CN207731920U - memory cooling unit - Google Patents

Abstract

The utility model provides a memory heat dissipation unit contains: a body; the body is provided with a first part, a second part and a connecting part, two ends of the connecting part are connected with the first part and the second part, the first part and the second part are respectively provided with at least one first heated part and at least one second heated part, the first heated part and the second heated part are correspondingly contacted with at least one wafer for heat conduction, and the body is manufactured by stamping, so that the heat exchange and heat dissipation of the memory body are realized, the structure of the body is rapidly formed, and the manufacturing cost is saved.

Description

memory cooling unit

technical field

The utility model relates to a memory (or called: memory) heat dissipation unit, in particular to a memory heat dissipation unit used for memory heat dissipation

Background technique

With the faster calculation and processing speed required by electronic equipment, high-performance processing chips must be selected relative to the set central processing unit and memory. When a high-performance processing chip is running, it will generate high temperatures, which can easily cause When the chip generates heat or burns, etc., it is necessary to install a heat dissipation unit or a memory heat dissipation unit that is sufficient to dissipate heat for the chip, so as to prevent heat shock and chip damage.

For the heat dissipation of the memory chip, the general industry adopts a single-piece aluminum or copper sheet, and a piece is installed on the left and right sides of the memory to directly attach and absorb the heat generated by the memory chip, and then the The sheet body radiates heat to the outside, and the two corresponding sheets usually need to be equipped with other components or parts such as glue, locking elements or clamping units, so that they can be glued or screwed or penetrated or clamped. It is fixedly combined with the memory, but when there are a plurality of memory chips and the set space is narrow, and these memories need to be closely arranged, it is impossible to additionally reserve the aforementioned heat sink body for the memory. Radiation heat dissipation. Moreover, since the single-chip corresponding to the clip-type heat sink needs to go through multiple installation procedures to fix it on the memory, it is extremely inconvenient to use.

And another Taiwan patent M300870 case discloses a memory cooling clip. Its side is viewed as a ㄇ-shaped long clip body, which is formed by connecting the inwardly inclined surfaces on both sides with the top surface. The top surface is curved. The width is approximately equal to the width of the memory, and the two inner inclined surfaces gradually reduce the width downward. After this, when the heat dissipation clip is clamped on the memory, one of the inner inclined surfaces will be in close contact with the surface of the chip on the memory, and the heat generated by the chip will be dissipated quickly, and another industry will think that the case disclosed is shown in Figure 12 As shown, a situation in which a heat dissipation clip 9 with a turning surface is used to clamp a memory card 8 is disclosed. The front and back sides of the memory card 8 each have a number of wafers 80 . The heat dissipation clip 9 includes a top surface 91 , two inner surfaces 90 and two vertical sections 93 parallel to each other. The two vertical sections 93 respectively extend from two sides of the top surface 91 and are connected to the two inner inclined surfaces 92 . In addition, the two vertical sections 93 are connected to the two inwardly inclined surfaces 92 by means of a connecting section 94 respectively. The connecting section 94 is extended from the vertical section 93 and first tilts outwards and then connects with the inwardly inclined surfaces 92. The distance D1 between the sections 93 is equal to the thickness W of the memory card 8, and the maximum distance D3 between the two connecting sections 94 is greater than the distance D1 between the two vertical sections 93 (i.e. the thickness W of the memory card 8). ), and the distance between the upper section H1 of the two inner inclined surfaces 92 is partly larger than the thickness W of the memory card 8 and partly equal to the thickness W of the memory card. The two vertical sections 93, the two connecting sections 94 and the upper section H1 of the two inwardly inclined surfaces 92 cannot provide clamping force for the entire cooling clip 9, which makes the cooling clip 9 only rely on the two internally inclined surfaces 92 The lower section H2 part of the lower part, that is, the part where the distance between the two inner inclined surfaces 92 is smaller than the thickness W of the memory card 8, clamps the memory card 8, and the other parts of the cooling clip 9 are completely unable to memory the memory card 8. The card 8 plays any clamping role, which makes the heat dissipation clip 9 not clamp the memory card 8, resulting in poor heat dissipation.

Furthermore, since the heat dissipation clip 9 is first bent outwards through the two connecting sections 94 and then connected to the two inwardly inclined surfaces 92 to be bent inward, the design and manufacture of the heat dissipation clip 9 weaving mold will be relatively difficult. , such a heat dissipation clip with a special shape is also difficult to manufacture through automatic processing.

Another industry has proposed a patented technology, China Taiwan Invention Patent Certificate No. I509391, which is mainly aimed at improving the lack of the aforementioned existing technology.

