CN204535494U - A kind of many pedestals position heat exchanger - Google Patents

Abstract

The utility model discloses a multi-base seat heat exchanger. The multi-base seat heat exchanger includes a plurality of base seats, a plurality of semiconductor cooling fins, several heat pipes and fin groups, and each base seat carries a semiconductor cooling fin. The heat pipes are connected in parallel to the plurality of semiconductor refrigeration fins to the fin group. The multi-base seat heat exchanger disclosed by the utility model is suitable for horizontal placement, has high heat dissipation efficiency, and the heat dissipation of the hot ends of the semiconductor refrigerating sheets does not affect each other.

Description

A multi-base seat heat exchanger

technical field

The utility model relates to a multi-base seat heat exchanger applied to semiconductor refrigeration and heat dissipation.

Background technique

For semiconductor refrigeration and heat dissipation, there are currently four common heat dissipation methods: air-cooled heat dissipation, water-cooled heat dissipation, heat pipe heat dissipation, and heat pipe and fan combination heat dissipation: air-cooled heat dissipation has low efficiency; water-cooled heat dissipation has high efficiency, but the structure is relatively complex and the volume is large; Heat pipe heat dissipation is energy-saving, environmentally friendly and simple in structure, but the heat dissipation efficiency needs to be improved; the heat dissipation efficiency of the combination of heat pipe and fan is greatly improved compared with heat pipe heat dissipation.

The heat pipe heat exchanger is mainly composed of a base attached to the hot end of the semiconductor cooling sheet, a heat conduction heat pipe for efficient heat transfer, and a fin for heat dissipation. The heat generated by the hot end of the semiconductor cooling sheet is absorbed through the heat pipe, and the The heat is transferred to the fins for dissipation. Existing semiconductor heat pipe heat exchangers are mainly divided into two types. The first form is a single-base heat exchanger corresponding to a single semiconductor cooling chip. As shown in Figure 1, this type of heat exchanger has a small heat transfer power and cannot meet the requirements. ; The second form: a long base heat exchanger, which can support the work of two semiconductor cooling fins, as shown in Figure 2, the advantage of this heat exchanger is that it can work for two or more semiconductor cooling fins at the same time , but the disadvantage is that the length of the heat source area of the heat pipe will be enlarged. In actual use, the temperature of the base will be too high. The heat pipe is affected by the effect of gravity. The base temperature rises.

Utility model content

The technical problem to be solved by the utility model is to provide a multi-base seat heat exchanger, which is suitable for horizontal placement, has high heat dissipation efficiency, and the heat dissipation at the hot end of the semiconductor refrigeration sheet does not affect each other.

In order to solve the above technical problems, the technical solution of the present invention is: a multi-base seat heat exchanger, the multi-base seat heat exchanger includes multiple base seats, multiple semiconductor cooling fins, several heat pipes and fin groups, Each base seat carries a semiconductor cooling fin, and the heat pipe connects the plurality of semiconductor cooling fins to the fin group in parallel.

As one of the specific implementation manners, the multi-base seat heat exchanger further includes a fan, and the fan is arranged in such a way that an airflow can flow through the set of fins.

As one of the specific implementation manners, the multi-base heat exchanger includes two base seats and two semiconducting cooling sheets.

As one of the specific implementation manners, the multi-base seat heat exchanger includes multiple bases, and each base is provided with a base seat.

As one of the specific implementation manners, the multi-base seat heat exchanger includes a base, and the base is provided with two base seats. Specifically, a heat insulation groove may be provided between the two base seats.

Specifically, it may be that each peltier is connected with three heat pipes.

Specifically, it may be that the contact surface of the heat pipe in thermal contact with the semiconductor refrigeration sheet is coated with thermal conductive silicon grease.

Specifically, it may be that the fin group is an aluminum fin group.

Specifically, it may be that the base seat is an aluminum base seat or a copper base seat.

Specifically, it may be that each fin of the fin group is in thermal contact with all heat pipes.

