CN205537254U - Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator - Google Patents

Abstract

The utility model relates to a heat exchange device and a semiconductor refrigeration refrigerator with the heat exchange device. Specifically, the utility model provides a heat exchange device, which includes a first heat exchange part, the first heat exchange part has: two fin groups, each fin group has a plurality of fins arranged in parallel and spaced apart, and two sets of fins are arranged at intervals along the length direction of the fins; and an axial flow fan, the rotation axis of the axial flow fan is located between the two sets of fins, and the axial flow fan is placed on the two sets of fins, The airflow can be blown to the gap between every two adjacent fins in each fin group, or the airflow can be sucked in from the gap between every two adjacent fins in each fin group. In addition, the utility model also provides a semiconductor refrigeration refrigerator with the heat exchange device. The heat exchange device and the semiconductor refrigeration refrigerator of the utility model can reduce the volume of the heat exchange device because an axial flow fan is placed on two fin groups at the same time, and is especially suitable for the heat dissipation of the semiconductor refrigeration refrigerator.

Description

Heat exchange device and semiconductor refrigeration refrigerator with the heat exchange device

technical field

The utility model relates to freezing and refrigerating equipment, in particular to a heat exchanging device and a semiconductor refrigeration refrigerator with the heat exchanging device.

Background technique

Semiconductor refrigeration refrigerators, also known as thermoelectric refrigerators. It uses semiconductor refrigerating sheets to achieve cooling through heat pipe heat dissipation and conduction technology and automatic variable pressure and variable flow control technology. It does not require refrigerants and mechanical moving parts, and solves the application problems of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical vibration. However, the cold end of the semiconductor refrigeration chip will generate a large amount of heat at the hot end while cooling. In order to ensure the reliable and continuous operation of the semiconductor refrigeration chip, it is necessary to dissipate heat from the hot end in time. The heat dissipation of the hot end of the fin generally adopts the scheme of forced convection cooling of the heat sink by setting an axial flow fan to improve the heat exchange efficiency, but the heat dissipation fin itself is relatively large; in addition, an axial flow fan is installed on one side of the heat dissipation fin group The fan is used to blow airflow to the gap between every two adjacent fins, or suck airflow from the gap between every two adjacent fins. This kind of heat exchanger is relatively large in size and requires a large installation space, and is not suitable for installation in a small space. In addition, the heat dissipation of the hot end is usually achieved by increasing the speed and power of the fan, which has poor heat dissipation efficiency, high noise and high energy consumption.

Utility model content

One purpose of the present utility model is to overcome at least one defect of the existing heat exchange device, and provide a heat exchange device with a novel structure, which has a small volume and is especially suitable for heat dissipation of semiconductor refrigeration refrigerators.

A further object of the first aspect of the present invention is to minimize the noise of the heat exchange device.

An object of the second aspect of the present invention is to provide a semiconductor refrigeration refrigerator with the above-mentioned heat exchange device.

According to one aspect of the utility model, the utility model provides a heat exchange device for a semiconductor refrigeration refrigerator. The heat exchange device includes a first heat exchange part, and the first heat exchange part has:

Two fin groups, each of which has a plurality of parallel fins arranged at intervals, and the two fin groups are arranged at intervals along the length direction of the fins; and

An axial flow fan, the axis of rotation of the axial flow fan is located between the two sets of fins, and the axial flow fan is placed on the two sets of fins, so that each of the fins Airflow is blown from every gap between two adjacent fins in a group, or airflow is sucked in from the gap between every two adjacent fins in each said fin group.

Optionally, the heat exchange device further includes a second heat exchange part, which is arranged symmetrically with the first heat exchange part about a geometric plane.

Optionally, the heat exchange device also includes:

two heat conducting devices, each said heat conducting device is symmetrical about said geometric plane, and

The middle portion of each said heat conducting device is configured to absorb heat or cold from a heat source or a cold source;

A fin group of the first heat exchange part and a fin group of the second heat exchange part are arranged at both ends of the heat conduction device;

The other fin group of the first heat exchanging part and the other fin group of the second heat exchanging part are arranged at both ends of the other heat conducting device.

Optionally, each of the heat conduction devices includes:

a thermally conductive substrate having a heat exchange surface thermally connected to said heat source or sink; and

A plurality of heat conductors are arranged at intervals along the length direction of the fins, each of the heat conductors includes a middle heat conductor section fixed to the heat conduction substrate and two sides of the middle heat conductor section perpendicular to the The two ends of the geometric plane are straight heat conductor segments, and the two end straight heat conductor segments of each heat conductor respectively extend through the through-pipe hole of each fin installed thereon.

