CN110749123A - Radiators and refrigeration equipment - Google Patents

Abstract

The application relates to the technical field of heat dissipation of refrigeration equipment, and discloses a radiator, including: a heat conductive substrate; a heat-dissipating substrate; the radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space; the heat pipe comprises a heat conduction pipe part embedded in the heat conduction substrate and a heat dissipation pipe part embedded in the heat dissipation substrate. According to the radiator provided by the embodiment of the disclosure, the radiating fin group is provided with the notch, the notch forms the accommodating space, the accommodating space can be used for accommodating the fan, heat among the fins can be dissipated in time, and the radiating effect of the hot-end radiator is improved. The application also discloses a refrigeration device.

Description

Radiators and refrigeration equipment

technical field

The present application relates to the technical field of heat dissipation of refrigeration equipment, such as radiators and refrigeration equipment.

Background technique

At present, with the development of semiconductor refrigeration technology, semiconductor refrigeration equipment using semiconductor refrigeration chips for refrigeration is widely used. The semiconductor refrigeration chip includes a cold end that releases cold energy and a hot end that releases heat, wherein the cold end releases the cold energy into the cooling space of the refrigeration equipment through the cold end radiator, and the hot end releases the heat to the outside through the hot end radiator .

In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art: the heat dissipation effect of the existing hot-end radiator is not good, which affects the cooling capacity of the semiconductor refrigeration equipment.

SUMMARY OF THE INVENTION

In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended to be an extensive review, nor to identify key/critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

Embodiments of the present disclosure provide a radiator and a cooling device to solve the technical problem of poor heat dissipation effect of the hot-end radiator.

In some embodiments, the heat sink includes: a heat-conducting substrate; a heat-dissipating substrate; a heat-dissipating fin group, which is disposed on the heat-dissipating substrate and is provided with a gap forming a accommodating space; a heat pipe, including a heat-conducting pipe embedded in the heat-conducting substrate part, and a heat dissipation pipe part embedded in the heat dissipation substrate.

In some embodiments, the refrigeration device includes the aforementioned heat sink.

The radiator and refrigeration equipment provided by the embodiments of the present disclosure can achieve the following technical effects:

At present, the method of arranging a fan on the surface of the hot-end radiator is often used to dissipate the heat of the hot-end radiator of the semiconductor refrigeration equipment. However, when the fan is set on the fin, the wind generated by the rotation of the fan can only dissipate the heat around the fan. For dissipation, the heat generated between the fins cannot be dissipated, which affects the heat dissipation effect of the heat sink at the hot end.

In the heat sink provided by the embodiment of the present disclosure, the heat dissipation fin group has a gap, and the gap forms an accommodation space. The accommodation space can be used to accommodate a fan, and the heat between the fins can be dissipated in time, thereby improving the heat dissipation effect of the hot end radiator.

The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.

Description of drawings

One or more embodiments are exemplified by the accompanying drawings, which are not intended to limit the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings do not constitute a limitation of scale, and in which:

FIG. 1 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;

FIG. 2 is another schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;

3 is another schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;

4 is a schematic structural diagram of a fan support provided by an embodiment of the present disclosure;

FIG. 5 is another schematic structural diagram of a fan bracket provided by an embodiment of the present disclosure;

FIG. 6 is another schematic structural diagram of a fan bracket provided by an embodiment of the present disclosure;

FIG. 7 is another schematic structural diagram of a fan bracket provided by an embodiment of the present disclosure;

FIG. 8 is another schematic structural diagram of a fan bracket provided by an embodiment of the present disclosure;

FIG. 9 is another schematic structural diagram of a heat sink provided by an embodiment of the present disclosure.

Reference number:

11: first heat-conducting substrate; 12: second heat-conducting substrate; 21: first heat-dissipating substrate; 22: second heat-dissipating substrate; 211: first heat-dissipating fin group; 221: second heat-dissipating fin group; 31: first accommodating space; 32: second accommodating space; 33: third accommodating space; 4: fan bracket; 41: flat plate; 411: first penetration part; 412: second penetration part; 413: third penetration part; 421: first penetration part a wind deflector; 422: the second wind deflector; 423: the third wind deflector; 424: the fourth wind deflector; 431: the first reinforcing plate; 432: the second reinforcing plate; 433: the third reinforcing plate; 434: the fourth reinforcing plate; 44: the fixing slot; 51: the first fan; 52: the second fan; 53: the third fan; 61: the first heat pipe group; 62: the second heat pipe group.