By adopting the above technical solutions, the utility model can at least achieve the following beneficial effects:

1. The heat exchanger of this utility model has a small heat source area of the heat pipe. When the overall structure is horizontally placed, it can better overcome the poor heat conduction effect of the heat pipe and the overheating of the base caused by the gravity effect of the heat pipe itself, so that the heat dissipation effect More preferably, long heat pipes can be used to achieve long-distance heat conduction in the horizontal direction.

2. The utility model heat exchanger is provided with a plurality of base seats, and each base seat carries a semiconductor cooling chip, and each semiconductor cooling chip is connected to a corresponding heat pipe, which solves the problem of mutual heat transfer between the semiconductor cooling chips through the base. question.

3. The heat exchanger of the utility model is suitable for a refrigeration system using multiple semiconductor refrigeration plates, which can increase the cooling power and improve the heat dissipation efficiency.

4. The heat exchanger of the utility model adopts a plurality of semiconductor cooling fins to share one fin group, which can ensure that multiple semiconductor cooling fins work at the same time or one semiconductor cooling fin works independently, and improve heat dissipation efficiency.

Description of drawings

Fig. 1 is a structural schematic diagram of a single base heat pipe heat exchanger;

Fig. 2 is a structural schematic diagram of a double base heat pipe heat exchanger;

Fig. 3 is a structural schematic diagram of the first form of the utility model heat exchanger;

Fig. 4 is a schematic structural diagram of the second form of the heat exchanger of the present invention.

1 is the fin group; 2 is the heat pipe; 3 is the base seat; 4 is the base; 5 is the heat insulation groove.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the utility model and implement it, but the examples given are not intended to limit the utility model.

The utility model discloses a multi-base seat heat exchanger. The multi-base seat heat exchanger includes a plurality of base seats 3, a plurality of semiconductor refrigeration sheets, several heat pipes 2 and fin groups 1, and each base seat 3 carries a For semiconductor cooling fins, the heat pipes 2 are connected in parallel to the plurality of semiconductor cooling fins and the fin group 1 .

As one of the specific implementation manners, the multi-base seat heat exchanger further includes a fan, and the fan is arranged in such a way that the airflow can flow through the fin set 1 .

As one of the specific implementations, the multi-base heat exchanger includes two bases 3 and two semiconducting cooling plates.

As one of the specific implementations, the multi-base seat heat exchanger includes a plurality of bases 4 , and each base 4 is provided with a base seat 3 .

As one of the specific implementations, the multi-base seat heat exchanger includes a base 4 provided with two base seats 3 . Specifically, a heat insulating groove 5 may be provided between the two base seats 3 .

Specifically, it may be that each peltier is connected with three heat pipes 2 .

Specifically, it may be that the contact surface of the heat pipe 2 in thermal contact with the peltier cooling sheet is coated with thermally conductive silicon grease.

Specifically, it may be that the fin group 1 is an aluminum fin group.

Specifically, it may be that the base seat 3 is an aluminum base seat or a copper base seat.

Specifically, it may be that each fin of the fin set 1 is in thermal contact with all the heat pipes 2 .

As a specific embodiment 1 of the present utility model, the multi-base seat heat exchanger shown in FIG. The multi-base seat heat exchanger also includes a base 4, on which a heat-insulating groove 5 is provided to separate the two base seats 3, relying on the large thermal resistance of the air to make the two base seats 3 The hot end heat dissipation of the semiconductor refrigerating sheet does not affect each other, and the two semiconductor refrigerating sheets are still connected on the same base 4, so the thinner the groove bottom thickness of the heat insulating groove 5 connecting the two base seats 3, the better. Each base seat 3 carries a semiconductor cooling chip, and each semiconductor cooling chip is connected with three heat pipes 2, the contact surface of the heat pipe 2 and the semiconductor cooling chip can be coated with thermal conductive silicon grease, and the six heat pipes 2 share a fin group 1 , each fin of the fin group 1 is in thermal contact with six heat pipes 2 .