China Taiwan Invention Patent Certificate No. I509391 mainly discloses a memory device 1 and its cooling clip 5. As shown in FIG. Side panels 53. The two side panels 53 face each other and extend downwards from two opposite sides of the top panel 51 . Each side panel 53 includes a top section 531 , an inward section 533 and a chamfer 535 . The two top sections 531 respectively extend from two opposite side edges of the top plate 51 and are inclined inward. The two inward sections 533 respectively extend from the bottom edges of the two top sections 531 and continue to incline inward. The two chamfers 535 respectively extend from the bottom edges of the two inward sections 533 and are inclined outward. The heat dissipation clip 5 tightly clamps the memory card 10 by means of the two side plates 53 , so that the chips 100 of the memory card 10 can achieve the purpose of heat dissipation. The above-mentioned two existing cases mainly conduct heat conduction by using the two incline sections 533 to clamp the wafer 100 of the memory card 10 inwardly by means of heat dissipation clips, and the inclination sections 533 are designed to be inclined rather than parallel, so When the wafer 100 of the memory card 10 is clamped, gaps are likely to be generated, and it cannot be effectively and completely compliantly clamped to cause thermal resistance. Although this structure is simple and easy to install, this structure has clamping force. In the selection of solid materials, if the ductility is not good or the material does not have elastic deformation, it is not suitable.

Therefore, how to improve the memory heat dissipation unit of the memory or the design improvement of the heat dissipation unit is the primary improvement goal of the people in the current art.

Utility model content

Thus, in order to solve the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to provide a memory cooling unit for heat dissipation of memory.

In order to achieve the above purpose, the utility model provides a memory cooling unit, which is characterized by comprising:

A body has a first part, a second part and a connecting part, the two ends of the connecting part are connected to the first part and the second part, and the first part and the second part respectively have at least one first heating part and at least one A second heat receiving part, the first heat receiving part and the second heat receiving part are correspondingly in contact with at least one chip for heat conduction.

The memory cooling unit, wherein: the first part, the second part and the connecting part respectively have a first included angle and a second included angle, and the first included angle and the second included angle are less than or equals 90 degrees.

The memory cooling unit, wherein: the first part has a first outer surface and a first inner surface, the first heat receiving part is recessed from the first inner surface to the first outer surface, and the The second part has a second outer surface and a second inner surface, and the second heat receiving part is recessed from the second inner surface to the second outer surface.

The memory cooling unit, wherein: the first part has a first outer surface and a first inner surface, the first heat receiving part is recessed from the first outer surface to the first inner surface, and the first The second part has a second outer surface and a second inner surface, and the second heat receiving part is recessed from the second outer surface to the second inner surface.

The memory heat dissipation unit, wherein: the first part has a first outer surface and a first inner surface, and the first heat receiving part opens a hole on the first outer surface, and the hole runs through the first part and connect the first outer surface and the first inner surface, the second part has a second outer surface and a second inner surface, and the second heat receiving part opens a hole on the second outer surface, and the hole It runs through the second part and connects the second outer surface and the second inner surface.

The memory cooling unit, wherein: the first part and the second part have a plurality of first heat receiving parts and second heat receiving parts, and the plurality of first heat receiving parts are arranged at intervals, and a first solid top is arranged on two first The heat receiving parts are occasionally arranged on the outside of the first and last first heat receiving parts, the first fixing part has a first through hole, the plurality of second heat receiving parts are arranged at intervals, and a second fixing part is arranged The heat receiving part is occasionally arranged outside the first and last second heat receiving parts, and the second fixing part has a second through hole.

The memory heat dissipation unit, wherein: the body has a first heat fransfer element and a second heat fransfer element, and the first heat fransfer element and the second heat fransfer element pass through the first fixing part, the second The first through hole and the second through hole of the fixed part, the first heat fransfer element and the second heat fransfer element are far away from the first fixed part, and one end of the second fixed part is connected to a heat dissipation unit, and the heat dissipation unit is a fin group Or any of the radiators or water blocks.

The memory cooling unit, wherein: the first part and the second part have a plurality of first heat receiving parts and second heat receiving parts, and the plurality of first heat receiving parts are arranged at intervals, and a first air hole is arranged in two first Between the heat receiving parts or outside the first heat receiving parts, the plurality of second heat receiving parts are arranged at intervals, and a second air hole is arranged between two second heat receiving parts or outside the second heat receiving parts.

The memory cooling unit, wherein: the surface of the main body has any one of a plurality of pits or holes or fins or fin columns or rough surfaces.

