CN204332939U - Press-Fit Dual Base Heat Sink - Google Patents

Abstract

The utility model discloses a press-fit type double base plate radiator. In the utility model, the press-fit double-substrate heat sink includes a plurality of heat dissipation units, and the heat dissipation unit includes two parallel heat conduction substrates and heat dissipation fins. The two sides of the heat conduction substrate are respectively provided with wedge-shaped latches and slots in staggered intervals. , the cooling fins are vertically arranged between the two heat-conducting substrates, the slots on the side of one cooling unit correspond to the teeth on the side of the other unit. The groove and the locking teeth are formed by mutual matching and interference pressing. The utility model solves the problems of bulky and heavy radiator equipment, uneven temperature distribution, low utilization rate of heat dissipation fins and low overall heat dissipation efficiency of the radiator.

Description

Press-Fit Dual Base Heat Sink

technical field

The utility model relates to a high-voltage frequency converter, in particular to a cooling device in the high-voltage frequency converter.

Background technique

High power, integration, and light weight are the development directions of high-voltage inverters in the future. As the core working device of the inverter, can the Insulated Gate Bipolar Transistor (IGBT) module be effectively maintained at the design temperature? Downstream operation has always been a very important link in product development and research. At present, single-plate aluminum heat sinks are commonly used in the market for heat dissipation of IGBT modules. In order to meet certain heat dissipation requirements, the required heat dissipation area is becoming larger and larger, occupying more space, and virtually increasing the volume and weight of the equipment; at the same time , due to the limited heat transfer capacity between the module and the heat-conducting substrate, the efficiency of the radiator fins is not high, and the high heat flow on one side of the heat-conducting substrate also reduces the reliability of the module.

That is to say, due to the single-plate aluminum heat sink currently used for heat dissipation of the IGBT module, since the IGBT module is installed on one side through the heat-conducting substrate, a large heat dissipation area is required to adapt to the high heat flow, which makes the heat sink equipment large and cumbersome. It is bulky, and the temperature distribution of the heat conduction substrate of the aluminum heat sink is uneven, and the utilization rate of the heat dissipation fins is not high. In addition, the contact between the heat dissipation fins and the heat conduction substrate will generate thermal resistance, resulting in more heat generation and reducing the overall heat dissipation efficiency of the heat sink.

Utility model content

The purpose of the utility model is to provide a press-fit double-substrate heat sink, so that the heat sink has the characteristics of small size, good thermal conductivity, and high heat dissipation efficiency.

In order to solve the above technical problems, the embodiment of the present utility model provides a press-fit double-substrate heat sink, which includes a plurality of integrally formed heat dissipation units.

A press-fit double-substrate heat sink, the press-fit double-base heat sink includes a plurality of heat dissipation units; the heat dissipation units include heat dissipation fins and two heat conduction substrates;

Wherein, the two heat conduction substrates are arranged in parallel; the heat dissipation fins are vertically arranged between the two heat conduction substrates arranged in parallel;

Both sides of the heat-conducting substrate are provided with wedge-shaped locking grooves, and the grooves on the side of one heat-conducting substrate correspond to the teeth on the side of the adjacent heat-conducting substrate;

The press-fit double-substrate heat sink is formed by a plurality of the heat dissipation units crossing each other through the slots and the teeth and press-fitting each other correspondingly and interferingly.

Compared with the prior art, the embodiment of the utility model is that the press-fit double-substrate heat sink is formed by interference pressing of a plurality of heat dissipation units, and each heat dissipation unit includes two heat conduction substrates arranged in parallel, and The heat dissipation fins arranged vertically to the heat conduction base plate make the entire press-fit double base plate radiator have the characteristics of small size, good heat conduction performance, and high heat dissipation efficiency.

In addition, the heat dissipation unit further includes a heat pipe; a heat pipe installation groove is arranged in the heat conduction substrate, and the heat pipe is embedded in the heat pipe installation groove. By embedding the heat pipe in the heat pipe installation groove in the heat conduction substrate, the contact thermal resistance generated when the heat dissipation unit is pressed laterally can be effectively reduced, the heat conduction capability between the module to be dissipated and the heat conduction substrate can be enhanced, and the efficiency of the heat dissipation fin can be improved.