Detailed ways

In order to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings, which are for reference only and are not intended to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, numerous details are provided to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

Herein, the terms "first," "second," etc. are only used to distinguish one element from another, and do not require or imply any actual relationship or order between the elements. In fact the first element can also be called the second element and vice versa. Furthermore, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a structure, device or device comprising a list of elements includes not only those elements, but also others not expressly listed elements, or elements inherent to such structures, devices, or equipment. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the structure, apparatus or device that includes the element. The various embodiments herein are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and it is sufficient to refer to each other for the same and similar parts between the various embodiments.

An embodiment of the present disclosure provides a heat sink, including: a heat-conducting substrate; a heat-dissipating substrate; a heat-dissipating fin group, which is disposed on the heat-dissipating substrate and is provided with a notch for forming an accommodating space; a heat pipe, including a heat-conducting pipe portion embedded in the heat-conducting substrate, and Fitted into the heat dissipation pipe part of the heat dissipation substrate.

It can be understood that the thermally conductive substrate may be a substrate that is in direct contact with the hot-end semiconductor chip of the semiconductor refrigeration equipment. The heat-conducting substrate is in direct contact with the hot-end semiconductor chip that releases heat. Through the contact heat conduction, the heat released by the hot-end semiconductor chip is transferred to the heat-conducting substrate, and the heat sink including the heat-conducting substrate dissipates the heat.

Optionally, a fin group is arranged on the thermally conductive substrate, and the fin group arranged on the thermally conductive substrate is defined as an intermediate fin group. Optionally, the middle fin set includes two or more fins. The connection between the fins in the middle fin group and the heat-conducting substrate may be fixed connection, for example, the fins in the middle fin group are welded on the heat-conducting substrate. Optionally, the thickness of a single fin in the middle fin group may be 0.8-1.3 mm, such as 1 mm, and the fins in the middle fin group may be aluminum sheets or inflation plates. When the fins in the middle fins are inflation plates, the inflation plates are filled with a phase-change working medium, such as a refrigerant, to improve the heat dissipation effect of the fins in the middle fin group.

As shown in FIG. 1 , the heat pipe includes a heat pipe part embedded in the heat conduction substrate, and a heat pipe part embedded in the heat dissipation base plate.

The heat pipe part and the heat pipe part here are for naming different parts of the heat pipe, and the function of the heat pipe is not limited. Optionally, the heat-conducting pipe portion and the heat-dissipating pipe portion of the heat pipe communicate with each other. The heat dissipation pipe part of the heat pipe is embedded in the heat dissipation base plate, and the heat is transferred to the heat dissipation base plate, and the heat dissipation is further dissipated through the heat dissipation base plate and the fins in the heat dissipation fin group on the heat dissipation base plate.

Optionally, the shape of the thermally conductive substrate may be a hexahedron, including a first surface, a second surface opposite to the first surface, a third surface located between the first surface and the second surface and in direct contact with the hot-end semiconductor chip, The fourth face opposite the third face, the remaining fifth face and the sixth face opposite the fifth face, such as a cuboid. Optionally, the fins in the middle fin group are connected to the fourth surface of the thermally conductive substrate. Optionally, the areas of the third surface and the fourth surface are larger than the areas of the first surface and the second surface, which increases the contact area with the hot-end semiconductor chip and improves the thermal conductivity of the thermally conductive substrate.

The heat-dissipating fin group is arranged on the heat-dissipating base plate, and is provided with a notch for forming an accommodating space.

The heat dissipation fin group includes two or more heat dissipation fins. Optionally, the area of a single heat dissipation fin in the heat dissipation fin group is larger than the area of the fins in the middle fin group. Optionally, the thickness of the fins in the heat dissipation fin group is smaller than the thickness of the fins in the middle fin group. Optionally, the thickness of the fins in the heat dissipation fin group is 0.3-0.6 mm, such as 0.5 mm.