The memory cooling unit, wherein: there is a first bending part between the first part and the first heat receiving part, and there is a second bending part between the second part and the second heat receiving part, so The first bending part and the second bending part are bent outward.

The memory heat dissipation unit, wherein: the other end of the first heat receiving portion relative to the first bending portion has a third bent portion, and the second heat receiving portion is opposite to the second bending portion The other end has a fourth bending portion, the third bending portion and the fourth bending portion extend and bend outward, and the first bending portion and the third bending portion form a first bending portion on the first outer surface. A clamping space and a second clamping space formed by the second bending portion and the fourth bending portion on the second outer surface can be combined with a heat conduction unit.

The memory heat dissipation unit, wherein: the other end of the first heat receiving portion relative to the first bending portion has a third bent portion, and the second heat receiving portion is opposite to the second bending portion The other end has a fourth bending portion, and the third bending portion and the fourth bending portion extend and bend inward.

A memory cooling unit is characterized in that it comprises:

A body, which has a first part, a second part and a connecting part, the two ends of the connecting part are connected to the first part and the second part, and a first heating part is arranged on any one of the first part and the second part, The first heat receiving part is in contact with at least one chip to conduct heat conduction.

In the memory cooling unit, wherein: the first part has a first outer surface and a first inner surface, and the first heat receiving part is recessed from the first inner surface to the first outer surface.

The memory cooling unit, wherein: the first part, the second part and the connecting part respectively have a first included angle and a second included angle, and the first included angle and the second included angle are less than or equals 90 degrees.

In the memory cooling unit, wherein: the first part has a first outer surface and a first inner surface, and the first heat receiving portion is recessed from the first outer surface to the first inner surface.

The memory heat dissipation unit, wherein: the first part has a first outer surface and a first inner surface, and the first heat receiving part opens a hole on the first outer surface, and the hole runs through the first part And connect the first outer surface and the first inner surface.

The memory cooling unit, wherein: the aforementioned first part has a plurality of first heat-receiving parts, the plurality of first heat-receiving parts are arranged at intervals, and a first solid top is arranged between the two first heat-receiving parts or is arranged at the first and the most On the outer side of the last first heat receiving part, the first fixing part has a first through hole.

The memory cooling unit, wherein: the body has a first heat fransfer element, the first heat fransfer element passes through the first through hole of the first fixing part, and the first heat fransfer element is far away from the first One end of the fixing part is connected to a heat dissipation unit, and the heat dissipation unit is any one of a fin group, a radiator or a water cooling head.

The memory cooling unit, wherein: the first part has a plurality of first heat receiving parts, the plurality of first heat receiving parts are arranged at intervals, and a first air hole is provided between the two first heat receiving parts or outside the first heat receiving parts place.

The memory cooling unit, wherein: the surface of the main body has any one of a plurality of pits or holes or fins or fin columns or rough surfaces.

In the memory cooling unit, there is a first bent portion between the first portion and the first heat receiving portion, and the first bent portion is bent outward.

The memory heat dissipation unit, wherein: the other end of the first heat-receiving portion relative to the first bending portion has a third bending portion, and the third bending portion faces either outward or inward. Extending and bending, a first clamping space formed by the first bending portion and the third bending portion on the first outer surface can be combined with a heat conduction unit.

Through the memory heat dissipation unit of the utility model, the lack of the existing memory heat dissipation unit can be improved, and at the same time, a fast-manufacturing and cost-saving memory heat dissipation unit can be provided.

Description of drawings

Fig. 1 is a three-dimensional combined sectional view of the first embodiment of the memory cooling unit of the present invention;

Fig. 1a is a three-dimensional combined cross-sectional view of another aspect of the first embodiment of the memory cooling unit of the present invention;

Fig. 2 is another implementation pattern diagram of the first embodiment of the memory cooling unit of the present invention;

Fig. 2a is another implementation view of the first embodiment of the memory cooling unit of the present invention;

Fig. 3 is a three-dimensional combined sectional view of the second embodiment of the memory cooling unit of the present invention;

Fig. 3a is a three-dimensional combined cross-sectional view of another aspect of the second embodiment of the memory cooling unit of the present invention;

Fig. 4 is a three-dimensional combined sectional view of the third embodiment of the memory cooling unit of the present invention;

Fig. 4a is a three-dimensional combined cross-sectional view of another aspect of the third embodiment of the memory cooling unit of the present invention;

Fig. 5 is another three-dimensional combined sectional view of the third embodiment of the memory cooling unit of the present invention;