Optionally, the middle heat conductor section of each heat conductor includes: a central straight heat conductor section, and two connecting heat conductor sections respectively extending from both ends of the middle straight heat conductor section to both sides; and

In each of the heat conduction devices, a plurality of the middle straight heat conductor segments are in the same plane, a plurality of the end straight heat conductor segments are in the same plane, and every two adjacent middle straight heat conductor segments The distance between each two adjacent end straight heat conductor segments is less than the distance between each two adjacent end straight heat conductor segments, and the distance between the middle straight heat conductor segment and the heat exchange surface is smaller than the end straight heat conductor segment and the distance between heat transfer surfaces.

Optionally, each of the heat conductors is a heat pipe.

Optionally, the width of each fin is 1/7 to 3/7 of its length.

Optionally, the distance between the two fin groups of the first heat exchange part is smaller than the width of each fin.

According to the second aspect of the utility model, the utility model provides a semiconductor refrigerating refrigerator, including an inner container, a semiconductor refrigerating sheet, and an insulation layer arranged on the rear side of the inner container, in particular, it also includes:

a rear shell, which defines an installation space with the rear surface of the thermal insulation layer, and is provided with a first air inlet, and two first air outlets located on both sides of the first air inlet; and

In any one of the above heat exchange devices, the two fin sets and the axial flow fan of the first heat exchange part are installed in the installation space and between the two first air outlets; and

The two fin groups of the first heat exchange part are directly or indirectly thermally connected to the hot end of the semiconductor cooling fin;

The axial flow fan of the first heat exchange part is configured to encourage the air flow to enter the axial flow fan from the first air inlet, and then flow to the two fin sets of the first heat exchange part, so as to communicate with each The fins of the fin group perform heat exchange, and then flow out of the installation space through the two first air outlets.

Optionally, one of the first air outlets is arranged above the other first air outlet;

The rear shell is also provided with a second air inlet and two second air outlets, one of the second air outlets is arranged above the other second air outlet, and the second air inlet is arranged at two between the second air outlets; and

The two fin sets and the axial flow fan of the second heat exchange part of the heat exchange device are both installed in the installation space and between the two second air outlets; and

The two fin groups of the second heat exchange part are directly or indirectly thermally connected to the hot end of the semiconductor cooling fin;

The axial flow fan of the second heat exchange part is configured to encourage the air flow to enter the axial flow fan from the second air inlet, and then flow to the two fin sets of the second heat exchange part, so as to communicate with each The fins of the fin group perform heat exchange, and then flow out of the installation space through the two second air outlets.

The heat exchange device and the semiconductor refrigeration refrigerator of the utility model can reduce the volume of the heat exchange device because an axial fan is placed on two fin groups at the same time, and is especially suitable for the heat dissipation of the semiconductor refrigeration refrigerator. In addition, having two heat exchanging parts and each heat exchanging part having two fin groups can also increase the heat dissipation area of the heat exchanging device. Using one axial flow fan to make the airflow flow through the two fin groups at the same time can improve the utilization rate of the axial flow fan and reduce the noise of the heat exchange device.

According to the following detailed description of specific embodiments of the utility model in conjunction with the accompanying drawings, those skilled in the art will be more aware of the above and other objectives, advantages and features of the utility model.

Description of drawings

Some specific embodiments of the present utility model will be described in detail below in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the drawings designate the same or similar parts or parts. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the attached picture:

Fig. 1 is a schematic front view of a heat exchange device according to an embodiment of the present invention;

Fig. 2 is a schematic side view of a heat exchange device according to an embodiment of the present invention;

Fig. 3 is a schematic side view of a semiconductor refrigeration refrigerator according to an embodiment of the present invention;

Fig. 4 is a schematic rear view of a peltier refrigerator according to an embodiment of the present invention.