Preferably, the embedding of the heat pipe and the heat pipe installation groove is welding embedding or heat-conducting silicone adhesive embedding, which ensures the close connection between the heat pipe and the heat pipe installation groove, thereby reducing its contact thermal resistance as much as possible.

In addition, the heat dissipation fins have a thickness smaller than that of the heat conduction substrate. This makes the whole device more stable and reliable, and is also more conducive to the uniform transfer of heat.

In addition, the front and back of the heat conduction substrate are equipped with module mounting holes for installing the modules to be dissipated, which allows the modules to be dissipated (such as IGBT modules) to be installed on both sides of the parallel heat conduction substrate to disperse the heat generated by the heat conduction substrate on one side. The flow rate is reduced, and the overall volume of the radiator is reduced, making the press-fit double-substrate radiator smaller in size and more compact in structure.

In addition, there are dovetail angles at the junction of both sides of the bottom of the card slot and the bottom surface, and the dovetail angles can keep the two sides of the assembly groove slightly deformed, making the assembly labor-saving and more firm.

Description of drawings

Fig. 1 is a schematic structural diagram of a heat dissipation unit according to a first embodiment of the present invention;

Fig. 2 is a schematic structural view of a press-fit double-substrate heat sink according to the first embodiment of the present invention;

Fig. 3 is a schematic diagram of a heat pipe embedded in a heat conducting substrate according to a second embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present utility model clearer, various implementation modes of the present utility model will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in each implementation manner of the present utility model, many technical details are proposed in order to enable readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

The first embodiment of the utility model relates to a press-fit double-substrate heat sink, which includes a plurality of heat dissipation units 1 as shown in FIG. 1 . The heat dissipation unit 1 is an integrally formed heat dissipation unit.

Specifically, the heat dissipation unit 1 includes heat dissipation fins 3 and two heat conduction substrates 2 . Wherein, between two heat-conducting substrates 2 arranged vertically and parallelly, the heat-dissipating fins 3 are arranged alternately on both sides of the heat-conducting substrate 2, and wedge-shaped latches 4 and slots 5 are respectively arranged at intervals. Specifically, the wedge-shaped latch slots extend longitudinally on Both sides of the thermally conductive substrate. The locking groove 5 on one side of the heat-conducting substrate and the locking teeth 4 on the side of the adjacent heat-conducting substrate are arranged corresponding to each other. In addition, dovetail corners 6 are provided at the junction between both sides of the bottom of the card slot 5 and the bottom surface of the card slot, as shown in FIG. 1 . Through the design of the dovetail angle, the two sides of the assembly groove can be slightly deformed, so that the assembly is labor-saving and more firm.

The press-fit double-substrate heat sink of this embodiment is formed by a plurality of heat dissipation units 1 being pressed together transversely through corresponding fit and interference between the slots and teeth, as shown in FIG. 2 . That is to say, a certain number of cooling units 1 form the entire radiator through lateral interference pressing, and the channels between two adjacent cooling fins 3 form air ducts for cooling air to flow through.

In addition, it should be noted that in this embodiment, the thickness of the cooling fins is smaller than that of the heat-conducting substrate, which makes the whole device more stable and reliable, and is also more conducive to the uniform transfer of heat.

The press-fit double-substrate heat sink of this embodiment is used in high-voltage frequency converters. The front and back sides of the heat-conducting substrate 2 are provided with module mounting holes for installing the modules to be dissipated. on substrate 2. In this way, the modules to be dissipated (such as IGBT modules) can be installed on both sides of the parallel heat-conducting substrate to disperse the high heat flow of the one-sided heat-conducting substrate, reduce the overall volume of the radiator, and make the press-fit double-substrate radiator smaller in size. The structure is more compact.

It is not difficult to find that the press-fit double-substrate heat sink of this embodiment is formed by interference pressing of a plurality of heat dissipation units, and each heat dissipation unit includes two heat-conducting substrates arranged in parallel, and vertically arranged with the heat-conducting substrate. The heat dissipation fins make the entire press-fit double-base heat sink have the characteristics of small size, good thermal conductivity, and high heat dissipation efficiency.

The second embodiment of the utility model relates to a press-fit double-substrate heat sink. The second embodiment is further improved on the basis of the first embodiment, and the main improvement is that: in this embodiment, the heat dissipation unit further includes a heat pipe.