Fig. 5a is another three-dimensional combined sectional view of the third embodiment of the memory cooling unit of the present invention;

Fig. 5b is another three-dimensional combined sectional view of the third embodiment of the memory cooling unit of the present invention;

Fig. 5c is another three-dimensional combined sectional view of the third embodiment of the memory cooling unit of the present invention;

Fig. 6 is a three-dimensional combined sectional view of the fourth embodiment of the memory cooling unit of the present invention;

Fig. 6a is another three-dimensional combined sectional view of the fourth embodiment of the memory cooling unit of the present invention;

Fig. 7 is another three-dimensional combined sectional view of the fourth embodiment of the memory cooling unit of the present invention;

Fig. 7a is another three-dimensional combined cross-sectional view of the fourth embodiment of the memory cooling unit of the present invention;

Fig. 8 is a perspective cross-sectional view of the fifth embodiment of the memory cooling unit of the present invention;

Fig. 8a is a perspective cross-sectional view of the fifth embodiment of the memory cooling unit of the present invention;

Fig. 9a is an exploded perspective view of the sixth embodiment of the memory cooling unit of the present invention;

Fig. 9b is an exploded perspective view of the sixth embodiment of the memory cooling unit of the present invention;

Fig. 10a is a perspective cross-sectional view of the seventh embodiment of the memory cooling unit of the present invention;

Fig. 10b is another perspective sectional view of the seventh embodiment of the memory cooling unit of the present invention;

Fig. 10c is another perspective sectional view of the seventh embodiment of the memory cooling unit of the present invention;

Fig. 10d is another perspective sectional view of the seventh embodiment of the memory cooling unit of the present invention;

Fig. 10e is another perspective sectional view of the seventh embodiment of the memory cooling unit of the present invention;

Fig. 10f is another perspective sectional view of the seventh embodiment of the memory cooling unit of the present invention;

Fig. 11 is a three-dimensional assembly diagram of the eighth embodiment of the memory cooling unit of the present invention;

Fig. 12 is a schematic diagram of an existing memory cooling unit;

FIG. 13 is a schematic diagram of a conventional memory cooling unit.

Explanation of reference numerals: first heat fransfer element a; second heat fransfer element b; body 1; first part 11; first bent portion 11a; third bent portion 11b; first heat receiving portion 111; first flange part 1111; the first extension part 1112; the first angle 112; the first outer surface 113; the first inner surface 114; Second heat receiving part 121; second flange part 1211; second extension part 1212; second bending part 12a; fourth bending part 12b; second included angle 122; second outer surface 123; second inner surface 124; The second fixing part 126; the second through hole 127; the second air hole 128; the connection part 13; the heat dissipation fin 131; the recessed part 132; ; top plate 51; side plate 53; top section 531; inward section 533; guide angle 535; heat conduction unit 6; 92 ; vertical segment 93 ; connecting segment 94 ; distance D1 ; thickness W; distance D3 ; upper segment H1 ; lower segment H2 ; memory card 10 ; chip 100 .

Detailed ways

Please refer to Fig. 1, Fig. 1a, Fig. 2, and Fig. 2a, which are the three-dimensional combination cross-sectional view of the first embodiment of the memory heat dissipation unit of the present invention and another embodiment diagram, as shown in the figure, the memory heat dissipation unit , including: a body 1;

The body 1 has a first part 11, a second part 12 and a connecting part 13, the two ends of the connecting part 13 are connected to the first part, the second part 11, 12, the first part, the second part 11, 12 respectively have at least one first heat receiving portion 111 and at least one second heat receiving portion 121 , and the first and second heat receiving portions 111 and 121 are correspondingly in contact with at least one chip 31 of memory 3 for heat exchange.

There is a first included angle 112 and a second included angle 122 between the first part, the second part 11, 12 and the connecting part 13 respectively, and the first included angle and the second included angle 112, 122 are less than or equal to 90° Spend.

The first part 11 has a first outer surface 113 and a first inner surface 114, the first heat receiving part 111 is recessed from the first inner surface 114 to the first outer surface 113, and the second part 12 It has a second outer surface 123 and a second inner surface 124, the second heat receiving part 121 is recessed from the second inner surface 124 to the second outer surface 123, and the first and second outer surfaces 113, 123 It is convex.

The main memory cooling unit of the present utility model is used for heat dissipation with a memory 3, the first inner surface 114 and the second inner surface 124 are in contact with the outer surface of the memory 3, especially the first, The two heat receiving parts 111, 121 are correspondingly combined with the plurality of wafers 31 protruding from the outside of the memory 3. In this embodiment, the first and second heat receiving parts 111, 121 are correspondingly covered on the outer surfaces of the wafers 31 for heat exchange. .