As shown in FIG. 1 , the heat dissipating fin set is provided with a notch that forms an accommodating space. Optionally, the heat dissipation fin group includes N heat dissipation fins, and the gap is formed by the adjacent M heat dissipation fins, that is, the adjacent M heat dissipation fins have missing surfaces, such as concave surfaces, and the adjacent M heat dissipation fins have a missing surface, such as a concave surface. The missing surface of the heat dissipation fin forms a gap, wherein N is greater than M, and M is greater than 2. Optionally, the heat dissipation fin group includes N heat dissipation fins, and the gap is formed by the N heat dissipation fins, that is, the N heat dissipation fins in the heat dissipation fin group have missing surfaces, such as concave surfaces, and the N heat dissipation fins. The missing face forms a notch, where N is greater than 3.

The notch forms an accommodation space. The accommodating space can be used for placing wind elements such as fans that can generate wind power, and provides a placement space for wind elements such as fans that can generate wind power. The wind force generated by the wind element can pass through the heat dissipation fins in the heat dissipation fin group to dissipate the heat between the heat dissipation fins, which improves the dissipation effect of the wind element on the heat between the heat dissipation fins and improves the heat dissipation of the radiator. Effect.

The heat sink provided by the embodiment of the present disclosure further includes a heat dissipation substrate.

The fins in the heat dissipation fin group are fixed on the heat dissipation base plate, which improves the connection stability of the fins in the heat dissipation fin group. The heat dissipation pipe part of the heat pipe transfers the heat to the heat dissipation base plate, and the heat dissipation base plate and the fins in the heat dissipation fin group further dissipate the heat. Optionally, the heat dissipation base plate is a temperature equalizing plate, which improves the uniformity of heat distribution among different fins in the heat dissipation fin group.

Optionally, the heat-conducting pipe portion of the heat pipe is parallel to the heat-dissipating pipe portion.

Optionally, the third surface of the thermally conductive substrate is provided with a groove, and the heat-conducting pipe portion of the heat pipe is embedded in the groove, and the heat-conducting pipe portion is in direct contact with the hot-end chip of the semiconductor refrigeration equipment to receive heat from the hot-end chip. Optionally, the number of heat pipes is two or more. Each of the two or more than two heat pipes includes a heat pipe part and a heat pipe part, and optionally, the two or more than two heat pipe parts are embedded in the heat conductive base in parallel. Optionally, the heat-conducting pipe portion of the heat pipe is parallel to the fifth and sixth surfaces of the heat-conducting substrate, which improves the heat-conducting uniformity of the heat pipe. Optionally, the heat-conducting pipe portions of a single heat pipe are respectively bent and extended toward both ends to obtain two heat-dissipating pipe portions. Optionally, a single heat pipe has four bending parts. As shown in FIG. 1 , there are two bending parts between one end of the heat pipe part of the heat pipe and the heat pipe part, and the other end of the heat pipe part of the heat pipe is connected to the other end of the heat pipe part. There are two bent parts between the heat dissipation pipe parts. Optionally, the heat-conducting pipe portion of the heat pipe is parallel to the heat-dissipating pipe portion. Optionally, two or more radiating pipe portions of the heat pipe are parallel, which improves the uniformity of heat transfer from the radiating pipe portions to the fins in the radiating fin group.

Optionally, the distance between two adjacent heat conduction pipe parts is smaller than the distance between two adjacent heat dissipation pipe parts.

The distance between two adjacent heat pipe parts is defined as the first distance, the distance between two adjacent heat pipe parts is the second distance, and the first distance is smaller than the second distance, which improves the uniformity of heat transfer between the heat pipe parts of the heat pipe The thermal conductivity and heat dissipation effect of the heat dissipation substrate are improved.

Optionally, the fins in the heat dissipation fin group include: a notch part; an extension part extending along the notch part, and the heat dissipation pipe part is arranged on the part of the heat dissipation base plate corresponding to the extension part.

It can be understood that the fins in the heat dissipation fin group include a notch portion provided with a notch and an extension portion extending along the notch portion. connection part. Optionally, the extension part is connected to one side of the heat dissipation base plate, and the heat dissipation pipe part is arranged on the other side opposite to this side, as shown in FIG. Effect.

Optionally, the thickness of the thermally conductive substrate is greater than that of the heat dissipation substrate.

The thickness of the thermally conductive substrate is greater than the thickness of the thermally conductive substrate, which improves the thermal conductivity of the thermally conductive substrate and the heat dissipation effect of the thermally conductive substrate, as shown in FIG. 2 . The heat dissipation substrate includes a first heat dissipation substrate 21 and a second heat dissipation substrate 22 , the thickness of the thermal conductive substrate is greater than that of the first heat dissipation substrate 21 , and the thickness of the thermal conductive substrate is greater than that of the second heat dissipation substrate 22 . Optionally, the thickness of the first heat dissipation substrate 21 is the same as the thickness of the second heat dissipation substrate 22 .

