes, and the heat-conducting pipes are distributed in the top panel in a serpentine shape.

In one embodiment, both ends of the heat conducting pipe may protrude from the side surface of the top panel.

In one embodiment, the top panel is provided with a plurality of fixing holes between the through grooves, and the screw member is clamped in the fixing holes.

To sum up, the combined heat sink device of the present invention improves the heat dissipation efficiency of the top panel by opening a slot on the top panel of the heat dissipation base, and cooperates with a set of heat sinks to be fixedly arranged under the top panel, and uses screws to complete the heat sink set. Fixing with the top panel improves the assembly efficiency of the device, and finally uses the heat dissipation fins to conduct heat conduction and dissipate the heat generated by the working substrate, which greatly improves the heat dissipation efficiency.

Description of drawings

1 is a schematic structural diagram of a combined heat sink device of the present invention;

2 is a schematic structural diagram of another embodiment of the combined heat sink device of the present invention;

FIG. 3 is a top view of the structure of the combined heat sink device of the present invention.

Detailed ways

In order to further understand the features, technical means, and specific goals and functions achieved by the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

As shown in FIGS. 1 to 3 , the combined heat sink device of the present invention includes a heat sink 10 , the heat sink 10 is used to be fixed on a working substrate (not shown), and the heat sink 10 is provided with a side panel 11 and the top panel 12, the side panels 11 are arranged on both sides of the top panel 12, the bottom end of the side panel 11 is concavely provided with a slot 111, and both sides of the working substrate are respectively clamped in the slot 111, so as to facilitate Stable connection between the heat sink 10 and the working substrate.

In one embodiment, the top panel 12 is provided with a plurality of through grooves 121 , and the through grooves 121 can be disposed through the top panel 12 to ensure air convection and improve the heat dissipation performance of the top panel 12 .

The top panel 12 is provided with a plurality of fixing holes (not shown) between the through-slots 121 , the fixing holes hold the screws 13 , and the top panel 12 and the side panel 11 are surrounded to form a heat dissipation cavity 14 . , the heat dissipation cavity 14 is provided with a heat sink group 20, the heat sink group 20 is attached and arranged under the top panel 12, the heat sink group 20 is provided with a substrate 21, and the substrate 21 is provided with a screw member 13. It is locked under the top panel 12 and is easy to install; the substrate 21 is provided with a plurality of heat dissipation fins 22 at intervals, and the height of the heat dissipation fins 22 can be designed into different sizes according to actual needs, so that the heat dissipation fins 22 can be closer to the working substrate, effectively ensuring the heat dissipation efficiency of the working panel; specifically, the heat dissipation fins 22 can be adjusted according to the height of the heat dissipation device on the working substrate, so as not to affect the normal operation of the heat dissipation device on the working substrate. It can effectively dissipate heat and improve the service life of the working substrate.

A connecting piece 23 is arranged between the heat dissipation fins 22, and the connecting piece 23 is used to fit on the heat dissipation device, thereby increasing the contact area with the heat dissipation device, thereby absorbing the heat emitted by the heat dissipation device and dissipating heat through the heat dissipation device. The fins 22 are diffused so as to improve the heat dissipation efficiency of the heat sink group 20 .

In one of the embodiments, the top panel 12 is provided with heat pipes 30, the heat pipes 30 are distributed in the top panel 12 in a serpentine shape, and the heat transfer between different heat sinks 10 can be completed through the heat pipes 30, Thus, the utilization rate of the device is improved; specifically, both ends of the heat conduction pipe 30 can protrude from the side surface of the top panel 12 .

To sum up, the combined heat sink device of the present invention improves the heat dissipation efficiency of the top panel 12 by opening the through-grooves 121 on the top panel 12 of the heat dissipation base 10 . The screw 13 completes the fixing of the heat sink group 20 and the top panel 12 to improve the assembly efficiency of the device. Finally, the heat dissipation fins 22 are used to conduct heat conduction and dissipate the heat generated by the working substrate, which greatly improves the heat dissipation efficiency.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as limiting the scope of the present invention. It should be pointed out that for those of ordinary skill in the art, some modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the appended claims.

Claims (5)

1. A combined type cooling fin device is characterized in that: including the radiating seat, the radiating seat is provided with side board and top panel, the side board sets up in the top panel both sides, a plurality of grooves of wearing have been seted up on the top panel, wear the groove and link up the top panel setting, the top panel encloses with the side board and establishes and form the heat dissipation chamber, be provided with fin group in the heat dissipation chamber, fin group laminating sets up in the top panel below, fin group is provided with the substrate, the substrate passes through screw spare lock solid in the top panel below, the interval is provided with a plurality of heat radiation fins on the substrate, be provided with the connection piece between the heat radiation fin.

2. The modular heat sink device of claim 1, wherein: and a clamping groove is concavely arranged on the inner side of the bottom end of the side panel.

3. The modular heat sink device of claim 1 or 2, wherein: the heat conduction pipe is arranged in the top panel and distributed in the top panel in a snake shape.

4. The modular heat sink device of claim 3, wherein: two ends of the heat conducting pipe can protrude out from the side surface of the top panel.

5. The modular heat sink device of claim 1 or 2, wherein: the top panel is provided with a plurality of fixing holes between the through grooves, and the screw piece is clamped in the fixing holes.

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