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 1a.

The first and second heat receiving parts 111 and 121 of this embodiment can be directly attached to a first heat fransfer element a and a second first heat fransfer element b for heat exchange, and the first and second heat fransfer elements Components a and b can be combined with the body 1 by gluing or welding, and can also be clamped and fixed with the body 1 by a ㄇ-shaped clamp 4 (as shown in FIG. 2 ).

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this form, the first heat receiving part 111 is provided in the first part 11, and It is directly attached to the corresponding first heat fransfer element a for heat exchange as an illustrative implementation, as shown in Figure 2a.

Please refer to Fig. 3 and Fig. 3a, which are three-dimensional combined cross-sectional views of the second embodiment of the memory cooling unit of the present invention. As shown in the figure, the difference between this embodiment and the aforementioned first embodiment is that the first part 11 has a first An outer surface 113 and a first inner surface 114, the first heat receiving part 111 is recessed from the first outer surface 113 to the first inner surface 114, and the second part 12 has a second outer surface 123 and a The second inner surface 124, the second heat receiving part 121 is recessed from the second outer surface 123 to the second inner surface 124, that is, the first and second heat receiving parts 111 and 121 in this embodiment are formed by the first and second heat receiving parts. The two inner surfaces 114 , 124 protrude against the outer surfaces of the wafers 31 of the memory 3 for heat exchange and heat dissipation.

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 3a.

Please refer to Fig. 4, Fig. 4a, Fig. 5, Fig. 5a, Fig. 5b, and Fig. 5c, which are combined cross-sectional views of the third embodiment of the memory cooling unit of the present invention. As shown in the figure, this embodiment is the same as the aforementioned first embodiment The difference is that the first and second heat receiving parts 111 and 121 in this embodiment are in the form of a hole, and the aforementioned hole (namely the first heat receiving part 111) penetrates the first part 11 and connects the first outer surface and the first inner surface 113, 114, and the hole (i.e. the second heat receiving part 121) runs through the second part 12 and connects the second outer and inner surfaces 123, 124, so that the first and second heat receiving parts 111, 121 are provided for the corresponding memory 3 outside The wafer 31 on the surface protrudes outward from the first and second heat receiving parts 111 and 121 and exposes to the outside of the main body 1 for radiation and heat dissipation.

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 4a.

A first flange part 1111 and a second flange part 1211 can be protruded outwards from the periphery of the first and second heat receiving parts 111 and 121, and the first and second flange parts 1111 and 1211 can be directly connected to the The outer peripheral edges of these wafers 31 are in contact with heat conduction, and the heat generated by the wafers 31 is transferred to the main body 1 for heat exchange (as shown in FIG. 5 ).

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part and the second part 11, 12. In this form, the first heat receiving part 111 is arranged on the first part 11 as An illustrative implementation is shown in Figure 5a.

The aforementioned first and second flange portions 1111, 1211 may also extend vertically to one or two of them, a first extension portion 1112 and a second extension portion 1212 (as shown in FIG. 5b ), and the first and second extension portions Parts 1112, 1212 are attached to the partial surface of the exposed portion of the chip 31, and the chips 31 can also be directly in contact with at least one first heat fransfer element a and one second heat fransfer element b for heat exchange .

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 5c.

Please refer to Fig. 6, Fig. 6a, Fig. 7 and Fig. 7a, which are the three-dimensional combination diagrams of the fourth embodiment of the memory cooling unit of the present invention. As shown in the figure, the difference between this embodiment and the aforementioned first embodiment lies in the plurality of first A heat receiving part 111 is arranged at intervals, and there is a first fixing part 116 between the two first heating parts 111, or the first fixing part 116 is arranged on the outside of the first and last first heating part 111 or other Any position is not restricted.

The first fixing part 116 has a first through hole 117, the second heating parts 121 are arranged at intervals, and there is a second fixing part 126 between the two second heating parts 121, or the second fixing part 126 The second fixing part 126 has a second through hole 127, which is arranged on the outside of the first and last second heat receiving part 121 or any other position. This embodiment has a first heat fransfer element a and a second heat transfer element a. The heat transfer element b, the first and second heat transfer elements a, b pass through the first and second through holes 117, 127 of the first and second fixing parts 111, 121, the first and second heat transfer elements a, b The pipe body is in contact with the first and second heat receiving parts 111 and 121 to conduct heat conduction, and the ends of the first and second heat transfer elements a and b away from the first and second fixing parts 116 and 126 are connected to a heat dissipation unit 7 , the heat dissipation unit 7 is any one of a fin group, a radiator, a water cooling head, or a heat exchange device. This embodiment is implemented with a radiator as an illustration and is not limited thereto.