detailed description

Fig. 1 and Fig. 2 are respectively a schematic front view and a side view of a heat exchange device 600 according to an embodiment of the present invention. As shown in FIG. 1 and FIG. 2 , the embodiment of the present invention provides a heat exchange device 600 for a semiconductor refrigeration refrigerator, which may include a first heat exchange part 610 . The first heat exchange part 610 may have two fin sets 611 and an axial fan 612 . Each fin group 611 has a plurality of fins arranged in parallel at intervals, and is directly or indirectly thermally connected with the cold end/hot end of the semiconductor refrigeration sheet in the semiconductor refrigeration refrigerator, and the two fin groups 611 can be arranged along the fins. Length direction interval setting. The axis of rotation of the axial flow fan 612 is located between the two fin groups 611, and the axial flow fan 612 is placed on the two fin groups 611, so as to provide direction to each fin group between every two adjacent fins. Airflow is blown through the gaps, or airflow is sucked in from the gap between every two adjacent fins in each fin set, thereby taking away the cooling/heating from the fins. Two fin groups 611 share one axial flow fan 612, and the axial flow fan 612 is in a relatively special position, not only can make the volume of the heat exchange device 600 relatively small, but also can make full use of the axial flow fan 612, reducing the heat exchange device. noise. Preferably, the width of each fin is 1/7 to 3/7 of its length. The width of each fin group 611 is 1/3 to 2/3 of the length of each fin. The distance between the two fin groups 611 of the first heat exchange part 610 is smaller than the width of the fins.

In some embodiments of the present invention, as shown in FIG. 1 and FIG. 2 , the heat exchange device 600 may further include a second heat exchange portion 610 ′. The second heat exchange part 610' may also have two fin sets 611 and an axial flow fan 612, and be symmetrically arranged with the first heat exchange part 610 about a geometric plane, so as to further improve heat exchange efficiency.

In some implementations of this embodiment, the heat exchange device 600 further includes two heat conduction devices 630, each heat conduction device 630 is symmetrical with respect to the above-mentioned geometric plane, and the middle part of each heat conduction device 630 is configured to absorb heat from a heat source or a cold source or cold. A fin group 611 of the first heat exchange part 610 and a fin group 611 of the second heat exchange part 610' are arranged at both ends of a heat conduction device 630; the other fin group 611 of the first heat exchange part 610 and Another fin set 611 of the second heat exchange portion 610 ′ is disposed at two ends of another heat conducting device 630 . That is to say, the heat exchange device 600 can absorb heat or cold from two heat sources at the same time, and each heat exchange device 600 can transfer heat or cold from a corresponding heat source or cold source to the first heat exchange part 610 One fin set 611 and one fin set 611 of the second heat exchange part 610'.

Specifically, each heat conducting device 630 includes a heat conducting substrate 631 and a plurality of heat conducting bodies 632 . The heat conduction substrate 631 has a heat exchange surface thermally connected with a heat source or a heat sink. A plurality of heat conductors 632 may be arranged at intervals along the length direction of the fins. Moreover, each heat conductor 632 can be a heat pipe, including a central heat conductor section fixed to the heat conduction substrate 631 and two end straight heat conductor sections located on both sides of the middle heat conductor section and perpendicular to the geometric plane. The middle heat conductor section of each heat conductor 632 includes: a central straight heat conductor section, and two connecting heat conductor sections respectively extending from both ends of the central straight heat conductor section to both sides. The two ends of each heat conductor 632 extend straight through the through-pipe hole of each fin installed thereon.

Preferably, in each heat conduction device 630, a plurality of middle straight heat conductor segments are in the same plane, a plurality of end straight heat conductor segments are in the same plane, and every two adjacent middle straight heat conductor segments The distance is less than the distance between every two adjacent end straight heat conductor segments, and the distance between multiple middle straight heat conductor segments and the heat exchange surface is smaller than the distance between multiple end straight heat conductor segments and the heat exchange surface . With this arrangement, the heat exchange device 600 can have a special structure, which facilitates the installation of the heat exchange device 600 in a semiconductor refrigeration refrigerator.

The fixed connection method between the middle straight heat conductor section and the heat conduction substrate 631 can be as follows: the heat conduction substrate 631 has only one bottom plate, and a plurality of accommodation grooves are opened on the side opposite to the heat exchange surface; Embedded in the receiving groove by pressure riveting, the connection is reliable and the thermal resistance is low in this way. The fixed connection method between the straight heat conductor section in the middle and the heat conduction substrate 631 can also be: the heat conduction substrate 631 can have a bottom plate and a cover plate, and a plurality of accommodation grooves are provided on the side of the bottom plate opposite to the heat exchange surface; The straight heat conductor section is embedded into the receiving groove by pressure riveting; the cover plate is installed on the side of the heat conduction substrate 631 opposite to the heat exchange surface, so as to sandwich the middle straight heat conductor sections of the plurality of heat conductors 632 with the bottom plate.