The pipe diameters of different parts of a single heat pipe may be the same or different. Optionally, the outer diameter of the heat pipe portion of the heat pipe is larger than the outer diameter of the heat pipe portion, and the inner diameter of the heat pipe portion of the heat pipe is larger than the inner diameter of the heat pipe portion, so as to improve the heat conduction and heat dissipation effects.

Optionally, the set of heat dissipation fins includes: a first set of heat dissipation fins provided with a first notch forming a first accommodating space; a second set of radiating fins provided with a second notch forming a second accommodating space.

Optionally, as shown in FIG. 1 , the first heat dissipation fin group and the second heat dissipation fin group are symmetrically arranged on both sides of the thermally conductive substrate.

As shown in FIG. 1 , the first heat dissipation fin group 211 includes two or more heat dissipation fins. Optionally, the area of a single heat dissipation fin in the first heat dissipation fin group 211 is larger than the area of the fins in the middle fin group. Optionally, the thickness of the fins in the first heat dissipation fin group 211 is smaller than the thickness of the fins in the middle fin group. Optionally, the thickness of the fins in the first heat dissipation fin group 211 is 0.3-0.6 mm, such as 0.5 mm.

The first heat dissipation fin group 211 is provided with a first notch forming the first accommodating space 31 . Optionally, the first heat dissipation fin group 211 includes N heat dissipation fins, and the first gap is formed by the adjacent M heat dissipation fins, that is, the adjacent M heat dissipation fins have missing surfaces, such as concave surfaces, The missing surfaces of the adjacent M heat dissipating fins form first notches, wherein N is greater than M, and M is greater than 2. Optionally, the first heat dissipation fin group 211 includes N heat dissipation fins, and the first gap is formed by N heat dissipation fins, that is, the N heat dissipation fins in the first heat dissipation fin group 211 have missing surfaces, For example, a concave surface, the missing surfaces of the N heat dissipation fins form a first gap, where N is greater than 3.

The first notch forms the first accommodating space 31 . The first accommodating space 31 can be used for placing wind elements such as fans that can generate wind power, and provides a placement space for wind elements such as fans that can generate wind power. The wind force generated by the wind element can pass through the heat dissipation fins in the first heat dissipation fin group 211 to dissipate the heat between the heat dissipation fins, which improves the dissipation effect of the wind element on the heat between the heat dissipation fins and improves the heat dissipation. the cooling effect of the device.

The second heat dissipation fin group 221 includes two or more heat dissipation fins. Optionally, the area of a single heat dissipation fin in the second heat dissipation fin group 221 is larger than the area of the fins in the middle fin group; The area of a single fin in the first heat dissipation fin group 211 is the same; optionally, the thickness of the fins in the second heat dissipation fin group 221 is smaller than the thickness of the fins in the middle fin group, optionally, the second heat dissipation fin group 221 The thickness of the fins in the fin group 221 is 0.3-0.6 mm, such as 0.5 mm.

The second heat dissipation fin group 221 is provided with a second gap forming the second accommodating space 32 . Optionally, the second heat dissipation fin group 221 includes N heat dissipation fins, and the second gap is formed by the adjacent M heat dissipation fins, that is, the adjacent M heat dissipation fins have missing surfaces, such as concave surfaces, The missing surfaces of the adjacent M heat dissipation fins form second notches, wherein N is greater than M, and M is greater than 2. Optionally, the second heat dissipation fin group 221 includes N heat dissipation fins, and the second gap is formed by N heat dissipation fins, that is, the N heat dissipation fins in the second heat dissipation fin group 221 have missing surfaces, For example, a concave surface, the missing surfaces of the N heat dissipation fins form a second gap, where N is greater than 3.

The second notch forms the second accommodating space 32 . The second accommodating space 32 can be used for placing wind elements such as fans that can generate wind power, and provides a placement space for wind elements such as fans that can generate wind power. The wind force generated by the wind element can pass through the heat dissipation fins in the second heat dissipation fin group 221 to dissipate the heat between the heat dissipation fins, which improves the dissipation effect of the wind element on the heat between the heat dissipation fins and improves the heat dissipation. the cooling effect of the device. Optionally, the volume of the second accommodating space 32 is equal to the volume of the first accommodating space 31 .