As a specific embodiment 2 of the present invention, the multi-base heat exchanger shown in FIG. 4 mainly includes: a fin set 1 , six heat pipes 2 , two semiconductor cooling fins and two base seats 3 . The difference between Fig. 4 and the multi-base seat heat exchanger shown in Fig. 3 is that the heat exchanger shown in Fig. 4 includes two independent bases 4, and the two base seats 3 are respectively on two independent bases. 4, so that the semiconductor refrigeration chips on the two base seats 3 are not connected, and the two bases 4 are independent of each other, which more effectively avoids the problem of mutual heat transfer between the two bases 4 . Each base seat 3 carries a semiconductor cooling chip, and each semiconductor cooling chip is connected with three heat pipes 2, the contact surface of the heat pipe 2 and the semiconductor cooling chip can be coated with thermal conductive silicon grease, and the six heat pipes 2 share a fin group 1 , each fin of the fin group 1 is in thermal contact with six heat pipes 2 .

The multi-base seat heat exchanger described in the above embodiment 1 and embodiment 2 is provided with two base seats, and each base seat carries a conductive cooling sheet, so that the two semiconductor cooling sheets are separated from each other, solving the basic problem The heat transfer at the hot end of the seat affects the heat dissipation of the heat exchanger. Two peltier coolers can work at the same time or each peltier cooler works independently. When the two semiconductor cooling fins work at the same time, the heat pipe 2 respectively conducts the heat corresponding to the hot end of the semiconductor cooling fin to the fin group 1 for heat dissipation. When only one peltier is working, the fin group 1 is all used for heat dissipation. The hot ends of the two semiconductor cooling plates do not interfere with each other when exchanging heat, which improves the heat exchanging efficiency. Compared with the long-base heat exchanger shown in Figure 2, the heat source area of the heat pipes of the heat exchangers in Embodiment 1 and Embodiment 2 is reduced, and when the overall heat exchanger is in a horizontally placed structure, it can be better It overcomes the poor heat conduction effect of the heat pipe and the overheating of the base caused by the gravity effect of the heat pipe itself, so that the heat dissipation effect is better.

The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present utility model are all within the protection scope of the present utility model. The scope of protection of the utility model shall be determined by the claims.

Claims (10)

1. A multi-base heat exchanger, characterized in that the multi-base heat exchanger includes multiple bases (3), multiple semiconductor cooling fins, several heat pipes (2) and fin groups (1) Each base seat (3) carries a semiconductor cooling fin, and the heat pipe (2) connects the plurality of semiconductor cooling fins to the fin group (1) in parallel. 2. The multi-base seat heat exchanger according to claim 1, characterized in that the multi-base seat heat exchanger further comprises a fan, and the fan is arranged in such a way that the airflow can flow through the fin set (1) . 3. The multi-base seat heat exchanger according to claim 1, characterized in that, the multi-base seat heat exchanger comprises two base seats (3) and two semiconductor cooling plates. 4. The multi-base seat heat exchanger according to claim 1, characterized in that, the multi-base seat heat exchanger comprises a plurality of bases (4), and each base (4) is provided with a base seat (3) . 5. The multi-base seat heat exchanger according to claim 1, characterized in that, the multi-base seat heat exchanger comprises a base (4), and the base (4) is provided with two base seats (3) . 6. The multi-base seat heat exchanger according to claim 5, characterized in that a heat insulation groove (5) is provided between the two base seats (3). 7. The multi-base seat heat exchanger according to any one of claims 1-6, characterized in that each peltier is thermally connected to three heat pipes (2). 8. The multi-base seat heat exchanger according to claim 7, characterized in that, the contact surface of the heat pipe (2) in thermal contact with the semiconductor refrigeration sheet is coated with heat-conducting silicone grease. 9. The multi-base seat heat exchanger according to any one of claims 1-6, characterized in that the fin group (1) is an aluminum fin group. 10. The multi-base seat heat exchanger according to any one of claims 1-6, characterized in that the base seat (3) is an aluminum base seat or a copper base seat.