In some alternative implementations, each heat conduction device 630 may be a strip-shaped heat conduction plate, and the middle part of one side thereof is a heat exchange surface. Four fin sets 611 are respectively arranged at two ends of the two heat conducting plates, and the fins of each fin set 611 extend from the other side of the heat conducting plate. The heat conducting plate can be a plate heat pipe. In other alternative embodiments, the two fin sets 611 of the first heat exchange part 610 can be installed on one heat conduction device 630, and the two fin sets 611 of the second heat exchange part 610' can be installed on the other. on the heat conduction device 630 . Specifically, each heat conduction device 630 may include a heat conduction substrate 631 and a plurality of U-shaped heat conduction heat pipes. The middle part of each U-shaped heat conduction heat pipe can be thermally connected to the hot end of the semiconducting cooling plate through the heat conduction substrate 631 . A fin group 611 is installed at both ends of each U-shaped heat pipe.

Further, the embodiment of the present utility model also provides a semiconductor refrigeration refrigerator using the above-mentioned heat exchange device 600, and Fig. 3 and Fig. 4 are schematic side views and rear views of the semiconductor refrigeration refrigerator according to an embodiment of the present utility model, respectively. . As shown in FIG. 3 to FIG. 4 , the semiconductor refrigeration refrigerator of this embodiment may include a semiconductor module 100 , an inner tank 200 , an outer shell, a door 300 and an insulation layer 400 . A storage space is defined in the liner 200 . There are generally two structures for the casing of semiconductor refrigeration refrigerators. One is the assembled type, that is, the top cover, the left and right side panels, the rear shell 510, the lower bottom panel, etc. are assembled into a complete cabinet. The other is an integral type, that is, the top cover and the left and right side plates are rolled into an inverted "U" shape as required, which is called a U shell, and then spot welded with the rear shell 510 and the lower bottom plate to form a box body. The semiconductor refrigeration refrigerator in the embodiment of the utility model preferably uses an integral shell, that is, the shell includes a U shell and a rear shell 510 . The rear shell 510 can define an installation space with the rear surface of the thermal insulation layer 400 on the rear side of the liner 200, and the rear shell 510 is provided with a first air inlet and two first air outlets on both sides of the first air inlet. .

In this embodiment, the semiconductor module 100 of the semiconductor refrigeration refrigerator may include a semiconductor refrigeration chip, a cold-end heat exchange device, and a hot-end heat exchange device. Mounting holes are provided on the rear wall of the inner container 200 and the insulation layer 400 on the rear side of the inner container 200 . The heat exchange device at the cold end may include a cooling block, a cooling base plate, a plurality of cooling fins formed on the cooling base plate, and a cooling fan for forced convection cooling. The cold conduction block and the semiconductor refrigeration sheet are installed in the installation hole, and the rear surface of the cold conduction block is in thermal contact with the cold end surface of the semiconductor refrigeration sheet.

The heat exchange device at the hot end can be the heat exchange device 600 in any of the above-mentioned embodiments, and the two fin sets 611 and the axial flow fan 612 of the first heat exchange part 610 are installed in the installation space and are located between the two first between the air outlets. Moreover, the two fin groups 611 of the first heat exchanging portion 610 are directly or indirectly thermally connected to the hot end of the semiconductor cooling fin. The axial flow fan 612 of the first heat exchange part 610 is configured to promote the air flow from the first air inlet into the axial flow fan 612, and then flow to the two fin groups 611 of the first heat exchange part 610, so as to communicate with each fin group The fins of 611 perform heat exchange, and then flow out of the installation space from the two first air outlets.

In order to improve heat exchange efficiency, the heat exchange device 600 further includes a second heat exchange portion 610'. One first air outlet is arranged above the other first air outlet. The rear shell 510 is also provided with a second air inlet and two second air outlets, one second air outlet is arranged above the other second air outlet, and the second air inlet is arranged between the two second air outlets. The first air inlet is at the same height as the second air inlet, and the first air outlet is at the same height as the second air outlet. The two fin sets 611 and the axial fan 612 of the second heat exchange part 610 ′ of the heat exchange device 600 are both installed in the installation space and between the two second air outlets. Moreover, the two fin groups 611 of the second heat exchange part 610' are directly or indirectly thermally connected to the hot end of the semiconductor cooling fin; After entering the axial flow fan 612, it flows to the two fin groups of the second heat exchange part to exchange heat with the fins of each fin group, and then flows out of the installation space through the two second air outlets.