Optionally, the thermally conductive substrate includes: a first thermally conductive substrate; and a second thermally conductive substrate, and a third accommodating space is formed between the first thermally conductive substrate and the first thermally conductive substrate. As shown in Figure 1 and Figure 3.

A third accommodating space 33 is formed between the second thermally conductive substrate 12 and the first thermally conductive substrate 11 . It can be understood that the second thermally conductive substrate 12 is not in direct contact with the first thermally conductive substrate 11 , and there is a certain distance between them. The distance forms the third accommodating space 33 . The third accommodating space 33 can be used for placing wind elements such as fans that can generate wind power, and provides a placement space for wind elements such as fans that can generate wind power. The wind power generated by the wind element can dissipate heat to the first thermally conductive substrate 11 and the second thermally conductive substrate 12 , thereby improving the heat dissipation effect of the radiator. Optionally, the thickness of the first thermally conductive substrate 11 is the same as the thickness of the second thermally conductive substrate 12 ; the area of the first thermally conductive substrate 11 is the same as the area of the second thermally conductive substrate 12 .

Optionally, the first thermally conductive substrate 11 is provided with a first intermediate fin group, the second thermally conductive substrate 12 is provided with a second intermediate fin group, the fins in the first intermediate fin group and the second intermediate fins The fins in the group are oriented the same. The wind power generated by the wind element disposed in the third accommodating space 33 can shuttle between the fins of the first intermediate fin group, and at the same time, it can also shuttle between the fins of the second intermediate fin group, which improves the first The heat dissipation effect of the fins in one middle fin group and the second middle fin group.

Optionally, the heat pipe includes: a first heat pipe group, including a first heat-conducting pipe portion embedded in a first heat-conducting substrate, a first heat-conducting pipe portion extending along one end of the first heat-conducting pipe portion, and a first heat-conducting pipe portion extending along the other end of the first heat-conducting pipe portion The extended second heat dissipation pipe part; the second heat pipe group includes a second heat dissipation pipe part embedded in the second heat conductive substrate; a third heat dissipation pipe part extending along one end of the second heat dissipation pipe part; A fourth heat dissipation pipe portion extending from one end.

As shown in FIG. 1 , the first heat pipe group 61 includes two or more heat pipes, the first heat pipe parts of the two or more heat pipes are parallel, and the first heat pipe part is embedded in the first heat dissipation base and is connected with the first heat pipe A heat dissipation base is connected, and the second heat dissipation pipe is embedded in the second heat dissipation base and connected with the second heat dissipation base. Similarly, the second heat pipe group 62 includes two or more heat pipes, the second heat pipe portions of the two or more heat pipes are parallel, and the third heat pipe portion is embedded in the first heat dissipation base, and is connected to the first heat dissipation base. The fourth heat dissipation pipe is embedded in the second heat dissipation base and connected with the second heat dissipation base, so as to improve the heat conduction uniformity of the heat pipe.

Optionally, the radiator further includes: a fan disposed in the accommodating space.

The fan includes a first fan 51 , which is arranged in the first accommodating space 31 , as shown in FIG. 3 and FIG. 9 .

The first accommodating space 31 is formed by the first gap of the first heat dissipation fin group 211. The first fan 51 is arranged in the first accommodating space 31, and the first fan 51 sucks air from the outside of the refrigeration equipment, and is located at the back of the refrigeration equipment box. Under the blocking of the plate, the generated wind force can travel through the gap between the adjacent two fins of the first heat dissipation fin group 211, dissipate the heat between the two adjacent fins, and improve the first fan 51 to the second. The heat dissipation effect of the fins in a heat dissipation fin group 211 . Optionally, the axial direction of the first fan 51 is perpendicular to the fins in the first heat dissipation fin group 211, which improves the wind power generated by the first fan 51 between the adjacent two fins in the first heat dissipation fin group 211. The shuttle performance of the gaps between them improves the heat dissipation effect of the fins in the first heat dissipation fin group 211 . Optionally, the first fan 51 is an axial flow fan.

The fins in the first heat dissipation fin group 211 include a notch portion, a first extension portion extending along a first end of the notch portion, and a second extension portion extending along a second end opposite to the first end, optionally, The area of the first extension portion is the same as that of the second extension portion, which improves the uniformity of heat dissipation by the first fan 51 to the fins in the first heat dissipation fin group 211 , as shown in FIG. 3 .