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 6a and Figure 7a.

At least one side of the first and second heat fransfer elements a and b described in this embodiment is a flat side that can directly contact the first and second heat receiving parts 111 and 121 for heat exchange. The appearance of b, such as D-type, flat tube, flat-plate heat pipe, etc., has its flat surface and can be directly attached to the chip 31 of the memory memory 3 directly.

Please refer to Fig. 8 and Fig. 8a, which are perspective cross-sectional views of the fifth embodiment of the memory cooling unit of the present invention. parts 111, 121, the plurality of first heat receiving parts 111 are arranged at intervals, and a first air hole 118 is arranged between the two first heat receiving parts 111 or at a position other than the first heat receiving parts 111, and these second heat receiving parts 121 Arranged at intervals, a second vent hole 128 is disposed between the two second heat receiving parts 121 or outside the second heat receiving parts 121, the first and second vent holes 118, 128 can increase the flow efficiency of heat dissipation airflow.

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 8a.

Please refer to Fig. 9a and Fig. 9b, which are perspective exploded views of the sixth embodiment of the memory cooling unit of the present invention. Structures (such as pits or protrusions) with protrusions or depressions (such as by bead peening) on the entire or local area, or breaches or perforations or perforations (such as by stamping) on the surface or increased surface roughness ( Sandblasting or setting a plurality of heat dissipation fins or fin structures (such as milling, stamping, etc.), this embodiment is to set a plurality of heat dissipation fins 131 on the surface of the connecting part 13 of the body 1 as an illustrative example and does not refer to To limit this, another embodiment of this embodiment is to form a plurality of gradual concave and convex shapes on the first and second outer surfaces 113, 123 of the body 1, so that the external structure added in this embodiment can increase the body size. The heat dissipation area of the outer surface of 1 radiates heat to improve the overall heat dissipation efficiency, and can also rely on the above-mentioned concave and convex shapes to form an appearance shape to endow it with beautiful and aesthetic design.

Please refer to Fig. 10a, Fig. 10b, Fig. 10c, Fig. 10d, Fig. 10e, Fig. 10f, which are three-dimensional combined cross-sectional views of the seventh embodiment of the memory cooling unit of the present invention, and the partial structure of this embodiment is the same as that of the first to sixth embodiments The example is the same, so it will not be repeated here. The structural technical features of this embodiment are applicable in conjunction with the aforementioned first to sixth embodiments. The connection between the second part 12 and the connecting portion 13 has a second bending portion 12a, the first and second bending portions 11a, 12a are bent outward, and the first and second bending portions 11a, 12a can be The inward clamping force of the first part and the second part 11, 12 is increased, but the first part and the second part 11, 12 are still kept parallel to each other, as shown in Fig. 10a.

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 10b.

Referring again to Fig. 10c, it is another modification of this embodiment. The difference between this modification and the aforementioned Fig. 10a is that the first heat receiving part 111 has a first Three bent portions 11b, the second heat receiving portion 121 has a fourth bent portion 12b at the other end of the second bent portion 12a, and the third and fourth bent portions 11b, 12b extend and bend outwards , the connecting portion 13 has a concave bending portion 132, the concave portion 132 can provide an elastic deformation space to facilitate the elastic deformation of the body 1, this variation consists of the first bending portion and the third bending portion A first clamping space 11c formed by 11a, 11b on the first outer surface 113 and a second clamping space 12c formed by the second and fourth bending portions 12a, 12b on the second outer surface 123 can be combined with A heat conduction unit 6 is combined, and the heat conduction unit 6 is a heat pipe or a vapor chamber or a metal heat conductor or a water-cooling jacket, and any one of them is penetrated and clamped, and the heat conduction unit 6 generates the wafer 31 The heat is conducted to the remote end to dissipate heat. In this embodiment, the heat pipe is used as an illustration and the embodiment is not limited thereto.

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 10d.

Referring again to Fig. 10e, it is another variation of this embodiment. The difference between this variation and the aforementioned Fig. 10b is that the third and fourth bending parts 11b, 12b extend and bend inwards to increase The effect of clamping the wafer 31 .