In this embodiment, there may be two semiconductor modules 100 arranged at intervals along the vertical direction to improve cooling efficiency. The heat exchange device 600 may further include two heat conduction devices 630 . The heat exchange surface of the heat conduction substrate 631 of each heat conduction device 630 is in contact with the hot end of a peltier, so as to transfer the heat of each peltier to the first heat exchange part 610 and the second heat exchange part 610' .

So far, those skilled in the art should recognize that although a number of exemplary embodiments of the present invention have been shown and described in detail herein, they can still be used according to the present invention without departing from the spirit and scope of the present invention. Many other variations or modifications that conform to the principles of the utility model are directly determined or derived from the disclosed content of the new model. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims (10)

1. the heat-exchanger rig for semiconductor freezer, it is characterised in that include the first heat exchanging part, institute State the first heat exchanging part to have:

Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and said two Fins set is spaced setting along the length direction of described fin；With

One axial flow blower, the rotation axis of described axial flow blower is between two described fins set, and institute State axial flow blower to be placed in said two fins set, with each two adjacent fins in each described fins set Between gap blow flow, or gap between each two adjacent fins sucks gas from each described fins set Stream.

Heat-exchanger rig the most according to claim 1, it is characterised in that also include:

Second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.

Heat-exchanger rig the most according to claim 2, it is characterised in that also include:

Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and

The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver；

One fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at one The two ends of individual described heat-transfer device；

Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at separately The two ends of heat-transfer device described in.

Heat-exchanger rig the most according to claim 3, it is characterised in that each described heat-transfer device includes:

Heat-conducting substrate, has heat-transfer surface hot linked with described thermal source or low-temperature receiver；With

Many heat carriers, the length direction along described fin is spaced, and every described heat carrier includes fixing In described heat-conducting substrate middle part heat carrier section and be positioned at heat carrier section both sides, described middle part, be perpendicular to described Two end straight heat carrier sections of geometrical plane, two end straight heat carrier sections of every described heat carrier are respectively Extend through the poling hole of each fin being mounted thereon.

Heat-exchanger rig the most according to claim 4, it is characterised in that

The middle part heat carrier section of every described heat carrier includes: middle part straight heat carrier section, and respectively from described Two connection heat carrier sections that the two ends of the straight heat carrier section in middle part extend to both sides；And

In each described heat-transfer device, multiple described middle parts straight heat carrier section is in same plane, multiple Described end straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two Distance between the end straight heat carrier section that distance is adjacent less than each two, described middle part straight heat carrier section and institute State the distance between heat-transfer surface less than the distance between described end straight heat carrier section and described heat-transfer surface.

Heat-exchanger rig the most according to claim 4, it is characterised in that

Every described heat carrier is heat pipe.

Heat-exchanger rig the most according to claim 1, it is characterised in that

The width of each described fin is the 1/7 to 3/7 of its length.

Heat-exchanger rig the most according to claim 1, it is characterised in that

Distance between two fins set of described first heat exchanging part is less than the width of each described fin.

9. a semiconductor freezer, including inner bag, semiconductor chilling plate be arranged on rear side of described inner bag Heat-insulation layer, it is characterised in that also include:

Back cover, it defines installing space with the rear surface of described heat-insulation layer, and offers the first air intake on it Mouthful, and it is positioned at two the first air outlets of described first air inlet both sides；With

Heat-exchanger rig according to any one of claim 1 to 8, two fins of its first heat exchanging part Group and axial flow blower are mounted in described installing space and are between two described first air outlets；And

Two fins set of described first heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly Thermally coupled；

The axial flow blower of described first heat exchanging part is configured to promote air-flow to enter described from described first air inlet In axial flow blower, after flow to two fins set of described first heat exchanging part, with the wing with each described fins set Sheet carries out heat exchange, after from two described first air outlets flow out described installing spaces.

Semiconductor freezer the most according to claim 9, it is characterised in that

One described first air outlet is arranged at the top of another described first air outlet；

The second air inlet and two the second air outlets, described second air outlet it is further opened with on described back cover Being arranged at the top of another described second air outlet, described second air inlet is arranged at two described second air-out Between Kou；And

Two fins set of the second heat exchanging part of described heat-exchanger rig and axial flow blower are mounted on described installation In space and be between two described second air outlets；And

Two fins set of described second heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly Thermally coupled；

The axial flow blower of described second heat exchanging part is configured to promote air-flow to enter described from described second air inlet In axial flow blower, after flow to two fins set of described second heat exchanging part, with the wing with each described fins set Sheet carries out heat exchange, after from two described second air outlets flow out described installing spaces.