The first heat dissipation fin group 211 includes end fins disposed at both ends of the first heat dissipation substrate 21, and inner fins disposed between the end fins, optionally, the gap between the adjacent two end fins It is larger than the gap between two adjacent inner fins, which improves the utilization of the wind force generated by the first fan 51 .

The fan includes a second fan 52 , which is disposed in the second accommodating space 32 , as shown in FIGS. 3 and 9 .

The second accommodating space 32 is formed by the second gap of the second heat dissipation fin group 221 , the second fan 52 is arranged in the second accommodating space 32 , the second fan 52 sucks air from the outside of the refrigeration equipment, and is located at the back of the refrigeration equipment case. Under the blocking of the plate, the generated wind force can travel through the gap between the adjacent two fins of the second heat dissipation fin group 221, dissipate the heat between the two adjacent fins, and improve the second fan 52 to the second. The heat dissipation effect of the fins in the two heat dissipation fin groups 221 . Optionally, the axial direction of the second fan 52 is perpendicular to the fins in the second heat dissipation fin group, which improves the wind force generated by the second fan 52 between two adjacent fins in the second heat dissipation fin group 221. The shuttle performance of the clearance gap improves the heat dissipation effect of the fins in the second heat dissipation fin group 221 . Optionally, the second fan 52 is an axial flow fan.

The fins in the second heat dissipation fin group 221 include a notch portion, a third extension portion extending along a third end of the notch portion, and a fourth extension portion extending along a fourth end opposite to the third end, optionally, The area of the third extension portion is the same as that of the fourth extension portion, which improves the uniformity of heat dissipation by the second fan 52 to the fins in the second heat dissipation fin group 221 .

The second heat dissipation fin group 221 includes end fins disposed at both ends of the second heat dissipation substrate 22, and inner fins disposed between the end fins, optionally, between adjacent two end fins The gap between the two adjacent inner fins is larger than the gap between two adjacent inner fins, which improves the utilization of the wind power generated by the second fan 52 .

The fan includes a third fan 53 , which is arranged in the third accommodating space 33 , as shown in FIG. 3 and FIG. 9 .

The third accommodating space 33 is formed by the distance between the first thermally conductive substrate 11 and the second thermally conductive substrate 12 , and the third fan 53 is arranged in the third accommodating space 33 , and the third fan 53 sucks air from the outside of the refrigeration equipment, and is used for cooling. Under the blocking of the back plate of the equipment box, the generated wind force can shuttle between the gaps between the two adjacent fins of the first intermediate fin group, and can also shuttle between the adjacent two fins of the second intermediate fin group The gap increases the heat dissipation effect on the first intermediate fin group and the second intermediate fin group. Optionally, the axial direction of the third fan 53 is perpendicular to the fins in the first intermediate fin group, and the third fan 53 is perpendicular to the fins in the second intermediate fin group, which improves the wind power generated by the third fan 53. The shuttle performance between two adjacent fins of the first intermediate fin group and the second intermediate fin group improves the heat dissipation effect of the first intermediate fin group and the second intermediate fin group. Optionally, the third fan 53 is an axial flow fan.

Optionally, the radiator further includes: a fan bracket for fixing the fan, as shown in FIG. 4 to FIG. 8 .

Optionally, the fan bracket 4 includes:

The flat plate 41 is provided with at least a first penetration portion 411;

The first side edge is bent and extended along the first end of the flat plate, and the bending here can be a vertical bending;

The second side is bent and extended along the second end of the plate, the first end is opposite to the second end, the extension direction of the first side and the second side is the same, and similarly, the bending here can also be vertical bend;

The first penetration portion 411 is used for installing the first fan 51 .

Optionally, the flat plate of the fan bracket further includes a second penetration portion 412 for installing the second fan 52 .

Optionally, the flat plate of the fan bracket further includes a third penetration portion 413 for installing the third fan 53 , as shown in FIGS. 4 and 5 .

Optionally, the fan bracket is provided with a fixing slot for fixing the fins in the heat dissipation fin group.