Yet another implementation form of this embodiment is that the aforementioned first heat receiving part 111 is provided only in any one of the first part, the second part 11, and 12. In this case, the first heat receiving part 111 is provided in the first part 11 as an illustration. The implementation is shown in Figure 10f.

This embodiment is suitable for being combined with any one of the foregoing first to sixth embodiments, and is not limited to any one of the foregoing embodiments.

Please refer to FIG. 11 , which is a three-dimensional combined cross-sectional view of the eighth embodiment of the memory cooling unit of the present invention. As shown in the figure, the difference between this embodiment and the aforementioned fifth embodiment lies in the first and second fixing parts 116 of this embodiment , 126 are set corresponding to the first and second fixing parts 116, 126 of the other body 1, that is, the first fixing part 116 set on the first part 11 of one body 1 is set on the second part 12 of the other body 1 The second fixing part 126 is arranged horizontally correspondingly, and the first through hole 117 and the second through hole 127 are also connected horizontally correspondingly, so that a first heat fransfer element a passes through the first and second through holes 117, 127 connects two adjacent bodies 1 in series, and the two sides of the first heat fransfer element a can simultaneously conduct heat absorbed by the two bodies 1 for heat conduction.

Refer to the first and second inner surfaces 114, 124 of the first and second heat-receiving parts 111, 121 in the first to eighth embodiments that are in contact with the wafer 31. not shown), to increase the tighter fit between the chip 31 and the first and second heat receiving parts 111 and 121 to prevent the occurrence of thermal resistance, and directly expose the first and second heat receiving parts 111 and 121 or the chip in each embodiment The place can be directly in contact with the heat conduction unit 6 for heat conduction or heat exchange. The heat conduction unit 6 is any one of a heat pipe or a vapor chamber or a metal heat conductor or a water cooling jacket or a water cooling head. The implementation is shown by way of illustration but not limitation.

The utility model mainly solves the problem that the existing technology cannot be installed in a narrow space. In addition, the prior art cannot be completely attached to the chip 3 to absorb the heat source for heat exchange when the clamping method and the memory assembly 3 are installed, and the clamping force is too large and damaged. Chips etc. are missing, the utility model mainly keeps the first and second heat receiving parts 111, 121 set in the first part and the second part 11, 12 and the corresponding memory 3's chip 31 to keep parallel and completely bonded to the memory chip, improving the present There is a problem that the heat dissipation element of the memory cannot be fully attached to the chip, resulting in poor heat exchange efficiency, and the simple structure provided by the utility model can improve the heat dissipation performance of the memory chip, prevent overheating, and increase the service life of the memory.

Claims (23)

1. a kind of memory body heat-sink unit, it is characterized in that comprising：

One ontology has a first part, a second part and an interconnecting piece, aforementioned first of the interconnecting piece both ends connection Dividing, second part, the first part, second part are respectively provided at least one first heated parts and at least one second heated parts, First heated parts, the second heated parts are corresponded to carries out heat transfer with an at least contact wafers.

2. memory body heat-sink unit according to claim 1, it is characterised in that：The first part, second part with should One first angle and one second angle are respectively provided between interconnecting piece, first angle, the second angle are less than or equal to 90 degree.

3. memory body heat-sink unit according to claim 1, it is characterised in that：The first part has one first appearance Face and one first inner surface, first heated parts are arranged from first inner surface to first outer surface depressions, and described second Part has one second outer surface and one second inner surface, and second heated parts are from second inner surface to second outer surface Recess setting.

4. memory body heat-sink unit according to claim 1, it is characterised in that：The first part has one first appearance Face and one first inner surface, first heated parts are recessed towards first inner surface by first appearance and are arranged, and described second Part has one second outer surface and one second inner surface, and second heated parts are by second appearance towards second inner surface Recess setting.

5. memory body heat-sink unit according to claim 1, it is characterised in that：The first part has one first appearance Face and one first inner surface, first heated parts are to open up a hole in first outer surface, which runs through this first Divide and connect first outer surface, the first inner surface, the second part has one second outer surface and one second inner surface, institute It is to open up a hole in second outer surface to state the second heated parts, and the hole is through the second part and connects second appearance Face, the second inner surface.

6. memory body heat-sink unit according to claim 1, it is characterised in that：Aforementioned first part, second part have Plural first heated parts, the second heated parts, first heated parts of plural number are alternatively arranged setting, and one first solid top is set to two-by-two Between first heated parts or it is set to the outsides of most first and most end the first heated parts, which has one first perforation, Second heated parts of plural number are alternatively arranged setting, one second fixed part be set between the second heated parts two-by-two or be set to it is most first and The outside of second heated parts of most end, second fixed part have one second perforation.