Specifically, as shown in FIG. 3 , a heat pipe installation groove 8 is provided in the heat conduction substrate, and the heat pipe 7 is embedded in the heat pipe installation groove 8 . When using the press-fit double-substrate heat sink, the heat conduction substrate 2 absorbs the heat released when the heat dissipation module 9 (such as an IGBT module) is working, and the heat pipe 7 arranged in the heat conduction substrate 2 transfers the heat evenly and quickly to the entire heat conduction substrate 2. Through the forced air cooling effect of the fan, the heat is transferred out by convective heat exchange between the cooling fins 3 and the cold air, so as to achieve the effect of rapid cooling of the module 9 .

That is to say, in this embodiment, by embedding the heat pipe 7 in the heat pipe installation groove in the heat conduction substrate, the contact thermal resistance generated when the heat dissipation unit is laterally pressed can be effectively reduced, and the heat conduction between the module to be dissipated and the heat conduction substrate can be enhanced. ability to improve fin efficiency.

The third embodiment of the present utility model relates to a press-fit double-substrate heat sink. The third embodiment is further improved on the basis of the second embodiment, and the main improvement is that: in this embodiment, the way of embedding the heat pipe and the heat pipe installation groove is further limited.

In this embodiment, the fitting of the heat pipe and the heat pipe installation groove is welding fitting or heat-conducting silica gel bonding fitting. That is to say, when the heat pipe is embedded into the heat pipe installation groove, welding and heat-conducting silica gel bonding methods are used to ensure the close connection between the heat pipe and the heat pipe installation groove, thereby reducing its contact thermal resistance as much as possible.

Of course, in practical applications, other methods can also be used to realize the embedding of the heat pipe and the heat pipe installation groove, such as using heat sink adhesive, heating element adhesive, etc. to realize the embedding of the heat pipe and the heat pipe installation groove.

Those of ordinary skill in the art can understand that the above-mentioned embodiments are specific examples for realizing the utility model, and in practical applications, various changes can be made to it in form and details without departing from the utility model spirit and scope.

Claims (9)

1. A press-fit type double-base heat sink is characterized in that the press-fit double-base heat sink comprises a plurality of heat dissipation units; the heat dissipation unit comprises heat dissipation fins and two heat-conducting substrates; Wherein, the two heat conduction substrates are arranged in parallel; the heat dissipation fins are vertically arranged between the two heat conduction substrates arranged in parallel; Both sides of the heat-conducting substrate are provided with wedge-shaped locking grooves, and the grooves on the side of one heat-conducting substrate correspond to the teeth on the side of the adjacent heat-conducting substrate; The press-fit double-substrate heat sink is formed by a plurality of the heat dissipation units crossing each other through the slots and the teeth and press-fitting each other correspondingly and interferingly. 2. A press-fit double-substrate heat sink as claimed in claim 1, wherein the heat dissipation unit further comprises a heat pipe; A heat pipe installation groove is arranged in the heat conduction substrate, and the heat pipe is embedded in the heat pipe installation groove. 3 . The press-fit double-base heat sink according to claim 2 , wherein the heat pipe and the heat pipe installation groove are embedded by welding or thermally conductive silica gel. 4 . 4 . The press-fit double-substrate heat sink according to claim 1 , wherein the wedge-shaped locking groove extends longitudinally on both sides of the heat-conducting substrate. 5 . 5 . The press-fit double-substrate heat sink according to claim 1 , wherein the thickness of the heat dissipation fins is smaller than the thickness of the heat conduction substrate. 6 . 6 . The press-fit double-substrate heat sink according to claim 1 , wherein a dovetail corner is provided at the junction between both sides of the bottom of the slot and the bottom surface of the slot. 6 . 7. A press-fit double-substrate heat sink according to any one of claims 1 to 6, wherein the front and back sides of the heat-conducting substrate are provided with module installation holes for installing modules to be dissipated. 8 . The press-fit double-substrate radiator according to claim 7 , wherein the module to be dissipated is an insulated gate bipolar transistor (IGBT) module. 9 . The press-fit double-substrate heat sink according to claim 7 , wherein the heat dissipation unit is integrally formed. 10 .