Optionally, the first side is provided with a fin fixing groove 44, as shown in FIG. 7 and FIG. 8, wherein FIG. 8 is a partial enlarged view of FIG. 7, which is used for fixing the aforementioned fins, such as the aforementioned middle fins The fins in the group of fins, the group of first heat dissipation fins or the group of second heat dissipation fins. The wind generated during the operation of the fan acts on the fins, and part of the edges of the fins can be clamped in the fixing grooves to prevent deformation of the fins and improve the service life of the radiator. Optionally, the fins are inflation plates.

Optionally, the second side is provided with fin fixing grooves 44 for fixing the aforementioned fins, such as the aforementioned fins in the middle fin group, the first heat dissipation fin group or the second heat dissipation fin group. The wind generated during the operation of the fan acts on the fins, and part of the edges of the fins can be clamped in the fixing grooves to prevent deformation of the fins and improve the service life of the radiator. Optionally, the fins are inflation plates.

Optionally, the fan bracket further includes a wind deflector. The windshield is used to block the airflow of the fan and prevent the fan from bypassing the air outlet, so that the wind generated by the fan flows through the fins of the radiator. Optionally, the wind deflector is perpendicular to the flat plate. As shown in FIG. 6 , the wind deflector includes a first wind deflector 421 disposed on one side of the first fan, disposed on the other side of the first fan, and located on the first side of the first fan. The second air baffle 422 between the fan and the second fan is disposed on one side of the third fan, and the third air baffle 423 between the second fan and the third fan is disposed on the other side of the third fan The fourth wind deflector 424.

Optionally, the fan bracket further includes a reinforcing plate to reduce deformation and vibration of the fan frame caused by the fan. Optionally, the reinforcement plate is parallel to the wind deflector. As shown in FIG. 6 , the reinforcing plates include a first reinforcing plate 431 and a second reinforcing plate 432 disposed on both sides of the first fan, and a third reinforcing plate 433 and a fourth reinforcing plate 434 disposed on both sides of the third fan.

Optionally, the fan bracket further includes:

The third side edge is bent and extended along the third end of the plate;

The fourth side is bent and extended along the fourth end of the flat plate, the third end is opposite to the fourth end, and the extension direction of the third side and the fourth side is the same,

The third side and the fourth side are provided with connecting pieces for fixing the fan bracket. Optionally, the fan bracket is fixed to the backplane of the cabinet of the refrigeration equipment.

The embodiments of the present disclosure also provide a refrigeration apparatus including the aforementioned radiator.

Optionally, the cooling device may be the aforementioned semiconductor cooling device, and the aforementioned heat sink is used to dissipate heat for the hot end of the semiconductor chip. Optionally, one or more of the foregoing radiators may be installed in a refrigeration device, and the embodiment of the present disclosure does not limit the number of radiators in the refrigeration device.

Claims (10)

1. A heat sink, comprising:

a heat conductive substrate;

a heat-dissipating substrate;

the radiating fin group is arranged on the radiating substrate and is provided with a notch forming an accommodating space;

the heat pipe comprises a heat conduction pipe part embedded in the heat conduction substrate and a heat dissipation pipe part embedded in the heat dissipation substrate.

2. The heat sink of claim 1,

the heat conducting pipe part of the heat pipe is parallel to the heat radiating pipe part.

3. The heat sink of claim 1,

the distance between two adjacent heat conduction pipe parts is less than the distance between two adjacent heat dissipation pipe parts.

4. The heat sink of claim 1, wherein the fins in the set of fins comprise:

a notch portion;

an extension portion extending along the notch portion,

the heat dissipation pipe part is arranged at the part of the heat dissipation substrate corresponding to the extension part.

5. The heat sink of claim 1,

the thickness of the heat conducting substrate is larger than that of the heat dissipation substrate.

6. The heat sink of claim 1,

the outer diameter of the heat conducting pipe part of the heat pipe is larger than that of the heat radiating pipe part.

7. The heat sink as recited in claim 1 wherein said set of fins comprises:

the first radiating fin group is provided with a first notch forming a first accommodating space;

and the second radiating fin group is provided with a second notch forming a second accommodating space.

8. The heat sink of claim 1, wherein the thermally conductive substrate comprises:

a first thermally conductive substrate;

and a third accommodating space is formed between the second heat-conducting substrate and the first heat-conducting substrate.

9. The heat sink of claim 1, further comprising:

and the fan is arranged in the accommodating space.

10. A refrigeration device comprising a heat sink according to any one of claims 1 to 9.

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