7. memory body heat-sink unit according to claim 6, it is characterised in that：The ontology has one first thermal transmission element And one second thermal transmission element, first thermal transmission element, the second thermal transmission element are through aforementioned first fixed part, the second fixed part First perforation, the second perforation, first thermal transmission element, the second thermal transmission element are far from first fixed part, the second fixed part One end connects a heat-sink unit, and the heat-sink unit is fins group or radiator or water-cooling head any of which.

8. memory body heat-sink unit according to claim 1, it is characterised in that：Aforementioned first part, second part have Plural first heated parts, the second heated parts, first heated parts of plural number are alternatively arranged setting, and one first venthole is set to two-by-two Between first heated parts or outside of the first heated parts, which is alternatively arranged setting, and one second venthole is set It is placed between the second heated parts two-by-two or outside of the second heated parts.

9. memory body heat-sink unit according to claim 1, it is characterised in that：The body surface has plural pit or broken Hole or fin or fin column or rough surface any of which.

10. memory body heat-sink unit according to claim 1, it is characterised in that：The first part is first heated with this There is one first bending part between portion, there is one second bending part, described first is curved between the second part and second heated parts Folding part, the second bending part outward bending.

11. memory body heat-sink unit according to claim 10, it is characterised in that：First heated parts are relative to aforementioned The other end of first bending part has a third bending part, the other end of second heated parts relative to aforementioned second bending part With one the 4th bending part, the third bending part, the 4th bending part extend outwardly bending, first bending part, third bending Portion forms one first grasping part and second bending part, the 4th bending part in the second outer surface institute in first outer surface One second grasping part formed can be combined with a heat-conducting unit.

12. memory body heat-sink unit according to claim 10, it is characterised in that：First heated parts are relative to aforementioned The other end of first bending part has a third bending part, the other end of second heated parts relative to aforementioned second bending part With one the 4th bending part, the third bending part, the 4th bending part extend internally bending.

13. a kind of memory body heat-sink unit, it is characterized in that comprising：

One ontology has a first part, a second part and an interconnecting piece, aforementioned first of the interconnecting piece both ends connection Point, second part, one first heated parts are set to aforementioned first part, second part any of which, first heated parts with An at least contact wafers carry out heat transfer.

14. memory body heat-sink unit according to claim 13, it is characterised in that：The first part has outside one first Surface and one first inner surface, first heated parts are arranged from first inner surface to first outer surface depressions.

15. memory body heat-sink unit according to claim 13, it is characterised in that：The first part, second part with One first angle and one second angle are respectively provided between the interconnecting piece, first angle, the second angle are less than or equal to 90 degree.

16. memory body heat-sink unit according to claim 13, it is characterised in that：The first part has outside one first Surface and one first inner surface, first heated parts are recessed towards first inner surface by first appearance and are arranged.

17. memory body heat-sink unit according to claim 13, it is characterised in that：The first part has outside one first Surface and one first inner surface, first heated parts are to open up a hole in first outer surface, the hole through this first Part simultaneously connects first outer surface, the first inner surface.

18. memory body heat-sink unit according to claim 13, it is characterised in that：Aforementioned first part has plural number first Heated parts, first heated parts of plural number are alternatively arranged setting, and one first solid top is set between the two two the first heated parts or is arranged In the outside of most first and most end the first heated parts, which has one first perforation.

19. memory body heat-sink unit according to claim 18, it is characterised in that：There is the ontology one first heat to pass member Part, for first thermal transmission element through the first perforation of aforementioned first fixed part, first thermal transmission element is first solid far from this The one end for determining portion connects a heat-sink unit, and the heat-sink unit is fins group or radiator or water-cooling head any of which.

20. memory body heat-sink unit according to claim 13, it is characterised in that：Aforementioned first part has plural number first Heated parts, first heated parts of plural number are alternatively arranged setting, and one first venthole is set between the two two the first heated parts or first Outside of heated parts.

21. memory body heat-sink unit according to claim 13, it is characterised in that：The body surface have plural pit or Holes or fin or fin column or rough surface any of which.

22. memory body heat-sink unit according to claim 13, it is characterised in that：The first part is first heated with this There is one first bending part, the first bending part outward bending between portion.

23. memory body heat-sink unit according to claim 22, it is characterised in that：First heated parts are relative to aforementioned The other end of first bending part has a third bending part, and inwardly or outwardly any of which extends bending to the third bending part, First bending part, third bending part is formed by one first grasping part in first outer surface can be with a heat transmission unit It is combined.